KR20210015635A - Light emitting device - Google Patents

Abstract

An object of the present invention is to provide a compact light emitting device. According to the present invention, the light emitting device comprises: an organic light emitting diode panel; and a power supply unit supplying power to the organic light emitting diode panel, wherein the organic light emitting diode panel has a light emitting surface, and at least a portion of the power supply unit is disposed on a rear surface of the light emitting surface of the organic light emitting diode panel to overlap the organic light emitting diode panel when viewed from an upper portion.

Description

Light emitting device

The present invention relates to a light emitting device.

In recent years, organic light emitting diodes (OLEDs) have the advantage of being thinner, so they have been used for lighting and display panels. The lighting device described in Patent Document 1 includes a lighting unit provided with an OLED sheet, a support unit connected to an end of the lighting unit, and a power supply unit provided on the support unit.

Patent Document 1: Utility Model Publication No. 20-2014-0005434

In the lighting device described in Patent Literature 1, there is a problem that it becomes difficult to configure the device compactly because the power supply unit is provided in parallel to the lighting unit.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a light emitting device capable of miniaturization.

According to an aspect of the present invention, an organic light emitting diode panel and a power supply unit for supplying power to the organic light emitting diode panel are provided, and the organic light emitting diode panel has a light emitting surface, and at least some of the power supply units may be viewed from above When the organic light emitting diode panel is overlapped, the light emitting device is provided, which is disposed on the rear surface of the light emitting surface of the organic light emitting diode panel.

According to the present invention, it becomes possible to provide a light emitting device capable of miniaturization.

1 is a schematic diagram of an OLED device according to a first embodiment of the present invention.
2 is a perspective view of an OLED device according to the first embodiment of the present invention.
3 is an exploded perspective view of the OLED device in the first embodiment of the present invention.
4 is a plan view of a connection substrate according to the first embodiment of the present invention.
5 is a plan view of the OLED device in the first embodiment of the present invention.
6 is a cross-sectional view of the OLED device taken along line A-A' in FIG. 5 in the first embodiment of the present invention.
7 is a cross-sectional view of the OLED device taken along line B-B' in FIG. 5 in the first embodiment of the present invention.
8 is a cross-sectional view of an OLED panel in the first embodiment of the present invention.
9 is a cross-sectional view of a curved OLED device in the first embodiment of the present invention.
Fig. 10 is a block diagram of an OLED device according to a second embodiment of the present invention.
11 is a plan view of an OLED device according to a second embodiment of the present invention.
12 is a cross-sectional view of the OLED device taken along line C-C' in FIG. 11 in the second embodiment of the present invention.

Hereinafter, an embodiment of the present invention will be described based on the drawings. The same reference numerals throughout the specification mean substantially the same constituent elements.

The size and thickness of each component illustrated in the drawings are illustrated for convenience of description, and are not necessarily limited to the size and thickness of the configuration illustrated in the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<First embodiment>

1 is a schematic diagram of an OLED device according to the present embodiment, showing an OLED lighting device. The OLED device includes a housing 1a and an OLED panel 2 stored in the housing 1a. The OLED panel 2 includes a plurality of organic light emitting diodes arranged in a matrix, and functions as OLED lighting. The OLED device may be configured to be bent along a long side direction as shown in FIG. 1, but may be bent along a short side direction. The long side direction of the OLED panel 2 is set as the X direction, the short side direction of the OLED panel 2 is set as the Y direction, and the direction from the light emitting surface 21 toward the rear is set as the Z direction. The housing 1a has a thin box shape and has an opening 1b. In addition to the OLED panel 2, a power supply unit described later is stored in the housing 1a. The housing 1a may be formed of, for example, plastic, ABS (Acrylonitrile, Butadiene, Styrene) resin, or metal. The housing 1a protects the OLED panel 2 from external impact, collision of objects, and the like. The light emitting surface 21 of the OLED panel 2 is exposed from the opening 1b of the housing 1a, and a power supply unit is installed on the rear surface of the OLED panel 2. The power supply cable 1c supplies a drive current to the OLED device. The power cable 1c is provided in a portion that does not inhibit light emission of the light emitting surface 21, such as a rear surface of the housing 1a or a side surface of the housing 1a. In the housing 1a, a stand for installing the OLED device may be installed. Further, the number of OLED panels 2 stored in the housing 1a is not limited to one, and may be plural.

Fig. 2 is a perspective view of an OLED device in this embodiment, and Fig. 3 is an exploded perspective view of the OLED device in this embodiment. An OLED device is provided with an OLED panel 2, a heat dissipation sheet 3, a connection substrate 4, a fixing tape 5, a spacer 6, a heat dissipation plate 7, a heat conduction sheet 8, and a power supply unit 9 do.

