KR20200105614A - Circuit board having sound generator and display device including the same - Google Patents

Abstract

Provided are a circuit board having a sound generation device and a display device including the same. The circuit board comprises: a base layer; lead lines disposed on the base layer; and a sound generation device disposed on the lead lines and contracting and expanding in accordance with driving voltages. Accordingly, an area in which an image is displayed can be widened by a display panel.

Description

A circuit board having a sound generating device and a display device including the same.

The present invention relates to a circuit board having a sound generating device and a display device including the same.

As the information society develops, demand for a display device for displaying an image is increasing in various forms. For example, display devices are applied to various electronic devices such as smart phones, digital cameras, notebook computers, navigation systems, and smart televisions. The display device may include a display panel for displaying an image and a sound generating device for providing sound.

As display devices are applied to various electronic devices, display devices having various designs are required. For example, in the case of a smartphone, there is a demand for a display device capable of widening a display area by deleting a call receiver for outputting a voice of the other party in the sound mode.

It is an object to be solved by the present invention to provide a circuit board capable of outputting sound using a sound generating device that is not exposed to the outside.

Another problem to be solved by the present invention is to provide a display device capable of outputting a sound using a sound generating device that is not exposed to the outside.

The problems of the present invention are not limited to the problems mentioned above, and other technical problems that are not mentioned will be clearly understood by those skilled in the art from the following description.

A circuit board according to an embodiment for solving the above problem is a base layer, a lead line disposed on the base layer, and a sound generating device disposed on the lead lines and contracting and expanding according to driving voltages It is equipped with.

The sound generating device is disposed between a first electrode to which a first driving voltage is applied, a second electrode to which a second driving voltage is applied, and between the first electrode and the second electrode, the first driving voltage and the second electrode. A vibration layer that contracts or expands according to a driving voltage, the first electrode, the second electrode, and a protective layer surrounding the vibration layer, a first electrode pad exposed without being covered by the protective layer and connected to the first electrode, And a second electrode pad exposed without being covered by the protective layer and connected to the second electrode.

A first adhesive member disposed between the lead lines and one surface of the sound generating device may be further provided.

Flexible having a first driving line electrically connected to the first electrode pad, a second driving line electrically connected to the second electrode pad, and a connection terminal connected to the first driving line and the second driving line The circuit board may include a connector disposed on the base layer and including an insertion portion into which the connection terminal is inserted.

A first driving line electrically connected to the first electrode pad, a second driving line electrically connected to the second electrode pad, a first circuit pad connected to the first driving line, and the second driving line A flexible circuit board having a second circuit pad to be connected, disposed on the base layer, a first film pad electrically connected to any one of the lead lines, and electrically connected to another one of the lead lines A circuit film having a second film pad, and an anisotropic conductive adhesive member disposed between the first circuit pad and the first film pad and between the second circuit pad and the second film pad may be further provided.

A first soldering unit electrically connecting any one of the lead lines and the first electrode pad, and a second soldering unit electrically connecting another one of the lead lines and the second electrode pad. I can.

The sound generating device may further include a dummy electrode pad exposed without being covered by the protective layer, and may further include a third soldering part electrically connecting one of the lead lines to the dummy electrode pad.

An anisotropic conductive adhesive member may be further provided between any one of the lead lines and the first electrode pad, and between another one of the lead lines and the second electrode pad.

A solder resist layer disposed on the lead lines, and a second adhesive member disposed between the protective layer of the sound generating device and the solder resist layer may be further provided.

The second adhesive member may not overlap the first electrode pad and the second electrode pad in the thickness direction of the sound generating device.

The display device according to an exemplary embodiment for solving the other problem includes a display panel, a circuit board disposed on a first surface of the display panel, and the display device overlapping the circuit board in a thickness direction of the display panel. A sound generating device for outputting sound by vibrating the panel is provided.

The sound generating device may be disposed on a second surface that is opposite to the first surface of the circuit board facing the first surface of the display panel.

A first adhesive member disposed between the second surface of the circuit board and the first surface of the sound generating device may be further provided.

A flexible circuit board having driving lines electrically connected to electrode pads disposed on a second surface opposite to the first surface of the sound generating device, and connection terminals connected to the driving lines, and the circuit board It is disposed on the second side of the connector, it may further include a connector including an insertion portion into which the connection terminal is inserted.

A flexible circuit board having driving lines connected to electrode pads disposed on a second surface opposite to the first surface of the sound generating device, and circuit pads connected to the driving lines, a second of the circuit board A circuit film disposed on a surface and having film pads electrically connected to the circuit pads, and an anisotropic conductive adhesive member disposed between the circuit pads and the film pads may be further provided.

A soldering unit for electrically connecting electrode pads disposed on the first surface of the sound generating device and lead lines disposed on the second surface of the circuit board may be further provided.

The soldering part may electrically connect at least one of the lead lines and dummy pads disposed on the first surface of the sound generating device.

It may be disposed between electrode pads disposed on the first surface of the sound generating device and lead lines disposed on the second surface of the circuit board.

A second adhesive member may be further provided between at least a portion of the first surface of the sound generating device and the second surface of the display circuit board.

The second adhesive member may not overlap the first electrode pad and the second electrode pad in the thickness direction of the circuit board.

A flexible film disposed between the display panel and the circuit board and on which an integrated driving circuit for driving the display panel is disposed may be further provided.

A power supply circuit for supplying display driving voltages to the integrated driving circuit, and a sound driving circuit for supplying sound driving voltages to the sound generating device may be provided.

The power supply circuit and the sound driving circuit may be disposed on the circuit board.

The sound generating device may be disposed between a first surface of the display panel and a first surface of the circuit board facing the first surface of the display panel.

A soldering unit for electrically connecting electrode pads disposed on the first surface of the sound generating device and lead lines disposed on the first surface of the circuit board may be further provided.

An anisotropic conductive adhesive member may be further provided between electrode pads disposed on the first surface of the sound generating device and lead lines disposed on the first surface of the circuit board.

Details of other embodiments are included in the detailed description and drawings.

According to the circuit board having the sound generating device and the display device including the same according to an exemplary embodiment, a sound generating device vibrating the display panel is disposed on one surface of the display circuit board to output sound. For this reason, it is possible to output sound by using the display panel as a vibration surface using a sound generating device that is not exposed to the outside. Accordingly, since the call receiver for outputting the voice of the other party from the front of the display device can be deleted, the transparent portion of the cover window can be widened, and the area in which an image is displayed by the display panel can be widened.

According to the circuit board having the sound generating device and the display device including the same according to an embodiment, the sound generating device is attached to one surface of the display circuit board through an adhesive member, and one surface of the display circuit board through the flexible circuit board. It may be electrically connected to an acoustic connection disposed thereon. Therefore, the sound generating device can be integrally formed with the display circuit board in the manufacturing step of the display circuit board. Accordingly, since a process or equipment for separately attaching the sound generating device to the lower surface of the panel can be omitted, manufacturing cost can be reduced. In addition, there is no need to provide a separate space for the sound generator to be attached to the lower panel cover.

According to the circuit board having the sound generating device and the display device including the same, the electrode pads of the sound generating device and the lead lines of the display circuit board are electrically connected by a soldering unit or an anisotropic conductive adhesive member. do. Therefore, the sound generating device can be integrally formed with the display circuit board in the manufacturing step of the display circuit board. Accordingly, since a process or equipment for separately attaching the sound generating device to the lower surface of the panel can be omitted, manufacturing cost can be reduced. In addition, there is no need to provide a separate space for the sound generating device to be attached to the lower panel cover.

Effects according to the embodiments are not limited by the contents illustrated above, and more various effects are included in the present specification.

