KR102330168B1 - Light emitting device - Google Patents

Abstract

An object of the present invention is to provide a compact light emitting device.
The light emitting device according to the present invention includes an organic light emitting diode panel and a power supply unit for supplying power to the organic light emitting diode panel, the organic light emitting diode panel has a light emitting surface, and at least a portion of the power supply unit is provided from the top It is disposed on the rear surface of the light emitting surface of the organic light emitting diode panel so as to overlap the organic light emitting diode panel when viewed.

Description

light emitting device

The present invention relates to a light emitting device.

In recent years, organic light emitting diodes (OLEDs) have come to be used for lighting, display panels, etc. because they have an advantage of being thin. The lighting device of patent document 1 is equipped with the lighting part provided with the OLED sheet, the support part connected to the edge part of the lighting part, and the power supply part provided in the support part.

Patent Document 1: Utility Model Publication No. 20-2014-0005434

In the lighting device described in Patent Document 1, there is a problem that the power supply unit is provided in parallel with the lighting unit, so that it becomes difficult to configure the device in a compact size.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a light emitting device capable of miniaturization.

According to one aspect of the present invention, an organic light emitting diode panel and a power supply unit for supplying power to the organic light emitting diode panel are provided, the organic light emitting diode panel has a light emitting surface, and at least a portion of the power supply unit, viewed from the top There is provided a light emitting device, characterized in that it is disposed on the rear surface of the light emitting surface of the organic light emitting diode panel so as to overlap the organic light emitting diode panel.

ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the light emitting device which can be miniaturized.

BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic of the OLED device in 1st Embodiment of this invention.
It is a perspective view of the OLED device in 1st Embodiment of this invention.
3 : is an exploded perspective view of the OLED device in 1st Embodiment of this invention.
Fig. 4 is a plan view of a connecting board according to the first embodiment of the present invention.
5 : is a top view of the OLED device in 1st Embodiment of this invention.
Fig. 6 is a cross-sectional view of the OLED device taken along the line A-A' in Fig. 5 in the first embodiment of the present invention.
Fig. 7 is a cross-sectional view of the OLED device taken along the line B-B' in Fig. 5 in the first embodiment of the present invention.
8 : is sectional drawing of the OLED panel in 1st Embodiment of this invention.
9 is a cross-sectional view of a curved OLED device according to the first embodiment of the present invention.
Fig. 10 is a block diagram of an OLED device according to a second embodiment of the present invention.
11 : is a top view of the OLED device in 2nd Embodiment of this invention.
Fig. 12 is a cross-sectional view of the OLED device taken along the line C-C' in Fig. 11 in the second embodiment of the present invention.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing. The same reference signs throughout the specification mean substantially the same components.

The size and thickness of each component shown in the drawings are shown for convenience of description, and the present invention is not necessarily limited to the size and thickness of the illustrated component.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described with reference to drawings.

<First embodiment>

Fig. 1 is a schematic diagram of an OLED device in the present embodiment, showing an OLED lighting device. The OLED device includes a housing 1a and an OLED panel 2 stored in the housing 1a. The OLED panel 2 includes a plurality of organic light emitting diodes arranged in a matrix, and functions as OLED lighting. The OLED device may be configured to be bendable along the long side direction as shown in FIG. 1 , but may be bendable along the short side direction. Let the long side direction of the OLED panel 2 be the X direction, the Y direction as the short side direction of the OLED panel 2, and the direction from the light emitting surface 21 to the back surface shall be Z direction. The housing 1a has a thin box shape and has an opening 1b. In the housing 1a, in addition to the OLED panel 2, a power supply unit to be described later is stored. The housing 1a may be made of, for example, plastic, ABS (Acrylonitrile, Butadiene, Styrene) resin, or metal. The housing 1a protects the OLED panel 2 from external impact, object collision, and the like. The light emitting surface 21 of the OLED panel 2 is exposed from the opening 1b of the housing 1a, and a power supply unit is installed on the rear surface of the OLED panel 2 . The power cable 1c supplies a driving current to the OLED device. The power supply cable 1c is provided in a portion that does not inhibit the light emission of the light emitting surface 21, such as the rear surface of the housing 1a or the side surface of the housing 1a. A stand for installing the OLED device may be installed in the housing 1a. In addition, the number of the OLED panels 2 stored in the housing 1a is not limited to one, Several pieces may be sufficient as it.

2 : is a perspective view of the OLED device in this embodiment, and FIG. 3 : is an exploded perspective view of the OLED device in this embodiment. The OLED device includes an OLED panel 2 , a heat dissipation sheet 3 , a connection substrate 4 , a fixing tape 5 , a spacer 6 , a heat sink 7 , a heat conduction sheet 8 , and a power supply unit 9 . do.

