JP2015125860A - Organic EL panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic EL panel which enables improvement of heat dissipation efficiency of a driver IC.SOLUTION: An organic EL panel 100 includes: a support substrate 11; a light emitting display part 12; a sealing member 13 which is disposed on the support substrate 11 so as to cover the light emitting display part 12 in an airtight manner; and a driver IC 14 which is mounted on the support substrate 11 so as to be arranged side by side with the sealing member 13 and applies a drive current to an area between first and second electrodes. The organic EL panel 100 includes: a first heat radiation member 15 disposed on a surface of the sealing member 13 which is opposite to a surface facing the light emitting display part 12 and having a base part 15b facing the sealing member 13 and an extension part 15b which extends from the base part 15a and faces the driver IC 14; a heat conduction part 17 disposed between the driver IC 14 and the extension part 15b, the heat conduction part 17 where one surface contacts with the driver IC 14 and the other surface contacts with the extension part 15b; and a heat insulation part (a space S) provided between the base part 15a and the sealing member 13.

Description

  The present invention relates to an organic EL (Electro Luminescence) panel, and more particularly to a COG (Chip On Glass) type organic EL panel in which a driver IC is mounted on a support substrate.

  Conventionally, as an organic EL panel, for example, an organic layer having at least an organic light emitting layer includes an anode line (first electrode line) made of ITO (Indium Tin Oxide) or the like, and a cathode line (second electrode) made of aluminum (Al) or the like. It is known that a plurality of organic EL elements sandwiched between lines) are formed on a supporting substrate made of a glass material as light emitting pixels to constitute a light emitting display portion (see, for example, Patent Document 1). Such an organic EL element emits light by injecting holes from the anode and injecting electrons from the cathode and recombining the holes and electrons in the light emitting layer.

  As a method for mounting a driver IC for driving the organic EL element, a COG configuration in which the driver IC is directly mounted on a support substrate is known (see, for example, Patent Document 2). The COG type organic EL panel is superior in that it can be miniaturized with respect to other mounting methods such as a TCP (Tape Career Package) type in which a driver IC is mounted on an FPC (Flexible Printed Circuit).

JP-A-8-315981 JP 2000-40585 A JP 2011-192942 A

  Since the COG type organic EL panel has a configuration in which the driver IC is directly mounted on the metal wiring (thickness of about 0.5 μm) formed on the support substrate, the thermal resistance becomes very large, and the heat radiation from the driver IC is performed. The temperature of the driver IC is likely to be high due to obstruction. Therefore, particularly in organic EL panels that are used for in-vehicle devices such as instruments and require high-luminance light emission, the deterioration of the light-emitting pixels close to the driver IC and the deterioration of the circularly polarizing plate progress quickly due to the heat from the driver IC. Alternatively, the temperature of the driver IC may exceed the rated temperature, and there is a problem that operation reliability at a high temperature may be lowered.

  On the other hand, as a method for improving the heat dissipation efficiency of the driver IC, Patent Document 3 discloses that heat generated from the driver IC facing the driver IC on the surface of the support substrate opposite to the surface on which the driver IC is mounted. A technique of disposing a heat radiating member that diffuses in the surface direction of a support substrate is disclosed.

  However, the technique disclosed in Patent Document 3 is still in the point that the size of the heat dissipation member is limited to the non-light emitting region in the bottom emission type organic EL panel that emits light from the support substrate side, and the heat dissipation efficiency is improved. There was room for improvement.

  In view of the above-described problems, an object of the present invention is to provide an organic EL panel capable of improving the heat dissipation efficiency of a driver IC in a COG type organic EL panel.

In order to solve the above problems, the present invention provides a support substrate, a light emitting display unit formed by laminating at least a first electrode, an organic light emitting layer, and a second electrode on the support substrate, and the support substrate on the support substrate. A sealing member disposed so as to hermetically cover the light-emitting display unit; and a driver IC mounted on the support substrate alongside the sealing member and applying a driving current between the first and second electrodes; An organic EL panel comprising:
A sealing member disposed on a surface of the sealing member opposite to the surface facing the light emitting display unit; a base portion facing the sealing member; and an extending portion extending from the base portion and facing the driver IC. A first heat dissipation member having
A heat conducting portion disposed between the driver IC and the extending portion, wherein one surface is in contact with the driver IC and the other surface is in contact with the extending portion;
And a heat insulating part provided between the base and the sealing member.

