KR20230098510A - Probe station - Google Patents

Abstract

The present invention relates to a probe station used to test chips on a wafer.
A probe station according to the present invention includes a probe stage provided to electrically connect wafer chips to a probe card; a wafer transfer device supplying or recovering wafers to the probe stage; and a rail device for moving and positioning at least one of the probe stage and the wafer transfer device. includes Further, the probe station includes a wafer repairer for repairing defects of the tested wafer; may further include.
According to the present invention, a large number of probe stages can be concentrated in a limited space, and a two-step test can be continuously performed by the operation of an automated wafer transfer device.

Description

Probe Station {PROBE STATION}

The present invention relates to a probe station for use in testing chips on a wafer.

The production of semiconductor devices starts with growing silicon to produce ingots. The grown ingot is thinly cut into multiple wafers. Then, patterns are formed on the wafer to form chips. Subsequently, the configured chips are separated into individual chips, and the separated chips are packaged to complete a final product. In this way, several times of electrical tests are conducted to prevent defective production until the grown ingot is commercialized as a packaged semiconductor device. The present invention relates to a process of forming chips by forming patterns on a wafer and then testing the chips on the wafer before separating the formed chips into individual chips.

A tester, a probe card, and a probe station are required to electrically connect the chips on the wafer to the tester and perform the test.

The tester supplies electrical signals to the chips on the wafer and then determines whether or not the chips are defective through the returned electrical signals. This tester has a test head for electrical connection with the chips.

The probe card is coupled to the test head and electrically connects chips on the wafer supplied from the probe station to the test head. To this end, the probe card is provided with a plurality of probes for electrically connecting the chips to the test head.

The probe station has a wafer chuck on which a wafer can be placed, and electrically connects the wafer placed on the wafer chuck to the probe card. Such a wafer chuck is also called a hot chuck because it is capable of applying heat to the wafer according to test conditions. The present invention relates to such a probe station.

The probe station includes a probe stage having a wafer chuck and a wafer transfer device that supplies wafers to or retrieves wafers from the probe stage. In addition, a manifold for coupling the test head to which the probe card is coupled to the probe stage may be included in the probe station.

In general, a probe stage, a wafer transporter, and a maniplate are coupled so that their mutual positions are firmly fixed. This is because if the distance between them is slightly different, electrical contact between the chips and the probe card may be defective.

On the other hand, while the demand for semiconductor devices increases and production volume increases, the space required for testing chips on a wafer is limited unless it is further expanded through securing a site and investing in facilities. It is not easy to secure a site in the vicinity of a production plant, and the continued securing of a site and facility investment in accordance with the increase in production of semiconductor devices is a major cause of reducing corporate profits. Therefore, a technology for integrating probe stations is being researched so that more tests can be performed within a limited space.

Korean Registered Patent Nos. 10-0346147, 10-1019899, 10-1079017, etc. (hereinafter referred to as 'prior art') seek to save space by combining several probe stages with one wafer transfer device.

However, according to the prior art, there are the following problems.

First, operating shocks of the individually operated probe stages and the wafer transfer device mutually affect each other, resulting in defective electrical contact between the wafer and the probe card. In addition, this problem may be more prominent as the gap between pads provided in the chip becomes ultra-fine as the integration technology of the semiconductor device develops.

Second, since a working space required for maintenance of the probe stages and the wafer transfer device must be secured, integration of the probe station is limited.

Meanwhile, chips judged to be defective in the first test are repaired by a wafer repairer and then undergo a second test. To this end, a process of retrieving the first test completed wafer from the probe station, supplying the wafer to the wafer repair machine, and resupplying the repaired wafer from the wafer repair machine to the probe station for the second test is required. Therefore, more space is required for the wafer repair machine to be located, manpower is required to perform the corresponding process, and inconvenience arises in performing the corresponding process.

The present invention has the following objects.

First, a technology capable of preventing the operating shocks of probe stations from affecting each other is provided.

