KR102625725B1 - Display apparatus - Google Patents

Abstract

A display device according to an embodiment of the present invention includes a cover substrate, a substrate with a pixel array layer, a back plate facing the cover substrate with the substrate in between, a first region disposed between the substrate and the cover substrate, and disposed on the back plate. A flexible film including a second region and a bending region that connects the first region and the second region and is bent while surrounding the substrate and the back plate, and a flexible film connected to the second region of the flexible film and disposed on the back plate. May include a printed circuit board. Additionally, the flexible printed circuit board may include a plurality of pinholes.

Description

DISPLAY APPARATUS}

The present invention relates to a display device.

As the information society develops, the demand for display devices for displaying images is increasing in various forms. Accordingly, recently, various display devices such as organic light emitting displays (OLED) and electroluminescence displays such as quantum dot light emitting displays (QLED) have been used. .

A display device includes a display panel including data lines, gate lines, a plurality of pixels connected to the data lines and the gate lines, a gate driver that supplies gate signals to the gate lines, and a gate driver that supplies data voltages to the data lines. It is provided with a data driver that supplies data, and a timing controller that controls the operation timing of the gate driver and the data driver. The data driver may include at least one source drive IC. The source drive IC can be mounted on flexible film.

Driving circuits that drive the display device may be mounted on a flexible printed circuit board (FPCB). These flexible printed circuit boards may require cost reduction and narrow bezels. Due to these demands, the area of flexible printed circuit boards is being reduced. There is a problem in that alignment defects occur when attaching a flexible printed circuit board with a reduced area to a display device.

In the case of smartphones, slimming and narrow bezels are required. While slimmer and narrower bezels are required, the size of batteries is increasing in response to customer needs. In order to meet these requirements, it is required to reduce the area of the flexible printed circuit board. However, there is a limit to reducing the area of the flexible printed circuit board, so it is difficult to secure space for a battery of increased size.

Accordingly, the inventor of the present invention recognized the above-mentioned problem and, through various experiments, invented a display device with a new structure that can reduce the area of the flexible printed circuit board and has a narrow bezel.

The technical task to be achieved by the invention is to provide a display device that can prevent misalignment of a flexible printed circuit board (FPCB).

The technical task to be achieved by the invention is to provide a display device with a narrow bezel by applying a flexible film with a multi-bending structure.

A display device according to an embodiment of the present invention includes a cover substrate, a substrate with a pixel array layer, a back plate facing the cover substrate with the substrate in between, a first region disposed between the substrate and the cover substrate, and disposed on the back plate. A flexible film including a second region and a bending region that connects the first region and the second region and is bent while surrounding the substrate and the back plate, and a flexible film connected to the second region of the flexible film and disposed on the back plate. May include a printed circuit board. Additionally, the flexible printed circuit board may include a plurality of pinholes.

A display device according to an embodiment of the present invention includes a cover substrate, a substrate with a pixel array layer, a back plate facing the cover substrate with the substrate in between, and a first region disposed between the substrate and the cover substrate, on the back plate. A second region disposed, a first bending region connecting the first region and the second region and bending while surrounding the substrate and the back plate, a second bending region connected to the second region and bending, and a second bending region; It may include a flexible film composed of a third region that is connected and disposed on the second region.

Embodiments of the present invention can prevent misalignment during the attachment process of the flexible printed circuit board (FPCB) by forming a pinhole in the flexible printed circuit board (FPCB).

Additionally, embodiments of the present invention can prevent misalignment during the attachment process of the flexible printed circuit board by forming pinholes (PH) having different sizes in the flexible printed circuit board.

In addition, the embodiment of the present invention can further reduce the bezel width of the display device by bending the flexible film at least twice, thereby expanding the space where the battery can be installed and creating a narrow bezel. There is an effect of providing a display device with

The effects that can be obtained from the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description below. .

1 is a diagram showing the attachment of a flexible printed circuit board according to an embodiment of the present invention.
Figure 2 is a plan view of a display device according to an embodiment of the present invention.
Figure 3 is a cross-sectional view taken along line II' of Figure 2.
Figure 4 is a cross-sectional view showing an example of the display module of Figures 2 and 3.
FIG. 5 is a cross-sectional view showing the display area of FIG. 4 in detail.
Figure 6 is a plan view of a display device according to another embodiment of the present invention.
Figure 7 is a cross-sectional view taken along line II-II' of Figure 6.
Figure 8 is an enlarged cross-sectional view showing A in Figure 7 in detail.
Figure 9 is a cross-sectional view of a display device according to another embodiment of the present invention.
Figure 10 is an enlarged cross-sectional view showing B in Figure 9 in detail.

Like reference numerals refer to substantially the same elements throughout the specification. In the following description, detailed descriptions of configurations and functions known in the technical field of the present invention and cases not related to the core configuration of the present invention may be omitted. The meaning of terms described in this specification should be understood as follows.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms. The present embodiments only serve to ensure that the disclosure of the present invention is complete and that common knowledge in the technical field to which the present invention pertains is not limited. It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are illustrative, and the present invention is not limited to the matters shown. Like reference numerals refer to like elements throughout the specification. Additionally, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the gist of the present invention, the detailed description will be omitted.

When 'includes', 'has', 'consists of', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the plural is included unless specifically stated otherwise.

When interpreting a component, it is interpreted to include the margin of error even if there is no separate explicit description.

In the case of a description of a positional relationship, for example, if the positional relationship of two parts is described as 'on top', 'on the top', 'on the bottom', 'next to', etc., 'immediately' Alternatively, there may be one or more other parts placed between the two parts, unless 'directly' is used.

In the case of a description of a temporal relationship, for example, if a temporal relationship is described as 'after', 'successfully after', 'after', 'before', etc., 'immediately' or 'directly' Unless used, non-consecutive cases may also be included.

Although first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are merely used to distinguish one component from another. Accordingly, the first component mentioned below may also be the second component within the technical spirit of the present invention.

