KR102356156B1 - Probe station - Google Patents

Abstract

The present invention relates to a probe station used to test chips on a wafer.
A probe station according to the present invention includes a probe stage provided to electrically connect wafer chips to a probe card; a wafer transport device for supplying or retrieving wafers to the probe stage; and a rail device for moving and setting at least one of the probe stage and the wafer transport device. includes And further, the probe station includes: a wafer repairer for repairing defects of the tested wafer; may further include.
According to the present invention, a large number of probe stages can be concentrated in a limited space, and there is an effect that the two-step test can be continuously performed by the operation of an automated wafer transport device.

Description

probe station {PROBE STATION}

The present invention relates to a probe station for use in testing chips on a wafer.

The production of semiconductor devices starts with the production of ingots by growing silicon. The grown ingot is thinly cut to form a plurality of wafers. Then, a pattern is formed on the wafer to configure the chips. Then, the configured chips are separated into individual chips, and the separated chips are packaged to complete a final product. In this way, from the grown ingot to a packaged semiconductor device, a number of electrical tests are performed to prevent defective production. The present invention relates to a process for forming chips by forming a pattern on a wafer and then testing the chips on the wafer before separating the constituted chips into individual chips.

A tester, a probe card, and a probe station are needed to conduct a test by electrically connecting the chips on the wafer to the tester.

The tester supplies electrical signals to the chips on the wafer and determines whether the chips are defective or not through the returned electrical signals. This tester has a test head for electrically connecting the chips.

The probe card is coupled to the test head, and electrically connects the chips on the wafer supplied from the probe station to the test head. To this end, the probe card is provided with a plurality of probes for electrically connecting the chips to the test head.

The probe station has a wafer chuck on which a wafer can be placed and electrically connects the wafer placed on the wafer chuck to a probe card. Such a wafer chuck is also called a hot chuck because it can apply heat to the wafer according to test conditions. The present invention relates to such a probe station.

The probe station includes a probe stage with a wafer chuck and a wafer transport device for supplying wafers to or retrieving wafers from the probe stage. And broadly, the probe station may include a manifold for coupling the test head to which the probe card is coupled to the probe stage.

In general, the probe stage, the wafer transporter and the manifold are coupled to each other so that their positions are firmly fixed. The reason for this is that if the distance between each other is slightly misaligned, a defect may occur in electrical contact between the chips and the probe card.

On the other hand, while the demand for semiconductor devices increases and production increases, the space required for testing chips on the wafer is limited unless it is expanded further by securing a site and investing in facilities. It is not easy to secure a site near the production plant, and the continued securing of site and facility investment along with the increase in production of semiconductor devices are also a major cause of a decrease in the company's profits. Therefore, a technology for integrating a probe station so that more tests can be performed in a limited space is being studied.

Republic of Korea Patent Registration Nos. 10-0346147, 10-1019899, 10-1079017, etc. (hereinafter referred to as 'prior art') try to save space by combining several probe stages in one wafer transport device.

However, according to the prior art, there are the following problems.

First, the operation impact of each individually operated probe stage and the wafer transport device affects each other, thereby causing a defect in electrical contact between the wafer and the probe card. And, such a problem may become more prominent as the spacing between pads provided in the chip becomes ultra-fine due to the development of semiconductor device integration technology.

Second, there is a limit to the integration of the probe stations because a work space necessary for the maintenance of the probe stages and the wafer transport device must be secured.

Meanwhile, chips determined to be defective in the first test are repaired by a wafer repairer and then undergo a second test. To this end, it is necessary to retrieve the wafer on which the first test has been completed from the probe station, supply it to the wafer repairer, and re-supply the repaired wafer from the wafer repairer to the probe station for the second test. Therefore, more space is required for the wafer repair machine to be located, manpower is required to perform the corresponding process, and the inconvenience of performing the corresponding process occurs.

The present invention has the following objects.

First, a technology capable of preventing the operation shocks of the probe stations from mutually affecting each other is provided.

Second, it provides a technology that can increase the density of the probe station by using multiple work spaces for equipment maintenance.

Third, it provides a technology in which the primary and secondary tests for wafers can be bundled into one automated process using a wafer transport device.