The OLED panel 2 has a substantially rectangular shape when viewed from above. For example, the length of the OLED panel 2 in the X direction, Y direction, and Z direction may be 200 mm, 50 mm, and 0.5 mm, respectively, but the shape and length are not limited. In FIG. 2 , the light emitting surface 21 faces downward in the Z direction, and the rear surface 22 faces upward in the Z direction.

The heat radiation sheet 3 has a rectangular shape and is provided on the back surface 22 of the OLED panel 2 . The heat dissipation sheet 3 is made of a material having high thermal conductivity, and may be made of, for example, any one or a combination of graphite, copper, and aluminum. Typically, the thermal conductivity of graphite is 700 ~ 1950 W/(m·K), the thermal conductivity of copper is 403 W/(m·K), and the thermal conductivity of aluminum is 236 W/(m·K). It is preferable to use graphite. By the structure mentioned above, the heat which generate|occur|produced in the OLED panel 2 is disperse|distributed uniformly to the heat radiation sheet 3 whole. Since the heat dissipation sheet 3 dissipates the heat generated in the OLED panel 2 , it is preferable to cover as many areas as possible on the back surface 22 of the OLED panel 2 . The number of the heat dissipation sheets 3 is not limited to one, and the heat dissipation sheets 3 may be divided into plural. For example, by arrange|positioning the some heat radiation sheet 3 side by side in the X direction, the heat radiation sheet 3 becomes easy to bend|bend in a X direction.

The connection board 4 is a thin and long band-shaped flexible printed circuit board (FPC), and may be made of, for example, polyimide, polyethylene terephthalate, or the like. On the connection board 4, a power supply wiring and a ground wiring are formed as an aluminum or copper pattern. The connection board 4 is disposed on the heat dissipation sheet 3, and the supply terminals formed at both ends of the connection board 4 are an anode terminal 201, a cathode terminal 201 provided on opposite sides of the OLED panel 2, respectively. 202) is electrically connected. A power supply connection part 45 is provided in the substantially center of the connection board 4 , and the power supply connection part 45 is connected to the power supply part 9 . Thereby, a drive current is supplied to the OLED panel 2 from the power supply part 9 through the connection board 4 .

The fixing tape 5 is a rectangular adhesive tape, and has an adhesive surface 51 and a non-adhesive surface 52 . The fixing tape 5 may be made of, for example, polyethylene terephthalate, a resin, or the like. The adhesive surface 51 of the fixing tape 5 is affixed to the back surface 22 of the OLED panel 2 via the heat dissipation sheet 3 and the connection substrate 4 . In this way, the heat dissipation sheet 3 and the connection substrate 4 are fixed to the OLED panel 2 by the fixing tape 5 . In the center of the fixing tape 5, a rectangular opening 55 for exposing the power connection portion 45 is formed. The opening 55 preferably has a size sufficient to allow the power connection part 45 to be inserted therethrough.

The spacer 6 is provided between the power supply unit 9 and the OLED panel 2 , and is used to form a gap 63 between the power supply unit 9 and the OLED panel 2 . The thickness (length in the Z direction) of the spacer 6 may be a value capable of forming sufficient voids 63 as a heat insulating layer, preferably about 0.5 to 3.0 mm, for example, 1.0 mm. The spacer 6 is a polymer sheet or the like having heat insulating properties, and may be made of, for example, urethane or the like.

The spacer 6 has first spacers 61a, 61b, 61c, and second spacers 62a, 62b, 62c, 62d. The first spacers 61a , 61b , 61c extend in a direction (Y direction) crossing the bending direction of the OLED panel 2 when viewed from above. The second spacers 62a , 62b , 62c , 62d extend in the bending direction (X direction) of the OLED panel 2 when viewed from above.

The first spacers 61a, 61b, and 61c are arranged substantially parallel to each other at predetermined intervals in the X direction. The second spacers 62a and 62b are disposed between the first spacers 61a and 61b, and are disposed substantially parallel to each other at a predetermined interval in the Y direction. The second spacers 62a and 62b are arranged along the vicinity of the edge portion of the long side of the heat sink 7 . The second spacers 62c and 62d are disposed between the first spacers 61b and 61c, and are disposed substantially parallel to each other at a predetermined interval in the Y direction. Preferably, the first spacers 61a and 61b and the second spacers 62a and 62b are not located on the opening 55 when viewed from the top so as not to interfere with the power connection portion 45 of the connection board 4 . .