1 is a perspective view illustrating a display device according to an exemplary embodiment.
2 is an exploded perspective view of a display device according to an exemplary embodiment.
3 is a bottom view illustrating an example of a display panel attached to the cover window of FIG. 2.
4 is a plan view showing an example of the bracket of FIG. 2.
5 is a plan view showing the main circuit board of FIG. 2.
6 is an enlarged bottom view showing in detail area A of FIG. 3.
7A is a cross-sectional view illustrating an example of Ⅰ-Ⅰ' of FIG. 6.
7B is a cross-sectional view illustrating the display circuit board, the sound generating device, and the sound connector of FIG. 7A in detail.
7C is a cross-sectional view illustrating the sound generating device and the flexible circuit board of FIG. 7A in detail.
8 is a cross-sectional view illustrating a display area of the display panel of FIG. 7A in detail.
9 is a cross-sectional view illustrating an example of the sound generating device of FIG. 7A.
10 is an exemplary view showing a method of vibrating a vibration layer disposed between a first branch electrode and a second branch electrode of the sound generating device.
11 and 12 are exemplary views illustrating a method of vibrating a display panel by vibration of the sound generating device of FIG. 10.
13 is a graph showing the sound pressure level of the sound generating device according to the frequency for each attachment position of the sound generating device.
14 is a graph showing the sound pressure level of the sound generator for each frequency according to the thickness of the first circuit board and the thickness of the first adhesive member when the first circuit board to which the sound generator is attached is a flexible printed circuit board.
15 is a graph showing the sound pressure level of the sound generating device for each frequency according to the thickness of the first circuit board and the thickness of the first adhesive member when the first circuit board to which the sound generating device is attached is a rigid printed circuit board.
16A is a cross-sectional view illustrating another example of I-I' of FIG. 6.
16B is a cross-sectional view showing in detail the flexible circuit board and the acoustic circuit film of FIG. 16A.
FIG. 17 is an enlarged bottom view showing in detail area A of FIG. 3.
18A is a cross-sectional view illustrating another example of II-II' of FIG. 17.
18B is a detailed cross-sectional view illustrating the display circuit board of FIG. 18A and the sound generating device.
19A is a cross-sectional view illustrating another example of II-II' of FIG. 17.
19B is a detailed cross-sectional view illustrating the display circuit board and the sound generating device of FIG. 19A.
20 is a cross-sectional view showing another example of II-II' of FIG. 17.
20B is a detailed cross-sectional view illustrating the display circuit board of FIG. 20A and the sound generating device.
21 is an enlarged bottom view showing in detail area A of FIG. 3.
22 is a cross-sectional view illustrating an example of Ⅲ-Ⅲ' of FIG. 21.
23 is a cross-sectional view illustrating an example of Ⅲ-Ⅲ' of FIG. 21.
24 is a cross-sectional view illustrating an example of Ⅲ-Ⅲ' of FIG. 21.

Advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, and only these embodiments make the disclosure of the present invention complete, and common knowledge in the technical field to which the present invention pertains. It is provided to completely inform the scope of the invention to those who have it, and the invention is only defined by the scope of the claims.

When elements or layers are referred to as “on” of another element or layer, it includes all cases where another layer or other element is interposed directly on or in the middle of another element. The same reference numerals refer to the same components throughout the specification. The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for describing the embodiments are exemplary, and the present invention is not limited to the illustrated matters.

Although the first, second, and the like are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are only used to distinguish one component from another component. Therefore, it goes without saying that the first component mentioned below may be the second component within the technical idea of the present invention.

Each of the features of the various embodiments of the present invention can be partially or entirely combined or combined with each other, technically various interlocking and driving are possible, and each of the embodiments can be implemented independently of each other or can be implemented together in a related relationship. May be.

1 is a perspective view illustrating a display device according to an exemplary embodiment. 2 is an exploded perspective view of a display device according to an exemplary embodiment.

1 and 2, a display device 10 according to an exemplary embodiment includes a cover window 100, a display panel 300, a display circuit board 310, a display driving circuit 320, and a flexible film 350. ), a sound generating device 510, a bracket 600, a main circuit board 700, and a lower cover 900.

In the present specification, “upper”, “top”, and “upper” refer to the direction in which the cover window 100 is arranged relative to the display panel 300, that is, the Z-axis direction, and “lower”, “bottom”, and “ "Under surface" refers to the direction in which the bracket 600 is arranged with respect to the display panel 300, that is, a direction opposite to the Z axis direction. In addition, “left”, “right”, “top”, and “bottom” indicate directions when the display panel 300 is viewed from a plane. For example, “Left” refers to the opposite direction of the X-axis direction, “Right” refers to the X-axis direction, “Up” refers to the Z-axis direction, and “Bottom” refers to the opposite direction of the Z-axis direction.

The display device 10 may have a rectangular shape on a plane. For example, the display device 10 may have a rectangular planar shape having a short side in a first direction (X-axis direction) and a long side in a second direction (Y-axis direction) as shown in FIGS. 1 and 2. A corner where the short side in the first direction (X-axis direction) and the long side in the second direction (Y-axis direction) meet may be rounded to have a predetermined curvature or may be formed at a right angle. The planar shape of the display device 10 is not limited to a rectangle, and may be formed in a different polygon, circle, or ellipse.

The display device 10 may include a first area DR1 formed to be flat and a second area DR2 extending from left and right sides of the first area DR1. The second region DR2 may be formed to be flat or curved. When the second region DR2 is formed flat, an angle formed between the first region DR1 and the second region DR2 may be an obtuse angle. When the second region DR2 is formed as a curved surface, it may have a constant curvature or a varying curvature.

1 illustrates that the second region DR2 extends from each of the left and right sides of the first region DR1, but is not limited thereto. That is, the second area DR2 may extend only on one of the left and right sides of the first area DR1. Alternatively, the second area DR2 may extend in at least one of the upper and lower sides as well as the left and right sides of the first area DR1. Hereinafter, a description will be made focusing on the second area DR2 disposed on the left and right edges of the display device 10.

The cover window 100 may be disposed on the display panel 300 to cover the upper surface of the display panel 300. Accordingly, the cover window 100 may function to protect the upper surface of the display panel 300.

The cover window 100 may include a transmission portion DA100 corresponding to the display panel 300 and a light blocking portion NDA100 corresponding to an area other than the display panel 300. The cover window 100 may be disposed in the first area DR1 and the second area DR2. The transmission part DA100 may be disposed in a part of the first region DR1 and a part of the second region DR2. The light blocking portion NDA100 may be formed to be opaque. Alternatively, the light blocking unit NDA100 may be formed as a decor layer on which a pattern that can be shown to a user when an image is not displayed. For example, a company logo or various characters may be patterned on the light blocking unit NDA100. In addition, a first camera hole CMH1 for exposing the front camera 740 may be formed in the light blocking portion NDA100, but is not limited thereto. For example, the first camera hole CMH1 may be formed in the transmissive portion DA100 instead of the light blocking portion NDA100. In this case, the display panel 300 may include a through hole for exposing the front camera 740.

The display panel 300 may be disposed under the cover window 100. The display panel 300 may be disposed to overlap the transparent portion 100DA of the cover window 100. The display panel 300 may be disposed in the first area DR1 and the second area DR2. For this reason, the image of the display panel 300 may be viewed in not only the first area DR1 but also the second areas DR2.

The display panel 300 may be a light emitting display panel including a light emitting element. For example, the display panel 300 includes an organic light emitting display panel using an organic light emitting diode including an organic light emitting layer, a micro light emitting diode display panel using a micro LED, and a quantum dot emission layer. It may be a quantum dot light emitting display panel using an included quantum dot light emitting diode (Quantum dot Light Emitting Diode), or an inorganic light emitting display panel using an inorganic light emitting device including an inorganic semiconductor. Hereinafter, a description will be made focusing on that the display panel 300 is an organic light emitting display panel.

A display circuit board 310 and a display driving circuit 320 may be attached to one side of the display panel 300. One end of the display circuit board 310 may be attached on pads provided on one side of the display panel 300 using an anisotropic conductive film. The display circuit board 310 includes a flexible printed circuit board that can be bent, a rigid printed circuit board that is hard to bend, or a rigid printed circuit board and a flexible printed circuit board. It may be a composite printed circuit board including all.

The display driving circuit 320 receives control signals and power voltages through the display circuit board 310, generates and outputs signals and voltages for driving the display panel 300. The display driving circuit 320 may be formed as an integrated circuit and attached to the protruding area PA of the display panel 300 by a chip on glass (COG) method, a chip on plastic (COP) method, or an ultrasonic method. Not limited. For example, the display driving circuit 320 may be attached on the display circuit board 310.

A touch driving circuit 330 may be disposed on the display circuit board 310. The touch driving circuit 330 may be formed as an integrated circuit and attached to the upper surface of the display circuit board 310. The touch driving circuit 330 may be electrically connected to the touch electrodes of the touch sensor layer of the display panel 300 through the display circuit board 310. The touch driving circuit 330 applies touch driving signals to the driving electrodes among the touch electrodes, and senses the amount of change in charge of capacitances between the driving electrodes and the sensing electrodes through the sensing electrodes among the touch electrodes. Touch data including touch coordinates may be output.

A sound driving circuit 340 may be disposed on the display circuit board 310. The sound driving circuit 340 receives sound data from the main processor 710. The sound driving circuit 340 generates sound driving voltages according to sound data and outputs the sound to the sound generating device 510. The acoustic driving voltages may include a first driving voltage and a second driving voltage. The sound generating device 510 may contract or expand according to the first driving voltage and the second driving voltage, and may output sound by vibrating the display panel 300 by the sound generating device 510.

The sound driving circuit 340 includes a digital signal processor (DSP) that processes sound data that is a digital signal, and a digital analog converter that converts digital data processed by the digital signal processor into driving voltages that are analog signals. It may include an analog converter (DAC), an amplifier (AMP) that amplifies and outputs driving voltages.

A power supply circuit for supplying display driving voltages for driving the display driving circuit 320 may be disposed on the display circuit board 310. In this case, display driving voltages for driving the display panel 300 and sound driving voltages for driving the sound generating device 510 may be generated and supplied by different circuits, respectively. Therefore, it is possible to prevent the display driving voltages for driving the display panel 300 from being affected by the sound driving voltages for driving the sound generating device 510.