A probe station according to a first aspect of the present invention for achieving the above object includes: a plurality of probe stages provided to electrically connect wafer chips to a probe card; a wafer transport device for supplying or retrieving wafers to the plurality of probe stages; and a rail device for at least one stage provided for guiding movement of at least one of the plurality of probe stages and setting a fixed position. Including, each of the plurality of probe stages are spaced apart from each other by a predetermined interval.

The wafer transport apparatus may include: a wafer receiver for taking out a wafer loaded in a cassette, supplying it to the plurality of probe stages, recovering tested wafers from the plurality of probe stages, and introducing the wafer into the cassette; a mover capable of moving and positioning the receiver to a plurality of supply positions capable of supplying a wafer to each of the plurality of probe stages or recovering a wafer from each of the plurality of probe stages; includes

The rail device for the stage includes: a guide rail for guiding the movement of the probe stage in a direction orthogonal to a movement direction of the wafer receiver; and a positioner for setting the original position of the probe stage moved by the guide rail. may include

The rail device for the stage may include a guide rail for guiding the movement of the probe stage in a direction parallel to the movement direction of the wafer receiver.

The above probe station includes: a wafer repair machine for repairing defective wafers that have been tested; The method further includes, wherein, when repair of a tested wafer is required, the wafer transport apparatus supplies the repaired wafer to the wafer repairer and then supplies the repaired wafer to the probe stage again.

a rail device for a repair machine provided for guiding the movement of the wafer repair machine and setting a fixed position; may further include.

The plurality of probe stages may be arranged side by side on at least one side of the wafer transport device.

The plurality of probe stages may include: a first probe stage disposed on one side of the wafer transport device; and a second probe stage disposed on the other side of the wafer transport device. may include

The probe station includes: a controller for controlling the wafer transport device so that wafers can be selectively supplied to one or more probe stages according to circumstances; may further include.

a detector for sensing the position of one or more probe stages; further comprising, wherein the controller determines a receiving position of the wafer repair device (a position of the wafer receiving device for supplying a wafer to the probe stage and recovering the wafer from the probe stage) according to the information sensed through the detector. .

A probe station according to a second aspect of the present invention for achieving the above object includes: at least one probe stage provided to electrically connect wafer chips to a probe card; a wafer transport device for supplying or retrieving a wafer to the at least one probe stage; and a wafer repairer for repairing defects in the tested wafer; and, when repair of a tested wafer is required, the wafer transport apparatus supplies the repaired wafer to the wafer repairer and then re-supplys the repaired wafer to the at least one probe stage.

It may include at least one of a rail device for at least one stage for guiding movement of the at least one probe stage and setting a fixed position, and a rail device for a repair machine for guiding movement and setting the position of the wafer repairer.

A probe station according to a third aspect of the present invention for achieving the above object includes: a first probe stage and a second probe stage provided to electrically connect wafer chips to a probe card; a wafer transport device provided between the first probe stage and the second probe stage and configured to supply or retrieve wafers to or from the first probe stage and the second probe stage; and a rail device for a transport device provided for guiding the movement of the wafer transport device and setting a fixed position; includes

The rail device for the transport device may include: a guide rail for guiding the movement of at least a portion of the wafer transport device so as to deviate between the first probe stage and the second probe stage; and a positioner for setting the original position of the wafer transport device moved by the guide rail. includes

According to the present invention, there are the following effects.

First, space can be saved by densifying the probe stages as much as possible while being free from mutual operation impact.

Second, it is possible to increase the density of the probe station by using multiple work spaces for equipment maintenance.

Third, since the primary and secondary tests for wafers are bundled into one automated process using a wafer transport device, space saving, reduction in the number of parts and production cost, and reduction of process and inconvenience caused by process execution are reduced. brings relief

Fourth, the operation of the remaining probe stations may be maintained even when some of the probe stations are stopped.