“X-axis direction,” “Y-axis direction,” and “Z-axis direction” should not be interpreted as only geometrical relationships in which the relationship between each other is vertical, and should not be interpreted as a wider range within which the configuration of the present invention can function functionally. It can mean having direction.

The term “at least one” should be understood to include all possible combinations from one or more related items. For example, “at least one of the first, second, and third items” means each of the first, second, or third items, as well as two of the first, second, and third items. It can mean a combination of all items that can be presented from more than one.

Each feature of the various embodiments of the present invention can be combined or combined with each other, partially or entirely, and various technological interconnections and operations are possible, and each embodiment can be implemented independently of each other or together in a related relationship. It may be possible.

Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.

1 is a diagram showing the attachment of a flexible printed circuit board (FPCB) according to an embodiment of the present invention. .

Referring to FIG. 1, a display device according to an embodiment of the present invention includes a display module 30 including a back plate 31, a substrate 32, a pixel array layer 33, and a barrier film 34, and a cover. It may include a substrate 10, a flexible film 50, and a flexible printed circuit board (FPCB) 60.

The cover substrate 10 may be made of plastic or glass. The cover substrate 10 may be a flat substrate or a curved substrate with a predetermined curvature.

The display module 30 may be disposed on the cover substrate 10 . The display module 30 displays an image and is implemented, for example, as an electroluminescence display such as an organic light emitting display or a quantum dot light emitting display. It may be possible, but is not limited to this. Hereinafter, for convenience of explanation, the description will focus on the display module 30 implemented as an organic light emitting display device. Additionally, the display module 30 may be implemented as a flexible display device.

The display module 30 may include, but is not limited to, a back plate 31, a substrate 32, a pixel array layer 33, and a barrier film 34. For example, the display module 30 may further include a polarizing film 35, as will be described later with reference to FIG. 3 . Additionally, an adhesive member for adhering the cover substrate 10 and the display module 30 may be further included. A detailed description of the adhesive member will be described later in conjunction with Figure 2.

The back plate 31 is a substrate for supporting the substrate 32 and may be made of plastic or glass. For example, the back plate 31 may be made of polyethylene terephthalate (PET), but is not limited thereto.

The substrate 32 may be placed on the back plate 31 and may be formed of a flexible plastic film. For example, the flexible substrate 32 may be formed of a polyimide film, but is not limited thereto.

The pixel array layer 33 may be formed on the substrate 32 . The pixel array layer 33 is a layer that displays an image using a plurality of pixels. The pixel array layer 33 may include a thin film transistor structure, a light emitting structure, and an encapsulation structure.

The barrier film 34 may be disposed to cover the pixel array layer 33 to protect the pixel array layer 33 from oxygen or moisture. For example, the barrier film 34 may be disposed on the pixel array layer 33. The barrier film 34 may include a touch sensing layer for sensing the user's touch.

A detailed description of the display module 30 will be described later in conjunction with FIGS. 4 and 5.

The flexible film 50 may be a chip on film (COF) that mounts a driver IC. The driving IC may be a source drive IC for supplying driving signals to the data lines of the pixel array layer 33.

The flexible film 50 may be attached in a bent shape as shown in FIG. 1 . One side of the first side of the flexible film 50 is attached to the substrate 32 by the first adhesive layer 41, and the other side of the first side of the flexible film 50 is bent through the second adhesive layer 42. It can be attached to the back plate 31 in the form of. The first adhesive layer 41 may be an anisotropic conductive film in order to be electrically connected to the flexible film 50 and the pixel array layer 33 on the substrate 32.

One side of the flexible film 50 may be attached to pads provided on one side of the substrate 32 that is not covered by the barrier film 34 . Since the pads provided on the substrate 32 are connected to the data lines of the pixel array layer 33, the driving signals of the source drive IC are transmitted to the data lines of the pixel array layer 33 through the flexible film 50 and the pads. can be supplied to

The second side of the flexible film 50 may be attached to the flexible printed circuit board 60 on which the driver 62 is mounted using the third adhesive layer 43. In addition, the third adhesive layer 43 may be an anisotropic conductive film to electrically connect the driver 62 of the flexible printed circuit board 60 and the flexible film 50. And, the third adhesive layer 43 disposed on the second side of the flexible film 50 may overlap the second adhesive layer 42 disposed on the first side of the flexible film 50. The flexible printed circuit board 60 may be attached and fixed to the back plate 31.

Additionally, the driver 62 of the flexible printed circuit board 60 may be an integrated driver with an integrated timing control unit for controlling data drive and gate drive timing.

Referring to FIG. 1, the flexible printed circuit board 60 attached to the flexible film 50 may include a pin hole (PH) for inserting a pin of a jig (JIG).

By inserting the pin of the jig into the pinhole (PH) of the flexible printed circuit board 60, the flexible film 50 is bent to connect the flexible film 50 and the flexible printed circuit board 60 to the display device. It can be placed on the back plate 31 without causing misalignment.

In addition, since the flexible printed circuit board 60 can use a circuit board 61 made of a flexible material, when forming a pinhole (PH) into which a jig pin can be inserted, the circuit around the pinhole (PH) Damage or deformation may occur in the board 61. Therefore, in order to prevent damage or deformation of the circuit board 61 due to the pinhole PH of the flexible printed circuit board 60, a rigid member of the circuit board 61 may be disposed around the pinhole PH. Details about the rigid member will be described later in Figure 2.

Figure 2 is a plan view of the display device 100 according to an embodiment of the present invention. FIG. 2 shows a display device 100 in which the flexible film 50 with the flexible printed circuit board 60 attached is bent using a jig in FIG. 1 and attached to the back plate 31 of the display module 30. This is a floor plan showing. And, Figure 3 is a cross-sectional view taken along line II' of Figure 2. Accordingly, FIGS. 2 and 3 will be described with reference to FIG. 1, and duplicate descriptions will be omitted or briefly described.