The OLED panel 2 has a substantially rectangular shape when viewed from the top. For example, the lengths of the OLED panel 2 in the X, Y, and Z directions may be 200 mm, 50 mm, and 0.5 mm, respectively, but the shape and length are not limited. In Fig. 2, the light emitting surface 21 faces downward in the Z direction, and the rear surface 22 faces upward in the Z direction.

The heat dissipation sheet 3 has a rectangular shape and is provided on the rear surface 22 of the OLED panel 2. The heat dissipation sheet 3 is composed of a material having a high thermal conductivity, and may be composed of, for example, graphite, copper, aluminum, or any combination. Typically, the thermal conductivity of graphite is 700 to 1950 W/(m·K), the thermal conductivity of copper is 403 W/(m·K), and the thermal conductivity of aluminum is 236 W/(m·K). It is preferred to use graphite. With the above-described configuration, the heat generated in the OLED panel 2 is uniformly dispersed throughout the heat dissipation sheet 3. Since the heat dissipation sheet 3 dissipates heat generated in the OLED panel 2, it is preferable to cover as many areas as possible of the rear surface 22 of the OLED panel 2. The number of the heat dissipation sheets 3 is not limited to one, and the heat dissipation sheets 3 may be divided into a plurality. For example, the plurality of heat dissipation sheets 3 are arranged side by side in the X direction, so that the heat dissipation sheet 3 is easily bent in the X direction.

The connection substrate 4 is a thin and long strip-shaped flexible printed circuit (FPC), and may be made of, for example, polyimide, polyethylene terephthalate, or the like. On the connection board 4, a power supply wiring and a ground wiring are formed as an aluminum or copper pattern. The connection board 4 is disposed on the heat dissipation sheet 3, and the supply terminals formed on both ends of the connection board 4 are an anode terminal 201 and a cathode terminal provided on opposite sides of the OLED panel 2, respectively. 202). A power supply connecting portion 45 is provided almost in the center of the connection board 4, and the power supply connecting portion 45 is connected to the power supply portion 9. Thereby, a driving current is supplied from the power source 9 to the OLED panel 2 through the connection substrate 4.

The fixing tape 5 is a rectangular adhesive tape and includes an adhesive surface 51 and a non-adhesive surface 52. The fixing tape 5 may be made of, for example, polyethylene terephthalate, resin, or the like. The adhesive surface 51 of the fixing tape 5 is attached to the rear surface 22 of the OLED panel 2 via the heat dissipation sheet 3 and the connection substrate 4. In this way, the heat dissipation sheet 3 and the connection substrate 4 are fixed to the OLED panel 2 by the fixing tape 5. In the center of the fixing tape 5, a rectangular opening 55 for exposing the power supply connecting portion 45 is formed. It is preferable that the opening 55 has a sufficient size to allow the power connection 45 to be inserted therethrough.

The spacer 6 is provided between the power source 9 and the OLED panel 2 and is used to form a void 63 between the power source 9 and the OLED panel 2. The thickness (length in the Z direction) of the spacer 6 may be a value capable of forming a sufficient void 63 as a heat insulating layer, and may preferably be about 0.5 to 3.0 mm, for example, 1.0 mm. The spacer 6 is a polymer sheet or the like having heat insulating properties, and may be made of, for example, urethane.

The spacer 6 has first spacers 61a, 61b, 61c and second spacers 62a, 62b, 62c, 62d. The first spacers 61a, 61b, and 61c extend in a direction (Y direction) crossing the bending direction of the OLED panel 2 when viewed from above. The second spacers 62a, 62b, 62c, 62d extend in the bending direction (X direction) of the OLED panel 2 when viewed from above.

The first spacers 61a, 61b, and 61c are disposed substantially parallel to each other at predetermined intervals in the X direction. The second spacers 62a and 62b are disposed between the first spacers 61a and 61b, and are disposed substantially parallel to each other at predetermined intervals in the Y direction. The second spacers 62a and 62b are disposed along the vicinity of the edge portion of the long side of the heat sink 7. The second spacers 62c and 62d are disposed between the first spacers 61b and 61c, and are disposed substantially parallel to each other at predetermined intervals in the Y direction. It is preferable that the first spacers 61a and 61b and the second spacers 62a and 62b are not located on the opening 55 when viewed from the top so as not to interfere with the power connection portion 45 of the connection board 4 .