1 is a schematic plan view of a probe station according to a first embodiment of the present invention.
FIG. 2 is a schematic perspective view of a wafer chuck and an elevator constituting a probe stage applied to the probe station of FIG. 1 .
Fig. 3 is a schematic side view of a wafer transport apparatus applied to the probe station of Fig. 1;
4 is a schematic perspective view of a rail device for a stage applied to the probe station of FIG. 1 .
5 to 7 are reference views for explaining a maintenance operation of the probe station of FIG. 1 .
8 and 9 are reference diagrams for explaining a probe station applied to the probe station of FIG. 1 .
10 is a schematic plan view of a probe station according to the second embodiment of the present invention.
11 is a schematic perspective view of a rail device for a transport device applied to the probe station of FIG. 10;
12 to 14 are reference views for explaining a maintenance operation of the probe station of FIG. 10 .
15 is a schematic plan view of a probe station according to a third embodiment of the present invention.
16 is a schematic plan view of a probe station according to a fourth embodiment of the present invention.
17 is a reference diagram for explaining a maintenance operation of the probe station of FIG. 16 .
18 is a reference diagram for explaining a probe station applied to the probe station of FIG. 17 .

Hereinafter, preferred embodiments according to the present invention as described above will be described with reference to the accompanying drawings, but overlapping descriptions will be omitted or compressed as much as possible for the sake of brevity of description.

<First embodiment>

As shown in FIG. 1 , the probe station 100 according to the first embodiment of the present invention includes N (N≥2) probe stages 110A to 110N, N manifold plates 120A to 120N, and a wafer transport device 130 . ), including rail devices 140A to 140N for N stages, a controller CA and a detector SA.

The N probe stages 110A to 110N are respectively provided to electrically connect the wafer chips to the probe card. These N probe stages 110A to 110N are arranged side by side on one side (rear side in the drawing) of the wafer transport device 130 . And, since the N probe stages 110A to 110N are separated from _{each other and spaced apart by a predetermined interval d 1} , the operation shock generated in each probe stage 110A to 110N is different from the probe stages 110A to 110N. does not affect Here, since the separation distance between the probe stages 110A to 110N is sufficient enough that the operating shocks do not affect each other, it is sufficient that they do not interfere with each other even when shaking due to the operating shock occurs. Therefore, even several millimeters is a separation distance that can be preferably considered. However, since the present invention is closely related to minimizing the gap between the probe stages 110A to 110N, it is difficult to ensure that the gap between the probe stages 110A to 110N is wide enough for an operator to move.

In addition, the number of the probe stages 110A to 110N is preferably provided with a number suitable for the working capacity of the wafer transport apparatus 130 . That is, the number of probe stages 110A to 110N capable of minimizing the waiting time of the probe stages 110A to 110N in consideration of the time during which the wafer is tested and the processing capacity and the working capacity of the wafer transport apparatus 130 are provided. make it

In addition, each of the probe stages 110A to 110N has a wafer chuck 111 and an elevator 112 for raising and lowering the wafer chuck 111 as shown in FIG. 2 .

The wafer chuck 111 applies heat according to test conditions to the wafer W placed on the upper surface.

The elevator 112 raises the wafer chuck 111 to electrically connect the wafer W placed on the upper surface of the wafer chuck 111 to the probe card, and when the test is finished, lowers the wafer chuck 111 to lower the wafer chuck ( 111), the wafer W placed on the upper surface is electrically separated from the probe card.

The N manifold plates 120A to 120N are coupled to one side of the N probe stages 110A to 110N, respectively. These manifolds 120A to 120N couple the test head to which the probe card is coupled to the probe stages 110A to 110N.

The wafer transport device 130 withdraws the wafer W loaded on the cassette C from the cassette C, and then supplies it to each of the probe stages 110A to 110N (more specifically, to the upper surface of the wafer chuck) and , The tested wafer W is recovered from the probe stages 110A to 110N and loaded into the cassette C. The wafer transport device 130 includes a wafer receiver 131 and a mover 132 as shown in FIG. 3 .

The wafer receiver 131 draws out the wafer W loaded on the cassette C, supplies it to the probe stages 110A to 110N, and completes the test from the probe stages 110A to 110N, the wafer W is recovered and introduced into the cassette (C). To this end, the wafer receiver 131 supplies a wafer W to each of the probe stages 110A to 110N, or a receiving position capable of recovering the tested wafer W from each of the probe stages 110A to 110N. (P ₁ to P _N ) It is provided to be movable so that it can be selectively located. The wafer receiver 131 includes a grip lever 131a, a lift source 131b, an advance/retract circle 131c, and a rotation source 131d.

The grip lever 131a grips or releases the wafer W. Here, the gripping force of the gripping lever 131a may be a vacuum adsorption force.