  As described above, according to the present invention, the heat dissipation efficiency of the driver IC can be improved in the COG type organic EL panel.

It is (a) top view and (b) bottom view which show the organic electroluminescent panel which is 1st embodiment of this invention. It is a side view which shows an organic electroluminescent panel same as the above. It is a top view which shows an organic electroluminescent panel same as the above. It is a principal part enlarged view of an organic electroluminescent panel same as the above. It is sectional drawing which shows the organic EL element of an organic EL panel same as the above. It is a side view which shows the organic electroluminescent panel which is 2nd embodiment of this invention. It is a side view which shows the organic electroluminescent panel which is 3rd embodiment of this invention.

Hereinafter, an organic EL panel 100 according to a first embodiment of the present invention will be described with reference to the accompanying drawings. 1 to 3 are overall views of the organic EL panel 100. FIG.
As shown in FIGS. 1 and 2, the organic EL panel 100 includes a support substrate 11, a light emitting display unit 12, a sealing member 13, a driver IC 14, a first heat radiating member 15, a protective film 16, The heat conduction part 17, the circularly-polarizing plate 18, and the 2nd heat radiating member 19 are provided. In addition, in FIG. 2, the protective film 16 and the heat conduction part 17 have shown the cross section. FIG. 3 is a top view of the organic EL panel 100, in which the sealing member 13, the first heat radiating member 15, the protective film 16, and the heat conducting portion 17 are omitted. In FIG. 3, a part of each wiring described later is omitted.

The support substrate 11 is an electrically insulating substrate made of a rectangular transparent glass material. On one surface (the upper surface in FIG. 2) of the support substrate 11, as shown in FIGS. 1 (a) and 2, a light emitting display unit 12 and a driver IC 14 are provided. In addition, a sealing member 13 is disposed on one surface of the support substrate 11 so as to cover the light emitting display unit 12 in an airtight manner, and is opposite to the surface of the sealing member 13 facing the light emitting display unit 12. A first heat radiating member 15 is disposed on the surface (the upper surface in FIG. 2). Further, a protective film 16 is formed on one surface of the support substrate 11 so as to cover the periphery of the driver IC 14 and each wiring to be described later at a place where the sealing member 13 is not provided. Further, a heat conducting portion 17 is disposed between the driver IC 14 and an extended portion 15b described later of the first heat radiating member 15. Further, on one surface of the support substrate 11, as shown in FIG. 3, an anode wiring 21 connected to each anode line of the light emitting display unit 12 described later and a cathode line of the light emitting display unit 12 described later are connected. The cathode wiring 22 and the input wiring 23 for electrically connecting the driver IC 14 to an external circuit are formed.
On the other hand, on the other surface of the support substrate 11 (the surface opposite to the surface on which the driver IC 14 is mounted and the bottom surface in FIG. 2), as shown in FIGS. A circularly polarizing plate 18 and a second heat radiating member 19 are provided side by side.

4 and 5 are enlarged views of main parts of the organic EL panel 100. FIG. In FIG. 4, the sealing member 13 and the first heat radiating member 15 are omitted.
As shown in FIGS. 4 and 5, the light emitting display unit 12 includes a plurality of anode lines (first electrodes) 12a, an insulating film 12b, a partition wall 12c, an organic layer 12d, and a plurality of cathode lines. (Second electrode) 12e, and so-called passive comprising a plurality of light-emitting pixels (organic EL elements) mainly composed of portions where each anode line 12a and each cathode line 12e cross each other and sandwich the organic layer 12d. This is a matrix-type light emitting display portion. The present embodiment is a so-called bottom emission type organic EL panel that emits display light of the light emitting display unit 12 from the support substrate 11 side. Moreover, the light emission display part 12 is airtightly covered with the sealing member 13, as shown in FIG.2 and FIG.5.