The first spacers 61a, 61b, and 61c have adhesive surfaces 611 and 612, respectively. The adhesive surface 611 is attached to the heat sink 7, and the adhesive surface 612 is attached to the fixing tape 5. The second spacers 62a, 62b, 62c and 62d have an adhesive surface 621 and a non-adhesive surface 622, respectively. The adhesive surface 621 is adhered to the heat sink 7, and the non-adhesive surface 622 abuts against the fixing tape 5 but is not adhered. That is, the second spacers 62a, 62b, 62c, and 62d extending in the X direction can move freely with respect to the fixing tape 5. Therefore, when the OLED device is bent in the X direction, it becomes possible to reduce the bending stress in the X direction.

The heat dissipation plate 7 is made of a metal having high thermal conductivity, such as aluminum or copper. The heat dissipation plate 7 has a rectangular shape, for example, but may be a polygon with a rectangular angle cut off. The heat sink 7 is disposed on the spacer 6 and fixed to the fixing tape 5. The heat sink 7 radiates heat conducted from the heat conduction sheet 8 to the heat sink 7 from the surface of the heat sink 7. A rectangular opening 75 for exposing the power supply connection 45 is formed in the heat sink 7. It is preferable that the opening 75 has a sufficient size so that the power connection portion 45 can be inserted therethrough.

The heat conductive sheet 8 includes a plurality of heat conductive sheets 8a, 8b, 8c, and 8d, and is made of a material having high thermal conductivity, such as silicon and graphite. The heat conductive sheets 8a, 8b, 8c, 8d form a rectangle extending in the Y direction, and have a predetermined length (width) in the X direction. The length of the heat conductive sheets 8a, 8b, 8c, and 8d in the Y direction may have a length equal to the length of the power source 9 in the Y direction. The heat conductive sheets 8a, 8b, 8c, 8d are provided substantially parallel to each other at predetermined intervals in the bending direction (X direction). It is preferable that the heat conductive sheets 8a, 8b, 8c, and 8d are not positioned on the opening 75 when viewed from the top. The thermally conductive sheets 8a, 8b, 8c, and 8d are provided with adhesive surfaces 81 and 82, respectively. The adhesive surface 81 is adhered to the power supply unit 9, and the adhesive surface 82 is adhered to the heat sink 7. The heat conduction sheets 8a, 8b, 8c, and 8d conduct heat generated by the power source 9 to the heat dissipation plate 7. Further, since the plurality of heat conductive sheets 8a, 8b, 8c, 8d are divided and provided in the bending direction, they do not interfere with the bending of the OLED device.

The power supply unit 9 is provided on the heat dissipation plate 7 via the heat conductive sheet 8. The power supply unit 9 includes a flexible circuit board (FPC) 90 such as polyimide and polyethylene terephthalate, and a plurality of circuit components 96 mounted on the circuit board 90. The circuit component 96 comprises, for example, an integrated circuit, a transistor, a resistor, a capacitor, a coil, or the like, and constitutes an inverter circuit, a rectifier circuit, and a smoothing circuit. The power supply unit 9 is connected to an AC power supply through a power cable 1c (see Fig. 1). The power supply unit 9 rectifies and smoothes the AC power supply of the commercial power supply, and supplies a DC current to the OLED panel 2 through the connection substrate 4. Further, the power supply 9 may be connected to an external DC power supply, and the power supply 9 does not necessarily need to have a rectifier circuit.

4 is a plan view of the connection substrate 4 in the present embodiment. As described above, the connection board 4 is formed from an elongated FPC or the like, and terminals 41A and 41C are formed at both ends, respectively. A U-shaped groove portion 48 is formed substantially in the center of the connection substrate 4, and a region defined by the groove portion 48 forms a power supply connection portion 45. The power supply connection part 45 is bendable at the junction with the connection board 4, and the power supply connection part 45 can be erected from the connection board 4.

Terminals 42A and 42C are formed at the ends of the power supply connection 45. The terminal 42A is electrically connected to the terminals 41A of both ends of the connection board 4 through the wiring 43A, and the terminal 42C is connected to both ends of the connection board 4 through the wiring 43C. It is electrically connected to the terminal 41C. The terminal 41A is soldered to the anode terminal 201 of the OLED panel 2, and the terminal 41C is soldered to the cathode terminal 202 of the OLED panel 2 (see Fig. 2). On the other hand, the power connection unit 45 is electrically connected to the power supply unit 9 through the opening 55 of the fixing tape 5 and the opening 75 of the heat sink 7. That is, the terminals 42A and 42C of the power supply connection unit 45 are connected to the anode power supply terminal and the cathode power supply terminal of the power supply unit 9. Accordingly, a driving current is supplied from the power supply 9 to the OLED panel 2 through the power connection 45.