The lifting source 131b raises and lowers the grip lever 131a. Therefore, the holding lever 131a can take out the wafers W loaded at different heights in the cassette C or load the wafers W that have been tested at different heights in the cassette C.

Advance and retreat circle (131c) by moving the grip lever (131a) forward and backward (moving in the left and right direction in the drawing) so that the gripping end (131a-1) of the grip lever (131a) enters or exits the inside of the cassette (C) do. In addition, the advance/retract circle 131c allows the grip lever 131a to be positioned above the wafer chuck 111 or to escape from the top of the wafer chuck 111 .

The rotation circle 131d turns the direction of the grip lever 131a by 90 degrees so that the grip end 131a - 1 is selectively directed toward the cassette C or the wafer chuck 111 .

The mover 132 moves the wafer receiver 131 so that the wafer receiver 131 can be selectively _{positioned at the supply positions (P 1} to P _{N ).} In the present embodiment, the wafer W is supplied to the N probe stages 110A to 110N by one wafer receiver 131 or the wafer W is recovered from the N probe stages 110A to 110N. That is, since one wafer receiver 131 is responsible for the N probe stages 110A to 110N, the number of parts is reduced, thereby reducing production cost.

In addition, the wafer transport device 130 may further include a position holder 133 that can be fixed to a position set in a positional relationship with the stage rail devices 140A to 140N to be described later. In addition, the wafer transport device 130 and the N probe stages 110A to 110N are also _{spaced apart from each other by a predetermined distance (d 2} ), so that the operating impact of the probe stages 110A to 110N is mutually via the wafer transport device 130 . block transmission to the liver.

The N stage rail devices 140A to 140N guide the movement of the N probe stages 110A to 110N, respectively, and set the correct positions of the N probe stages 110A to 110N. Each of these N-stage rail devices 140A to 140N includes a pair of guide rails 141a and 141b and a positioner 142 as shown in FIG. 4 .

The pair of guide rails 141a and 141b guide the probe stages 110A to 110N moving away from the wafer transport device 130 or toward the wafer transport device 130 . That is, the probe stages 110A to 110N may be moved in a direction perpendicular to the moving direction of the wafer receiver 131 according to the guidance of the pair of guide rails 141a and 141b.

The positioner 142 sets the correct positions of the probe stages 110A to 110N moved toward the wafer transport device 130 by the guide rails 141a and 141b. Of course, it is preferable that the positioner 142 also has a function of fixing the positions of the probe stages 110A to 110N in the correct positions.

The controller CA controls each of the above-described components.

The detector SA detects the probe stages 110A to 110N in the correct position, and transmits the sensed information to the controller CA.

A maintenance operation of the probe station 100 having the above configuration will be described.

For example, when a defect occurs in the probe stage of reference numeral 110C in the state of FIG. 1 , the operator moves the probe stages 110A to 110C away from the wafer transport device 130 so that the arrangement is as shown in FIG. 5 . do. In the arrangement shown in FIG. 5 , the operator may use WS ₁ , WS ₃ as a work space for the probe stage of reference numeral 110C. Furthermore, if it is switched to the arrangement as shown in FIG. 6, it can be used as a work space for the probe stage 110C of _{WS 2, as a target.} That is, in the arrangement shown in FIG. 1, the operator _{can utilize only WS 0} as a work space targeting the probe stage of symbol 110C, but when it is difficult to perform maintenance work targeting the probe stage of symbol 110C in the work space of _{WS 0} 5 or 6 by moving the probe stations 110A to 110C, it is possible to easily perform an operation targeting the probe stage 110C. Here, _{the work space of WS 1} can also be used as a work space for the probe station of reference numeral 110B or 110D. Also, _{the work space of WS 0} can be used as an administrator's moving passage.

On the other hand, depending on the implementation, as shown in FIG. 7 , the number of the rail devices 140A to 140D for the stage may be smaller than the number of the probe stages 110A to 110N. In this case, even when the probe stage 110N is fixed as shown in FIG. 8 , the remaining probe stages 110A to 110D are moved to secure a working space for the probe stage 110N.