One side of the flexible film 350 may be attached to the upper surface of the display panel 300 from the lower side of the display panel 300 using an anisotropic conductive film. The other side of the flexible film 350 may be attached on the upper surface of the display circuit board 310 from the upper side of the display circuit board 310 using an anisotropic conductive film. The flexible film 350 may be a flexible film that can be bent.

A sound generating device 510 may be disposed on one surface of the display circuit board 310. The sound generating device 510 may be a piezoelectric element or a piezoelectric actuator that vibrates the display panel 300 using a piezoelectric material that contracts or expands according to an applied voltage.

The bracket 600 may be disposed under the display panel 300. The bracket 600 may include plastic, metal, or both plastic and metal. The bracket 600 includes a second camera hole CMH2 into which the camera device 720 is inserted, a battery hole BH in which a battery is disposed, and a cable hole through which the cable 314 connected to the display circuit board 310 passes. CAH) can be formed.

The main circuit board 700 may be disposed under the bracket 600. The main circuit board 700 may be a printed circuit board or a flexible printed circuit board.

The main circuit board 700 may include a main processor 710, a camera device 720, a main connector 730, and a front camera 740. The camera device 720 is disposed on both the upper and lower surfaces of the main circuit board 700, the main processor 710 is disposed on the upper surface of the main circuit board 700, and the main connector 730 is the main circuit board 700. ) Can be placed underneath.

The main processor 710 may control all functions of the display device 10. For example, the main processor 710 may output digital video data to the display driving circuit 320 through the display circuit board 310 so that the display panel 300 displays an image. Further, the main processor 710 may receive touch data from the touch driving circuit 330 and determine the user's touch coordinates, and then execute an application indicated by an icon displayed on the user's touch coordinates. In addition, the main processor 710 outputs sound data to the sound driving circuit 340 that drives the sound generating device 510 in order to output sound by vibrating the display panel 300 by the sound generating device 510 can do. The main processor 710 may be an application processor made of an integrated circuit, a central processing unit, or a system chip.

The camera device 720 processes an image frame such as a still image or a moving picture obtained by an image sensor in a camera mode and outputs it to the main processor 710.

A cable 314 passing through the cable hole CAH of the bracket 600 may be connected to the main connector 730. Accordingly, the main circuit board 700 may be electrically connected to the display circuit board 310.

In addition, the main circuit board 700 may be further equipped with a mobile communication module capable of transmitting and receiving a wireless signal with at least one of a base station, an external terminal, and a server on a mobile communication network. The wireless signal may include a voice signal, a video call signal, or various types of data according to transmission and reception of text/multimedia messages.

The lower cover 900 may be disposed under the bracket 600 and the main circuit board 700. The lower cover 900 may be fastened to and fixed to the bracket 600. The lower cover 900 may form a lower surface of the display device 10. The lower cover 900 may include plastic, metal, or both plastic and metal.

A third camera hole CMH3 through which the lower surface of the camera device 720 is exposed may be formed in the lower cover 900. The position of the camera device 720 and the positions of the second and third camera holes CMH2 and CMH3 corresponding to the camera device 720 are not limited to the embodiment illustrated in FIG. 2.

3 is a bottom view illustrating an example of a display panel attached to the cover window of FIG. 2. 4 is a plan view showing an example of the bracket of FIG. 2. 5 is a plan view showing the main circuit board of FIG. 2.

3 to 5, a lower panel cover 400 may be disposed under the display panel 300. The lower panel cover 400 may be attached to the lower surface of the display panel 300 through an adhesive member. The adhesive member may be a pressure sensitive adhesive (PSA).

The panel lower cover 400 includes at least one of a light absorbing member for absorbing light incident from the outside, a buffer member for absorbing shock from the outside, and a heat dissipating member for efficiently dissipating heat from the display panel 300. Can include.

The light absorbing member may be disposed under the display panel 300. The light absorbing member prevents the transmission of light to prevent the elements disposed under the light absorbing member, for example, the display circuit board 310, the sound generating device 510, etc. from being visually recognized from the top of the display panel 300 do. The light absorbing member may include a light absorbing material such as black pigment or dye.

The buffer member may be disposed under the light absorbing member. The buffer member absorbs an external impact and prevents the display panel 300 from being damaged. The buffer member may be made of a single layer or a plurality of layers. For example, the cushioning member is formed of a polymer resin such as polyurethane, polycarbonate, polypropylene, polyethylene, etc., or foam-molded rubber, urethane-based material, or acrylic-based material It may include a material having elasticity such as a sponge. The cushioning member may be a cushion layer.

The heat dissipation member may be disposed under the buffer member. The heat dissipation member may include a first heat dissipation layer including graphite or carbon nanotubes, and a second heat dissipation layer formed of a metal thin film such as copper, nickel, ferrite, or silver that can shield electromagnetic waves and has excellent thermal conductivity.

Meanwhile, the lower panel cover 400 may be omitted, and in this case, a configuration disposed on the lower surface of the panel lower cover 400, for example, the display circuit board 310 instead of the lower surface of the panel lower cover 400 It may be disposed on the lower surface of the display panel 300.

The display circuit board 310 may be bent as shown in FIG. 3 and disposed under the panel lower cover 400. The display circuit board 310 may be fixed or adhered to the lower surface of the panel lower cover 400 by a fixing member such as a screw or an adhesive member such as a pressure sensitive adhesive under the panel lower cover 400.

The display circuit board 310 may include a first circuit board 311 and a second circuit board 312. For example, the first circuit board 311 and the second circuit board 312 may be a rigid printed circuit board or a flexible printed circuit board. When one of the first circuit board 311 and the second circuit board is a rigid printed circuit board and the other is a flexible printed circuit board, the display circuit board 310 may be a composite printed circuit board.

3 illustrates that the second circuit board 312 extends from one side of the first circuit board 311 in the second direction (Y-axis direction). The width of the second circuit board 312 in the first direction (X-axis direction) may be smaller than the width of the first circuit board 311 in the first direction (X-axis direction).

A sound generating device 510 may be disposed on one surface of the first circuit board 311. The sound generating device 510 is formed on the display circuit board 310 by means of an adhesive member such as a pressure sensitive adhesive, an anisotropy conductive paste and an anisotropy conductive film, or solder. Can be fixed to Since the display circuit board 310 is fixed to the lower panel cover 400, the display panel 300 may vibrate in the thickness direction (Z-axis direction) by the sound generating device 510.

The touch driving circuit 330 and the sound driving circuit 340 may be disposed on one surface of the second circuit board 312, and the first connector 313 may be disposed on the other surface. The first connector 313 may include an insertion part connected to the first connection terminal of the cable 314.

The first connection terminal disposed at one end of the cable 314 may be inserted into the insertion portion of the first connector 313. The second connection terminal disposed at the other end of the cable 314 is bent to the bottom of the main circuit board 700 through a cable hole CAH penetrating the bracket 600 as shown in FIGS. 4 and 5, and the main connector 730 ) Can be inserted into the insertion part.

According to the exemplary embodiment illustrated in FIGS. 3 to 5, a sound generating device 510 for vibrating the display panel 300 is disposed on one surface of the display circuit board 310 to output sound. For this reason, the display panel 300 may be used as a vibration surface using the sound generating device 510 that is not exposed to the outside to output sound. Accordingly, since the call receiver for outputting the voice of the other party can be deleted from the front of the display device, the transparent portion DA100 of the cover window 100 can be widened, so that an image is displayed by the display panel 300. You can broaden your area.

6 is an enlarged bottom view showing in detail area A of FIG. 3.

Referring to FIG. 6, in the display circuit board 310, the sound generating device 510 and the sound connector 530 may be disposed on the first circuit board 311. The sound generating device 510 and the sound connector 530 may be connected by a flexible circuit board 520.

The flexible circuit board 520 may include a first driving line 522 and a second driving line 523. The first driving line 522 and the second driving line 523 of the flexible circuit board 520 are exposed to the second surface of the sound generating device 510 and the first electrode pad 514 and the second electrode pad 515. ) Can each be electrically connected. One end of the flexible circuit board 520 may be connected to the acoustic connector 530.

The acoustic connector 530 serves to electrically connect the lead lines of the first circuit board 311 and the flexible circuit board 520. The acoustic connector 530 may be implemented as an acoustic connector 531 as shown in FIG. 7A or as an acoustic circuit film 532 as shown in FIG. 16A.

7A is a cross-sectional view illustrating an example of Ⅰ-Ⅰ' of FIG. 6. 7B is a detailed cross-sectional view illustrating the display circuit board, the sound generating device, and the sound connector of FIG. 7C is a detailed cross-sectional view illustrating the sound generating device and the flexible circuit board of FIG. 7A. 7A and 7B illustrate a case in which the acoustic connector 530 is an acoustic connector 531.

7A to 7C, the display panel 300 may include a substrate SUB1, a pixel array layer PAL, and a polarizing film PF.