2 and 3, the display device 100 according to an embodiment of the present invention includes a back plate 31, a substrate 32, a pixel array layer 33, a barrier film 34, and a polarizing film ( 35) may include a display module 30, an adhesive member 20, a cover substrate 10, a flexible film 50, and a flexible printed circuit board 60.

The back plate 31 of the display module 30 may include a first surface facing the cover substrate 10 and a second surface to which the flexible film 50 is attached. And, the substrate 32 of the display module 30 may be disposed on the first side of the back plate 31. For example, the substrate 32 may be disposed between the cover substrate 10 and the back plate 31. Additionally, the first side of the substrate 32 may face the back plate 31, and the second side of the substrate 32 may face the cover substrate 10. Additionally, the flexible film 50 may be attached to the second surface of the substrate 32 facing the cover substrate 10. Therefore, the flexible film 50 is attached to one side of the substrate 32 using the first adhesive layer 41, and the flexible film 50 is bent to attach the second adhesive layer 42 to one side of the back plate 31. ) can be used to attach.

As shown in FIG. 3, the flexible film 50 has a first region 51 connected to the substrate 32 of the display module 30, a first bending region connected to the first region 51 and bent ( BA1), and may include a second area 52 connected to the first bending area BA1.

The first region 51 of the flexible film 50 can be attached to the substrate 32 of the display module 30 using the first adhesive layer 41. The second region 52 of the flexible film 50 can be attached to the back plate 31 of the display module 30 using the second adhesive layer 42. In addition, the second region 53 can be attached to the flexible printed circuit board 60 using the third adhesive layer 43.

The first bending area BA1 of the flexible film 50 may be bent while surrounding one end of the substrate 32 and the back plate 31 of the display module 30.

One side of the flexible printed circuit board 60 on which the driving unit 62 is disposed may be attached to the second region 52 of the flexible film 50 using a third adhesive layer 43. For example, the flexible printed circuit board 60 may include a first surface on which the driver 62 is disposed, and a second surface corresponding to the first surface. The first side of the flexible printed circuit board 60 may be attached to the second region 52 of the flexible film 50 . And the first side of the flexible printed circuit board 60 may face the back plate 31 of the display module 30.

The first region 51 of the flexible film 50 may be disposed between the cover substrate 10 and the substrate 32 of the display module 30, and a first adhesive layer may be formed on the substrate 32 of the display module 30. It can be attached using (41). The flexible film 50 may be attached to a non-display area of the substrate 32 of the display module 30 adjacent to the pixel array layer 33.

The second region 52 of the flexible film 50 may be disposed on the back plate 31 facing the cover substrate 10 with the substrate 32 of the display module 30 interposed therebetween. It can be attached to (31) using the second adhesive layer 42. The second adhesive layer 42 may be disposed on the second region 52 of the flexible film 50 and the back plate 31 .

The first bending area BA1 of the flexible film 50 connects the first area 51 and the second area 52 and surrounds the substrate 32 and the back plate 31 of the display module 30. Can be bent. Additionally, the substrate 32 and the back plate 31 of the display module 30 may be disposed between the first region 51 and the second region 52 of the flexible film 50 .

The flexible printed circuit board 60 may be disposed on the second area 52 of the flexible film 50, and the flexible printed circuit board 60 may be disposed on the second area 53 of the flexible film 50. It can be attached using an adhesive layer 43. The third adhesive layer 43 may be disposed between the second region 52 of the flexible film 50 and the flexible printed circuit board 60. The second region 52 of the flexible film 50 may be disposed between the back plate 31 and the flexible printed circuit board 60.

The pixel array layer 33 may be formed on the substrate 32 . For example, the pixel array layer 33 may be formed between the substrate 32 and the cover substrate 10. A pixel array layer 33 may be formed on the second surface of the substrate 32 facing the cover substrate 10. Additionally, the barrier film 34 may be disposed to cover the pixel array layer 33 to protect the pixel array layer 33 from oxygen or moisture.

The polarizing film 35 may be attached to the barrier film 34 to prevent visibility from being reduced due to reflection of external light. The polarizing film 35 may be arranged to overlap the pixel array layer 33.

The adhesive member 20 is disposed between the cover substrate 10 and the polarizing film 35 of the display module 30 to adhere the cover substrate 10 and the display module 30. The adhesive member 20 may be a transparent adhesive resin (optically clear resin, OCR) or a transparent adhesive film (optically clear adhesive film, OCA film), but is not limited thereto.

Additionally, a heat dissipation layer may be further disposed on the back plate 31. The heat dissipation layer may be made of a metal material with high thermal conductivity to effectively dissipate heat generated from the flexible display module 30. For example, the heat dissipation layer may be copper (Cu), aluminum (Al), or aluminum nitride (AlNx). Additionally, the heat dissipation layer may further include foam that acts as a buffer to protect the display module 30 from external shock. When the heat dissipation layer includes a metal material layer and foam, the foam may be placed on the back plate 31 and the metal material layer may be placed on the foam.

Additionally, a bottom cover may be disposed to serve to surround the display module 30 together with the cover substrate 10. The bottom cover is arranged to face the cover substrate 10 with the display module 30 interposed therebetween, and thus may serve to protect the display module 30 .

Additionally, there may be a first distance W1 from the edge of the back plate 31 to the edge of the flexible printed circuit board 60 disposed on the second side of the back plate 31.

When cost reduction or a narrow bezel is required, the first distance W1 can be reduced by reducing the area of the flexible printed circuit board 60. When attaching the flexible printed circuit board 60 with a reduced area to the back plate 31 of the display device 100, alignment defects may occur. Accordingly, the flexible printed circuit board 60 may further include a pinhole (PH) into which a jig pin can be inserted. The jig includes a protruding pin, and the protruding pin can be inserted into the pinhole PH of the flexible printed circuit board 60. Then, the flexible printed circuit board 60 can be fixed by inserting the pin of the jig into the pin hole PH of the flexible printed circuit board 60. Additionally, since the flexible printed circuit board 60 can be attached to a certain area on the back plate 31, misalignment can be prevented.