For reference, in this embodiment, the probe stages 110A to 110N are arranged side by side on one side of the wafer transport device 130 , but depending on implementation, both sides of the wafer transport device 130 as shown in FIG. 9 . It may have a structure in which the probe stages 110A' to 110N' are disposed. If the probe stages 110A to 110N and 110A' to 110' are disposed on both sides of the wafer transport device 130, the rotation circle 131d of the wafer receiver 131 moves the grip lever 131a in the direction It is desirable to be configured to be able to switch in a 180 degree range.

On the other hand, the detector SA detects whether the probe stages 110A to 110N are in the correct position, and transmits the sensed information to the controller CA. If all of the probe stages 110A to 110N are in their original positions as shown in FIG. 1 , the controller CA controls the wafer transport device 130 to supply wafers to all the probe stages 110A to 110N. However, if it is determined that any one or more probe stages 110C are out of their original positions as in FIG. 6 due to failure, repair, or other circumstances such as training, the controller CA controls the remaining probe stages 110C except for the out-of-place probe stages 110C. The wafer transport apparatus 130 is controlled so that wafers are supplied only to the probe stages 110A, 110B, 110D to 110N.

For reference, in this embodiment, N detectors SA are provided to detect the correct positions of the N probe stages 110A to 110N. However, depending on implementation, instead of configuring a separate detector, the wafer transport apparatus may be implemented to selectively supply wafers to the probe stages 110A to 110N by the setting of an administrator. In addition, since only one detector is provided in the wafer receiver of the wafer transport device, it may be implemented to detect the correct position of the probe stage during the movement of the wafer receiver.

<Second embodiment>

10 , the probe station 200 according to the second embodiment of the present invention includes a first probe stage 210A, a second probe stage 210B, a first manifold plate 220A, and a second manifold plate 220B. ), a wafer transport device 230, and a rail device 250 for a transport device.

The first probe stage 210A and the second probe stage 210B are disposed with the wafer transport device 230 interposed therebetween. Of course, it is preferable that a _{predetermined distance d 3} exists between the first probe stage 210A and the wafer transport device 230B and between the second probe stage 210B and the wafer transport device 230 . In addition, it is preferable that the first probe stage 210A and the second probe stage 210B include a positioning device (not shown) capable of being fixed to a position set in a positional relationship with the rail device 250 for a transport device, respectively.

The first manifold 220A and the second manifold 220B are coupled to the first probe stage 210A and the second probe stage 210B, respectively.

The wafer transport device 230 withdraws the wafer (W) loaded on the cassette (C) from the cassette (C) and supplies it to each probe stage (210A, 210B), and transfers the tested wafer (W) to each of the probe stages 210A and 210B. It is recovered from the probe stages 210A and 210B and loaded into the cassette (C). Such a wafer transport device 230 suffices to set the rotation range of the grip lever to 180 degrees, and unlike the first embodiment, a mover for moving the wafer receiver is not required.

The rail device 250 for the transport device guides the movement of the wafer transport device 230 and sets the original position of the wafer transport device 230 . The rail device 250 for such a transport device also includes a pair of guide rails 251a and 251b and a positioner 252 as shown in FIG. 11 .

The pair of guide rails 251a and 251b moves in a direction (right direction in the drawing) in which the wafer transport device 230 moves between the first probe stage 210A and the second probe stage 210B, or the first probe It guides movement between the stage 210A and the second probe stage 210B.

The positioner 252 sets the original position of the wafer transport device 230 moving between the first probe stage 210A and the second probe stage 210B along the guide rails 251a and 251b and fixes the position. do.

A maintenance operation of the probe station 200 having the above configuration will be described.

For example, when a defect occurs in any one of the first probe stage 210A, the second probe stage 210B, and the wafer transport device 230 in the state of FIG. By moving the 230 away from the first probe stage 210A and the second probe stage 210B, the position WS _a where the wafer transport device 230 is located can be utilized as a work space. In addition, the symbols WS _b and WS _c may be used as working spaces for the wafer transport device 230 . Of course, as shown in FIG. 12 , the wafer transport device 230 may be configured to completely deviate between the first probe stage 210A and the second probe stage 210B, but as in FIG. 13 , a part of the wafer transport device 230 is It can also be advantageously considered for space saving that the rail device 250 for a transport device is configured to only move out between the first probe stage 210A and the second probe stage 210B. Here, the space PS in which the portion deviated between the first probe stage 210A and the second probe stage 210B is located by movement is usually used as a movement path for an administrator, or another probe station ( 200') can be used as a work space for maintenance.