The substrate SUB1 may be a rigid substrate or a flexible substrate capable of bending, folding, rolling, or the like. The substrate SUB1 may be made of an insulating material such as glass, quartz, or polymer resin. Examples of polymeric materials include polyethersulphone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylenenapthalate (PEN), Polyethyleneterepthalate (PET), polyphenylenesulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT) , Cellulose acetate propionate (CAP) or a combination thereof. The substrate SUB1 may include a metal material.

The pixel array layer PAL may be disposed on the substrate SUB1. The pixel array layer PAL may be a layer that displays an image including pixels PX. As shown in FIG. 8, the pixel array layer PAL may include a thin film transistor layer 303, a light emitting device layer 304, and a thin film encapsulation layer 305.

A polarizing film PF may be disposed on the pixel array layer PAL in order to prevent a decrease in visibility due to reflection of external light. The polarizing film PF may include a linear polarizing plate and a phase delay film such as a λ/4 plate. In this case, a phase delay film may be disposed on the pixel array layer PAL, and a linear polarizing plate may be disposed between the phase delay film and the cover window 100.

The lower panel cover 400 may be disposed on the first surface of the display panel 300, and the cover window 100 may be disposed on the second surface. That is, the lower panel cover 400 may be disposed on the substrate SUB1 of the display panel 300, and the cover window 100 may be disposed on the polarizing film PF.

A display circuit board 310 may be disposed on the lower panel cover 400. The first surface of the display circuit board 310 may be a surface facing the lower panel cover 400, and the second surface may be a surface opposite to the first surface. As shown in FIG. 7A, the display circuit board 310 may be attached to and fixed to the lower panel cover 400 through an adhesive member 360 such as a pressure sensitive adhesive, but is not limited thereto. For example, the display circuit board 310 may be fixed to the panel lower cover 400 through a fixing member such as a screw.

The display circuit board 310 includes a first base layer 310a, lead lines 310b and 310c disposed on one surface of the first base layer 310a, and lead lines 310b and 310c as shown in FIG. 7B. ) May include a first solder-resist layer 310d disposed on it. The first base layer 310a may be formed of rigid or soft plastic. Among the lead lines 310b and 310c, the first lead lines 310b indicate lead lines that are not connected to the acoustic connector 531, and the second lead lines 310c refer to the lead lines connected to the acoustic connector 531. Point. The first solder resist layer 310d refers to an insulating layer protecting the lead lines 310b and 310c.

One side of the flexible film 350 may be attached on one side of the substrate SUB1 using an anisotropic conductive film. The other side of the flexible film 350 may be attached on the second surface of the display circuit board 310 using an anisotropic conductive film.

The sound generating device 510 may be disposed on the second surface of the display circuit board 310. The first surface of the sound generating device 510 may be a surface facing the display circuit board 310, and the second surface may be a surface opposite to the first surface. The first surface of the sound generating device 510 may be attached to the second surface of the display circuit board 310 through the first adhesive member 550. The first adhesive member 550 may be a pressure sensitive adhesive. That is, the first adhesive member 550 may be disposed between the sound generating device 510 and the solder resist layer 310d of the display circuit board 310 as shown in FIG. 7A. The sound generating device 510 may overlap the first lead lines 310b of the lead lines 310b and 310c.

On the second surface of the sound generating device 510, the first electrode pad 514 and the second electrode pad 515 of the sound generating device 510 are disposed on the outside of the sound generating device 510 as shown in FIG. 7C. It may be exposed without being covered by the protective layer 519.

The sound generating device 510 may be connected to the sound connector 531 through a flexible printed circuit (FPC) 520. The flexible circuit board 520 may be disposed on the second surface of the sound generating device 510.

The flexible circuit board 520 includes a second base layer 521, a first driving line 522, a second driving line 523, a connection terminal 524, and a second solder resist layer 525 as shown in FIG. 7C. It may include.

The second base layer 521 may be a rigid or soft plastic. A first driving line 522 and a second driving line 523 are disposed on the second base layer 521, and a second solder resist layer 525 is disposed on the first driving line 522 and the second driving line 523. ) Can be placed. The second solder resist layer 525 may be an insulating layer for protecting the first driving line 522 and the second driving line 523.

The first driving line 522 may be electrically connected to the first electrode pad 514, and the second driving line 523 may be electrically connected to the second electrode pad 515. An anisotropic conductive adhesive member 516 may be disposed between the first driving line 522 and the first electrode pad 514 and between the second driving line 523 and the second electrode pad 515.

The connection terminal 524 may be formed on one end of the flexible circuit board 520. The connection terminal 524 may be connected to the first driving line 522 and the second driving line 523. The connection terminal 524 may be inserted into the insertion part 531a of the acoustic connector 531.

The acoustic connector 531 is disposed on the second surface of the display circuit board 310 and may include an insertion part 531a into which the connection terminal 524 of the flexible circuit board 520 is inserted. 7 illustrates that the insertion portion 531a is disposed on the lower surface of the acoustic connector 531 in order to easily insert the connection terminal 524 of the flexible circuit board 520, but the position of the insertion portion 531a is Not limited. For example, the insertion part 531a may be disposed on one side of the sound connector 531 facing one side of the sound generating device 510.

The acoustic connector 531 is disposed on the first base layer 310a of the display circuit board 310 as shown in FIG. 7B, and may be connected to the second lead lines 310c of the lead lines 310b and 310c. . The acoustic connector 531 may be connected to the acoustic driving circuit 340 through the second lead lines 310c. Therefore, the first driving voltage of the sound driving circuit 340 is the first driving voltage of the sound generating device 510 through one of the second lead lines 310c, the sound connector 531, and the first driving line 522. It may be applied to the first electrode pad 514. In addition, the second driving voltage of the sound driving circuit 340 is the second driving voltage of the sound generating device 510 through the other one of the second lead lines 310c, the sound connector 531, and the second driving line 523. 2 It may be applied to the electrode pad 515.

7A to 7C, the sound generating device 510 is attached to one surface of the display circuit board 310 through an adhesive member, and the display circuit board 310 through the flexible circuit board 520. ) May be electrically connected to the acoustic connector 531 disposed on one side of the). Therefore, the sound generating device 510 may be integrally formed with the display circuit board 310 in the manufacturing step of the display circuit board 310. Accordingly, since a process or equipment for separately attaching the sound generating device 510 to the lower surface of the panel lower cover 400 can be omitted, manufacturing cost can be reduced. In addition, there is no need to provide a separate space for the sound generating device 510 to be attached to the lower panel cover 400.

8 is a cross-sectional view illustrating a display area of the display panel of FIG. 7A in detail.

Referring to FIG. 8, the display panel 300 may include a substrate SUB1 and a pixel array layer PAL. As shown in FIG. 8, the pixel array layer PAL may include a thin film transistor layer 303, a light emitting device layer 304, and a thin film encapsulation layer 305.

A buffer layer 302 may be formed on the substrate SUB1. The buffer layer 302 may be formed on the substrate SUB1 to protect the thin film transistors 335 and light emitting devices from moisture penetrating through the substrate SUB1 vulnerable to moisture permeation. The buffer layer 302 may be formed of a plurality of inorganic layers alternately stacked. For example, the buffer layer 302 may be formed as a multilayer in which one or more inorganic layers of a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), and SiON are alternately stacked. The buffer layer may be omitted.

A thin film transistor layer 303 is formed on the buffer layer 302. The thin film transistor layer 303 includes thin film transistors 335, a gate insulating film 336, an interlayer insulating film 337, a protective film 338, and a planarization film 339.

Each of the thin film transistors 335 includes an active layer 331, a gate electrode 332, a source electrode 333, and a drain electrode 334. 8 illustrates that the thin film transistor 335 is formed in an upper gate (top gate) method in which the gate electrode 332 is positioned above the active layer 331, it should be noted that the present invention is not limited thereto. That is, in the thin film transistors 335, a lower gate (bottom gate) method in which the gate electrode 332 is positioned under the active layer 331 or the gate electrode 332 is formed on the upper and lower portions of the active layer 331 It may be formed in a double gate method located in both.

An active layer 331 is formed on the buffer layer 302. The active layer 331 may be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. A light blocking layer for blocking external light incident on the active layer 331 may be formed between the buffer layer 302 and the active layer 331.

A gate insulating layer 336 may be formed on the active layer 331. The gate insulating layer 316 may be formed of an inorganic layer, for example, a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), or multiple layers thereof.

A gate electrode 332 and a gate line may be formed on the gate insulating layer 316. The gate electrode 332 and the gate line are any of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be formed as a single layer or multiple layers made of one or an alloy thereof.

An interlayer insulating layer 337 may be formed on the gate electrode 332 and the gate line. The interlayer insulating layer 337 may be formed of an inorganic layer, for example, a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), or multiple layers thereof.

A source electrode 333, a drain electrode 334, and a data line may be formed on the interlayer insulating layer 337. Each of the source electrode 333 and the drain electrode 334 may be connected to the active layer 331 through a contact hole passing through the gate insulating layer 336 and the interlayer insulating layer 337. The source electrode 333, the drain electrode 334, and the data line are molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd). And it may be formed of a single layer or multiple layers made of any one of copper (Cu) or an alloy thereof.