  The anode line 12a is made of a light-transmitting conductive material such as ITO. The anode lines 12a are formed so as to be substantially parallel to each other by a photolithography method or the like after the conductive material is formed in layers on the support substrate 11 by means such as vapor deposition or sputtering. Each anode line 12a is connected to each anode wiring 21 on one side of the end (the lower side in FIG. 1).

  The insulating film 12b is made of, for example, a polyimide-based electrically insulating material, and is formed so as to be positioned between the anode line 12a and the cathode line 12e, and prevents a short circuit between the electrode lines 12a and 12e. The insulating film 12b is formed with an opening 12b1 that defines each light emitting pixel and makes the outline clear. The insulating film 12b also extends between the cathode wiring 22 and the cathode line 12e, and has a contact hole 12b2 for connecting each cathode wiring 22 and each cathode line 12e.

  The partition wall 12c is made of, for example, a phenol-based electrically insulating material, and is formed on the insulating film 12b. The partition wall 12c is formed by means such as a photolithography method so that the cross section thereof has a reverse taper shape with respect to the insulating film 12b. A plurality of partition walls 12c are formed at equal intervals in a direction orthogonal to the anode line 12a. The partition wall 12c has a structure in which the organic layer 12d and the cathode line 12e are divided when the organic layer 12d and the cathode line 12e are formed from above by a vapor deposition method, a sputtering method, or the like.

  The organic layer 12d is formed on the anode line 12a and includes at least an organic light emitting layer. In the present embodiment, the organic layer 12d is formed by sequentially laminating a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and an electron injection layer by means such as vapor deposition or sputtering. It is.

  The cathode line 12e is formed of a plurality of metallic conductive materials having higher conductivity than the anode line 12a such as aluminum (Al) and magnesium silver (Mg: Ag) so as to intersect the anode line 12a by means such as vapor deposition. It will be. Each cathode line 12e is connected to each cathode wiring 22 through a contact hole 12b2 provided in the insulating film 12b.

  The sealing member 13 is made of, for example, a glass material molded into a concave shape, and is disposed on the support substrate 11 via an adhesive 13a to store the light emitting display portion 12 in an airtight manner. The sealing member 13 may be flat.

  The driver IC 14 constitutes a drive circuit that drives the light emitting display unit 12 to emit light, and includes a signal line drive circuit, a scanning line drive circuit, and the like. The driver IC 14 is mounted side by side with the sealing member 13 on the support substrate 11 in accordance with the light emitting display unit 12 by a known COG mounting technique, and each anode line 12 a and each cathode line 22 is connected to each anode line 21 and each cathode line 22. It is electrically connected to the cathode line 12e, and a drive current is applied between each anode line 12a and each cathode line 12e based on a drive signal from an external circuit.

  The first heat radiating member 15 is formed by processing a material having a higher thermal conductivity than the material of the support substrate 11 such as copper (Cu) or aluminum (Al) into a flat plate shape. The first heat radiating member 15 is widely arranged in the panel surface direction of the sealing member 13, and the area thereof is at least larger than the area of the sealing member 13, and the base 15 a facing the sealing member 13, Projecting toward the sealing member 13 from the facing surface of the extending portion 15b projecting from the base portion 15a in a direction parallel to the support substrate 11 and the sealing member 13 of the base so as to face the driver IC 14 with a space therebetween. Leg portions 15c and 15d. The leg portions 15c and 15d are provided so as to face the upper end portion and the lower end portion of the sealing member 13, respectively. The first heat dissipating member 15 is arranged (fixed) on the surface opposite to the surface facing the light emitting display portion 12 of the sealing member 13 via an adhesive, a pressure sensitive adhesive sheet, or the like via the leg portions 15c and 15d. The base portion 15 a is disposed on the surface of the sealing member 13 opposite to the surface facing the light emitting display portion 12 so as to face the sealing member 13 with the space S therebetween. The leg portions 15c and 15d are portions for providing a space S between the base portion 15a and the sealing member 13, and the number, shape, and formation position of the leg portions are not limited to the present embodiment, and for example, the sealing member 13 Four legs may be provided so as to face the four corners. The reason why the first heat radiating member 15 is provided in this manner will be described in detail later. Moreover, although the thickness of the 1st heat radiating member 15 is suitably set according to the use of the organic EL panel 100 and the emitted-heat amount of driver IC14, from a viewpoint of suppressing the total thickness as the organic EL panel 100. Is preferably formed as thin as possible.

