KR102343409B1 - Modular PC slab for vibration reduction - Google Patents

Abstract

The present invention combines a plurality of box-type PC modules with a hollow inside in the width direction to form a PC slab, thereby reducing vibrations in semiconductor or display production factories, etc. while reducing the construction period by minimizing field work. It's about the slab.
The present invention modular vibration reduction PC slab relates to a PC slab by the All PC method in which on-site concrete is not poured. The PC slab has an upper plate, a lower plate, and a pair of side plates connecting both ends of the upper and lower plates. It is configured by connecting a plurality of box-shaped PC modules of a square cross section having a hollow inside and connected in the width direction, and steel rods are provided in the upper plate and lower plate of the box-type PC module in the width direction of the box-type PC module, respectively. One end is exposed through the first pocket formed at one end of the upper and lower plates, and the steel bars of the box-type PC module adjacent in the width direction are interconnected by a joint inside the first pocket portion, and there is no space between the adjacent box-type PC modules. It is characterized in that the shrink mortar is filled.

Description

Modular PC slab for vibration reduction

The present invention combines a plurality of box-type PC modules with a hollow inside in the width direction to form a PC slab, thereby reducing vibrations in semiconductor or display production factories, etc. while reducing the construction period by minimizing field work. It's about the slab.

Since semiconductor or display production facilities mainly use large equipment, factories for these facilities must be able to support a large weight while forming a large space. In addition, it is very important to control the vibration of the structure because it is very sensitive to vibration.

In addition, since the release date of a new product is important in these fields, there is a large demand for shortening the construction period of production facilities.

On the other hand, the reinforced concrete structure (RC), which constructs the structure by pouring concrete after reinforcing bars and installing the formwork, takes a lot of time and has a problem of poor precision.

On the other hand, the S-structure (steel structure) composed of steel frame has a short construction period and excellent precision, but is disadvantageous to vibration and has high construction cost.

And PC tank (Precast concrete structure) using precast concrete members pre-fabricated at the factory has shorter air and better precision than RC tank, and has advantageous advantages in vibration compared to S group. However, since the weight of the PC member is large, it is difficult to transport and assemble on-site in the case of a large structure.

In particular, in factories for semiconductor or display facilities, an increase in the thickness of the slab is unavoidable for vibration-free implementation. However, since there is a problem of member weight in this case, the half PC floor plate method in which the lower section of the slab is formed of a PC member and pouring concrete topping is mainly used to construct the slab.

However, this half PC floor plate also requires on-site concrete pouring, so there is a limit to shortening the construction period, and there is a risk of cracking of the topping concrete.

KR 10-2033671 B1

In order to solve the above problems, an object of the present invention is to provide a modular vibration reduction PC slab capable of shortening the construction period by minimizing field work while minimizing vibration in a semiconductor or display production plant.

The present invention according to a preferred embodiment relates to a PC slab by the All PC method in which on-site concrete is not poured, wherein the PC slab is an upper plate, a lower plate, and a pair of side plates connecting both ends of the upper and lower plates. It is configured by connecting a plurality of box-shaped PC modules of a square cross section having a hollow inside thereof in the width direction, and steel rods are respectively provided in the width direction of the box-type PC module in the upper plate and the lower plate of the box-type PC module. The addition is exposed through the first pocket portion formed at one end of the upper and lower plates, and the steel bars of the box-type PC module adjacent in the width direction are interconnected by a joint inside the first pocket portion, and non-shrinkage between the adjacent box-type PC modules The mortar is filled, and each of the box-type PC modules is coupled to a side surface of a first girder having both ends at the ends in the longitudinal direction. It provides a modular vibration reduction PC slab, characterized in that it is configured to be rigidly joined by a joint and an anchoring steel rod embedded in the provided second girder.

The present invention according to another preferred embodiment provides a modular vibration reduction PC slab, characterized in that an air injection-type balloon mold is provided inside the hollow of the box-type PC module.