<Third embodiment>

15, the probe station 300 according to the third embodiment of the present invention includes N (N≥2) probe stages 310A to 310N, N manifold plates 320A to 320N, and a wafer transport device 330. ), and includes a rail device 340A to 340N for N stages, a wafer repair machine 360 and a rail device 370 for repair machine.

The N probe stages 310A to 310N, the N manifold plates 320A to 320N, and the N stage rail devices 340A to 340N are the same as in the first embodiment, and thus descriptions thereof will be omitted.

The wafer transport device 330 withdraws the wafer W loaded on the cassette C from the cassette C, then supplies it to each of the probe stages 310A to 310N, and transfers the tested wafer W to the probe stage. (310A to 310N) and loaded into the cassette (C). Furthermore, when repair of the wafer W on which the first test has been completed is required, the wafer transport device 330 supplies the repaired wafer W to the wafer repairer 360 and then probes the repaired wafer W Secondary testing is supported by feeding back to stages 310A to 310N.

The wafer repairer 360 repairs defects of the wafer W on which the first test is completed.

The rail device 370 for the repair machine guides the movement of the wafer repair machine 360 and sets the correct position of the wafer repair machine 360 . The rail device 370 for the repair machine also includes a pair of guide rails 371a and 371b and a positioner (not shown).

A pair of guide rails 371a and 371b guides the movement of the wafer repairer 360 , and the positioner sets the original position of the wafer repairer 360 and fixes the position.

Of course, the configuration of the rail device 370 for the repair machine may be omitted.

In this embodiment, it is sufficient if one or more probe stages 310A to 310N are provided.

According to this embodiment, since the wafer (W) is supplied to and recovered from the wafer repair machine 360 using the wafer transport device 330, it is possible to reduce the production cost by saving space and reducing the number of parts. , since the first and second tests can be performed in one automated process, it is possible to reduce processing time and manpower.

<Fourth embodiment>

As shown in FIG. 16 , the probe station 400 according to the fourth embodiment of the present invention includes N (N≧2) probe stages 410A to 410N, N manifold plates 420A to 420N, and a wafer transport device 430. ), including a rail device 440 for the stage, a controller CA and a detector SA.

The N probe stages 410A to 410N, the N manifold plates 420A to 420N, the wafer transport apparatus 430 and the controller CA in the first embodiment include the N probe stages 110A to 110N, N Since they are the same as the manifolds 120A to 120N, the wafer transport device 130 and the controller CA, a description thereof will be omitted.

The rail device 440 for the stage guides the movement of the probe stages 410A to 410N in a direction parallel to the moving direction (arrow a direction) of the wafer repair machine (arrow b direction).

The detector SA is provided in the wafer receiver 431 of the wafer transport device 430 , and detects the positions of the probe stages 420A to 420N while moving along with the movement of the wafer receiver 431 . For this purpose, it may be preferably considered that each of the probe stages 410A to 410N includes an element to be sensed that can be sensed by the detector SA. The position information sensed by the detector SA is transmitted to the controller CA. And the controller CA determines the supply/demand position of the wafer repair machine according to the information from the detector SA.

A maintenance operation of the probe station 400 having the above configuration will be described.

For example, when a defect occurs in the probe stage 410B in the state of FIG. 16, the operator moves the probe stage 410C to 410N away from the probe stage 410B as shown in FIG. A work space is secured by increasing the distance between the probe stage and the probe stage of reference numeral 410C.

On the other hand, as shown in FIG. 18 , the probe stages 410A to 410N are required to work by moving the probe stages 410A to 410N to either side for convenience by having the rail device 440 for the stage long in both left and right directions. Implementation to secure the work space of the can also be considered. Of course, it is also possible to provide probe stages on both sides of the wafer transport apparatus as in the first embodiment.

As described above, the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings, but since the above-described embodiments have been described only by taking preferred examples of the present invention, the present invention is not limited to the above embodiments It should not be construed as being limited only to, and the scope of the present invention should be understood as the following claims and their equivalent concepts.