  The protective film 16 is made of, for example, an electrically insulating material such as a silicone-based resin material. The protective film 16 is disposed on one surface of the support substrate 11 where the sealing member 13 is not disposed and the periphery of the driver IC 14 and wirings 21, described later. 22 and 23 are formed to cover.

  The heat conduction portion 17 is made of a material made of a silicone resin material, an acrylic resin material, or the like, which has a higher thermal conductivity than the material of the support substrate 11, and is particularly excellent in the thermal conductivity in the thickness direction. And is filled so as to fill the gap between the driver IC 14 and the extended portion 15b of the first heat radiation member 15. When filling, the heat conduction portion 17 is deformed along the surface shape including the protruding portion and the inclination of the protective film 16 formed on the periphery of the driver IC 14, and one surface (the bottom surface in FIG. 2) is the upper surface of the driver IC 14. And adheres without gaps. Moreover, the other surface (upper surface in FIG. 2) of the heat conducting portion 17 is in contact with the extending portion 15b. In addition, although the adhesiveness is inferior, the heat conducting part 17 may be a sheet.

  Further, the heat conducting portion 17 is widely arranged in the panel surface direction so as to cover the non-light emitting region of the support substrate 11, and the area is desirably at least larger than the area of the driver IC 14. Specifically, the heat conducting portion 17 is disposed so as to cover at least the area where the driver IC 14 is not mounted on the one surface of the support substrate 11 together with the driver IC 14. In the region where the driver IC 14 on one surface of the support substrate 11 is not mounted, one surface of the heat conduction unit 17 is connected to the support substrate 11 via the protective film 16 so that heat can be transmitted from the support substrate 11. It has become. Further, the entire other surface of the heat conducting portion 17 is in contact with the extending portion 15 b of the first heat radiating member 15, so that heat can be transferred from the whole heat conducting portion 17 to the first heat radiating member 15. .

  The circularly polarizing plate 18 is a plate-like light transmissive member formed by laminating a linearly polarizing plate and a birefringent plate, and suppresses reflection of external light. The circularly polarizing plate 18 is attached to the emission surface side of the support substrate 11 through an adhesive layer (not shown).

  The second heat dissipating member 19 has higher thermal conductivity than the material of the support substrate 11 such as copper (Cu), aluminum (Al), or graphite, and the surface direction thermal conductivity is superior to that of the heat conducting portion 17. It is made of an adhesive sheet obtained by processing a material, and is disposed on the surface of the support substrate 11 opposite to the surface on which the driver IC 14 is mounted so as to face the driver IC 14. In particular, graphite having excellent thermal conductivity in the plane direction is desirable. In the present embodiment, the second heat radiating member 19 is attached to the emission surface side of the support substrate 11. As will be described later, in order to diffuse the heat generated from the driver IC 14 in the panel surface direction, the second heat radiating member 19 is other than the support substrate 11 when the organic EL panel 100 is modularized by being housed in a case. Shall not contact any member. The second heat radiating member 19 is widely arranged in the panel surface direction so as to cover the non-light emitting region of the support substrate 11, and the area is desirably at least larger than the area of the driver IC 14. Further, the thickness of the second heat radiating member 19 is appropriately set according to the use of the organic EL panel 100 and the amount of heat generated by the driver IC 14, but circularly polarized light disposed on the same surface of the support substrate 11. By making it thinner than the plate 18, the total thickness of the organic EL panel 100 can be suppressed, which is preferable.

  The anode wiring 21 is a wiring for connecting the anode line 12a and the driver IC 14, and is made of, for example, a conductive material such as ITO, chromium (Cr), aluminum (Al), or the like, which is the same material as the anode line 12a, or a laminate of these conductive materials. Become. The anode wiring 21 is formed integrally with the anode line 12a on one surface of the support substrate 11, or is formed separately so as to be connected to the anode line 12a.