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The present invention according to another preferred embodiment is a coupler coupled to the end of the steel bar on one side of the joint of the steel bar; One end is coupled to the coupler, the other end is a head bar provided with an enlarged head; a receiving socket having one end coupled to an end of the other side of the steel bar and having a receiving space at the other end to accommodate the enlarged head of the headed bar; and a fixing cap coupled to the receiving space of the receiving socket to press the enlarged head of the headed bar; It provides a modular vibration reduction PC slab, characterized in that consisting of.

The present invention according to another preferred embodiment is a modular vibration reduction PC slab, characterized in that the upper and lower plates of the box-type PC module are provided with PC steel wires in the longitudinal direction of the box-type PC module, so that pretension is introduced into the box-type PC module. provides

According to the present invention as described above, there are the following effects.

First, by combining a plurality of box-type PC modules having a hollow inside in the width direction to form a PC slab, it is possible to provide a modular vibration reduction PC slab that is light in weight and easy to construct.

Second, since the slab vibration can be minimized by increasing the height of the box-type PC module, it can be easily utilized in a semiconductor or display production plant.

Third, since the upper plate of the box-type PC module forms the upper surface of the floor, the on-site concrete pouring process is omitted by the All PC method, and the construction period can be greatly shortened.

Fourth, the width of the PC slab can be freely adjusted by adjusting the number of box-type PC modules.

1 is a perspective view showing an embodiment of a box-type PC module;
Fig. 2 is an enlarged view showing an end of the box-shaped PC module shown in Fig. 1;
Fig. 3 is an enlarged view showing a portion A of the box-shaped PC module shown in Fig. 1;
Fig. 4 is a perspective view showing an embodiment of the box-type PC module viewed from another angle;
Fig. 5 is an enlarged view showing a portion A of the box-shaped PC module shown in Fig. 4;
Figure 6 is a perspective view showing the present invention modular vibration reduction PC slab.
7 is a plan view showing the present invention modular vibration reduction PC slab.
8 is a cross-sectional view showing the present invention modular vibration reduction PC slab.
Fig. 9 is a perspective view showing a coupling relationship between a PC slab and a girder;
10 is a perspective view showing a state in which the PC slab is installed.
11 is a perspective view showing the arrangement state of the air injection-type balloon mold.
12 is a perspective view showing a PC slab manufactured by an inflatable balloon mold.
13 is a perspective view showing a steel bar connection process by a joint.
14 is a cross-sectional view showing a bonding process of neighboring box-type PC modules.
Fig. 15 is a cross-sectional view showing a section C of the PC slab in Fig. 10;
Fig. 16 is a cross-sectional view showing a D section of the PC slab in Fig. 10;

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings and preferred embodiments.

Figure 1 is a perspective view showing an embodiment of the box-type PC module, Figure 2 is an enlarged view showing the end of the box-type PC module shown in Figure 1, Figure 3 is a portion A of the box-type PC module shown in Figure 1 It is an enlarged view showing. And Figure 4 is a perspective view showing an embodiment of the box-type PC module viewed from another angle, Figure 5 is an enlarged view showing a portion A of the box-type PC module shown in Figure 4 .

Figure 6 is a perspective view showing the present invention modular vibration reduction PC slab, Figure 7 is a plan view showing the present invention modular vibration reduction PC slab, Figure 8 is a cross-sectional view showing the present invention modular vibration reduction PC slab . In addition, Figure 9 is a perspective view showing the coupling relationship between the PC slab and the girder, Figure 10 is a perspective view showing the PC slab installed state.

1 to 8, the present invention modular vibration reduction PC slab relates to a PC slab 4 by the All PC method in which on-site concrete is not poured, and the PC slab 4 is an upper plate ( 41), a lower plate 42 and a pair of side plates 43 connecting both ends of the upper plate 41 and the lower plate 42. It is characterized in that it is configured by connecting a plurality of in the width direction.

An object of the present invention is to provide a modular vibration reduction PC slab that can be applied to a semiconductor or display production plant, etc., and can shorten the construction period by minimizing field work while reducing vibration.