5 is a plan view of an OLED device. Fig. 6 is a cross-sectional view of the OLED device along line A-A' in Fig. 5, and Fig. 7 is a cross-sectional view of the OLED device along line B-B' in Fig. 5.

As described above, the fixing tape 5 is adhered to the rear surface 22 of the OLED panel 2 via the heat dissipation sheet 3 and the connection substrate 4. A spacer 6 is provided between the fixing tape 5 and the heat sink 7, and a void 63 is formed between the fixing tape 5 and the heat sink 7. Moreover, the power supply unit 9 is provided on the heat dissipation plate 7 via the heat conductive sheet 8. The power supply unit 9 has first regions 91a, 91b, 91c, 91d in which the circuit component 96 is mounted, and second regions 92a, 92b, 92c in which the circuit component 96 is not mounted. Each of the first regions 91a, 91b, 91c, and 91d has a predetermined width in the X direction, and a circuit component 96 is mounted in the Y direction. The second regions 92a, 92b, 92c are provided between the first regions 91a, 91b, 91c, and 91d. That is, the second region 92a is provided between the first regions 91a and 91b, and the second region 92b is provided between the first regions 91b and 91c. Similarly, a second region 92c is provided between the first regions 91c and 91d. The first regions 91a, 91b, 91c, and 91d have high hardness because the circuit component 96 is mounted, and are difficult to bend. On the other hand, the second regions 92a, 92b, and 92c are liable to bend because the circuit component 96 is not mounted. By arranging the second regions 92a, 92b, 92c, which tend to be bent, between the first regions 91a, 91b, 91c, and 91d, the power supply unit 9 can be bent in the X direction. That is, the circuit area (first area, 91a, 91b, 91c, 91d) in which the circuit component 96 is mounted and the curved area (second area, 92a, 92b, 92c) in which the circuit subform 96 is not mounted are alternately By arranging it as, the power supply unit 9 can be bent in the X direction.

The heat conductive sheet 8 is provided between the power source 9 and the heat dissipation plate 7. The heat conduction sheet 8 includes heat conduction sheets 8a, 8b, 8c, and 8d, and the heat conduction sheets 8a, 8b, 8c, 8d are installed under the first regions 91a, 91b, 91c, and 91d, respectively. It is desirable to be. In addition, it is preferable that the length of the X direction of the heat conductive sheets 8a, 8b, 8c, 8d is about the same as the length of the X direction of the first regions 91a, 91b, 91c, and 91d. The heat conductive sheets 8a, 8b, 8c, 8d are installed under the first regions 91a, 91b, 91c, 91d, thereby efficiently removing the heat generated in the first regions 91a, 91b, 91c, 91d. It can be conducted to the heat sink 7.

Spacers 61a, 61b, 61c, 62a, 62b, 62c, 62d are provided between the heat sink 7 and the fixing tape 5. Therefore, a void 63 is formed between the heat sink 7 and the fixing tape 5. The length d of the void 63 in the Z direction corresponds to the thickness (length in the Z direction) of the spacers 61a, 61b, 61c, 62a, 62b, 62c, 62d. Accordingly, by appropriately selecting the thickness of the spacers 61a, 61b, 61c, 62a, 62b, 62c, 62d, the void 63 having a desired length d can be formed.

Part of the heat conducted to the heat sink 7 through the heat conductive sheets 8a, 8b, 8c, and 8d is discharged to the voids 63. Since the thermal conductivity of the voids 63 and the spacers 61a, 61b, 61c, 62a, 62b, 62c, 62d constituting the heat insulating layer is sufficiently small, the heat generated from the power supply 9 is prevented from being conducted to the OLED panel 2. By preventing, it becomes possible to reduce the deterioration of the OLED panel 2. Moreover, since the void 63 is formed between the OLED panel 2 and the power supply 9, the bending stress when the OLED lighting is bent is reduced in the void 63. Therefore, it becomes possible to prevent problems such as peeling of the power supply unit 9 and the OLED panel 2.

The connection board 4 is provided between the rear surface 22 of the OLED panel 2 and the fixing tape 5 as described above, and the terminals 41A and 41C formed on both ends of the connection board 4 are OLED panels. It is electrically connected to the anode terminal 201 and the cathode terminal 202 provided at both ends of (2), respectively. The power supply connection part 45 is erected in the Z direction from the connection board 4 and is inserted into the opening 55 of the fixing tape 5 and the opening 75 of the heat sink 7. Therefore, it is preferable that the opening 55 and the opening 75 are formed at positions that overlap each other when viewed from the top. The terminals of the power supply connection portion 45 may be connected to a connector provided on the circuit board 90 or may be soldered directly to a wiring pattern formed on the circuit board 90. It is preferable that the power supply connection 45 has a sufficient length in the X direction so that the power connection 45 does not peel off from the circuit board 90 when the OLED panel 2 is bent.