The first spacers 61a, 61b, and 61c have adhesive surfaces 611 and 612, respectively. The adhesive surface 611 is adhered to the heat sink 7 , and the adhesive surface 612 is adhered to the fixing tape 5 . The second spacers 62a, 62b, 62c, and 62d have an adhesive surface 621 and a non-adhesive surface 622, respectively. The adhesive surface 621 is adhered to the heat sink 7 , and the non-adhesive surface 622 abuts against the fixing tape 5 but is not adhered. That is, the second spacers 62a, 62b, 62c, and 62d extending in the X direction can freely move with respect to the fixing tape 5 . Therefore, when an OLED device is bent in the X direction, it becomes possible to reduce the bending stress in the X direction.

The heat sink 7 is made of a metal having high thermal conductivity, such as aluminum or copper. The heat sink 7 may be, for example, a polygon that forms a rectangle, but cuts out an angle of the rectangle. The heat sink 7 is placed on the spacer 6 and fixed to the fixing tape 5 . The heat sink 7 radiates heat conducted from the heat conduction sheet 8 to the heat sink 7 from the surface of the heat sink 7 . A rectangular opening 75 for exposing the power connection part 45 is formed in the heat sink 7 . The opening 75 preferably has a size sufficient to allow the power connection part 45 to be inserted therethrough.

The heat conductive sheet 8 includes a plurality of heat conductive sheets 8a, 8b, 8c, and 8d, and is made of a material having high heat conductivity such as silicon and graphite. The heat conductive sheets 8a, 8b, 8c, and 8d have a rectangular shape extending in the Y direction, and have a predetermined length (width) in the X direction. The length in the Y direction of the heat conductive sheets 8a , 8b , 8c , and 8d may have the same length as the length in the Y direction of the power supply unit 9 . The heat conductive sheets 8a, 8b, 8c, and 8d are provided substantially parallel to each other at predetermined intervals in the bending direction (X direction). Preferably, the heat conductive sheets 8a, 8b, 8c, 8d are not located on the opening 75 when viewed from above. The heat conductive sheets 8a, 8b, 8c, and 8d have adhesive surfaces 81 and 82, respectively. The adhesive surface 81 is adhered to the power supply unit 9 , and the adhesive surface 82 is adhered to the heat sink 7 . The heat conduction sheets 8a, 8b, 8c, and 8d conduct heat generated by the power supply unit 9 to the heat sink 7 . Moreover, since the some heat conductive sheet|seat 8a, 8b, 8c, 8d is divided|segmented and provided in a bending direction, bending|flexion of an OLED device is not disturbed.

The power supply part 9 is provided on the heat sink 7 with the heat conduction sheet 8 interposed therebetween. The power supply unit 9 includes a flexible circuit board (FPC, 90 ) such as polyimide or polyethylene terephthalate, and a plurality of circuit components 96 mounted on the circuit board 90 . The circuit component 96 is, for example, an integrated circuit, a transistor, a resistor, a capacitor, a coil, and the like, and constitutes an inverter circuit, a rectifier circuit, and a smoothing circuit. The power supply unit 9 is connected to an AC power supply via a power supply cable 1c (refer to Fig. 1). The power supply part 9 rectifies and smoothes the AC power supply of a commercial power supply, and supplies a DC current to the OLED panel 2 via the connection board 4 . Also, the power supply unit 9 may be connected to an external DC power supply, and the power supply unit 9 does not necessarily include a rectifying circuit.

4 is a plan view of the connecting substrate 4 in the present embodiment. As described above, the connecting board 4 is made of an elongated FPC or the like, and terminals 41A and 41C are formed at both ends, respectively. A U-shaped groove portion 48 is formed substantially in the center of the connection substrate 4 , and an area defined by the groove portion 48 forms a power supply connection portion 45 . The power supply connection part 45 is bendable in the joint part with the connection board|substrate 4, and the power supply connection part 45 can stand up from the connection board|substrate (4).

Terminals 42A and 42C are formed at the ends of the power supply connection portion 45 . The terminal 42A is electrically connected to the terminals 41A at both ends of the connection board 4 through the wiring 43A, and the terminal 42C is connected to the terminals of both ends of the connection board 4 through the wiring 43C. It is electrically connected to the terminal 41C. The terminal 41A is soldered to the anode terminal 201 of the OLED panel 2, and the terminal 41C is soldered to the cathode terminal 202 of the OLED panel 2 (see FIG. 2). On the other hand, the power supply connection part 45 is electrically connected to the power supply part 9 through the opening part 55 of the fixing tape 5 and the opening part 75 of the heat sink 7 . That is, the terminals 42A, 42C of the power supply connection portion 45 are connected to the anode power supply terminal and the cathode power supply terminal of the power supply part 9 . Thereby, the driving current is supplied from the power supply unit 9 to the OLED panel 2 through the power supply connection unit 45 .