Second, a technology capable of increasing the degree of integration of a probe station is provided by utilizing multiple workspaces for equipment maintenance.

Third, it provides a technology that can combine the first and second tests on wafers into one automated process using a wafer transportation device.

A probe station according to a first aspect of the present invention for achieving the above objectives includes a plurality of probe stages provided to electrically connect wafer chips to a probe card; a wafer transfer device supplying or collecting wafers to or from the plurality of probe stages; and at least one stage rail device provided for guiding movement of at least one probe stage among the plurality of probe stages and setting the correct position; Including, each of the plurality of probe stages are spaced apart from each other by a predetermined interval.

The wafer transfer device may include: a wafer receiver for taking out wafers loaded in a cassette, supplying the wafers to the plurality of probe stages, and recovering tested wafers from the plurality of probe stages and introducing them into the cassette; a mover capable of moving and positioning the receiver to a plurality of supply/receiving positions capable of supplying wafers to each of the plurality of probe stages or retrieving wafers from each of the plurality of probe stages; includes

The rail device for the stage may include a guide rail for guiding the movement of the probe stage in a direction perpendicular to the movement direction of the wafer receiver; and a positioning unit configured to set a proper position of the probe stage moved by the guide rail. can include

The rail device for the stage may include a guide rail for guiding movement of the probe stage in a direction parallel to a movement direction of the wafer receiver.

The above probe station includes a wafer repairer for repairing defects of a wafer that has been tested; The wafer transfer device further includes, when repair of the wafer after testing is required, supplies the wafer to be repaired to the wafer repair machine and then resupplies the repaired wafer to the probe stage.

a rail device for a repairer provided for guiding movement of the wafer repairer and setting the correct position; may further include.

The plurality of probe stages may be arranged side by side on at least one side of the wafer transfer device.

The plurality of probe stages may include a first probe stage disposed on one side of the wafer transfer device; and a second probe stage disposed on the other side of the wafer transfer device. can include

The probe station includes a controller for controlling the wafer transfer device to selectively supply wafers to one or more probe stages according to circumstances; may further include.

a detector for sensing the position of one or more probe stages; The controller further includes, and the controller determines the supply/demand position of the wafer receiver (a position of the wafer receiver for supplying wafers to the probe stage and recovering wafers from the probe stage) according to the information sensed through the detector. .

A probe station according to a second aspect of the present invention for achieving the above object includes at least one probe stage provided to electrically connect wafer chips to a probe card; a wafer transfer device supplying or recovering wafers to the at least one probe stage; and a wafer repairer for repairing defects of the wafer on which the test has been completed. The wafer transfer device supplies the wafer to be repaired to the wafer repairer and then resupplies the repaired wafer to the at least one probe stage, when repair of the tested wafer is required.

At least one of a rail device for a stage for guiding the movement of the at least one probe stage and setting the correct position thereof and a rail device for a repair device for guiding movement and setting the correct position of the wafer repair device may be included.

A probe station according to a third aspect of the present invention for achieving the above object includes a first probe stage and a second probe stage provided to electrically connect wafer chips to a probe card; a wafer transfer device provided between the first probe stage and the second probe stage and supplying or recovering wafers to the first probe stage and the second probe stage; And a rail device for a transport device provided for guiding movement of the wafer transport device and setting the correct position; includes

The rail device for the transport device may include a guide rail for guiding movement of at least a portion of the wafer transport device to move away from the first probe stage and the second probe stage; and a positioning unit for setting a proper position of the wafer transfer device moved by the guide rail. includes

According to the present invention, there are the following effects.

First, it is possible to save space by maximally clustering the probe stages while being free from mutual operation impact.

Second, the degree of integration of the probe station can be increased by utilizing multiple workspaces for equipment maintenance.