8 is a cross-sectional view of the OLED panel 2. The OLED panel 2 includes a substrate layer 210, an anode electrode 211, an organic emission layer 212, a cathode electrode 213, a buffer layer 214, a base film 215, an insulating film 216, and a barrier film ( 217) and a fluorescence extraction film 218. The substrate layer 210 is made of, for example, polyimide, and has wirings for electrically connecting the anode electrode 211 and the cathode electrode 213 to the anode terminal 210 and the cathode terminal 202.

The anode electrode 211 is provided on the substrate layer 210. The anode electrode 211 is made of a transparent conductive material such as Indium Tin Oxide (ITO) and Indium Zinc Oxide (IZO), for example. ITO or IZO is made of a transparent conductive material and can transmit light.

The organic emission layer 212 is provided on the anode 211 and may be formed of an organic emission material that outputs white light. The organic emission layer 212 may be formed of, for example, a blue organic emission layer, a red organic emission layer, and a green organic emission layer, and may be formed in a tandem structure including a blue organic emission layer, a yellow or green organic emission layer. The organic light-emitting layer 212 of the present invention is not limited to the above structure, and various structures may be applied. As the organic light-emitting layer 212, for example, 8-hydroxy-quinoline aluminum complex, carbazole-based compound, dimer styryl compound, 10-hydroxy benzoquinoline-metal compound, and the like are used, but are not limited thereto.

The cathode electrode 213 is made of a material such as aluminum, silver and magnesium alloy, and calcium. The cathode electrode 213 is provided on the organic emission layer 212.

The anode electrode 211, the organic light emitting layer 212, and the cathode electrode 213 constitute an organic light emitting element. Voltage is applied to the anode electrode 211 and the cathode electrode 213 from the anode terminal 201 and the cathode terminal 202, respectively, through wiring provided on the substrate layer 210. When a voltage is applied to the anode electrode 211 and the cathode electrode 213, electrons are injected from the cathode electrode 213 into the organic emission layer 212, and holes are injected from the anode electrode 211 into the organic emission layer 212. . In the organic emission layer 212, excitons are generated by combining electrons and holes. As the excitons disappear, light corresponding to the energy difference between the lowest unoccupied molecular orbital function and the highest occupied molecular orbital function of the organic emission layer 212 is generated. Light generated from the organic emission layer 212 is emitted toward the substrate layer 210.

The buffer layer 214 is, for example, a photocurable adhesive or a thermosetting adhesive. The buffer layer 214 is provided to cover the organic emission layer 212 and the cathode electrode 213. The base film 215 may be made of a polymer material such as polyethylene terephthalate or a metal material such as aluminum, iron/nickel alloy, iron/nickel/cobalt alloy, and prevents water vapor and air from permeating to the organic light emitting layer 212. . The base film 215 seals the organic light emitting layer 212 and the cathode electrode 213 by the buffer layer 214. The buffer layer 214 and the base film 215 are also referred to as encapsulation layers, and seal the organic light emitting element.

The insulating film 216 is provided on the base film 215. The insulating film 216 electrically insulates the organic light-emitting element sealed by the encapsulation layer from the outside of the OLED panel 2. The insulating film 216 may be made of a material such as polyimide or polyethylene terephthalate.

The barrier film 217 is provided under the substrate layer 210. The barrier film 217 is a transparent polymer film, and may be made of a material such as polyethylene terephthalate, polyethylene naphthalate, and cycloolefin polymer. The barrier film 217 prevents water vapor and air from permeating to the organic emission layer 212 and the like, thereby preventing deterioration and corrosion of the organic emission layer 212 due to water.

The fluorescence extraction film 218 is a transparent thin film having a fine microlens structure. The fluorescence extraction film 218 is provided under the barrier film 217. By providing the fluorescence extraction film 218, light generated from the organic emission layer 212 can be efficiently extracted.

9 is a cross-sectional view of a curved OLED device. In Fig. 9, the OLED device is bent along the X direction so as to form a convex shape in the light emission direction (-Z direction). In this embodiment, it is possible to configure the OLED device to be bendable while superimposing and installing the power supply unit 9 on the OLED panel 2. Hereinafter, the reason will be described in detail.