The flexible printed circuit board 60 may include a circuit board 61 and a driver 62. In addition, the flexible printed circuit board 60 may further include a pinhole (PH) into which a jig pin can be inserted. Additionally, in order to prevent damage or deformation of the circuit board 61 due to the pinhole PH, a rigid member 70 may be attached to the circuit board 61. The rigid member 70 may have a hole through which a jig pin can pass. Additionally, the hole of the rigid member 70 may have the same shape as the pinhole PH of the circuit board 61. Additionally, the rigid member 70 attached to the circuit board 61 may be arranged to surround the pinhole PH.

As shown in FIG. 2, at least two pinholes PH may be formed in the circuit board 61, and the plurality of pinholes PH may have the same shape, but is not limited thereto. No. For example, a plurality of pinholes PH may include pinholes PH having different sizes and shapes. As shown in FIG. 2, the pinhole PH may include a first pinhole PH1 and a second pinhole PH2 at one edge of the flexible printed circuit board 60. Additionally, the size of the first pinhole PH1 may be larger than that of the second pinhole PH2. Also, the shape of the first pinhole PH1 and the shape of the second pinhole PH2 may have different shapes. Accordingly, the first pinhole PH1 and the second pinhole PH2 may have different sizes and different shapes. For example, as shown in FIG. 2, the hole of the first pinhole PH1 may be oval or bar-shaped with curved ends, and the hole of the second pinhole PH2 may be circular.

The rigid member 70 may include a first rigid member 71 having a hole corresponding to the first pinhole PH1 and a second rigid member 72 having a hole corresponding to the second pinhole PH2. . The first rigid member 71 may have the same shape as the first pinhole PH1, and the second rigid member 72 may have the same shape as the second pinhole PH2.

When placing the flexible printed circuit board 60 on the back plate 31 of the display module 30 using a jig, the pinholes (PH) of different sizes are flexible printed circuit boards. It serves to be easily inserted into the pinhole (PH) of the circuit board 60. For example, the first pinhole PH1, which is larger in size than the second pinhole PH2, can serve as a guide so that the pins of the jig can be easily inserted. Additionally, the relatively small second pinhole PH2 may serve to prevent the pins of the jig from moving. Accordingly, the pinholes PH of the flexible printed circuit board 60 having different sizes allow the flexible printed circuit board 60 to be easily inserted into the pins of the jig and reduce the flow of the flexible printed circuit board 60. Also, the flexible printed circuit board 60 can be attached to the area to be attached on the back plate 31 of the display module 30 without alignment defects.

Figure 4 is a cross-sectional view showing an example of the display module of Figures 2 and 3. FIG. 5 is a cross-sectional view showing the display area of FIG. 4 in detail. 4 and 5, the description focuses on the display module 30 implemented as an organic light emitting display device. In addition, in FIGS. 4 and 5 , the light-emitting structure 120 is described with a focus on being formed in a top-emitting manner, emitting light in the direction in which the barrier film 34 is disposed, that is, in the upward direction.

Referring to Figures 4 and 5, the display area (AA) refers to the area where the light emitting device layer 120 is formed to display an image, and the non-display area (NAA) refers to the surrounding area of the display area.

The display module 30 includes a back plate 31, a substrate 32, a thin film transistor structure 110, a pixel array layer 33 including a light emitting structure 120 and an encapsulation structure 130, and a barrier film 34. , and a polarizing film 35.

Since the back plate 31, the substrate 32, the barrier film 34, and the polarizing film 35 have been described in detail in conjunction with FIGS. 2 and 3, detailed descriptions thereof will be omitted.

A thin film transistor structure 110 may be formed on the substrate 32. The thin film transistor structure 110 may include thin film transistors 210, a gate insulating film 220, an interlayer insulating film 230, a protective film 240, and a planarization film 250. .

A buffer film may be formed on the substrate 32. The buffer film may be formed on the substrate 32 to protect the thin film transistors 210 and the light emitting structure from moisture penetrating through the back plate 31 and the substrate 32, which are vulnerable to moisture permeation. The buffer film may be composed of a plurality of inorganic films stacked alternately. For example, the buffer layer may be formed as a multilayer in which one or more inorganic layers of silicon oxide (SiOx) and silicon nitride (SiNx) are alternately stacked. Additionally, the buffer film may be omitted depending on the characteristics and structure of the thin film transistor 210.

A thin film transistor 210 is formed on the buffer film. The thin film transistor 210 includes an active layer 211, a gate electrode 212, a source electrode 213, and a drain electrode 214. 5 illustrates that the thin film transistor 210 is formed in a top gate manner in which the gate electrode 212 is located on top of the active layer 211, but the present invention is not limited thereto. That is, the thin film transistors 210 are of the bottom gate type where the gate electrode 212 is located at the bottom of the active layer 211, or the gate electrode 212 is located at the top and bottom of the active layer 211. It can be formed as a double gate method located in both.

An active layer 211 may be formed on the buffer film. The active layer 211 may be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. A light blocking layer may be additionally formed between the buffer film and the active layer 211 to block external light incident on the active layer 211.

A gate insulating layer 220 may be formed on the active layer 211. The gate insulating layer 220 may be formed of an inorganic layer, for example, a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), or a multilayer thereof.

A gate electrode 212 and a gate line may be formed on the gate insulating film 220. The gate electrode 212 and the gate line are made of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be formed as a single layer or multiple layers made of one or an alloy thereof.

An interlayer insulating film 230 may be formed on the gate electrode 212 and the gate line. The interlayer insulating film 230 may be formed of an inorganic film, for example, a silicon oxide film (SiOx), a silicon nitride film (SiNx), or a multilayer thereof.