6 to 7, the present invention constitutes a PC slab 4 by combining a plurality of divided box-type PC modules 40 in the width direction.

1 and 2, the box-type PC module 40 is a hollow member composed of an upper plate 41, a lower plate 42, and a pair of side plates 43, a hollow is formed therein. Therefore, the weight is very light, so it is easy to construct on site, and the PC slab 4 can be assembled in various widths by adjusting the number of box-type PC modules 40 .

Since the box-type PC module 40 itself forms the upper surface of the floor, the box-type PC module 40 can be constructed by the All PC method in which on-site concrete is not poured. Accordingly, very rapid construction is possible.

The adjacent box-type PC modules 40 are connected to each other so that the side plates 43 are in close contact with each other.

First stepped portions 46 may be formed at both ends of the upper surface of the box-type PC module 40 in order to close a gap between adjacent box-type PC modules 40 in the width direction ( FIG. 2 ).

After the box-type PC module 40 is installed, the non-shrinkable mortar M may be filled in the first stepped portion 46 .

In addition, as shown in FIG. 8 , it is possible to minimize the vibration of the PC slab 4 by filling the non-shrinkable mortar M between the adjacent box-type PC modules 40 .

The box-type PC module 40 may have a sufficiently thick height to minimize slab vibration. In addition, the construction period can be greatly shortened by omitting the on-site concrete pouring process with the All PC method.

For the existing RC method or half PC flooring, it is essential to level the top surface after pouring the slab concrete. Unlike the present invention, since the box-type PC module 40 with a flat top surface is exposed as it is manufactured at a factory, there is no need for a separate top surface flattening operation.

In the present invention, the width of the PC slab 4 can be variously adjusted to fit the planar size by using the box-type PC module 40 of the same standard, and the thickness of the PC slab 4 can be sufficiently increased. In this respect, it is different from a conventional hollow core slab in which a plurality of rows of hollow cores are formed inside the PC slab.

9 and 10, after installing the first girders 2 and the second girders 3 in both directions between the plurality of pillars 1 spaced apart from each other, respectively, a plurality of box-type PC modules (40) can be constructed by fixing the end of the PC slab (4) formed by assembling the first girder (2) and the second girder (3).

At this time, the PC slab 4 formed by assembling a plurality of box-type PC modules 40 may be coupled to the side surfaces of the first girder 2 provided at the longitudinal ends at both ends of each box-type PC module 40 . And the box-type PC module 40 located at the outermost part of the PC slab 4 has a fixing steel rod embedded inside the second girder 3 in which the steel rod 44 is provided at the width direction end of the PC slab 4 ( 31) and can be configured to be strongly joined by the joint (5).

A step for mounting the PC slab 4 may be formed under the first girder 2 or the second girder 3 .

The PC slab 4 may be formed by assembling a plurality of box-type PC modules 40 in a factory. However, in consideration of transport convenience, it is preferable to assemble a plurality of box-type PC modules 40 in the field to manufacture the PC slab 4 .

In addition, the entire PC slab 4 manufactured by assembling the box-type PC module 40 in the field workshop can be lifted and installed, but each box-type PC module 40 is lifted and the ends are attached to the first girders on both sides (2) It is also possible to configure the PC slab 4 by combining with the neighboring box-type PC module 40 in the state mounted on the.

A PC steel wire is provided on the upper plate 41 and the lower plate 42 of the box-type PC module 40 in the longitudinal direction of the box-type PC module 40 to introduce pretension to the box-type PC module 40 .

By introducing such a pretension, it is possible to suppress the occurrence of cracks in the box-type PC module 40, thereby minimizing floor vibration.

11 is a perspective view showing the arrangement state of the air-injected balloon mold, Figure 12 is a perspective view showing the PC slab produced by the air-injected balloon mold.

11 and 12, an air-injected balloon mold 49 may be provided inside the hollow of the box-type PC module 40.

Conventionally, a plastic sphere was used to form a hollow when manufacturing a hollow PC member.