A protective layer 338 for insulating the thin film transistor 335 may be formed on the source electrode 333, the drain electrode 334, and the data line. The protective layer 338 may be formed of an inorganic layer, for example, a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), or multiple layers thereof.

A planarization layer 339 may be formed on the passivation layer 338 to flatten a step due to the thin film transistor 335. The planarization film 339 may be formed of an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, and a polyimide resin. have.

A light emitting element layer 304 is formed on the thin film transistor layer 303. The light emitting element layer 304 includes light emitting elements and a pixel defining layer 344.

The light emitting elements and the pixel defining layer 344 are formed on the planarization layer 339. The light emitting device is exemplified as an organic light emitting device including an anode electrode 341, light emitting layers 342, and a cathode electrode 343.

The anode electrode 341 may be formed on the planarization layer 339. The anode electrode 341 may be connected to the source electrode 333 of the thin film transistor 335 through a contact hole penetrating the passivation layer 338 and the planarization layer 339.

The pixel defining layer 344 may be formed to cover an edge of the anode electrode 341 on the planarization layer 339 to partition pixels. That is, the pixel defining layer 344 serves as a pixel defining layer defining pixels. In each of the pixels, an anode electrode 341, a light emitting layer 342, and a cathode electrode 343 are sequentially stacked so that holes from the anode electrode 341 and electrons from the cathode electrode 343 are mutually integrated in the light emitting layer 342. It represents a region that is combined and emits light.

Emission layers 342 are formed on the anode electrode 341 and the pixel defining layer 344. The emission layer 342 may be an organic emission layer. The emission layer 342 may emit one of red light, green light, and blue light. Alternatively, the emission layer 342 may be a white emission layer emitting white light, and in this case, a red emission layer, a green emission layer, and a blue emission layer may be stacked, and may be a common layer formed in common with pixels. In this case, the display panel 300 may further include separate color filters for displaying red, green, and blue colors.

The emission layer 342 may include a hole transporting layer, a light emitting layer, and an electron transporting layer. In addition, the light emitting layer 342 may be formed in a tandem structure of two or more stacks, and in this case, a charge generation layer may be formed between the stacks.

The cathode electrode 343 is formed on the emission layer 342. The second electrode 343 may be formed to cover the emission layer 342. The second electrode 343 may be a common layer commonly formed in pixels.

When the light emitting element layer 304 is formed in a top emission method that emits light in an upward direction, the anode electrode 341 is a laminated structure of aluminum and titanium (Ti/Al/Ti), and a laminated structure of aluminum and ITO (ITO/Al/ITO), APC alloy, and a laminated structure of APC alloy and ITO (ITO/APC/ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu). In addition, the cathode electrode 263 is a transparent metallic material (TCO, Transparent Conductive Material) such as ITO and IZO that can transmit light, or magnesium (Mg), silver (Ag), or magnesium (Mg) and silver (Ag). ) May be formed of a semi-transmissive conductive material such as an alloy. When the cathode electrode 343 is formed of a semi-transmissive metal material, light emission efficiency may be increased due to microcavities.

When the light emitting device layer 304 is formed in a bottom emission method that emits light in a downward direction, the anode electrode 341 is a transparent metal material such as ITO or IZO (TCO, Transparent Conductive Material) or magnesium (Mg). , Silver (Ag), or may be formed of a semi-transmissive conductive material such as an alloy of magnesium (Mg) and silver (Ag). The second electrode 343 is a laminated structure of aluminum and titanium (Ti/Al/Ti), a laminated structure of aluminum and ITO (ITO/Al/ITO), an APC alloy, and a laminated structure of APC and ITO (ITO/APC /ITO) can be formed of a highly reflective metal material. When the anode electrode 341 is formed of a semi-transmissive metal material, light emission efficiency may be increased due to microcavities.

A thin film encapsulation layer 305 is formed on the light emitting device layer 304. The thin film encapsulation layer 305 serves to prevent penetration of oxygen or moisture into the light emitting layer 342 and the cathode electrode 343. To this end, the thin film encapsulation layer 305 may include at least one inorganic layer. The inorganic film may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. In addition, the thin film encapsulation layer 305 may further include at least one organic layer. The organic layer may be formed to have a sufficient thickness to prevent particles from penetrating the thin film encapsulation layer 305 and being injected into the light emitting layer 342 and the cathode electrode 343. The organic film may include any one of epoxy, acrylate, or urethane acrylate.

A touch sensor layer may be formed on the thin film encapsulation layer 305. When the touch sensor layer is directly formed on the thin film encapsulation layer 305, there is an advantage in that the thickness of the display device 10 can be reduced compared to when a separate touch panel is attached to the thin film encapsulation layer 305.

The touch sensor layer may include touch electrodes for sensing a user's touch in a capacitive manner, and touch lines connecting the pads and the touch electrodes. For example, the touch sensor layer may sense a user's touch using a self-capacitance method or a mutual capacitance method.

9 is a cross-sectional view illustrating an example of the sound generating device of FIG. 7A. 10 is an exemplary view showing a method of vibrating a vibration layer disposed between a first branch electrode and a second branch electrode of the sound generating device. 11 and 12 are exemplary views illustrating a method of vibrating a display panel by vibration of the sound generating device of FIG. 10.

9 to 12, the sound generating device 510 is a piezoelectric element or piezoelectric element that vibrates the display panel 300 using a piezoelectric material that contracts or expands according to an applied voltage. It may be a piezoelectric actuator. The sound generating device 510 may include a vibration layer 511, a first electrode 512, and a second electrode 513.

The first electrode 512 may include a first stem electrode 5121 and first branch electrodes 5122. The first stem electrode 5121 may be disposed on at least one side of the vibration layer 511 as shown in FIG. 9. Alternatively, the first stem electrode 5121 may be disposed through a part of the vibration layer 511. The first stem electrode 5121 may be disposed on the upper surface of the vibration layer 511. The first branch electrodes 5122 may be branched from the first stem electrode 5121. The first branch electrodes 5122 may be disposed parallel to each other.

The second electrode 513 may include a second stem electrode 5131 and second branch electrodes 5132. The second electrode 513 may be disposed apart from the first electrode 512. Accordingly, the second electrode 513 may be electrically separated from the first electrode 512. The second stem electrode 5131 may be disposed on at least one side of the vibration layer 511. In this case, the first stem electrode 5121 may be disposed on the first side of the vibration layer 511, and the second stem electrode 5131 may be disposed on the second side of the vibration layer 511. Alternatively, the second stem electrode 5131 may be disposed through a part of the vibration layer 511. The second stem electrode 5131 may be disposed on the upper surface of the vibration layer 511. The second branch electrodes 5132 may be branched from the second stem electrode 5131. The second branch electrodes 5132 may be disposed parallel to each other.

The first branch electrodes 5122 and the second branch electrodes 5132 may be disposed parallel to each other in a horizontal direction (X-axis direction or Y-axis direction). In addition, the first branch electrodes 5122 and the second branch electrodes 5132 may be alternately disposed in the vertical direction (Z-axis direction). That is, the first branch electrodes 5122 and the second branch electrodes 5132 are the first branch electrode 5122, the second branch electrode 5132, and the first branch electrode 5122 in the vertical direction (Z-axis direction). , The second branch electrodes 5132 may be repeatedly disposed in the order.

The first electrode pad 514 connected to the first electrode 512 and the second electrode pad 515 connected to the second electrode 513 may be exposed without being covered by the protective layer 519. Therefore, the first electrode pad 514 and the second electrode pad 515 may be connected to the first driving line 522 and the second driving line 523 of the flexible circuit board 520.

The vibration layer 511 may be a piezoelectric element that is deformed according to a driving voltage applied to the first electrode 512 and a driving voltage applied to the second electrode 513. In this case, the vibration layer 511 may be any one of a piezoelectric material such as a Poly Vinylidene Fluoride (PVDF) film or a PZT (Plumbum Ziconate Titanate), or an Electro Active Polymer.

Since the manufacturing temperature of the vibration layer 511 is high, the first electrode 512 and the second electrode 513 may be formed of silver (Ag) having a high melting point or an alloy of silver (Ag) and palladium (Pd). In order to increase the melting point of the first electrode 512 and the second electrode 513, when the first electrode 512 and the second electrode 513 are formed of an alloy of silver (Ag) and palladium (Pd), The content of silver (Ag) may be higher than the content of palladium (Pd).

The vibration layer 511 may be disposed between the first branch electrodes 5122 and the second branch electrodes 5132. The vibration layer 511 contracts or expands according to a difference between the driving voltage applied to the first branch electrode 5122 and the driving voltage applied to the second branch electrode 5132.