A source electrode 213, a drain electrode 214, and a data line may be formed on the interlayer insulating film 230. Each of the source electrode 213 and the drain electrode 214 may be connected to the active layer 211 through a contact hole penetrating the gate insulating film 220 and the interlayer insulating film 230. The source electrode 213, drain electrode 214, and data line are made of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), and neodymium (Nd). and copper (Cu) or an alloy thereof may be formed as a single layer or multiple layers.

A protective film 240 may be formed on the source electrode 223, the drain electrode 224, and the data line to insulate the thin film transistor 220. The protective film 240 may be formed of an inorganic film, for example, a silicon oxide film (SiOx), a silicon nitride film (SiNx), or a multilayer thereof.

A planarization film 250 may be formed on the protective film 240 to flatten the step caused by the thin film transistor 210. The planarization film 250 may be formed of an organic film such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. there is.

A light emitting structure 120 is formed on the thin film transistor structure 110. The light emitting structure 120 includes light emitting elements and a bank 264.

Light emitting elements and the bank 264 are formed on the planarization film 250. The light emitting device may include a first electrode 261, a light emitting layer 262, and a second electrode 263. The first electrode 261 may be an anode electrode, and the second electrode 263 may be a cathode electrode.

The first electrode 261 may be formed on the planarization film 250 . The first electrode 261 may be connected to the source electrode 213 of the thin film transistor 210 through a contact hole penetrating the protective film 240 and the planarization film 250. The first electrode 261 has a stacked structure of aluminum and titanium (Ti/Al/Ti), a stacked structure of aluminum and ITO (ITO/Al/ITO), a stacked structure of silver and ITO (ITO/Ag/ITO), and APC. It can be formed of a metal material with high reflectivity, such as an alloy, and a laminated structure of APC alloy and ITO (ITO/APC/ITO). APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

The bank 264 may be formed to cover the edge of the first electrode 261 on the planarization film 250 to partition the pixels. That is, the bank 264 may serve as a pixel defining layer that defines pixels.

Each of the pixels includes a first electrode 261 corresponding to the anode electrode, a light emitting layer 262, and a second electrode 263 corresponding to the cathode electrode, which are sequentially stacked to generate holes from the first electrode 261 and the second electrode 263. It represents a region where electrons from the electrode 263 combine with each other in the light emitting layer 262 to emit light.

A light emitting layer 262 is formed on the first electrode 261 and the bank 264. The light-emitting layer 262 may be an organic light-emitting layer. In this case, the light-emitting layer 262 is a common layer commonly formed in pixels, and may be a white light-emitting layer that emits white light. The light emitting layer 262 may be formed in a tandem structure of two or more stacks. Each of the stacks may include a hole transporting layer, at least one light emitting layer, and an electron transporting layer.

Additionally, when the light emitting layer 262 is formed in a tandem structure of two or more stacks, a charge generation layer may be formed between the stacks. The charge generation layer may include an n-type charge generation layer located adjacent to the lower stack and a p-type charge generation layer formed on the n-type charge generation layer and located adjacent to the upper stack. The n-type charge generation layer injects electrons into the lower stack, and the p-type charge generation layer injects holes into the upper stack. The n-type charge generation layer may be an organic layer in which an organic host material capable of electron transport is doped with an alkali metal such as Li, Na, K, or Cs, or an alkaline earth metal such as Mg, Sr, Ba, or Ra. The p-type charge generation layer may be an organic layer in which a dopant is doped into an organic host material capable of hole transport.

The second electrode 263 is formed on the light emitting layer 262. The second electrode 263 may be formed to cover the light emitting layer 262. The second electrode 263 may be a common layer commonly formed in pixels.

The second electrode 263 is made of a transparent metal material (TCO, Transparent Conductive Material) such as ITO or IZO that can transmit light, or magnesium (Mg), silver (Ag), or magnesium (Mg) and silver (Ag). It can be formed of a semi-transmissive conductive material such as an alloy. When the second electrode 140 is formed of a translucent metal material, light output efficiency can be increased due to micro cavity. A capping layer may be formed on the second electrode 263.

An encapsulation structure 130 may be formed on the light emitting structure 120. The encapsulation structure 130 includes an encapsulation film 270 .

The encapsulation film 270 serves to prevent oxygen or moisture from penetrating into the light emitting layer 262 and the second electrode 263. To this end, the encapsulation film 270 may include at least one inorganic film. The inorganic film may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, or a multilayer thereof.

Additionally, the encapsulation film 270 may further include at least one organic film. The organic film may be formed to be thicker than the thickness of the encapsulation film 270 to prevent particles from penetrating the encapsulation film 270 and being introduced into the light emitting layer 262 and the second electrode 263.

A color filter layer may be formed on the encapsulation structure 130. The color filter layer includes color filters and a black matrix. Each of the color filters may be arranged to correspond to the pixels. The black matrix 294 may be disposed between color filters to prevent color mixing from occurring when light from one pixel travels to the color filter of an adjacent pixel. The black matrix 294 may be arranged to correspond to the bank 264. An overcoat layer may be formed on the color filters to flatten the steps caused by the color filters and the black matrix.

Figure 6 is a plan view of a display device 100 according to another embodiment of the present invention. Figure 7 is a cross-sectional view taken along line II-II' of Figure 6.

Referring to FIG. 6, a display device 100 according to another embodiment of the present invention includes a cover substrate 10, an adhesive member 20, a display module 30, a flexible film 50, and a flexible printed circuit board ( 60), it may include a first adhesive layer 41, a second adhesive layer 42, a third adhesive layer 43, and a fourth adhesive layer 44.

The cover substrate 10, the adhesive member 20, the display module 30, and the flexible printed circuit board 60 shown in FIG. 6 are substantially the same as those described in connection with FIGS. 2 and 3, so detailed information about them will be provided. The explanation is omitted or explained briefly.