Third, since the first test and the second test for the wafer are bundled into one automated process using the wafer transfer device, space saving, reduction in the number of parts and production cost, shortening the process, and eliminating the hassle of performing the process brings relief

Fourth, even when some of the probe stations stop operating, the operation of the remaining probe stations can be maintained.

1 is a schematic plan configuration diagram of a probe station according to a first embodiment of the present invention.
FIG. 2 is a schematic perspective view of a wafer chuck and an elevator constituting a probe stage applied to the probe station of FIG. 1;
3 is a schematic side view of a wafer transfer device applied to the probe station of FIG. 1;
Figure 4 is a schematic perspective view of a rail device for a stage applied to the probe station of Figure 1;
5 to 7 are reference views for explaining maintenance work of the probe station of FIG. 1 .
8 and 9 are reference views for explaining a probe station applied to the probe station of FIG. 1 .
Fig. 10 is a schematic plan configuration diagram of a probe station according to a second embodiment of the present invention.
FIG. 11 is a schematic perspective view of a rail device for a transportation device applied to the probe station of FIG. 10 .
12 to 14 are reference diagrams for explaining maintenance work of the probe station of FIG. 10 .
15 is a schematic plan configuration diagram of a probe station according to a third embodiment of the present invention.
Fig. 16 is a schematic plan configuration diagram of a probe station according to a fourth embodiment of the present invention.
Fig. 17 is a reference diagram for explaining a maintenance operation of the probe station of Fig. 16;
18 is a reference diagram for explaining a probe station applied to the probe station of FIG. 17;

Hereinafter, preferred embodiments according to the present invention as described above will be described with reference to the accompanying drawings, but redundant descriptions are omitted or compressed as much as possible for conciseness of description.

<First Embodiment>

As shown in FIG. 1, the probe station 100 according to the first embodiment of the present invention includes N (N≥2) probe stages 110A to 110N, N manifolds 120A to 120N, and a wafer transfer device 130. ), a rail device for N stages (140A to 140N), a controller (CA) and a detector (SA).

The N probe stages 110A to 110N are provided to electrically connect wafer chips to the probe card, respectively. These N probe stages 110A to 110N are arranged side by side on one side (rear side in the drawing) of the wafer transfer device 130 . In addition, since the N probe stages 110A to 110N are separated from each other and spaced apart at a predetermined interval d ₁ , the operating shock generated from each probe stage 110A to 110N is transferred to the other probe stages 110A to 110N. can't affect Since the separation distance between the probe stages 110A to 110N is sufficient so that the operating impact does not affect each other, it is sufficient to have a distance that does not interfere with each other even if vibration due to the operating impact occurs. Therefore, even several mm is a separation distance that can be considered preferably. However, since the present invention is closely related to minimizing the distance between the probe stages 110A to 110N, it is difficult to ensure that the distance between the probe stages 110A to 110N is wide enough for an operator to move.

In addition, it is preferable that the number of probe stages 110A to 110N is appropriate for the working capacity of the wafer transfer device 130 . That is, the probe stages 110A to 110N are provided as many as possible to minimize the waiting time of the probe stages 110A to 110N in consideration of the wafer testing time, processing capacity, and working capacity of the wafer transfer device 130. let it

Also, each of the probe stages 110A to 110N has a wafer chuck 111 and an elevator 112 that lifts the wafer chuck 111 as shown in FIG. 2 .

The wafer chuck 111 applies heat according to test conditions to the wafer W placed on the upper surface.

The elevator 112 raises the wafer chuck 111 to electrically connect the wafer W placed on the upper surface of the wafer chuck 111 to the probe card, and when the test is finished, lowers the wafer chuck 111 to the wafer chuck ( 111) is electrically separated from the probe card.

The N maniplates 120A to 120N are coupled to one side of the N probe stages 110A to 110N, respectively. The manifolds 120A to 120N couple the test head to which the probe card is coupled to the probe stages 110A to 110N.