5 is a plan view of an OLED device. 6 is a cross-sectional view of the OLED device taken along line A-A' in FIG. 5, and FIG. 7 is a cross-sectional view of the OLED device taken along line B-B' in FIG.

As described above, on the back surface 22 of the OLED panel 2, a fixing tape 5 is adhered with the heat dissipation sheet 3 and the connection substrate 4 interposed therebetween. A spacer 6 is provided between the fixing tape 5 and the heat sink 7 , and a gap 63 is formed between the fixing tape 5 and the heat sink 7 . Furthermore, the power supply part 9 is provided on the heat sink 7 with the heat conduction sheet 8 interposed therebetween. The power supply unit 9 has first regions 91a, 91b, 91c, and 91d in which the circuit component 96 is mounted, and second regions 92a, 92b, 92c in which the circuit component 96 is not mounted. Each of the first regions 91a , 91b , 91c , and 91d has a predetermined width in the X direction, and the circuit component 96 is mounted along the Y direction. The second regions 92a, 92b, and 92c are provided between the first regions 91a, 91b, 91c, and 91d. That is, a second region 92a is provided between the first regions 91a and 91b, and a second region 92b is provided between the first regions 91b and 91c. Similarly, a second region 92c is provided between the first regions 91c and 91d. Since the circuit component 96 is mounted, 1st area|region 91a, 91b, 91c, 91d has high hardness, and is hard to bend. On the other hand, since the circuit component 96 is not mounted, the 2nd area|region 92a, 92b, 92c is easy to bend. By arranging the easily bent second regions 92a, 92b, and 92c between the first regions 91a, 91b, 91c, and 91d, the power supply unit 9 can be bent in the X direction. That is, the circuit region (first region, 91a, 91b, 91c, 91d) in which the circuit component 96 is mounted and the bent region (second region, 92a, 92b, 92c) in which the circuit subform 96 is not mounted are alternated. By arranging as , the power supply part 9 becomes bendable in the X direction.

The heat conduction sheet 8 is provided between the power supply part 9 and the heat sink 7 . The heat-conducting sheet 8 includes heat-conducting sheets 8a, 8b, 8c, and 8d, and the heat-conducting sheets 8a, 8b, 8c, and 8d are provided below the first regions 91a, 91b, 91c, and 91d, respectively. It is preferable to be In addition, it is preferable that the X-direction length of the heat conductive sheets 8a, 8b, 8c, 8d is about the same as the X direction length of the 1st area|region 91a, 91b, 91c, 91d. The heat conduction sheets 8a, 8b, 8c, and 8d are provided below the first regions 91a, 91b, 91c, and 91d to efficiently dissipate the heat generated in the first regions 91a, 91b, 91c, and 91d. It can be conducted to the heat sink (7).

Spacers 61a, 61b, 61c, 62a, 62b, 62c, 62d are provided between the heat sink 7 and the fixing tape 5 . Therefore, a gap 63 is formed between the heat sink 7 and the fixing tape 5 . The length d in the Z direction of the gap 63 corresponds to the thickness (length in the Z direction) of the spacers 61a, 61b, 61c, 62a, 62b, 62c, 62d. Accordingly, by appropriately selecting the thicknesses of the spacers 61a, 61b, 61c, 62a, 62b, 62c, and 62d, the voids 63 of the desired length d can be formed.

A part of the heat conducted to the heat sink 7 through the heat conduction sheets 8a , 8b , 8c , and 8d is emitted to the voids 63 . Since the thermal conductivity of the voids 63 and the spacers 61a, 61b, 61c, 62a, 62b, 62c, and 62d constituting the heat insulating layer is sufficiently small, the heat generated by the power supply unit 9 is prevented from being conducted to the OLED panel 2 . It becomes possible to prevent and reduce deterioration of the OLED panel 2 . Furthermore, since the space|gap 63 is formed between the OLED panel 2 and the power supply part 9, the bending stress at the time of bending the OLED illumination is reduced in the space|gap 63. As shown in FIG. Therefore, it becomes possible to prevent problems, such as peeling of the power supply part 9 and the OLED panel 2 .

The connection board 4 is provided between the back surface 22 of the OLED panel 2 and the fixing tape 5 as described above, and the terminals 41A and 41C formed at both ends of the connection board 4 are connected to the OLED panel. It is electrically connected to the anode terminal 201 and the cathode terminal 202 provided in the both ends of (2), respectively. The power supply connection part 45 is erected from the connection board 4 in the Z direction, and is inserted through the opening 55 of the fixing tape 5 and the opening 75 of the heat sink 7 . Therefore, it is preferable that the opening 55 and the opening 75 are formed at positions overlapping each other when viewed from above. The terminal of the power supply connection portion 45 may be connected to a connector provided on the circuit board 90 , or directly soldered to a wiring pattern formed on the circuit board 90 . It is preferable that the power supply connection part 45 has a sufficient length in the X direction so that the power supply connection part 45 does not peel from the circuit board 90 when the OLED panel 2 is bent.