Referring to FIG. 6, the second distance W2 from the edge of the back plate 31 to the edge of the flexible printed circuit board 60 disposed on the back plate 31 is the first distance W1 in FIG. 2. ) may be smaller than To manufacture the display device 100 with a narrow bezel, the size of the flexible printed circuit board 60 can be reduced. Then, the flexible film 50, which electrically connects the flexible printed circuit board 60 and the substrate 32 of the display module 30, is multiple bent and attached to the back plate 31, thereby increasing the second distance W2. can be reduced. Accordingly, the bezel area of the display device 100 can be reduced, and space for an increased battery can be secured.

The flexible film 50 can be bent multiple times. For example, as shown in FIG. 7, the flexible film 50 has a first area 51 attached to the substrate 32 of the display module 30 using the first adhesive layer 41, a first A first bending area (BA1) connected to the area 51 and bent, connected to the first bending area (BA1) and attached to the back plate 31 of the display module 30 using the second adhesive layer 42. It may include a second area 52, a second bending area BA2 connected to the second area and bent, and a third area 53 connected to the second bending area BA2.

The first region 51 of the flexible film 50 can be attached to the substrate 32 of the display module 30 using the first adhesive layer 41, and the second region 52 can be attached to the substrate 32 of the display module 30 using the first adhesive layer 41. ) can be used to attach it to the back plate 31 of the display module 30. Additionally, the third region 53 can be attached to the flexible printed circuit board 60 using the third adhesive layer 43.

The first bending area BA1 of the flexible film 50 can be bent while surrounding one end of the substrate 32 and the back plate 31 of the display module 30, and the second bending area BA2 is flexible. It can be bent while surrounding one end of the printed circuit board 60.

One side of the flexible printed circuit board 60 on which the driving unit 62 is disposed may be attached to the second region 52 of the flexible film 50 using the fourth adhesive layer 44, and the flexible printed circuit board ( The other side of 60) may be attached to the third area 53 of the flexible film 50 using a third adhesive layer 43. For example, the flexible printed circuit board 60 may include a first surface on which the driver 62 is disposed, and a second surface corresponding to the first surface. The first side of the flexible printed circuit board 60 may be attached to the second region 52 of the flexible film 50 . Additionally, the second side of the flexible printed circuit board 60 may be attached to the third region 53 of the flexible film 50 .

The first region 51 of the flexible film 50 may be disposed between the cover substrate 10 and the substrate 32 of the display module 30, and a first adhesive layer may be formed on the substrate 32 of the display module 30. It can be attached using (41). The flexible film 50 may be attached to a non-display area of the substrate 32 of the display module 30 adjacent to the pixel array layer 33.

The second region 52 of the flexible film 50 may be disposed on the back plate 31 facing the cover substrate 10 with the substrate 32 of the display module 30 interposed therebetween. It can be attached to (31) using the second adhesive layer 42.

The first bending area BA1 of the flexible film 50 connects the first area 51 and the second area 52 and surrounds the substrate 32 and the back plate 31 of the display module 30. Can be bent. Additionally, the substrate 32 and the back plate 31 of the display module 30 may be disposed between the first region 51 and the second region 52 of the flexible film 50 .

The third region 53 of the flexible film 50 may be disposed on the second region 52 .

The flexible printed circuit board 60 may be disposed between the second region 52 and the third region 53 of the flexible film 50, and is one part of the flexible printed circuit board 60 on which the driving unit 62 is disposed. The side surface may be attached to the third region 53 of the flexible film 50 using a third adhesive layer 43. Additionally, the other side of the flexible printed circuit board 60 may be attached to the second region 52 of the flexible film 50 using the fourth adhesive layer 44 .

The second bending area BA2 of the flexible film 50 connects the second area 52 and the third area 53 and may be bent while surrounding the flexible printed circuit board 60 .

Figure 8 is an enlarged cross-sectional view showing A in Figure 7 in detail.

Referring to FIG. 8, the fourth adhesive layer 44 may be composed of multiple layers. For example, the fourth adhesive layer 44 may have a base layer 44b having a predetermined elastic modulus disposed in the center layer, and a first adhesive member having adhesive properties on one side and the other side of the base layer 44b. and second adhesive members 44a and 44c may be disposed.

The base layer 44b may include a polymer material including at least one of polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP), and polyethylene terephthalate (PET), or aluminum and copper. It may include, but is not limited to, at least one metal material.

The first adhesive member and the second adhesive member 44a, 44c may include an acrylic adhesive component, but are not limited thereto.

Additionally, the fourth adhesive layer 44 may be formed to have a hollow portion, and the hollow portion may be formed to correspond to the shape of the driving unit 62. The hollow portion of the fourth adhesive layer 44 can be formed to correspond to the shape and dimensions of the driving unit 62, and is thus formed over a large area excluding the driving unit 62, thereby showing high adhesive performance and the driving unit 62 ) can minimize interference.

FIG. 9 is a cross-sectional view of a display device according to another embodiment of the present invention, and FIG. 10 is an enlarged cross-sectional view showing B of FIG. 9 in detail.

9 and 10, a display device 100 according to another embodiment of the present invention includes a back plate 31, a substrate 32, a pixel array layer 33, a barrier film 34, and a polarizing film. Display module 30 including (35), adhesive member 20, cover substrate 10, flexible film 50, flexible printed circuit board 60, first adhesive layer 41, third adhesive layer 43 ), and a fifth adhesive layer 45.

The back plate 31, the substrate 32, the pixel array layer 33, the barrier film 34, and the polarizing film 35 have been described in detail in conjunction with FIGS. 2 and 3, so a detailed description thereof is provided. Omit it.

Since the flexible film 50 and the flexible printed circuit board 60 have been described in detail in conjunction with FIGS. 6 and 7, overlapping descriptions thereof will be omitted.

The first region 51 of the flexible film 50 may be attached to the substrate 32 of the display module 30 using the first adhesive layer 41, and the second region 52 may be attached to the substrate 32 of the display module 30 using the first adhesive layer 41. ) can be used to attach it to the back plate 31 of the display module 30. Additionally, the third region 53 can be attached to the flexible printed circuit board 60 using the third adhesive layer 43.