The wafer transfer device 130 withdraws the wafer W loaded in the cassette C from the cassette C and then supplies it to each of the probe stages 110A to 110N (more specifically, supplies it to the upper surface of the wafer chuck), , The wafer (W) on which the test has been completed is retrieved from the probe stages (110A to 110N) and loaded into the cassette (C). The wafer transfer device 130 includes a wafer receiver 131 and a mover 132 as shown in FIG. 3 .

The wafer receiver 131 takes out the wafers W loaded in the cassette C, supplies them to the probe stages 110A to 110N, and transfers the tested wafers W from the probe stages 110A to 110N. is recovered and drawn into the cassette (C). To this end, the wafer receiver 131 is a supply/demand position capable of supplying wafers W to each of the probe stages 110A to 110N or recovering a test-completed wafer W from each of the probe stages 110A to 110N. (P ₁ to P _N ) It is provided movably so that it can be selectively positioned. The wafer receiver 131 includes a gripping lever 131a, an elevation circle 131b, a forward and backward circle 131c, and a rotation circle 131d.

The holding lever 131a grips the wafer W or releases the grip. Here, the gripping force of the gripping lever 131a may be a vacuum suction force.

The lift member 131b lifts the grip lever 131a. Therefore, the gripping lever 131a can take out the wafers W loaded at different heights in the cassette C or load the wafers W on which tests have been completed at different heights in the cassette C.

The advancing and retracting member 131c allows the gripping end 131a-1 of the gripping lever 131a to enter or exit the inside of the cassette C by moving the gripping lever 131a forward and backward (moving in the left and right directions on the drawing). do. In addition, the advance and retreat member 131c allows the gripping lever 131a to be positioned above the wafer chuck 111 or to move away from the top of the wafer chuck 111 .

The rotation source 131d changes the direction of the gripping lever 131a by 90 degrees so that the gripping end 131a-1 is selectively directed toward the cassette C or toward the wafer chuck 111.

The mover 132 moves the wafer receiver 131 so that the wafer receiver 131 can be selectively positioned at the supply/demand positions P ₁ to P _N . In this embodiment, wafers W are supplied to N probe stages 110A to 110N by one wafer receiver 131 or wafers W are retrieved from N probe stages 110A to 110N. That is, since one wafer receiver 131 is in charge of the N probe stages 110A to 110N, the number of parts can be reduced and the production cost can be reduced.

In addition, the wafer transfer device 130 may further include a position holder 133 that can be fixed to a position set in a positional relationship with the stage rail devices 140A to 140N, which will be described later. Also, since the wafer transporter 130 and the N probe stages 110A to 110N are also spaced apart from each other at a predetermined interval (d ₂ ), operating shocks of the probe stages 110A to 110N pass through the wafer transporter 130 to each other. It blocks transmission to the liver.

The N stage rail devices 140A to 140N respectively guide the movement of the N probe stages 110A to 110N and set the proper positions of the N probe stages 110A to 110N. These N stage rail devices 140A to 140N each include a pair of guide rails 141a and 141b and a positioning device 142 as shown in FIG. 4 .

The pair of guide rails 141a and 141b guide the probe stages 110A to 110N moving away from or toward the wafer transporter 130 . That is, the probe stages 110A to 110N may be moved in a direction orthogonal to the moving direction of the wafer receiver 131 according to the guidance of the pair of guide rails 141a and 141b.

The position setter 142 sets the proper positions of the probe stages 110A to 110N moved toward the wafer transfer device 130 by the guide rails 141a and 141b. Of course, it is preferable that the position setter 142 also has a function of fixing the position of the probe stages 110A to 110N in the correct position.

The controller CA controls each of the above components.

The detector SA detects the probe stages 110A to 110N in the correct position and transmits the sensed information to the controller CA.

Maintenance work of the probe station 100 having the above configuration will be described.