8 is a cross-sectional view of the OLED panel 2 . The OLED panel 2 includes a substrate layer 210, an anode electrode 211, an organic light emitting layer 212, a cathode electrode 213, a buffer layer 214, a base film 215, an insulating film 216, a barrier film ( 217), and a fluorescence extraction film 218. The substrate layer 210 is made of, for example, polyimide or the like, and has wirings for electrically connecting the anode electrode 211 and the cathode electrode 213 and the anode terminal 210 and the cathode terminal 202 .

The anode electrode 211 is provided on the substrate layer 210 . The anode electrode 211 is made of, for example, a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO). ITO or IZO, made of a transparent conductive material, can transmit light.

The organic light emitting layer 212 is provided on the anode electrode 211 and may be made of an organic light emitting material emitting white light. The organic light emitting layer 212 may include, for example, a blue organic light emitting layer, a red organic light emitting layer, and a green organic light emitting layer, and may have a tandem structure including a blue organic light emitting layer and a yellow or green organic light emitting layer. The organic light emitting layer 212 of the present invention is not limited to the above structure, and various structures may be applied. For the organic light emitting layer 212, for example, an 8-hydroxy-quinoline aluminum complex, a carbazole-based compound, a dimeric styryl compound, a 10-hydroxybenzoquinoline-metal compound, or the like is used, but is not limited thereto.

The cathode electrode 213 is made of a material such as aluminum, silver and magnesium alloy, and calcium, for example. The cathode electrode 213 is provided on the organic light emitting layer 212 .

The anode electrode 211 , the organic light emitting layer 212 , and the cathode electrode 213 constitute an organic light emitting element. A voltage is applied to the anode electrode 211 and the cathode electrode 213 from the anode terminal 201 and the cathode terminal 202 through wiring provided on the substrate layer 210 , respectively. When a voltage is applied to the anode electrode 211 and the cathode electrode 213 , electrons are injected into the organic emission layer 212 from the cathode electrode 213 , and holes are injected into the organic emission layer 212 from the anode electrode 211 . . In the organic light emitting layer 212 , electrons and holes combine to generate excitons. As the exciton is annihilated, light corresponding to the energy difference between the lowest unoccupied molecular orbital and the highest occupied molecular orbital of the organic light emitting layer 212 is generated. Light generated from the organic light emitting layer 212 is emitted toward the substrate layer 210 .

The buffer layer 214 is, for example, a photocurable adhesive, a thermosetting adhesive, or the like. The buffer layer 214 is provided to cover upper portions of the organic light emitting layer 212 and the cathode electrode 213 . The base film 215 may be made of a polymer material such as polyethylene terephthalate or a metal material such as aluminum, iron/nickel alloy, iron/nickel/cobalt alloy, etc. . The base film 215 encapsulates the organic light emitting layer 212 and the cathode electrode 213 by the buffer layer 214 . The buffer layer 214 and the base film 215 are also called an encapsulation layer, and seal the organic light emitting element.

The insulating film 216 is provided on the base film 215 . The insulating film 216 electrically insulates the organic light emitting element sealed by the encapsulation layer from the outside of the OLED panel 2 . The insulating film 216 may be made of, for example, polyimide, polyethylene terephthalate, or the like.

The barrier film 217 is provided under the substrate layer 210 . The barrier film 217 is a transparent polymer film, and may be made of, for example, polyethylene terephthalate, polyethylene naphthalate, or cycloolefin polymer. The barrier film 217 prevents water vapor and air from permeating through the organic light emitting layer 212 and the like, thereby preventing deterioration and corrosion of the organic light emitting layer 212 by water.

The fluorescence extraction film 218 is a transparent thin film having a fine microlens structure. The fluorescence extraction film 218 is provided under the barrier film 217 . By providing the fluorescence extraction film 218 , light generated from the organic light emitting layer 212 can be efficiently extracted.

9 is a cross-sectional view of a curved OLED device. In Fig. 9, the OLED device is bent along the X direction so as to form a convex shape in the light emission direction (-Z direction). In this embodiment, it is possible to comprise an OLED device so that bending is possible, overlapping and providing the power supply part 9 to the OLED panel 2 . Hereinafter, the reason will be described in detail.