  The cathode wiring 22 is a wiring that connects the cathode line 12e and the driver IC 14, and is made of, for example, a conductive material such as ITO, chromium (Cr), aluminum (Al), or the like, which is the same material as the anode line 12a, or a laminate of these conductive materials. Become. The cathode wiring 22 is a wiring formed on the side of one side of the support substrate 11 so as to be alternately routed left and right with respect to each cathode line 12e. One end is connected to the cathode line 12e and the other end is connected to the driver IC 14. Is done. As shown in FIG. 4, the cathode wiring 22 has at least an end portion of the cathode line 12e connected to the cathode line 12e via the insulating film 12b so that it can be connected to the cathode line 12e via the contact hole 12b2. It is formed so as to be positioned below.

  The input wiring 23 is a wiring for electrically connecting the driver IC 14 and an external circuit. For example, a conductive material such as ITO, chromium (Cr) or aluminum (Al), which is the same material as the anode line 12a, or these conductive materials. It consists of a laminate of materials. The input wiring 23 is formed around the driver IC 14 on one surface of the support substrate 11, one end is connected to the driver IC 14, and the other end is connected to the FPC (not shown) via the ACF (not shown).

  The organic EL panel 100 is configured by the above-described units.

Next, main heat dissipation paths in the present embodiment will be described. As indicated by the arrows in FIG. 2, the heat generated from the driver IC 14 is first transferred to the heat conducting portion 17 in contact with the driver IC 14 as the first heat dissipation path, and then to the extended portion 15 b of the first heat radiating member 15. Communicated. The heat transmitted to the extended portion 15 b is diffused throughout the first heat radiating member 15 and radiated from the first heat radiating member 15 to the outside. Further, a part of the heat generated from the driver IC 14 is first transmitted into the support substrate 11 as a second heat dissipation path and then transmitted to the second heat dissipation member 19. The heat transmitted to the second heat radiating member 19 is diffused throughout the second heat radiating member 19. Further, the heat diffused throughout the second heat radiating member 19 is radiated to the outside from the second heat radiating member 19 itself, and more than the second heat radiating member 19 at the time of heat diffusion from the second heat radiating member 19. It is transmitted to the entire portion of the support substrate 11 that is at a low temperature and in contact with the second heat radiating member 19. Further, the heat transferred to the support substrate 11 is transmitted to the entire heat conducting portion 17 through the protective film 16, and then transmitted to the extending portion 15 b of the first heat radiating member 15. The heat transmitted to the extended portion 15 b is diffused throughout the first heat radiating member 15 and radiated from the first heat radiating member 15 to the outside.
That is, the heat from the driver IC 14 is transmitted to the first heat radiating member 15 having a large area disposed on the surface of the sealing member 13 through the heat conducting portion 17 in direct contact with the driver IC 14 by the first heat radiating path. Can be efficiently dissipated. In addition, in order to efficiently transfer heat to the first heat radiating member 15 disposed so as to face the driver IC 14 with a space therebetween, heat conduction disposed between the driver IC 14 and the first heat radiating member 15 is performed. Although it is desirable that the portion 16 is a material having excellent thermal conductivity in the thickness direction, generally, a material having excellent thermal conductivity in the thickness direction has a thermal conductivity in the plane direction such as graphite. Inferior to materials with excellent thermal conductivity. On the other hand, the heat from the driver IC 14 is diffused in the surface direction of the support substrate 11 via the second heat radiation path through the second heat radiation member 19 having a thermal conductivity in the surface direction that is superior to that of the heat conduction portion 16. As a result, the heat spot due to the heat generated by the driver IC 14 can be alleviated, and heat can be transmitted to the entire heat conducting portion 17 through the support substrate 11, thereby further improving the heat dissipation efficiency of the driver IC 14. .