For example, when a defect occurs in the probe stage 110C in the state of FIG. 1, the operator moves the probe stages 110A to 110C in a direction away from the wafer transfer device 130 so that they are arranged as shown in FIG. do. In the arrangement shown in FIG. 5, a worker may utilize WS ₁ and WS ₃ as a workspace for the probe stage of reference numeral 110C. Furthermore, when switching to the arrangement shown in FIG. 6, WS ₂ can also be used as a work space for the probe stage of reference numeral 110C. That is, in the arrangement shown in FIG. 1, the operator can use only WS ₀ as a work space for the probe stage of code 110C, but it is difficult to perform maintenance work for the probe stage of code 110C in the work space of WS ₀ 5 or 6 by moving the probe stations 110A to 110C, it is possible to easily perform an operation targeting the probe stage 110C. Here, the workspace of WS ₁ can also be used as a workspace targeting probe stations of code 110B or code 110D. In addition, the workspace of WS ₀ can be used as a path for administrators to move normally.

Meanwhile, depending on implementation, the number of stage rail devices 140A to 140D may be less than the number of probe stages 110A to 110N as shown in FIG. 7 . In this case, even if the probe stage 110N is fixed as shown in FIG. 8, the work space for the probe stage 110N can be secured by moving the remaining probe stages 110A to 110D.

For reference, in this embodiment, the probe stages 110A to 110N are arranged side by side on one side of the wafer transporter 130, but depending on the implementation, both sides of the wafer transporter 130 as shown in FIG. It may have a structure in which the probe stages 110A' to 110N' are disposed. If the probe stages 110A to 110N and 110A' to 110' are disposed on both sides of the wafer transfer device 130, the rotation circle 131d of the wafer receiver 131 changes the direction of the grip lever 131a. It is preferable to be configured to be able to switch in the range of 180 degrees.

Meanwhile, the sensor SA detects whether the probe stages 110A to 110N are in the right position and sends the detected information to the controller CA. If all of the probe stages 110A to 110N are in the right position as shown in FIG. 1, the controller CA controls the wafer transfer device 130 to supply wafers to all of the probe stages 110A to 110N. However, when it is determined that one or more probe stages 110C are out of position as shown in FIG. 6 due to other circumstances such as failure, repair, or training, the controller CA controls the remaining probe stages 110C except for the probe stages 110C out of position. The wafer transfer device 130 is controlled so that wafers are supplied only to the probe stages 110A, 110B, and 110D to 110N.

For reference, in this embodiment, N detectors SA are provided to detect the proper positions of the N probe stages 110A to 110N. However, depending on implementation, instead of configuring a separate sensor, the wafer transfer device may be implemented to selectively supply wafers to the probe stages 110A to 110N according to a manager's setting. In addition, only one sensor may be provided in the wafer receiver of the wafer transporter to detect the correct position of the probe stage during the movement of the wafer receiver.

<Second Embodiment>

As shown in FIG. 10, the probe station 200 according to the second embodiment of the present invention includes a first probe stage 210A, a second probe stage 210B, a first manifold 220A, and a second manifold 220B. ), a wafer transport device 230, and a rail device 250 for the transport device.

The first probe stage 210A and the second probe stage 210B are disposed with the wafer transfer device 230 interposed therebetween. Of course, it is preferable that a predetermined distance d ₃ exists between the first probe stage 210A and the wafer transporter 230B and between the second probe stage 210B and the wafer transporter 230 . Also, each of the first probe stage 210A and the second probe stage 210B preferably includes a positioning device (not shown) that can be fixed to a position set in a positional relationship with the transport rail device 250.

The first manifold 220A and the second manifold 220B are coupled to the first probe stage 210A and the second probe stage 210B, respectively.

The wafer transfer device 230 takes out the wafer W loaded on the cassette C from the cassette C, supplies it to each of the probe stages 210A and 210B, and transfers the tested wafer W to each of the probe stages 210A and 210B. It is retrieved from the probe stages 210A and 210B and loaded into the cassette C. This wafer transfer device 230 suffices if the rotation range of the gripping lever is 180 degrees, and unlike the first embodiment, a mover for moving the wafer receiver is not required.