First, in the power supply unit 9, between the first regions 91a, 91b, 91c, and 91d in which the circuit component 96 is mounted, the second regions 92a, 92b, 92c in which the circuit component 96 is not mounted. is formed. Therefore, in the power supply unit 9, the second regions 92a, 92b, and 92c can be bent. That is, it becomes possible to configure the power supply part 9 to be bendable together with the OLED panel 2 while overlapping and arranging the power supply part 9 on the OLED panel 2 .

Further, between the fixing tape 5 and the heat sink 7 , in addition to the first spacer 61 extending in the Y direction, a second spacer 62 extending in the bending direction (X direction) is provided. Therefore, even if the fixing tape 5 and the heat sink 7 are bent in the X direction, the fixing tape 5 and the heat sink 7 are not in contact and are separated through the gap 63 . Here, assuming that the spacer 62 is not installed, the heat sink 7 is greatly curved, so that a portion of the heat sink 7 where the second spacer 62 is not installed may come into contact with the fixing tape 5 . In this case, the heat generated in the power supply unit 9 may propagate from the heat sink 7 to the OLED panel 2 through the fixing tape 5 , which may cause deterioration of the OLED panel 2 . In the present embodiment, by providing the second spacers 62a, 62b, 62c, and 62d extending in the bending direction (X direction), heat from the power supply unit 9 is transferred to the OLED panel 2 even when the OLED device is bent. It is possible to prevent the spread of

Furthermore, in the present embodiment, the second spacer 62 extending in the X direction is adhered to the heat sink 7 , but is not adhered to the fixing tape 5 . Therefore, when the OLED device is bent in the X direction, the second spacer 62 can freely move with respect to the fixing tape 5 and absorb the bending stress of the OLED device. As a result, even when an OLED device is bent, it becomes possible to prevent problems, such as a fall in the adhesion|attachment between each member.

Further, even when the OLED device is bent along the X direction so as to form a concave shape in the direction opposite to that of FIG. That is, it is possible to prevent the heat from the power supply unit 9 from propagating to the OLED panel 2 while always ensuring the air gap 63 regardless of the bending direction of the OLED device. In addition, it is possible to prevent problems such as poor adhesion between the respective members due to the bending of the OLED device.

As described above, according to the present embodiment, it is possible to realize miniaturization of OLED lighting by overlapping at least a part of the OLED panel and the power supply unit when viewed from the top. In addition, by providing a heat insulating layer including a gap between the power supply unit and the OLED panel, the influence of the heat generated in the power supply unit on the OLED panel can be reduced. Furthermore, by arranging the region where no circuit components are mounted in the power supply unit along the bending direction of the OLED panel, the power supply unit can be easily bent. In this way, flexible OLED lighting can be realized while overlapping the OLED panel and the power supply.

<Second embodiment>

Then, the OLED device in this embodiment is demonstrated. This embodiment differs from the first embodiment in that the OLED panel is a display panel capable of displaying an image. Hereinafter, it demonstrates centering around the structure different from 1st Embodiment.

Fig. 10 is a block diagram of an OLED device according to the present embodiment. The OLED device includes an OLED panel 20 , a power supply unit 9 , a control unit 11 , a data driver 12 , and a gate driver 13 . The OLED panel 20 includes a plurality of organic light emitting diodes arranged in a matrix.

The OLED panel 20 includes a plurality of pixels 23 arranged in a matrix, and each pixel 23 includes a light emitting element 231 and a pixel circuit 232 . The light emitting element 231 has a light emitting layer of an organic material. The pixel circuit 232 includes a switch transistor, a driving transistor, a capacitor, and the like. The switch transistor and the driving transistor have a TFT (Thin Film Transistor) structure. Each light emitting element 231 is provided with an RGB (R: Red, G: Green, B: Blue) color filter to generate a color image. Moreover, instead of providing a color filter, the light emitting element 231 which can emit light in each color may be used.

The data driver 12 applies a data voltage according to the luminance signal to the pixel circuit 232 through the data line 242 . The gate driver 13 drives the gate of the switch transistor of the pixel circuit 232 via the gate line 241 . The gate driver 13 sequentially selects the gate line 241 and applies a voltage to the gate line 241 that turns on a switch transistor connected to the selected gate line 241 . The pixel circuit 232 supplies a driving current according to the data voltage to the light emitting element 231 to cause the light emitting element 231 to emit light.

The control unit 11 includes a CPU (Central Processing Unit), a memory, an interface, and the like, and performs digital signal processing such as gamma correction, level shift, color correction, and noise reduction on image data input from the outside. The CPU controls the operations of the power supply unit 9 , the control unit 11 , the data driver 12 , and the gate driver 13 according to a predetermined application program. The memory includes a read only memory (ROM) and a random access memory (RAM). The ROM stores the contents of storage even after the power is turned off, like a non-volatile memory or the like. RAM is used as a work area for CPU operation.