  Further, when heat is transmitted to the entire first heat radiating member 15, if the base 15 a and the sealing member 13 are in contact, a part of the heat is transmitted from the first heat radiating member 15 to the sealing member 13. There is a possibility that the temperature of the hermetic space for housing the light emitting display unit 12 rises to accelerate the deterioration of the organic layer 12d and shorten the device life (the light emission luminance is quickly reduced). On the other hand, in this embodiment, since the leg portions 15c and 15d are provided on the first heat radiating member 15 and the space S is formed between the base portion 15a and the sealing member 13, the space S functions as a heat insulating portion. It is possible to suppress heat from being transmitted from the base portion 15a to the sealing member 13. Since heat is transferred from the leg portions 15c and 15d in contact with the sealing member 13, the areas of the leg portions 15c and 15d are desirably as small as possible. At least the areas of the leg portions 15c and 15d are smaller than the area of the space S. Small is desirable.

The organic EL panel 100 includes a support substrate 11, a light emitting display section 12 formed by laminating at least an anode line 12 a, an organic layer 12 d including an organic light emitting layer, and a cathode line 12 e on the support substrate 11, and the support substrate 11. A driving member between the anode line 12a and the cathode line 12e mounted on the support substrate 11 alongside the sealing member 13 disposed so as to cover the light emitting display unit 12 in an airtight manner. A base 15a disposed on a surface opposite to the surface facing the light emitting display portion 12 of the sealing member 13 and overlapping the sealing member 13. And a first heat dissipating member 15 having an extended portion 15b extending from the base portion 15a and facing the driver IC 14; and between the driver IC 14 and the extended portion 15b. Bar IC14 and contact, in which the other surface is a heat-conducting portion 17 in contact with the extended portion 15b, the heat insulating unit provided between the base portion 15a and the sealing member 13 (the space S), and includes a.
Thereby, the heat from the driver IC 14 can be transmitted to the first heat radiating member 15 via the heat conducting portion 17 that is in direct contact with the driver IC 14, and heat can be efficiently radiated. Further, in the bottom emission type organic EL panel 100, since the first heat radiating member 15 is disposed by using the surface of the sealing member 13 which is not the light emitting surface, the heat radiating structure is not complicated, and the organic EL panel 100 is not complicated. It can suppress that the whole enlarges. Further, by providing a heat insulating portion (space S) between the base portion 15 a and the sealing member 13, it is possible to suppress the heat of the first heat radiating member 15 from being transmitted to the sealing member 13.

The first heat radiating member 15 includes leg portions 15c and 15d that protrude from the base portion 15a toward the sealing member 13 and are disposed on the surface opposite to the surface facing the light emitting display portion 12 of the sealing member 13. Have
A space S is provided between the base portion 15a and the sealing member 13 as the heat insulating portion.
Thereby, a heat insulation part can be easily provided by the shape of the 1st heat radiating member 15. FIG.

  Next, a second embodiment of the present invention will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the same or equivalent part as the above-mentioned embodiment, and the detailed description is abbreviate | omitted.

  FIG. 6 is a side view of the organic EL panel 200 according to the present embodiment. The main feature of the organic EL panel 200 is that the sealing member 13 has projecting portions 13b and 13c that project from the surface opposite to the surface facing the light emitting display portion 12 toward the base portion 15a of the first heat radiating member 15. The space S is provided between the base portion 15a and the sealing member 13 as a heat insulating portion. The protruding portions 13b and 13c are provided so as to protrude from the upper end portion (right end portion in FIG. 6) and the lower end portion (left end portion in FIG. 6) of the sealing member 13, respectively. The first heat dissipating member 15 has a surface facing the light emitting display portion 12 of the sealing member 13 by disposing (fixing) a part of the base portion 15a on the protruding portions 13b and 13c via an adhesive or an adhesive sheet. A base portion 15 a is disposed on the opposite surface so as to face the sealing member 13 with a space S therebetween. The protruding portions 13b and 13c are portions for providing a space S between the base portion 15a of the first heat radiating member 15 and the sealing member 13, and the number, shape, and forming position of the protruding portions are limited to the present embodiment. For example, you may provide four protrusion parts so that it may protrude from the four corners of the sealing member 13, for example. In addition, since heat is transmitted from the base 15a to the protrusions 13b and 13c in contact with the sealing member 13, it is desirable that the areas of the protrusions 13b and 13d be as small as possible, and at least the areas of the protrusions 13b and 13c are at least in the space S. Desirably smaller than the area.