The rail device 250 for the transport device guides the movement of the wafer transport device 230 and sets the correct position of the wafer transport device 230 . The rail device 230 for the transportation device also includes a pair of guide rails 251a and 251b and a positioning device 252 as shown in FIG. 11 .

The pair of guide rails 251a and 251b move in a direction in which the wafer transfer device 230 moves away from between the first probe stage 210A and the second probe stage 210B (rightward direction in the drawing) or the first probe stage 210A. Movement between the stage 210A and the second probe stage 210B is guided.

The position setter 252 sets the proper position of the wafer transfer device 230 moving between the first probe stage 210A and the second probe stage 210B along the guide rails 251a and 251b and fixes the position. do.

Maintenance work of the probe station 200 having the above structure will be described.

For example, in the state of FIG. 10, when a defect occurs in any one of the first probe stage 210A, the second probe stage 210B, and the wafer transporter 230, the operator operates the wafer transporter as shown in FIG. By moving the 230 away from the first probe stage 210A and the second probe stage 210B, the location WS _a of the wafer transfer device 230 may be used as a work space. In addition, symbols WS _b and WS _c may be used as a work space for the wafer transfer device 230 . Of course, as shown in FIG. 12, the wafer transporter 230 may be configured to completely deviate between the first probe stage 210A and the second probe stage 210B, but as shown in FIG. 13, a portion of the wafer transporter 230 In order to save space, it may be desirable to configure the rail device 250 for the transportation device so that only the first probe stage 210A and the second probe stage 210B are out of position. Here, the space (PS) where the part deviating between the first probe stage 210A and the second probe stage 210B by movement is located is normally used as a manager's movement path, or, as shown in FIG. 14, another probe station ( 200') can be used as a work space for maintenance.

<Third Embodiment>

As shown in FIG. 15, the probe station 300 according to the third embodiment of the present invention includes N (N≥2) probe stages 310A to 310N, N manifolds 320A to 320N, and a wafer transfer device 330. ), N number of stage rail devices 340A to 340N, a wafer repair device 360, and a repair rail device 370.

Since N probe stages 310A to 310N, N mani plates 320A to 320N, and N stage rail devices 340A to 340N are the same as in the first embodiment, their descriptions are omitted.

The wafer transfer device 330 withdraws the wafer W loaded on the cassette C from the cassette C, supplies it to each of the probe stages 310A to 310N, and transfers the tested wafer W to the probe stage. 310A to 310N are retrieved and loaded into cassette (C). Furthermore, if repair of the wafer W for which the first test has been completed is required, the wafer transfer device 330 supplies the wafer W to be repaired to the wafer repairer 360, and then probes the repaired wafer W. Resupply to stages 310A to 310N supports the secondary test.

The wafer repairer 360 repairs defects of the wafer W after the first test is completed.

The rail device 370 for the repair machine guides the movement of the wafer repair machine 360 and sets the correct position of the wafer repair machine 360 . The rail device 370 for the repair machine also includes a pair of guide rails 371a and 371b and a positioning device (not shown).

A pair of guide rails 371a and 371b guide the movement of the wafer handling machine 360, and a positioning machine sets the correct position of the wafer handling machine 360 and fixes the position.

Of course, the configuration of the rail device 370 for the repair machine may be omitted.

In this embodiment, it is sufficient if one or more probe stages 310A to 310N are provided.

According to the present embodiment, since the wafer W is supplied and collected from the wafer repairer 360 using the wafer transfer device 330, it is possible to save space and reduce the production cost by reducing the number of parts, , since the first test and the second test can be performed in one automated process, processing time and manpower can be reduced.