First, in the power supply unit 9, between the first regions 91a, 91b, 91c, and 91d in which the circuit components 96 are mounted, the second regions 92a, 92b, 92c in which the circuit components 96 are not mounted. Is formed. Therefore, in the power supply unit 9, the second regions 92a, 92b, and 92c can be bent. That is, it becomes possible to configure the power supply unit 9 together with the OLED panel 2 to be bendable while superimposing the power supply unit 9 on the OLED panel 2.

Further, between the fixing tape 5 and the heat sink 7, in addition to the first spacer 61 extending in the Y direction, a second spacer 62 extending in the bending direction (X direction) is provided. Therefore, even if the fixing tape 5 and the heat dissipating plate 7 are bent in the X direction, the fixing tape 5 and the heat dissipating plate 7 do not come into contact, but are isolated via the void 63. Here, assuming that the spacer 62 is not installed, the heat sink 7 is greatly curved, so that a portion of the heat sink 7 where the second spacer 62 is not installed may contact the fixing tape 5. In this case, heat generated in the power supply unit 9 is propagated from the heat sink 7 to the OLED panel 2 through the fixing tape 5, which may cause deterioration of the OLED panel 2. In this embodiment, by providing the second spacers 62a, 62b, 62c, 62d extending in the bending direction (X direction), the heat from the power supply 9 is also transferred to the OLED panel 2 even when the OLED device is bent. It becomes possible to prevent it from spreading.

Further, in the present embodiment, the second spacers 62 extending in the X direction are adhered to the heat sink 7 but not to the fixing tape 5. Accordingly, when the OLED device is bent in the X direction, the second spacer 62 can move freely with respect to the fixing tape 5, and can absorb the bending stress of the OLED device. As a result, even when the OLED device is bent, it becomes possible to prevent problems such as poor adhesion between members.

In addition, even when the OLED device is bent along the X direction so as to form a concave shape in the direction opposite to that of Fig. 9, that is, in the light emission direction (-Z direction), the above-described effect can be obtained. In other words, it is possible to prevent the heat from the power source 9 from spreading to the OLED panel 2 while always securing the void 63 regardless of the bending direction of the OLED device. In addition, it is possible to prevent problems such as poor adhesion between the respective members due to the bending of the OLED device.

As described above, according to the present embodiment, when viewed from the top, the OLED panel and at least a part of the power supply unit are overlapped to each other, thereby miniaturizing the OLED lighting. In addition, by providing a heat insulating layer including voids between the power supply unit and the OLED panel, the effect of heat generated in the power supply unit on the OLED panel can be reduced. Moreover, by arranging the area in the power supply unit where no circuit components are mounted along the bending direction of the OLED panel, the power supply unit can be easily bent. In this way, it is possible to realize flexible OLED lighting by overlapping the OLED panel and the power supply unit.

<Second Embodiment>

Subsequently, the OLED device in this embodiment will be described. This embodiment differs from the first embodiment in that the OLED panel is a display panel capable of displaying an image. Hereinafter, the structure different from that of the first embodiment will be mainly described.

10 is a block diagram of an OLED device in the present embodiment. The OLED device includes an OLED panel 20, a power supply unit 9, a control unit 11, a data driver 12, and a gate driver 13. The OLED panel 20 is provided with a plurality of organic light emitting diodes arranged in a matrix.

The OLED panel 20 includes a plurality of pixels 23 arranged in a matrix, and each pixel 23 includes a light emitting element 231 and a pixel circuit 232. The light emitting element 231 has a light emitting layer made of an organic material. The pixel circuit 232 includes a switch transistor, a driving transistor, a capacitor, and the like. The switch transistor and the driving transistor have a TFT (Thin Film Transistor) structure. Each light-emitting element 231 is provided with an RGB (R: Red, G: Green, B: Blue) color filter, so that a color image can be generated. Further, instead of installing a color filter, a light emitting element 231 capable of emitting light in each color may be used.

The data driver 12 applies a data voltage according to the luminance signal to the pixel circuit 232 through the data line 242. The gate driver 13 drives the gate of the switch transistor of the pixel circuit 232 via the gate line 241. The gate driver 13 sequentially selects the gate line 241 and applies a voltage for turning on the switch transistor connected to the selected gate line 241 to the gate line 241. The pixel circuit 232 supplies a driving current according to the data voltage to the light-emitting element 231 to cause the light-emitting element 231 to emit light.

The control unit 11 includes a CPU (Central Processing Unit), a memory, an interface, and the like, and performs digital signal processing such as gamma correction, level shift, color correction, and noise reduction on image data input from the outside. The CPU controls the operation of the power supply unit 9, the control unit 11, the data driver 12, and the gate driver 13 according to a predetermined application program. The memory includes ROM (Read Only Memory) and RAM (Random Access Memory). The ROM stores the contents of memory even after the power is turned off, such as a nonvolatile memory. RAM is used as a work area for CPU operation.