  According to the organic EL panel 200, the heat of the first heat radiating member 15 can be prevented from being transmitted to the sealing member 13 as in the above-described embodiment. Further, the heat insulating portion can be easily provided depending on the shape of the sealing member 13.

  Next, a third embodiment of the present invention will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the same or equivalent part as the above-mentioned embodiment, and the detailed description is abbreviate | omitted.

  FIG. 7 is a side view of the organic EL panel 300 according to the present embodiment. The main feature of the organic EL panel 300 is that the heat insulating material 20 is disposed as a heat insulating portion between the sealing member 13 and the base portion 15a of the first heat radiating member 15.

  The heat insulating material 20 is made of a low thermal conductivity member having a thermal conductivity lower than that of at least the material of the support substrate 11 such as a vacuum thermal insulation sheet or silica aerogel (desirably having a thermal conductivity equal to or lower than that of air). The heat insulating material 20 is disposed on the surface opposite to the surface facing the light emitting display portion 12 of the sealing member 13 via an adhesive, an adhesive sheet, or the like. Moreover, the 1st heat radiating member 15 arrange | positions the base part 15a to the heat insulating material 20 via an adhesive agent or an adhesive sheet, and is on the opposite side to the surface facing the light emission display part 12 of the sealing member 13. A base portion 15 a is disposed on the surface so as to face the sealing member 13 across the heat insulating material 20. The heat insulating material 20 itself has adhesiveness, and the heat insulating material 20 is fixed on the sealing member 13 without requiring an adhesive or the like, and the first heat radiating member 15 is fixed on the heat insulating material 20. May be.

  According to the organic EL panel 200, the heat of the first heat radiating member 15 can be prevented from being transmitted to the sealing member 13 as in the above-described embodiment. Moreover, there is no part which the base 15a and the sealing member 13 connect, and it can suppress the transmission of the heat to the sealing member 13 more efficiently.

  The present invention is suitable for a COG type organic EL panel.

100, 200, 300 Organic EL panel 11 Support substrate 12 Light-emitting display portion 12a Anode line (first electrode)
12b Insulating film 12c Partition 12d Organic layer 12e Cathode line (second electrode)
13 Sealing member 14 Driver IC
DESCRIPTION OF SYMBOLS 15 1st heat radiating member 15a Base 15b Extension part 15c, 15d Leg part 16 Protective film 17 Thermal conduction part 18 Circularly polarizing plate 19 2nd heat radiating member 20 Heat insulating material (heat insulating part)
21 Anode wiring 22 Cathode wiring 23 Input wiring S Space (heat insulation part)

Claims (4)

A support substrate, a light-emitting display unit formed by laminating at least a first electrode, an organic light-emitting layer, and a second electrode on the support substrate; and a light-emitting display unit disposed on the support substrate so as to hermetically cover the light-emitting display unit. An organic EL panel comprising: a sealing member provided; and a driver IC mounted on the support substrate alongside the sealing member and applying a driving current between the first and second electrodes. ,
A sealing member disposed on a surface of the sealing member opposite to the surface facing the light emitting display unit; a base portion facing the sealing member; and an extending portion extending from the base portion and facing the driver IC. A heat dissipating member having
A heat conducting portion disposed between the driver IC and the extending portion, wherein one surface is in contact with the driver IC and the other surface is in contact with the extending portion;
An organic EL panel comprising: a heat insulating portion provided between the base portion and the sealing member. The heat dissipation member has a leg portion that protrudes from the base portion toward the sealing member and is disposed on a surface opposite to the surface facing the light emitting display portion of the sealing member,
The organic EL panel according to claim 1, wherein a space is provided as the heat insulating portion between the base portion and the sealing member. The sealing member has a protruding portion that protrudes from the surface opposite to the surface facing the light emitting display portion toward the base portion of the heat dissipation member,
The organic EL panel according to claim 1, wherein a space is provided as the heat insulating portion between the base portion and the sealing member.   The organic EL panel according to claim 1, wherein a heat insulating material is disposed as the heat insulating portion between the sealing member and the base portion of the heat radiating member.

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