The first bending area BA1 of the flexible film 50 can be bent while surrounding one end of the substrate 32 and the back plate 31 of the display module 30, and the second bending area BA2 is flexible. It can be bent while surrounding one end of the printed circuit board 60.

One side of the flexible printed circuit board 60 on which the driving unit 62 is disposed may be attached to the second region 52 of the flexible film 50 using the fifth adhesive layer 45, and the flexible printed circuit board ( The other side of 60) may be attached to the third area 53 of the flexible film 50 using a third adhesive layer 43. For example, the flexible printed circuit board 60 may include a first surface on which the driver 62 is disposed, and a second surface corresponding to the first surface. The first side of the flexible printed circuit board 60 may be attached to the second region 52 of the flexible film 50 . Also, the second side of the flexible printed circuit board 60 may be attached to the third region 53 of the flexible film 50 .

The fifth adhesive layer 45 is disposed on the base layer 45b, one side of the base layer of the base layer 45b, and the other side of the first adhesive member 45a and the base layer arranged to surround the driving unit, It may include a second adhesive member 45c in contact with the flexible film.

Additionally, the first adhesive member 45a may be multi-layered, including an adhesive member disposed on the same layer as the driving unit 62 and an adhesive member disposed to cover the driving unit. The fifth adhesive layer 45 includes a first adhesive member formed of multiple layers, thereby preventing damage due to contraction and expansion of the base layer and the adhesive member at high and low temperatures from being transmitted to the driving unit 62. The first adhesive member 45a may be provided in a layered structure including a plurality of plates, but is not limited thereto and may be provided in various forms surrounding the driving unit.

In addition, the first adhesive member 45a is a colored adhesive member that can provide a kind of work guideline to provide ease of fastening when coupling the drive unit 62 to the groove and is formed on the same layer as the drive unit 62. And, since a transparent adhesive member is formed on the upper part of the colored adhesive member, it is possible to check whether there is interference with the driving unit 62.

The first adhesive member 45a may include a groove corresponding to the shape and size of the driving part 62, and the driving part 62 is disposed in this groove so that the driving part 62 is formed on the side, upper, and Impact generated from the lower part can be dispersed through the first adhesive member 45a, and through this, the reliability of the display device can be improved.

Additionally, the fifth adhesive layer 45 may be formed to include a groove in the first adhesive member 45a formed adjacent to the driving unit 62 to correspond to the shape of the driving unit 62, and may be disposed away from the driving unit 62. Since the second adhesive member 45c can be formed to have a large area, it can provide sufficient adhesive force to overcome the force of the flexible film 50.

A display device according to an embodiment of the present invention includes a cover substrate, a substrate with a pixel array layer, a back plate facing the cover substrate with the substrate in between, a first region disposed between the substrate and the cover substrate, and a back plate on the back plate. A flexible film including a second region disposed and a bending region that connects the first region and the second region and is bent while surrounding the substrate and the back plate, and is connected to the second region of the flexible film and disposed on the back plate. May include a flexible printed circuit board. Additionally, the flexible printed circuit board may include a plurality of pinholes.

According to an embodiment of the present invention, the plurality of pinholes include a first pinhole and a second pinhole, and the first pinhole and the second pinhole may have different sizes and shapes.

According to an embodiment of the present invention, the first pinhole may include an oval-shaped or bar-shaped hole with curved ends at both ends, and the second pinhole may include a circular hole.

According to an embodiment of the present invention, a plurality of rigid members disposed on the flexible printed circuit board may be further included, respectively corresponding to the plurality of pinholes.

According to an embodiment of the present invention, a plurality of rigid members may have holes of the same shape as the plurality of pinholes and may be arranged to surround each of the plurality of pinholes.

According to an embodiment of the present invention, the plurality of rigid members includes a first rigid member and a second rigid member, the first rigid member has a hole of the same shape as the first pinhole, and the second rigid member has a second pinhole and It can have holes of the same shape.

A display device according to an embodiment of the present invention includes a cover substrate, a substrate with a pixel array layer, a back plate facing the cover substrate with the substrate in between, and a first region disposed between the substrate and the cover substrate, on the back plate. A second region disposed in, a first bending region connecting the first region and the second region and bending while surrounding the substrate and the back plate, a second bending region connected to the second region and bending, and a second bending region. It may include a flexible film composed of a third region connected to and disposed on the second region.

According to an embodiment of the present invention, the first region of the flexible film may be attached to the substrate using a first adhesive layer.

According to an embodiment of the present invention, the second region of the flexible film may be attached to the back plate using a second adhesive layer.

According to an embodiment of the present invention, the substrate and the back plate may be disposed between the first region and the second region of the flexible film.

According to an embodiment of the present invention, a flexible printed circuit board disposed between the second region and the third region of the flexible film may be further included.

According to an embodiment of the present invention, the flexible printed circuit board includes a driving part disposed on one side of the flexible printed circuit board, and one side of the flexible printed circuit board on which the driving part is arranged has a third adhesive layer in the third region of the flexible film. It can be attached using .

According to an embodiment of the present invention, the other side of the flexible printed circuit board may be attached to the second region of the flexible film using a fourth adhesive layer.

According to an embodiment of the present invention, the fourth adhesive layer includes a hollow portion, and a driving unit may be disposed in the hollow portion.

According to an embodiment of the present invention, the other side of the flexible printed circuit board may be attached to the second region of the flexible film using a fifth adhesive layer.

According to an embodiment of the present invention, the fifth adhesive layer includes a base layer, a first adhesive member disposed on one side of the base layer and in contact with the flexible film, and a first adhesive member disposed on the other side of the base layer and arranged to surround the driving unit. 2 May include adhesive members.

According to an embodiment of the present invention, the second bending region of the flexible film connects the second region and the third region and may be bent while surrounding the flexible printed circuit board.