Specifically, as shown in FIG. 10, the polarity direction of the vibration layer 511 disposed between the first branch electrode 5122 and the second branch electrode 5132 disposed below the first branch electrode 5122 is the upper direction (↑ ), the vibration layer 511 may have a positive polarity in an upper region adjacent to the first branch electrode 5122 and a negative polarity in a lower region adjacent to the second branch electrode 5132. In addition, when the polarity direction of the vibration layer 511 disposed between the second branch electrode 5132 and the first branch electrode 5122 disposed under the second branch electrode 5132 is the downward direction (↓), the vibration layer The 511 may have a negative polarity in an upper region adjacent to the second branch electrode 5132, and may have a positive polarity in a lower region adjacent to the first branch electrode 5122. The polarity direction of the vibration layer 511 may be determined by a polling process in which an electric field is applied to the vibration layer 511 using the first branch electrode 5122 and the second branch electrode 5132.

When the polarity direction of the vibration layer 511 disposed between the first branch electrode 5122 and the second branch electrode 5132 disposed under the first branch electrode 5122 as shown in FIG. 10 is the upper direction (↑) , When a positive driving voltage is applied to the first branch electrode 5122 and a negative driving voltage is applied to the second branch electrode 5122, the vibration layer 511 may contract according to the first force F1. have. The first force F1 may be a contractile force. In addition, when a driving voltage having a negative polarity is applied to the first branch electrode 5122 and a driving voltage having a positive polarity is applied to the second branch electrode 5122, the vibration layer 511 expands according to the second force F2. I can. The second force F2 may be an elongation force.

Similarly, when the polarity of the vibration layer 511 disposed between the second branch electrode 5132 and the first branch electrode 5122 disposed under the second branch electrode 5132 is in the lower direction (↓) , When a positive driving voltage is applied to the second branch electrode 5132 and a negative driving voltage is applied to the first branch electrode 5122, the vibration layer 511 may expand according to the elongation force. Further, when a negative driving voltage is applied to the second branch electrode 5132 and a positive driving voltage is applied to the first branch electrode 5122, the vibration layer 511 may contract according to the contraction force.

When the driving voltage applied to the first electrode 512 and the driving voltage applied to the second electrode 513 are alternately repeated with positive and negative polarities, the vibration layer 511 contracts and expands as shown in FIGS. 11 and 12. Is repeated. Due to this, the sound generating device 510 vibrates. Since the sound generating device 510 is disposed on one surface of the heat dissipating film 130, when the vibration layer 511 of the sound generating device 510 contracts and expands, the display panel 300 is stressed as shown in FIGS. 11 and 12. As a result, the display panel 300 vibrates in a third direction (Z-axis direction) that is a thickness direction.

A protective layer 519 may be disposed on the second surface and side surfaces of the sound generating device 510. That is, protection on the exposed vibration layer 511 without being covered by the first electrode 512, the second electrode 513, and the first electrode 512 and the second electrode 513 of the sound generator 510 Layer 519 may be disposed. The protective layer 519 is to be disposed to surround the exposed vibration layer 511 without being covered by the first electrode 512, the second electrode 513, and the first electrode 512 and the second electrode 513. I can. Therefore, the vibration layer 511, the first electrode 512, and the second electrode 513 of the sound generating device 510 may be protected by the protective layer 519. The protective layer 519 may be formed of an insulating material such as ceramic.

According to the embodiments illustrated in FIGS. 9 to 12, sound may be output by the sound generating device 510 vibrating the display panel 300 according to the first driving voltage and the second driving voltage in the sound mode.

13 is a graph showing the sound pressure level of the sound generating device according to the frequency for each attachment position of the sound generating device.

In FIG. 13, the X-axis indicates the frequency (Hz) of sound output by vibrating the display panel 300 by the sound generator 510, and the Y-axis indicates the sound pressure level (dB) of the sound. 13, when the center of the sound generating device 510 is attached to the reference position (①), when attached to the left side (②) than the reference position, when attached to the right side (③) than the reference position, the reference position 1 When attached to the upper side (④), when attached to the second upper side (⑤) than the reference position, the sound pressure level according to the frequency of the sound output by vibrating the display panel 300 by the sound generating device 510 Is shown. The second upper side (⑤) is farther from the reference position than the first upper side (④).

Referring to FIG. 13, when the center of the sound generating device 510 is attached to the left (②) or right (③) than the reference position, the sound pressure level according to the frequency of the sound is determined by the frequency of the sound at the reference position (①). There is little difference with the sound pressure level. However, when attached to the first upper side (④) or the second upper side (⑤) than the reference position, the sound pressure level according to the frequency of the sound is different from the sound pressure level according to the frequency of the sound in the case of the reference position (①). In particular, the difference is large in the low frequency band between 100 Hz and 800 Hz. Therefore, in the sound generating device 510, the error attached to the left or right of the reference position is irrelevant when considering the sound pressure level according to the frequency of the sound, and the error attached to the upper or lower side of the reference position is the sound pressure according to the frequency of the sound. This is not desirable considering the level. Therefore, when considering the change in the sound pressure level of the sound due to the attachment error of the sound generating device 510, the length of the display circuit board 310 in the first direction (X-axis direction) which is the left and right direction as shown in FIG. It is preferable that the length of the board 310 is longer than the length of the second direction (Y-axis direction) which is the vertical direction.

14 is a graph showing the sound pressure level of the sound generator for each frequency according to the thickness of the first circuit board and the thickness of the first adhesive member when the first circuit board to which the sound generator is attached is a flexible printed circuit board.

In FIG. 14, the X-axis indicates the frequency (Hz) of sound output by vibrating the display panel 300 by the sound generating device 510, and the Y-axis indicates the sound pressure level (dB) of the sound. In FIG. 14, if the thickness of the first adhesive member 550 is 0.12 mm without the first circuit board 311 (①), the thickness of the first circuit board 311 is 0.10 mm and the thickness of the first adhesive member 550 When the thickness is 0.24 mm (②), when the thickness of the first circuit board 311 is 0.20 mm and the thickness of the first adhesive member 550 is 0.24 mm (③), and the first circuit board 311 When the thickness is 0.40 mm and the thickness of the first adhesive member 550 is 0.24 mm (④), the sound pressure level (㏈) according to the frequency of the sound is shown. As shown in FIG. 14, as the thickness of each of the first circuit board 311 and the first adhesive member 550 to which the sound generating device 510 is attached is thinner, the sound pressure level (dB) according to the frequency of the sound may increase. However, in the four cases (①, ②, ③, ④), the difference between the sound pressure level (㏈) according to the frequency of the sound is at most 10 dB or less. That is, it can be seen that the influence of the thickness of each of the first circuit board 311 and the first adhesive member 550 on the sound pressure level (dB) according to the frequency of the sound is not significant.

15 is a graph showing the sound pressure level of the sound generating device for each frequency according to the thickness of the first circuit board and the thickness of the first adhesive member when the first circuit board to which the sound generating device is attached is a rigid printed circuit board.

In FIG. 15, the X-axis indicates the frequency (Hz) of sound output by vibrating the display panel 300 by the sound generator 510, and the Y-axis indicates the sound pressure level (dB) of the sound. In FIG. 15, the thickness of the first adhesive member 550 without the first circuit board 311 is 0.12 mm (①) and the thickness of the first circuit board 311 is 0.25 mm and the thickness of the first adhesive member 550 When the thickness is 0.24 mm (②), the sound pressure level (㏈) according to the frequency of the sound is shown. As shown in FIG. 15, in the two cases (①, ②), the difference between the sound pressure level (dB) according to the frequency of the sound is at most 10dB or less. That is, it can be seen that the influence of the thickness of each of the first circuit board 311 and the first adhesive member 550 on the sound pressure level (dB) according to the frequency of the sound is not significant.

16A is a cross-sectional view illustrating another example of Ⅰ-Ⅰ' of FIG. 6. 16B is a cross-sectional view showing in detail the flexible circuit board and the acoustic circuit film of FIG. 16A. 16A and 16B illustrate a case where the acoustic connection part 350 is an acoustic circuit film 352.

In the embodiment shown in FIGS. 16A and 16B, the flexible circuit board 520 includes circuit pads 525 and 526 instead of the connection terminal 524, and the acoustic circuit film 352 is replaced with the acoustic connector 531. There is a difference from the embodiment shown in FIG. 7A in that it is disposed on the display circuit board 310. In FIG. 16A, differences from the embodiment shown in FIG. 7A will be mainly described.

16A and 16B, the flexible circuit board 520 includes a second base layer 521, a first driving line 522, a second driving line 523, a second solder resist layer 525, and A first circuit pad 526 and a second circuit pad 527 may be included.

The second base layer 521, the first driving line 522, the second driving line 523, and the second solder resist layer 525 of the flexible circuit board 520 are described in conjunction with FIGS. 7A and 7C. Since it is substantially the same as that, description of these will be omitted.

A first circuit pad 526 may be formed at the other end disposed opposite to one end of the first driving line 522 connected to the first electrode pad 514. A second circuit pad 527 may be formed at the other end disposed opposite to one end of the second driving line 523 connected to the second electrode pad 515.