The power supply part 9 contains an inverter circuit, a rectifier circuit, a smoothing circuit, etc. similarly to 1st Embodiment, and is connected to an external AC power supply or DC power supply. The power supply unit 9 supplies driving current to the control unit 11 , the data driver 12 , the gate driver 13 , and the OLED panel 2 .

11 : is a top view of the OLED display in this embodiment, and FIG. 12 is sectional drawing of the OLED device in the line C-C' of FIG. The OLED device includes an OLED panel 20 , a heat dissipation sheet 3 , a connection substrate 4 , a fixing tape 5 , a spacer 6 , a heat sink 7 , a heat conduction sheet 8 , and a circuit portion 10 . do.

The OLED panel 20 is a substantially rectangular light emitting display. Let the long side direction of the OLED panel 2 be the X direction, the short side direction of the OLED panel 20 shall be the Y direction, and the direction from the light emitting surface 21 to the back surface 22 shall be the Z direction. The OLED panel 20 may be bendable in the X direction, but may also be bendable in the Y direction. The OLED panel 20 is provided with a plurality of electrode terminals at the end of the short side and the end of the long side in the back surface 22 , respectively. A plurality of electrode terminals at the end of the short side are electrically connected to the gate line 241 , and the plurality of electrode terminals at the end of the long side are electrically connected to the data line 242 (refer to FIG. 10 ). . The data driver 12 and the gate driver 13 may be formed of a flexible FPC or the like. The pair of gate drivers 13 are disposed on both sides of the OLED panel 20 in the X direction. The data driver 12 is disposed above the OLED panel 20 in the Y direction.

The heat dissipation sheet 3 is disposed on the back surface 22 of the OLED panel 20 . The heat radiation sheet 3 is arrange|positioned substantially in the center of the OLED panel 2 . The connecting substrate 4 is disposed on the OLED panel 2 and the heat dissipation sheet 3 .

The connecting boards 4a, 4b, and 4c are made of a bendable FPC or the like. One end of the connecting board 4a is electrically connected to the data driver 12 , and the other end of the connecting board 4a is electrically connected to the circuit part 10 through an opening 55 formed in the fixing tape 5 . Similarly, one end of the connecting substrates 4b and 4c is connected to each of the pair of gate drivers 13 , and the other end is electrically connected to the circuit portion 10 through an opening 55 formed in the fixing tape 5 .

The fixing tape 5 fixes the heat dissipation sheet 3 and the connection boards 4a, 4b, and 4c to the OLED panel 20 . The number of the fixing tapes 5 is not limited to one, and may be plural. The fixing tape 5 has a plurality of openings 55 . The connecting substrates 4a, 4b, and 4c are disposed on the top of the fixing tape 5 through the opening 55 from the bottom of the fixing tape 5 . The heat sink 7 is disposed on the fixing tape 5 with spacers 61 and 62 interposed therebetween. The heat sink 7 is not limited to one, and a plurality may be sufficient as it.

The circuit part 10 is provided with the circuit board 100 which consists of a bendable FPC, and the some circuit component 106 mounted on the circuit board 100. As shown in FIG. The plurality of circuit components 106 constitute the power supply unit 9 and the control unit 11 . In the circuit board 100 , a first region 101 in which the circuit component 106 is mounted and a second region 102 in which the circuit component 106 is not mounted are formed. The first region 101 and the second region 102 are alternately arranged in the X direction, and the circuit board 100 becomes bendable in the X direction in the second region 102 . Also, the power supply unit 9 and the control unit 11 may be respectively formed on the plurality of circuit boards 100 . In this case, the plurality of circuit boards 100 may be flexibly connected to each other by FPC.

The spacers (61, 62) are provided between the fixing tape (5) and the heat sink (7), and a gap (63) is formed between the fixing tape (5) and the heat sink (7). The spacers 61 and 62 may be formed of a polymer sheet having heat insulating properties, urethane, or the like. The spacers 61 are arranged so that the long sides of the spacers 61 are substantially parallel to the Y direction when viewed from above, and are arranged at predetermined intervals along the Y direction. The spacers 62 are arranged so that the long sides of the spacers 62 are substantially parallel to the X direction when viewed from above, and are arranged at predetermined intervals along the Y direction. Adjacent to the spacer 62, another spacer 61 is disposed. The spacers 61 and 62 are alternately arranged and may be arranged, for example, in a grid pattern when viewed from above. This can prevent the heat sink 7 from contacting the fixing tape 5 when the OLED display is bent. Moreover, the spacer 62 is adhere|attached only to either one of the fixing tape 5 or the heat sink 7, and it is possible to relieve|moderate bending stress at the time of bending|flexion of an OLED device.