100, 200, 300 : probe station
110A to 110N, 210A, 210B, 310A to 310N: probe stage
130, 230, 330: wafer transport device
131: wafer receiving device 132: moving device
340A to 340N: Rail device for stage
341a, 341b: guide rail
342: positioner
250: rail device for transportation device
251a, 251b: guide rail
252: positioner
360 : Wafer Repairer
370: rail device for repair equipment
CA: controller
SA: Detector

Claims (14)

a plurality of probe stages provided to electrically connect the wafer chips to the probe card;
a wafer transport device for supplying or retrieving wafers to the plurality of probe stages; and
a rail device for at least one stage provided for guiding movement of at least one of the plurality of probe stages and setting a fixed position; and
a plurality of manifold plates coupled to one side of the probe stage to couple the test head to which the probe card is coupled to the probe stage; including,
The wafer transport device,
a wafer receiver that takes out the wafer loaded in the cassette, supplies it to the plurality of probe stages, collects the tested wafers from the plurality of probe stages, and introduces the wafer into the cassette; includes
The rail device for the stage,
a guide rail guiding the movement of the probe stage and the manifold in a direction orthogonal to a movement direction of the wafer receiver; and
a positioner for setting an exact position of the probe stage moved by the guide rail; including,
Each of the plurality of probe stages is characterized in that spaced apart from each other
probe station. a plurality of probe stages provided to electrically connect the wafer chips to the probe card;
a wafer transport device for supplying or retrieving wafers to the plurality of probe stages; and
a rail device for at least one stage provided for guiding movement of at least one of the plurality of probe stages and setting a fixed position; and
a plurality of manifold plates coupled to one side of the probe stage to couple the test head to which the probe card is coupled to the probe stage; including,
The wafer transport device,
a wafer receiver that takes out the wafer loaded in the cassette, supplies it to the plurality of probe stages, collects the tested wafers from the plurality of probe stages, and introduces the wafer into the cassette; includes,
The rail device for the stage includes a guide rail for guiding the movement of the probe stage and the manifold in a direction parallel to the movement direction of the wafer receiver,
Each of the plurality of probe stages is characterized in that spaced apart from each other
probe station. According to claim 1 or 2,
The wafer transport device may further include a mover capable of moving and positioning the receiver to a plurality of supply positions capable of supplying wafers to each of the plurality of probe stages or recovering wafers from each of the plurality of probe stages. to do
probe station. 3. The method of claim 1 or 2,
a wafer repair machine for repairing defects of wafers that have been tested; further comprising,
The wafer transport apparatus, when repair of a tested wafer is required, supplies the repaired wafer to the wafer repair machine and then supplies the repaired wafer to the probe stage again
probe station. 5. The method of claim 4,
a rail device for a repair machine provided for guiding the movement of the wafer repair machine and setting a fixed position; characterized in that it further comprises
probe station. 3. The method of claim 1 or 2,
The plurality of probe stages are arranged side by side on at least one side of the wafer transport device.
probe station. 3. The method of claim 1 or 2,
The plurality of probe stages,
a first probe stage disposed on one side of the wafer transport device; and
a second probe stage disposed on the other side of the wafer transport device; characterized in that it comprises
probe station. 3. The method of claim 1 or 2,
a controller for controlling the wafer transport device so that wafers can be selectively supplied to one or more probe stages according to circumstances; characterized in that it further comprises
probe station. 9. The method of claim 8,
a detector for sensing the position of one or more probe stages; further comprising,
The controller determines a receiving position of the wafer receiving device (a position of the wafer receiving device for supplying a wafer to the probe stage and recovering the wafer from the probe stage) according to the information sensed through the sensor
probe station. at least one probe stage provided to electrically connect the wafer chips to the probe card;
at least one manifold plate coupled to one side of the probe stage to couple the test head to which the probe card is coupled to the probe stage;
a wafer transport device for supplying or retrieving a wafer to the at least one probe stage; and
a wafer repair machine for repairing defects of wafers that have been tested; including,
The wafer transport device supplies the repaired wafer to the at least one probe stage after supplying the repaired wafer to the wafer repairer when the tested wafer needs to be repaired,
A rail device for at least one stage for guiding movement and setting a fixed position so that the at least one probe stage and the at least one manifold can be simultaneously operated, and a rail device for a repair machine for guiding and setting the movement of the wafer repair machine comprising at least one of
probe station. delete delete delete delete

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