The acoustic circuit film 532 is disposed on the second surface of the display circuit board 310 and is electrically connected to the first circuit pad 526 and the second circuit pad 527 of the flexible circuit board 520. It may include a 1 film pad 532a and a second film pad. An anisotropic conductive adhesive member 540 may be disposed between the first circuit pad 526 and the first film pad 532a and between the second circuit pad 527 and the second film pad.

The first film pad 532a and the second film pad may be connected to the second lead lines 310c of the lead lines 310b and 310c, respectively. The acoustic circuit film 532 may be connected to the acoustic driving circuit 340 through the second lead lines 310c. Therefore, the first driving voltage of the sound driving circuit 340 is of the sound generating device 510 through any one of the second lead lines 310c, the sound circuit film 532, and the first driving line 522. It may be applied to the first electrode pad 514. In addition, the second driving voltage of the sound driving circuit 340 is the second driving voltage of the sound generating device 510 through the other one of the second lead lines 310c, the sound connector 531, and the second driving line 523. 2 It may be applied to the electrode pad 515.

16A and 16B, the sound generating device 510 is attached to one surface of the display circuit board 310 through an adhesive member, and the display circuit board 310 through the flexible circuit board 520. ) May be electrically connected to the acoustic circuit film 532 disposed on one side of the). The sound generating device 510 may be integrally formed with the display circuit board 310 in the manufacturing step of the display circuit board 310. Therefore, since a process or equipment for separately attaching the sound generating device 510 to the lower surface of the panel lower cover 400 can be omitted, manufacturing cost can be reduced. Accordingly, there is no need to separately provide a space in which the sound generating device 510 is attached to the lower panel cover 400.

FIG. 17 is an enlarged bottom view showing in detail area A of FIG. 3.

The embodiment shown in FIG. 17 is different from the embodiment shown in FIG. 6 in that the flexible circuit board 520 and the acoustic connector 530 are omitted. That is, in FIG. 17, the sound generating device 510 is electrically connected to the lead lines of the display circuit board 310 without the flexible circuit board 520 and the acoustic connection part 530. There is this. The sound generating device 510 may be electrically connected to the lead lines of the display circuit board 310 through a soldering part 560 as shown in FIGS. 18A and 18B. Alternatively, the sound generating device 510 may be electrically connected to lead lines of the display circuit board 310 through the anisotropic conductive adhesive member 570 as shown in FIGS. 19A, 19B, 20A, and 20B.

18A is a cross-sectional view illustrating another example of II-II' of FIG. 17. 18B is a detailed cross-sectional view illustrating the display circuit board of FIG. 18A and the sound generating device.

18A and 18B, the cover window 100, the substrate SUB1 of the display panel 300, the pixel array layer PAL, and the polarizing film PF, the flexible film 350, and the lower panel cover ( The description of 400) is substantially the same as that described in conjunction with FIG. 7A, and thus descriptions thereof will be omitted.

18A and 18B, a display circuit board 310 may be disposed on the lower panel cover 400. The first surface of the display circuit board 310 may be a surface facing the lower panel cover 400, and the second surface may be a surface opposite to the first surface. 18A and 18B, the display circuit board 310 may be attached to and fixed to the lower panel cover 400 through an adhesive member 360 such as a pressure sensitive adhesive, but is not limited thereto. For example, the display circuit board 310 may be fixed to the panel lower cover 400 through a fixing member such as a screw.

The display circuit board 310 includes a first base layer 310a, lead lines 310b disposed on one surface of the first base layer 310a, and lead lines 310b, as shown in FIGS. 18A and 18B. A first solder-resist layer 310d disposed on 310c) may be included. The first base layer 310a may be formed of rigid or soft plastic. The first solder resist layer 310d refers to an insulating layer protecting the lead lines 310b.

The sound generating device 510 may be disposed on the second surface of the display circuit board 310. The first surface of the sound generating device 510 may be a surface facing the display circuit board 310, and the second surface may be a surface opposite to the first surface. The first electrode pad 514 of the sound generating device 510 is a protective layer 519 disposed on the outside of the sound generating device 510 on the first surface of the sound generating device 510 as shown in FIGS. 18A and 18B Can be exposed without being covered by The second electrode pad 515 of the sound generating device 510 is also exposed without being covered by the protective layer 519 disposed on the outer side of the sound generating device 510 on the first surface of the sound generating device 510. I can. In addition, a portion of each of the lead lines 310b may be exposed without being covered by the first solder resist layer 310d.

Any of the first electrode pad 514 of the sound generating device 510 exposed without being covered by the protective layer 519 and the lead lines 310b exposed without being covered by the first solder resist layer 310d One may be electrically connected by the first soldering part 561. The first soldering part 561 refers to a region connecting any one of the first electrode pad 514 and the lead line 310b by soldering.

Among the second electrode pads 515 of the sound generating device 510 exposed without being covered by the protective layer 519 and the lead lines 310b exposed without being covered by the first solder resist layer 310d The other may be electrically connected by the second soldering part 562. The second soldering part 562 refers to a region connecting the second electrode pad 515 and another one of the lead lines 310b by soldering.

In order to stably fix the sound generating device 510 to the display circuit board 310 by soldering, the first soldering portion 561 is disposed close to the right side from the first surface of the sound generating device 510, and the second The soldering part 562 may be disposed close to the left side of the first surface of the sound generating device 510. When both the first soldering portion 561 and the second soldering portion 562 are disposed on one side of the first surface of the sound generating device 510, the dummy electrode pad and the first solder resist of the sound generating device 510 A dummy soldering part electrically connecting any one of the exposed lead lines 310b without being covered by the layer 310d may be disposed on a side opposite to one side of the first surface of the sound generating device 510. The dummy electrode pad is exposed without being covered by the protective layer 519, and may extend from the first electrode 512 or the second electrode 513 of the sound generating device 510.

The lead lines 310b of the display circuit board 310 may be connected to the sound driving circuit 340. Therefore, the first driving voltage of the sound driving circuit 340 is applied to the first electrode pad 514 of the sound generating device 510 through any one of the second lead lines 310c and the first soldering part 561. Can be authorized. In addition, the second driving voltage of the sound driving circuit 340 is applied to the second electrode pad 515 of the sound generating device 510 through another one of the second lead lines 310c and the second soldering part 562. Can be applied to.

18A and 18B, the first electrode pads 514 of the sound generating device 510 are connected to the lead lines 310b of the display circuit board 310 through the first soldering part 561. The second electrode pad 515 of the sound generating device 510 is connected to another one of the lead lines 310b of the display circuit board 310 through the second soldering part 562. I can. Therefore, the sound generating device 510 may be integrally formed with the display circuit board 310 in the manufacturing step of the display circuit board 310. Accordingly, since a process or equipment for separately attaching the sound generating device 510 to the lower surface of the panel lower cover 400 can be omitted, manufacturing cost can be reduced. In addition, there is no need to provide a separate space for the sound generating device 510 to be attached to the lower panel cover 400.

19A and 19B are cross-sectional views illustrating another example of II-II' of FIG. 17.

19A and 19B, the first electrode pad 514 and the second electrode pad 515 of the sound generating device 510 by using the anisotropic conductive adhesive member 570 instead of the soldering portion 560 There is a difference from the embodiment shown in FIGS. 18A and 18B in that each is electrically connected to the lead lines 310b of the display circuit board 310. In FIGS. 19A and 19B, differences from the embodiment shown in FIGS. 18A and 18B will be mainly described.

19A and 19B, an anisotropic conductive adhesive member 570 may be disposed between the second surface of the display circuit board 310 and the first surface of the sound generating device 510. Any of the first electrode pad 514 of the sound generating device 510 exposed without being covered by the protective layer 519 and the lead lines 310b exposed without being covered by the first solder resist layer 310d One may be electrically connected by an anisotropic conductive adhesive member 570. Among the second electrode pads 515 of the sound generating device 510 exposed without being covered by the protective layer 519 and the lead lines 310b exposed without being covered by the first solder resist layer 310d The other may be electrically connected by the anisotropic conductive adhesive member 570. The anisotropic conductive adhesive member 570 may be an adhesive or an adhesive film having conductive balls, for example, an anisotropy conductive paste or an anisotropy conductive film.

In order to stably fix the sound generating device 510 to the display circuit board 310 by the anisotropic conductive adhesive member 570, the anisotropic conductive adhesive member 570 includes the protective layer 519 of the sound generating device 510 and the It may be disposed between the first solder resist layer 310d of the display circuit board 310. That is, the bonding area between the sound generating device 510 and the display circuit board 310 may be increased.

The lead lines 310b of the display circuit board 310 may be connected to the sound driving circuit 340. Therefore, the first driving voltage of the sound driving circuit 340 is applied to the first electrode pad 514 of the sound generating device 510 through any one of the second lead lines 310c and the anisotropic conductive adhesive member 570. Can be authorized. In addition, the second driving voltage of the sound driving circuit 340 is applied to the second electrode pad 515 of the sound generating device 510 through the other one of the second lead lines 310c and the anisotropic conductive adhesive member 570. Can be applied to.