According to an embodiment of the present invention, the flexible printed circuit board may include a plurality of pinholes and a plurality of rigid members disposed on the flexible printed circuit board respectively corresponding to the plurality of pinholes.

According to an embodiment of the present invention, the plurality of pinholes include a first pinhole and a second pinhole, and the first pinhole and the second pinhole may have different sizes and shapes.

According to an embodiment of the present invention, the first pinhole may include an oval-shaped or bar-shaped hole with curved ends at both ends, and the second pinhole may include a circular hole.

According to an embodiment of the present invention, a plurality of rigid members may have holes of the same shape as the plurality of pinholes and may be arranged to surround each of the plurality of pinholes.

According to an embodiment of the present invention, the plurality of rigid members includes a first rigid member and a second rigid member, the first rigid member has a hole of the same shape as the first pinhole, and the second rigid member has a second pinhole and It can have holes of the same shape.

As discussed above, the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, but the present invention is not necessarily limited to these embodiments, and the technical idea of the present invention is Various modifications may be made without departing from the scope. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. The scope of protection of the present invention should be interpreted in accordance with the claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of rights of the present invention.

10: Cover substrate 20: Adhesive member (20)
30: display module 31: back plate
32: substrate 33: pixel array layer
34: barrier film 35: polarizing film
41: first adhesive layer 42: second adhesive layer
43: third adhesive layer 44: fourth adhesive layer
45: fifth adhesive layer 44b, 45b: base layer
44a, 45a: first adhesive member 44c, 45c: second adhesive member
50: flexible film 51: first region
52: Second area 53: Third area
BA1: first bending area BA2: second bending area
60: flexible printed circuit board 62: driving unit
61: circuit board 70: rigid member
71: first rigid member 72: second rigid member
W1: first distance W2: second distance
PH: pinhole PH1: first pinhole
PH2: 2nd pinhole JIG: Jig

Claims (22)

cover substrate;
A substrate having a pixel array layer;
a back plate facing the cover substrate with the substrate interposed therebetween;
A first region disposed between the substrate and the cover substrate, a second region disposed on the back plate, and a bend that connects the first region and the second region and bends while surrounding the substrate and the back plate. A flexible film comprising a region; and
a flexible printed circuit board connected to the second region of the flexible film and disposed on the back plate, the flexible printed circuit board including a plurality of pinholes into which jig pins are inserted;
A plurality of rigid members arranged to surround each pinhole are formed on one side of the flexible printed circuit board in contact with the jig pin,
A display device in which a hole is formed in each rigid member to pass the jig pin so that the jig pin is inserted into the pin hole. According to claim 1,
The plurality of pinholes are,
a first pinhole formed to have a first size to guide insertion of the jig pin; and
A display device comprising a second pinhole formed to have a second size smaller than the first size to prevent the jig pin from moving. According to claim 2,
The first pinhole includes an oval or bar-shaped hole with curved ends, and the second pinhole includes a circular hole. delete delete According to claim 2,
The plurality of rigid members include a first rigid member arranged to surround the first pinhole and a second rigid member arranged to surround the second pinhole,
The display device wherein the hole formed in the first rigid member has the same shape as the first pinhole, and the hole formed in the second rigid member has the same shape as the second pinhole. cover substrate;
A substrate having a pixel array layer;
a back plate facing the cover substrate with the substrate interposed therebetween; and
A first region disposed between the substrate and the cover substrate, a second region disposed on the back plate, and a first region that connects the first region and the second region and is bent while surrounding the substrate and the back plate. A flexible film consisting of a bending area, a second bending area connected to the second area and bent, and a third area connected to the second bending area and disposed on the second area; and
A flexible printed circuit board disposed between the second region and the third region of the flexible film and including a plurality of pinholes into which jig pins are inserted,
A plurality of rigid members arranged to surround each pinhole are formed on one side of the flexible printed circuit board in contact with the jig pin,
A display device in which a hole is formed in each rigid member to pass the jig pin so that the jig pin is inserted into the pin hole. According to claim 7,
The first region of the flexible film is attached to the substrate using a first adhesive layer. According to claim 7,
The display device wherein the second region of the flexible film is attached to the back plate using a second adhesive layer. According to claim 7,
The display device wherein the substrate and the back plate are disposed between the first region and the second region of the flexible film. delete According to claim 7,
The flexible printed circuit board includes a driving unit disposed on the other side opposite to the one side of the flexible printed circuit board, and one side of the flexible printed circuit board has a third adhesive layer applied to the third region of the flexible film. A display device attached using a display device. According to claim 12,
A display device wherein the other side of the flexible printed circuit board on which the driving unit is disposed is attached to the second region of the flexible film using a fourth adhesive layer. According to claim 13,
The fourth adhesive layer includes a hollow portion, and the driving unit is disposed in the hollow portion. According to claim 12,
A display device wherein the other side of the flexible printed circuit board on which the driving unit is disposed is attached to the second region of the flexible film using a fifth adhesive layer. According to claim 15,
The fifth adhesive layer includes a base layer, a first adhesive member disposed on one side of the base layer and disposed to surround the driving unit, and a second adhesive member disposed on the other side of the base layer and in contact with the flexible film. Display device. According to claim 7,
The second bending area of the flexible film connects the second area and the third area and is bent while surrounding the flexible printed circuit board. delete According to claim 7,
The plurality of pinholes are,
a first pinhole formed to have a first size to guide insertion of the jig pin; and
A display device comprising a second pinhole formed to have a second size smaller than the first size to prevent the jig pin from moving. According to claim 19,
The first pinhole includes an oval or bar-shaped hole with curved ends, and the second pinhole includes a circular hole. delete According to claim 19,
The plurality of rigid members include a first rigid member arranged to surround the first pinhole and a second rigid member arranged to surround the second pinhole,
The display device wherein the hole formed in the first rigid member has the same shape as the first pinhole, and the hole formed in the second rigid member has the same shape as the second pinhole.

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