However, plastic spheres are heavy in weight and costly to produce.

In particular, the bottom plate for semiconductor production facilities should have a thickness of about 800 mm to provide a vibration-free environment, and in this case, the size of the hollow should be much larger than that of the conventional hollow slab. However, it is not easy to form a large hollow plastic sphere due to limitations in rigidity and weight.

Accordingly, the present invention was made to form a hollow by using an air-injection-type balloon mold 49 whose shape is maintained by injection of air.

Therefore, when manufacturing the box-type PC module 40, a plurality of air-injected balloon molds 49 are disposed to be spaced apart from each other as shown in FIG. 11 inside the steel mold, and then concrete is poured to form a hollow (FIG. 12).

The inflated balloon mold 49 is lighter in weight than the plastic sphere, thereby reducing the overall weight of the PC member.

In addition, the size of the hollow can be freely adjusted by adjusting the amount of air injected into the air injection-type balloon mold 49 .

When the PC slab (4) is installed, the non-shrinkable mortar (M) should not penetrate into the hollow when grouting the non-shrinkable mortar (M).

In the conventional hollow PC member, it was impossible to remove the plastic sphere, but in the present invention, after the box-type PC module 40 production is completed, the air of the air-injected balloon mold 49 is removed to remove the air-injected balloon mold 49 and can be reused. .

13 is a perspective view illustrating a steel bar connection process by a joint, and FIG. 14 is a cross-sectional view illustrating a bonding process of a neighboring box-type PC module. And FIGS. 15 and 16 are cross-sectional views each showing the C section and the D section of the PC slab in FIG. 10 .

7, 8, 13, 14, etc., inside the upper plate 41 and the lower plate 42 of the box-type PC module 40, steel bars in the width direction of the box-type PC module 40, respectively 44 is provided so that one end is exposed to the first pocket portion 45 formed at one end of the upper and lower plates 41 and 42, and the steel rod 44 of the box-type PC module 40 adjacent in the width direction is the first It can be configured to be interconnected by a joint (5) in the interior of the one-pocket portion (45).

The box-type PC module 40 is formed long in the longitudinal direction of the PC slab 4, and is combined with other box-type PC modules 40 adjacent in the width direction to form the PC slab 4 .

To this end, the steel rods 44 are embedded in the width direction in the upper plate 41 and the lower plate 42 of the box-type PC module 40, respectively, and the ends of the steel rods 44 are adjacent to each other by the joint 5. It can be connected to the end of the steel bar 44 of the box-type PC module 40.

The outermost box-type PC module 40 is the same as the coupling between the steel bars 44 of other neighboring box-type PC modules 40, as shown in FIG. 44) can be fixed to the second girder (3) upper and lower by the joint (5). At this time, a stepped portion may be formed on the lower side of the side of the second girder 3 to support the gravity load of the PC slab 4 until the joint 5 is fastened so that the end of the PC slab 4 is mounted.

To this end, the fixing steel rod 31 may be embedded in the second girder 3 and connected to the steel rod 44 and the joint 5 . Although rigid welding of the PC slab 4 is possible only by fixing the joint 5, for non-vibration of the structure, a non-shrinkable mortar M is filled between the box-type PC module 40 and the second girder 3 to ensure close contact with each other. It is desirable to make it fixed.

In order to reduce the vibration of the slab, it is important to form the end continuously to transmit the negative moment. In the present invention, the PC slab 4 is continuous in the longitudinal direction. In addition, while configured to be divided into a plurality of box-type PC modules 40 in the width direction, the side surface of the box-type PC module 40 can be strongly joined with the side surface of the second girder 3 by the joint 5, thereby reducing vibration. Very effective.

To this end, the first girder 2 located at the longitudinal end of the box-type PC module 40 also forms a stepped portion on the side like the second girder 3 to mount the end of the PC slab 4, and each box-type PC module ( 40) can be strongly joined to the upper and lower ends of the first girder (2) and the joint (5). In addition to joining the joint (5), if non-shrinkage mortar (M) is filled between the PC slab (4) and the first girder (2), all four sides of the PC slab (4) are closely supported and firmly fixed with strong joints. The vibration can be completely controlled.