19A and 19B, the first electrode pads 514 of the sound generating device 510 are connected to the lead lines 310b of the display circuit board 310 through the anisotropic conductive adhesive member 570. The second electrode pad 515 of the sound generating device 510 is connected to another one of the lead lines 310b of the display circuit board 310 through the anisotropic conductive adhesive member 570 I can. Therefore, the sound generating device 510 may be integrally formed with the display circuit board 310 in the manufacturing step of the display circuit board 310. Accordingly, since a process or equipment for separately attaching the sound generating device 510 to the lower surface of the panel lower cover 400 can be omitted, manufacturing cost can be reduced. In addition, there is no need to provide a separate space for the sound generating device 510 to be attached to the lower panel cover 400.

20A and 20B are cross-sectional views illustrating another example of II-II' of FIG. 17.

20A and 20B, instead of the anisotropic conductive adhesive member 570 between the protective layer 519 of the sound generating device 510 and the first solder resist layer 310d of the display circuit board 310 There is a difference from the embodiment shown in FIGS. 19A and 19B in that the second adhesive member 580 is attached. That is, in FIGS. 20A and 20B, the second adhesive member 580 may be disposed between at least a portion of the first surface of the sound generating device 510 and the second surface of the display circuit board 310. Also, the second adhesive member 580 may not overlap the first electrode pad 514 and the second electrode pad 515 in the thickness direction (Z-axis direction) of the display circuit board 310.

21 is an enlarged bottom view showing in detail area A of FIG. 3.

In the embodiment illustrated in FIG. 21, the flexible circuit board 520 and the acoustic connection part 530 are omitted, and the sound generating device 510 is disposed between the panel lower cover 400 and the display circuit board 310. There are differences from the embodiment shown in 6. That is, in FIG. 21, differences from the embodiment shown in FIG. 6 in that the sound generating device 510 is electrically connected to the lead lines of the display circuit board 310 without the flexible circuit board 520 and the acoustic connection part 530. There is this.

The sound generating device 510 may be electrically connected to the lead lines of the display circuit board 310 through a soldering part 560 as shown in FIG. 22. The embodiment illustrated in FIG. 22 is substantially the same as described in connection with FIGS. 18A and 18B except that the sound generating device 510 is disposed between the panel lower cover 400 and the display circuit board 310. A description of the embodiment shown in FIG. 22 will be omitted.

Alternatively, the sound generating device 510 may be electrically connected to the lead lines of the display circuit board 310 through the anisotropic conductive adhesive member 570 as shown in FIGS. 23 and 24. 23 and 24, except that the sound generating device 510 is disposed between the panel lower cover 400 and the display circuit board 310, FIGS. 19A, 19B, 20A, and 20B are shown. Since it is substantially the same as described in conjunction with each other, descriptions of the embodiments shown in FIGS. 23 and 24 will be omitted.

Embodiments of the present invention have been described above with reference to the accompanying drawings, but those of ordinary skill in the art to which the present invention pertains can be implemented in other specific forms without changing the technical spirit or essential features of the present invention. You can understand. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not limiting.

10: display device 100: cover window
300: display panel 310: display circuit board
311: first circuit board 312: second circuit board
313: first connector 314: cable
320: display driving circuit 330: touch driving circuit
340: acoustic drive circuit 350: flexible film
360: adhesive member 400: panel lower cover
510: vibration generating device 511: vibration layer
5111: first vibration layer 5112: second vibration layer
5113: third vibration layer 512: first electrode
5121: first stem electrode 5122: first branch electrode
513: second electrode 5131: second stem electrode
5132: second branch electrode 514: first electrode pad
515: second electrode pad 520: flexible circuit board
530: acoustic connector 531: acoustic connector
532: acoustic circuit film 540: anisotropic conductive film
550: first adhesive member 560: soldering portion
561: first soldering portion 562: second soldering portion
570: anisotropic conductive adhesive member 580: second adhesive member
600: bracket 700: main circuit board
900: lower cover

Claims (26)

Base layer;
Lead lines disposed on the base layer; And
A circuit board disposed on the lead lines and including a sound generating device that contracts and expands according to driving voltages. The method of claim 1,
The sound generating device,
A first electrode to which a first driving voltage is applied;
A second electrode to which a second driving voltage is applied;
A vibration layer disposed between the first electrode and the second electrode and contracting or expanding according to the first driving voltage and the second driving voltage;
A protective layer surrounding the first electrode, the second electrode, and the vibration layer;
A first electrode pad exposed without being covered by the protective layer and connected to the first electrode; And
A circuit board including a second electrode pad exposed without being covered by the protective layer and connected to the second electrode. The method of claim 2,
A circuit board further comprising a first adhesive member disposed between the lead lines and one surface of the sound generating device. The method of claim 3,
Flexible having a first driving line electrically connected to the first electrode pad, a second driving line electrically connected to the second electrode pad, and a connection terminal connected to the first driving line and the second driving line Circuit board; And
A circuit board disposed on the base layer and including a connector including an insertion portion into which the connection terminal is inserted. The method of claim 3,
A first driving line electrically connected to the first electrode pad, a second driving line electrically connected to the second electrode pad, a first circuit pad connected to the first driving line, and the second driving line A flexible circuit board having a second circuit pad to be connected;
A circuit film disposed on the base layer and having a first film pad electrically connected to one of the lead lines and a second film pad electrically connected to another one of the lead lines; And
A circuit board further comprising an anisotropic conductive adhesive member disposed between the first circuit pad and the first film pad and between the second circuit pad and the second film pad. The method of claim 2,
A first soldering unit electrically connecting one of the lead lines to the first electrode pad; And
A circuit board further comprising a second soldering unit electrically connecting another one of the lead lines to the second electrode pad. The method of claim 6,
The sound generating device further includes a dummy electrode pad exposed without being covered by the protective layer,
A circuit board further comprising a third soldering portion electrically connecting one of the lead lines to the dummy electrode pad. The method of claim 2,
A circuit board further comprising an anisotropic conductive adhesive member disposed between any one of the lead lines and the first electrode pad, and between another one of the lead lines and the second electrode pad. The method of claim 8,
A solder resist layer disposed on the lead lines; And
A circuit board further comprising a second adhesive member disposed between the protective layer of the sound generating device and the solder resist layer. The method of claim 9,
The second adhesive member does not overlap the first electrode pad and the second electrode pad in a thickness direction of the sound generating device. Display panel;
A circuit board disposed on the first surface of the display panel; And
A display device comprising: a sound generating device disposed to overlap the circuit board in a thickness direction of the display panel and vibrating the display panel to output sound. The method of claim 11,
The sound generating device is disposed on a second surface of the circuit board opposite to the first surface of the circuit board facing the first surface of the display panel. The method of claim 12,
The display device further includes a first adhesive member disposed between the second surface of the circuit board and the first surface of the sound generating device. The method of claim 13,
A flexible circuit board having driving lines electrically connected to electrode pads disposed on a second surface opposite to the first surface of the sound generating device, and connection terminals connected to the driving lines; And
The display device further comprises a connector disposed on the second surface of the circuit board and including an insertion portion into which the connection terminal is inserted. The method of claim 13,
A flexible circuit board having driving lines connected to electrode pads disposed on a second surface opposite to the first surface of the sound generating device, and circuit pads connected to the driving lines;
A circuit film disposed on a second surface of the circuit board and having film pads electrically connected to the circuit pads; And
A display device further comprising an anisotropic conductive adhesive member disposed between the circuit pads and the film pads. The method of claim 12,
A display device further comprising: a soldering unit electrically connecting electrode pads disposed on a first surface of the sound generating device and lead lines disposed on a second surface of the circuit board. The method of claim 16,
The soldering unit electrically connects at least one of the lead lines to dummy pads disposed on a first surface of the sound generating device. The method of claim 12,
The display device further includes an anisotropic conductive adhesive member disposed between electrode pads disposed on the first surface of the sound generating device and lead lines disposed on the second surface of the circuit board. The method of claim 18,
The display device further includes a second adhesive member disposed between at least a portion of the first surface of the sound generating device and the second surface of the circuit board. The method of claim 19,
The second adhesive member does not overlap the electrode pads in the thickness direction of the circuit board. The method of claim 12,
A display device further comprising a flexible film disposed between the display panel and the circuit board and on which an integrated driving circuit for driving the display panel is disposed. The method of claim 21,
A power supply circuit for supplying display driving voltages to the integrated driving circuit; And
A display device comprising a sound driving circuit that supplies sound driving voltages to the sound generating device. The method of claim 22,
The power supply circuit and the sound driving circuit are disposed on the circuit board. The method of claim 12,
The sound generating device is disposed between a first surface of the display panel and a first surface of the circuit board facing the first surface of the display panel. The method of claim 24,
A display device further comprising: a soldering unit electrically connecting electrode pads disposed on the first surface of the sound generating device and lead lines disposed on the first surface of the circuit board. The method of claim 24,
The display device further includes an anisotropic conductive adhesive member disposed between electrode pads disposed on the first surface of the sound generating device and lead lines disposed on the first surface of the circuit board.

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