<Fourth Embodiment>

As shown in FIG. 16, the probe station 400 according to the fourth embodiment of the present invention includes N (N≥2) probe stages 410A to 410N, N manifolds 420A to 420N, and a wafer transfer device 430. ), a stage rail device 440, a controller CA, and a sensor SA.

The N probe stages 410A to 410N, the N maniplates 420A to 420N, the wafer transfer device 430 and the controller CA are the N probe stages 110A to 110N, N probe stages 110A to 110N in the first embodiment. Since the maniplates 120A to 120N, the wafer transfer device 130, and the controller CA are the same, description thereof will be omitted.

The stage rail device 440 guides the movement of the probe stages 410A to 410N in a direction (direction of arrow b) parallel to the moving direction of the wafer repair machine (direction of arrow a).

The detector SA is provided in the wafer receiver 431 of the wafer transfer device 430 and detects the positions of the probe stages 420A to 420N while moving along with the movement of the wafer receiver 431 . To this end, it may be considered desirable that each of the probe stages 410A to 410N has a sensing element capable of being sensed by the detector SA. Position information sensed by the sensor SA is transmitted to the controller CA. Then, the controller CA determines the supply/demand position of the wafer repair machine according to the information received from the sensor SA.

Maintenance work of the probe station 400 having the above structure will be described.

For example, when a defect occurs in the probe stage 410B in the state of FIG. 16, as in FIG. 17, the operator moves the probe stages 410C to 410N in a direction away from the probe stage 410B, thereby A work space is secured by increasing the distance between the probe stage and the probe stage of the reference numeral 410C.

On the other hand, as shown in FIG. 18, the probe stages 410A to 410N requiring work are moved by moving the probe stages 410A to 410N to one side according to convenience by providing the stage rail device 440 long in both left and right directions. It may also be considered to implement to secure a working space of. Of course, it is also possible to provide probe stages on both sides of the wafer transfer device as in the first embodiment.

As described above, the detailed description of the present invention has been made by embodiments with reference to the accompanying drawings, but since the above-described embodiments have only been described by way of preferred examples of the present invention, the present invention is based on the above embodiments. It should not be understood as being limited only to, and the scope of the present invention should be understood as the following claims and equivalent concepts thereof.

100, 200, 300: probe station
110A to 110N, 210A, 210B, 310A to 310N: probe stage
130, 230, 330: wafer transfer device
131: wafer receiver 132: mover
340A to 340N: Rail devices for stages
341a, 341b: guide rail
342: position setter
250: Rail device for transportation device
251a, 251b: guide rail
252: position setter
360: wafer repair machine
370: rail device for repair
CA: controller
SA: detector

Claims (3)

a plurality of probe stages provided to electrically connect the chips of the wafer to the probe card and spaced apart from each other at regular intervals so that operating shocks do not affect each other; and
a wafer transfer device supplying or collecting wafers to or from the plurality of probe stages; including,
The plurality of probe stages are arranged side by side on one side of the wafer transport device,
The wafer transporter and the plurality of probe stages are also spaced apart from each other at a predetermined interval in order to block the transfer of operating shocks of the plurality of probe stages to each other via the wafer transporter,
The wafer transport device
a wafer receiver for taking out the wafers loaded on the cassette, supplying the wafers to the plurality of probe stages, and recovering the wafers tested from the plurality of probe stages and introducing them into the cassette; and
a mover capable of moving and positioning the receiver to a plurality of supply/receiving positions capable of supplying wafers to each of the plurality of probe stages or retrieving wafers from each of the plurality of probe stages; characterized in that it includes
probe station. According to claim 1,
a wafer repairer for repairing defects of wafers that have been tested; Including more,
The probe station according to claim 1 , wherein the wafer transport device supplies the wafer to be repaired to the wafer repairer and then resupplies the repaired wafer to the probe stage when repair of the wafer after testing is required. According to claim 1,
The plurality of probe stages
a plurality of probe stages disposed on the other side of the wafer transfer device; Probe station further comprising a.

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