The power supply unit 9 includes an inverter circuit, a rectifier circuit, a smoothing circuit, and the like as in the first embodiment, and is connected to an external AC power supply or a DC power supply. The power supply 9 supplies driving current to the control unit 11, the data driver 12, the gate driver 13, and the OLED panel 2.

FIG. 11 is a plan view of the OLED display in this embodiment, and FIG. 12 is a cross-sectional view of the OLED device taken along line C-C' in FIG. 11. The OLED device is provided with an OLED panel 20, a heat radiation sheet 3, a connection substrate 4, a fixing tape 5, a spacer 6, a heat sink 7, a heat conduction sheet 8, and a circuit portion 10. do.

The OLED panel 20 is a substantially rectangular light-emitting display. The long side direction of the OLED panel 2 is set as the X direction, the short side direction of the OLED panel 20 is set as the Y direction, and the direction from the light emitting surface 21 to the rear surface 22 is set as the Z direction. The OLED panel 20 may be bent in the X direction, but may be bent in the Y direction as well. The OLED panel 20 is provided with a plurality of electrode terminals at the end of the short side and the end of the long side of the rear surface 22, respectively. The plurality of electrode terminals at the end of the short side are electrically connected to the gate line 241, and the plurality of electrode terminals at the end of the long side are electrically connected to the data line 242 (see Fig. 10). . The data driver 12 and the gate driver 13 may be formed of a flexible FPC or the like. A pair of gate drivers 13 are disposed on both sides of the OLED panel 20 in the X direction. The data driver 12 is disposed above the OLED panel 20 in the Y direction.

The heat dissipation sheet 3 is disposed above the rear surface 22 of the OLED panel 20. The heat dissipation sheet 3 is disposed almost at the center of the OLED panel 2. The connection substrate 4 is disposed above the OLED panel 2 and the heat dissipation sheet 3.

The connection boards 4a, 4b, 4c are formed from a bendable FPC or the like. One end of the connection board 4a is electrically connected to the data driver 12, and the other end of the connection board 4a is electrically connected to the circuit portion 10 through an opening 55 formed in the fixing tape 5. Similarly, one end of the connection substrates 4b and 4c is connected to each of the pair of gate drivers 13, and the other end is electrically connected to the circuit portion 10 through an opening 55 formed in the fixing tape 5.

The fixing tape 5 fixes the heat dissipation sheet 3 and the connection boards 4a, 4b, 4c to the OLED panel 20. The number of fixing tapes 5 is not limited to one, and may be plural. The fixing tape 5 has a plurality of openings 55. The connection boards 4a, 4b, 4c are disposed above the fixing tape 5 through the openings 55 from the bottom of the fixing tape 5. The heat dissipation plate 7 is disposed above the fixing tape 5 through the spacers 61 and 62. The heat sink 7 is not limited to one, and may be plural.

The circuit unit 10 includes a circuit board 100 made of a bendable FPC, and a plurality of circuit components 106 mounted on the circuit board 100. The plurality of circuit components 106 constitute a power supply unit 9 and a control unit 11. In the circuit board 100, a first region 101 in which the circuit component 106 is mounted and a second region 102 in which the circuit component 106 is not mounted are formed. The first region 101 and the second region 102 are alternately arranged in the X direction, and the circuit board 100 is bent in the X direction in the second region 102. Also, the power supply unit 9 and the control unit 11 may be formed on a plurality of circuit boards 100, respectively. In this case, a plurality of circuit boards 100 may be connected to each other in a bendable manner by an FPC.

The spacers 61 and 62 are provided between the fixing tape 5 and the heat dissipating plate 7, and form a void 63 between the fixing tape 5 and the heat dissipating plate 7. The spacers 61 and 62 may be formed from a polymer sheet having heat insulating properties, urethane, or the like. The spacers 61 are arranged so that the long sides of the spacers 61 are substantially parallel to the Y direction when viewed from above, and are arranged at predetermined intervals along the Y direction. The spacers 62 are arranged so that the long sides of the spacers 62 are substantially parallel to the X direction when viewed from above, and are arranged at predetermined intervals along the Y direction. Adjacent to the spacer 62, another spacer 61 is disposed. The spacers 61 and 62 are alternately arranged, and may be arranged in a grid shape when viewed from the top. This can prevent the heat sink 7 from contacting the fixing tape 5 when the OLED display is bent. Further, the spacer 62 is adhered to only one of the fixing tape 5 or the heat dissipating plate 7, so that the bending stress can be relieved at the time of bending the OLED device.

