KR102351010B1 - 풉 세정 장치 - Google Patents

풉 세정 장치 Download PDF

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Publication number
KR102351010B1
KR102351010B1 KR1020190129010A KR20190129010A KR102351010B1 KR 102351010 B1 KR102351010 B1 KR 102351010B1 KR 1020190129010 A KR1020190129010 A KR 1020190129010A KR 20190129010 A KR20190129010 A KR 20190129010A KR 102351010 B1 KR102351010 B1 KR 102351010B1
Authority
KR
South Korea
Prior art keywords
foop
cleaning
dry air
foup
cover
Prior art date
Application number
KR1020190129010A
Other languages
English (en)
Korean (ko)
Other versions
KR20210045675A (ko
Inventor
허동근
박영수
류수렬
최우진
김학두
손혁주
박상필
Original Assignee
(주)에스티아이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)에스티아이 filed Critical (주)에스티아이
Priority to KR1020190129010A priority Critical patent/KR102351010B1/ko
Priority to TW109135889A priority patent/TWI769556B/zh
Publication of KR20210045675A publication Critical patent/KR20210045675A/ko
Application granted granted Critical
Publication of KR102351010B1 publication Critical patent/KR102351010B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
KR1020190129010A 2019-10-17 2019-10-17 풉 세정 장치 KR102351010B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020190129010A KR102351010B1 (ko) 2019-10-17 2019-10-17 풉 세정 장치
TW109135889A TWI769556B (zh) 2019-10-17 2020-10-16 前開式晶圓傳送盒清潔裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190129010A KR102351010B1 (ko) 2019-10-17 2019-10-17 풉 세정 장치

Publications (2)

Publication Number Publication Date
KR20210045675A KR20210045675A (ko) 2021-04-27
KR102351010B1 true KR102351010B1 (ko) 2022-01-14

Family

ID=75725972

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190129010A KR102351010B1 (ko) 2019-10-17 2019-10-17 풉 세정 장치

Country Status (2)

Country Link
KR (1) KR102351010B1 (zh)
TW (1) TWI769556B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113380918B (zh) * 2021-04-30 2024-05-17 徐州中辉光伏科技有限公司 单晶硅电池返工多道清洗优化设备
TWI762311B (zh) * 2021-05-13 2022-04-21 科嶠工業股份有限公司 物料傳送盒之清潔成果檢測方法及其裝置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1555689B1 (en) * 2002-10-25 2010-05-19 Shin-Etsu Polymer Co., Ltd. Substrate storage container
DE102006028057B4 (de) * 2005-10-17 2017-07-20 Dynamic Microsystems Semiconductor Equipment Gmbh Vorrichtung zum Lagern von kontaminationsempfindlichen, plattenförmigen Gegenständen, insbesondere zum Lagern von Halbleiterwafern
JP5674314B2 (ja) * 2007-02-28 2015-02-25 インテグリス・インコーポレーテッド レチクルｓｍｉｆポッド又は基板コンテナ及びそのパージ方法
WO2009114798A2 (en) * 2008-03-13 2009-09-17 Entegris, Inc. Wafer container with tubular environmental control components
KR102067752B1 (ko) * 2018-02-09 2020-01-17 (주)에스티아이 풉 세정 장치 및 풉 세정 방법

Also Published As

Publication number Publication date
TW202116641A (zh) 2021-05-01
TWI769556B (zh) 2022-07-01
KR20210045675A (ko) 2021-04-27

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