Structurally, since the upper joint 5 transmits the end negative moment, vibration control of the structure is not required, and in some cases, it is possible to omit the lower joint 5 fastening.

Of course, as shown in FIGS. 2 and 16, by exposing the reinforcing bar 48 in the longitudinal direction of the box-type PC module 40 and overlapping the reinforcing bar 21 of the first girder 2 to make the end continuous. It can also be made to resist negative moment.

When the first girder 2 is a PC member, the reinforcing bar 21 of the first girder 2 is embedded in a bent steel box, and after the PC slab 4 installation is completed, the reinforcing bar 21 It can be extended and continuous with the reinforcing bar 48 of the box-type PC module 40 .

A second stepped portion 47 may be formed at an end of the upper plate 41 so that an end of the longitudinal reinforcing bar 48 of the box-type PC module 40 is exposed to the outside.

13 to 15, the joint 5 of the steel bar 44 includes a coupler 51 coupled to an end of the steel bar 44 on one side; a headed bar 52 having one end coupled to the coupler 51 and having an enlarged head 521 at the other end; a receiving socket 53 having one end coupled to the end of the other steel bar 44 ′ and having an accommodating space 531 to accommodate the enlarged head 521 of the headed bar 52 at the other end; and a fixing cap 54 coupled to the receiving space 531 of the receiving socket 53 to press the enlarged head 521 of the headed bar 52 ; can be configured as

When the steel rods 44, 44' of the neighboring box-type PC modules 40, 40' are joined, it is easy to absorb construction errors and at the same time, the steel rods 44, 44' joined are closely coupled to each other without mutual play, so that the tensile force is Of course, the steel bars 44 and 44' can be joined by mechanical joints so that the load can be stably transmitted against the compressive force.

A coupler 51 is coupled to one end of the steel bar 44 , and a headed bar 52 provided with an enlarged head 521 is coupled to the coupler 51 and exposed to the outside, the headed bar 52 . A fixing cap 54 is provided on the outside of the .

And the receiving socket 53 is coupled to the other end of the steel bar 44 and is embedded in the box-shaped PC module 40 so that the entrance of the receiving space 531 inside is exposed (FIG. 5).

Accordingly, one end of the steel rod 44 of the box-type PC module 40 may be coupled to the other end of the steel rod 44' of the other box-type PC module 40'.

An accommodating space 531 having an open front is formed in the accommodating socket 53 , and a female thread is formed on an inner circumferential surface of the accommodating space 531 .

The fixing cap 54 has a screw thread formed on its outer circumferential surface so as to be screwed into the receiving space 531 of the receiving socket 53, and the headed bar 52 is configured to pass through the center.

A tool coupling part 541 may be formed on the rear outer surface of the fixing cap 54 so that the fixing cap 54 can be rotated by a tool. The tool coupling portion 541 may be formed in a polygonal shape to facilitate tool coupling.

A first pocket part 45 may be formed at the end of the steel bar 44 on the coupler 51 side so that the headed bar 52 and the fixing cap 54 can be exposed to the outside ( FIGS. 2 and 3 ). ).

Since the joint 5 can support both compression and tension, the same joint 5 is installed at the upper and lower portions of the box-type PC module 40 . Since the box-type PC module 40 mounted on the second girder 3 is mounted on the stepped portion of the second girder 3, the box-type PC module in the case of the lower joint 5 so as not to interfere with the stepped portion when the fixing cap 54 is rotated. The receiving socket 53 is embedded in the side (40), and the second girder 3 corresponding thereto may be configured to be provided with a coupler 51 and a headed bar 52 (FIG. 15).

A process of connecting the steel bars of the adjacent box-type PC module by means of a joint will be described with reference to FIGS. 13 and 14 .