The heat sink 7 is disposed on the fixing tape 5 with spacers 61 and 62 interposed therebetween. The heat sink 7 preferably has a substantially rectangular shape when viewed from the top, and has a size sufficient to place the circuit unit 10 thereon. The number of heat sinks 7 is not limited to one, and may be plural. Moreover, in this embodiment, although the opening part for passing the connection board|substrates 4a, 4b, 4c is not formed in the heat sink 7, it is also possible to form an opening in the heat sink 7 similarly to 1st Embodiment.

The heat conductive sheet 8 is provided under the first region 101 of the circuit portion 10 . Accordingly, it becomes possible to effectively block the heat generated from the circuit component 106 from propagating to the heat sink 7 .

As described above, according to the present embodiment, by overlapping at least a part of the OLED panel and the power supply unit, it is possible to realize miniaturization of the OLED display. In addition, by providing a heat insulating layer including a gap between the power supply unit and the OLED panel, the influence of the heat generated in the power supply unit on the OLED panel can be reduced. Furthermore, by arranging the region where no circuit components are mounted in the power supply unit along the bending direction of the OLED panel, the power supply unit can be bent. In this way, it is possible to realize a flexible OLED display while overlapping the OLED panel and the power supply unit.

2: OLED panel
3: heat dissipation sheet
4: connection board
5: fixing tape
55: opening
6: Spacer
63: void
7: heat sink
75: opening
8: heat conduction sheet
9: Power
91, 101: first area
92, 102: second area

Claims (21)

an organic light emitting diode panel having a light emitting surface and curved in a first direction;
The organic light emitting diode panel and the organic light emitting diode panel at least partially overlapped on the rear surface of the panel to supply power to the organic light emitting diode panel and is composed of a power supply unit bent in a first direction,
The power supply unit includes a power substrate in which a plurality of bending regions and non-bending regions are alternately formed and a plurality of circuit components mounted on the non-bending region,
The light emitting device, characterized in that the plurality of bent regions and non-bend regions are alternately arranged along the first direction.
delete The method of claim 1,
and a heat insulating layer provided between the organic light emitting diode panel and the power supply unit.
4. The method of claim 3,
The heat insulating layer comprises a gap formed between the power supply unit and the organic light emitting diode panel.
5. The method of claim 4,
The gap is formed by a plurality of spacers installed between the power supply unit and the organic light emitting diode panel.
6. The method of claim 5,
The plurality of spacers includes a first spacer extending in the first direction and a second spacer extending in a second direction crossing the first direction.
7. The method of claim 6,
The second spacer is fixedly attached to the organic light emitting diode panel and the power supply unit,
The first spacer is bent and attached to and fixed to only one of the organic light emitting diode panel and the power supply unit and not fixed to the other, so that when the organic light emitting diode panel is bent in the first direction, the organic light emitting diode panel is the first spacer Light emitting device, characterized in that not constrained by. delete delete delete delete delete 4. The method of claim 3,
It is configured in a band shape and is disposed between the organic light emitting diode panel and the power supply unit and further includes a connection board having a first supply terminal and a second supply terminal installed at both ends thereof,
The first supply terminal and the second supply terminal are installed on opposite sides of the organic light emitting diode panel and include a first input unit and a second input unit supplied with power from the power supply unit,
The light emitting device of claim 1, wherein the first supply terminal is connected to the first input unit, and the second supply terminal is connected to the second input unit.
14. The method of claim 13,
A light emitting device according to claim 1, wherein a power supply connection portion connected to the power supply portion is provided between the first supply terminal and the second supply terminal of the connection board.
15. The method of claim 14,
The power supply connection portion is defined by a U-shaped opening formed in the connection substrate when viewed from above.
16. The method of claim 15,
A light emitting device, characterized in that a heat sink is installed between the power supply and the heat insulating layer.
17. The method of claim 16,
The connection substrate is installed between the organic light emitting diode panel and the heat sink;
The light emitting device according to claim 1, wherein the power connection part is connected to the power supply part through an opening formed in the heat sink.
14. The method of claim 13,
and a heat dissipation sheet is provided between the organic light emitting diode panel and the connection substrate.
The method of claim 1,
wherein the organic light emitting diode panel is a display panel in which a plurality of organic light emitting diodes are arranged in a matrix.
20. The method of claim 19,
A light emitting device, wherein a circuit for processing an image signal is mounted on the power supply unit. The method of claim 16, further comprising a plurality of heat-conducting sheets disposed between the power supply unit and the heat sink,
The plurality of heat conductive sheets are arranged to be spaced apart from each other by a predetermined distance along a second direction intersecting the first direction.

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