The heat dissipation plate 7 is disposed above the fixing tape 5 through the spacers 61 and 62. It is preferable that the heat sink 7 has a substantially rectangular shape when viewed from the top, and has a size sufficient to place the circuit portion 10 on the top. The number of the heat sink 7 is not limited to one, and may be plural. Further, in the present embodiment, the heat sink 7 is not provided with an opening for passing the connection substrates 4a, 4b, and 4c, but an opening may be formed in the heat sink 7 as in the first embodiment.

The heat conductive sheet 8 is provided below the first region 101 of the circuit portion 10. Therefore, it becomes possible to effectively block the heat generated from the circuit component 106 from propagating to the heat sink 7.

As described above, according to the present embodiment, by overlapping at least a part of the OLED panel and the power supply unit, it is possible to realize downsizing of the OLED display. In addition, by providing a heat insulating layer including voids between the power supply unit and the OLED panel, the effect of the heat generated in the power supply unit on the OLED panel can be reduced. Moreover, by arranging the area in the power supply unit where no circuit components are mounted along the bending direction of the OLED panel, the power supply unit can be bent. In this way, it is possible to realize a flexible OLED display while overlapping the OLED panel and the power supply.

2: OLED panel
3: heat dissipation sheet
4: connection board
5: fixed tape
55: opening
6: spacer
63: void
7: heat sink
75: opening
8: heat conduction sheet
9: power supply
91, 101: first area
92, 102: second area

Claims (20)

An organic light emitting diode panel,
And a power supply for supplying power to the organic light emitting diode panel,
The organic light emitting diode panel has a light emitting surface,
At least a portion of the power supply unit is installed on the rear surface of the light emitting surface of the organic light emitting diode panel so as to overlap the organic light emitting diode panel when viewed from above.
The method of claim 1,
The light emitting device, wherein the organic light emitting diode panel is bendable.
The method according to claim 1 or 2,
A light emitting device comprising a heat insulating layer provided between the organic light emitting diode panel and the power supply unit.
The method of claim 3,
Wherein the heat insulating layer includes a void formed between the power supply unit and the organic light emitting diode panel.
The method of claim 4,
The air gap is formed by a plurality of spacers provided between the power supply unit and the organic light emitting diode panel.
The method of claim 5,
The plurality of spacers include a first spacer extending in a direction crossing the bending direction of the organic light emitting diode panel, and a second spacer extending in the bending direction.
The method of claim 6,
The first spacer is fixed to the organic light emitting diode panel and the power supply,
The second spacer is fixed to either the organic light emitting diode panel or the power supply unit.
The method of claim 6,
The light emitting device, wherein the second spacer is bendable.
The method of claim 6,
The power supply unit includes a bendable power supply board and a plurality of circuit components mounted on the power supply board,
The light emitting device, wherein the power supply unit includes a curved region formed in the intersecting direction and on which the circuit component is not mounted.
The method of claim 9,
A light-emitting device, wherein the plurality of bent regions are formed side by side along the bent direction.
The method of claim 9,
In the power supply unit, the circuit component is mounted in a circuit region other than the curved region.
The method of claim 11,
In the power supply unit, the curved region and the circuit region are alternately formed along the bending direction.
The method of claim 3,
It is provided with a connecting board having a first supply terminal and a second supply terminal provided at both ends while forming a strip shape,
The first supply terminal and the second supply terminal are installed on opposite sides of the organic light emitting diode panel and have a first input unit and a second input unit to which power is supplied from the power supply unit,
The first supply terminal is connected to the first input unit, and the second supply terminal is connected to the second input unit.
The method of claim 13,
In the connection board, a light emitting device, wherein a power connection part connected to the power supply is provided between the first supply terminal and the second supply terminal.
The method of claim 14,
The light-emitting device, wherein the power connection part is defined by a U-shaped opening formed in the connection substrate when viewed from above.
The method of claim 15,
A light emitting device, characterized in that a heat sink is installed between the power supply unit and the heat insulating layer.
The method of claim 16,
The connection substrate is provided between the organic light emitting diode panel and the heat sink,
The power connection unit is connected to the power supply unit through an opening formed in the heat sink.
The method of claim 13,
A light emitting device, characterized in that a heat dissipation sheet is provided between the organic light emitting diode panel and the connection substrate.
The method according to claim 1 or 2,
The organic light emitting diode panel is a display panel in which a plurality of organic light emitting diodes are arranged in a matrix.
The method of claim 19,
A light emitting device, wherein a circuit for processing an image signal is mounted on the power supply unit.

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