As shown in FIGS. 13 (a) and 14 (a), the other box-type PC in a state in which the headed bar 52 is retracted to the coupler 51 side so as not to protrude to the side of the box-type PC module 40 The module 40' is installed in close contact.

And as shown in FIGS. 13 (b) and 14 (b), the receiving space 531 formed inside the receiving socket 53 of the other box-type PC module 40 ′ by advancing the headed bar 52 . ) is inserted into At this time, the gap between the joint portions of the steel rods 44 and 44 ′ is removed, and the front surface of the enlarged head 521 of the headed bar 52 is brought into close contact with the bottom surface of the accommodation space 531 so as to transmit the compressive force.

Finally, as shown in FIGS. 13 (c) and 14 (c), the front end is a headed bar by screwing the fixing cap 54 into the receiving space 531 of the receiving socket 53. 52) is installed to press the back of the enlarged head 521.

After completing the fastening of the joint (5) through this process, the non-shrinkage mortar (M) is filled in the first pocket part (45).

When the steel rods 44 and 44' are joined by the joint 5, both sides of the steel rods 44 and 44' can be interconnected and fixed by simple screw coupling. The connection is thus very fast and stress bearing is possible immediately after screwing in.

1: Post 2: First girder
21: reinforcing bar 3: second girder
31: anchoring steel bar 4: PC slab
40: box type PC module 41: top plate
42: lower plate 43: side plate
44: steel bar 45: first pocket portion
46: first stepped portion 47: second stepped portion
48: longitudinal reinforcement 49: balloon mold
5: joint 51: coupler
52: headed bar 521: enlarged head
53: receiving socket 531: receiving space
54: fixing cap 541: tool coupling part
M: non-shrink mortar

Claims (5)

It relates to the PC slab (4) by the All PC method in which on-site concrete is not poured,
The PC slab 4 is composed of an upper plate 41, a lower plate 42, and a pair of side plates 43 connecting both ends of the upper plate 41 and the lower plate 42, and a hollow is formed therein. It is configured by connecting a plurality of box-shaped PC modules 40 of a rectangular cross-section in the width direction,
Inside the upper plate 41 and the lower plate 42 of the box-type PC module 40, steel rods 44 are respectively provided in the width direction of the box-type PC module 40, so that one end is one side of the upper and lower plates 41 and 42 The steel bars 44 of the box-type PC module 40 that are exposed through the first pocket portion 45 formed at the end and are adjacent in the width direction are interconnected by the joint 5 inside the first pocket portion 45 . and non-shrinkage mortar (M) is filled between the neighboring box-type PC modules 40,
Each of the box-type PC modules 40 is coupled to the side of the first girder 2 provided at both ends in the longitudinal direction,
The box-shaped PC module 40 located at the outermost part of the PC slab 4 has a fixing steel rod embedded in the inside of the second girder 3 in which the steel rod 44 is provided at the end of the PC slab 4 in the width direction ( 31) and the modular vibration reduction PC slab, characterized in that it is configured to be rigidly joined by the joint (5).
In claim 1,
Modular vibration reduction PC slab, characterized in that the air injection-type balloon mold (49) is provided in the hollow inside of the box-type PC module (40).
delete In claim 1,
The joint 5 of the steel bar 44 includes a coupler 51 coupled to an end of the steel bar 44 on one side;
a headed bar 52 having one end coupled to the coupler 51 and having an enlarged head 521 at the other end;
a receiving socket 53 having one end coupled to the end of the other steel bar 44 ′ and having an accommodating space 531 to accommodate the enlarged head 521 of the headed bar 52 at the other end; and
a fixing cap 54 coupled to the receiving space 531 of the receiving socket 53 to press the enlarged head 521 of the headed bar 52; Modular vibration reduction PC slab, characterized in that consisting of.
In claim 1,
The upper plate 41 and the lower plate 42 of the box-type PC module 40 are provided with PC steel wires in the longitudinal direction of the box-type PC module 40, characterized in that pretension is introduced into the box-type PC module 40 Modular vibration dampening PC slab.

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