CN110176550B - Preparation method of packaging cover plate, display panel and display device - Google Patents

Preparation method of packaging cover plate, display panel and display device Download PDF

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Publication number
CN110176550B
CN110176550B CN201910527303.1A CN201910527303A CN110176550B CN 110176550 B CN110176550 B CN 110176550B CN 201910527303 A CN201910527303 A CN 201910527303A CN 110176550 B CN110176550 B CN 110176550B
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cathode layer
layer
bulges
substrate
facing
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CN110176550A (en
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陈薇
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H10K50/824—Cathodes combined with auxiliary electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

The application provides a preparation method of encapsulation apron, display panel and display device, is applied to display panel, display panel still include with the encapsulation apron is to the display substrate of box setting, be formed with pixel definition layer and cathode layer on the display substrate, the encapsulation apron includes: a substrate; a transparent heat conducting layer and an auxiliary cathode layer which are arranged on the substrate in a stacked manner; the auxiliary cathode layer is provided with a plurality of discontinuous first bulges facing the cathode layer, and one surface of each first bulge facing the cathode layer is exposed and is used for being electrically contacted with the cathode layer on the pixel defining layer, so that the problems that the OLED device is influenced by temperature, the edge of an OLED screen is yellow, and the periphery of the OLED screen is dark are solved.

Description

Preparation method of packaging cover plate, display panel and display device
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a method for manufacturing a package cover plate, a display panel, and a display device.
Background
With the vigorous development of display technology, Organic Light Emitting Diode (OLED) is increasingly used in the high performance display field as a current type Light Emitting device due to its characteristics of self-luminescence, fast response, wide viewing angle and flexible display.
In the conventional OLED device, the light-emitting material layer is arranged between the anode and the cathode and is easily influenced by temperature, so that the edge of an OLED screen is yellow, the periphery of the OLED screen is darkened, and the service life of the OLED device is further influenced.
Disclosure of Invention
The application provides a preparation method of an encapsulation cover plate, the encapsulation cover plate, a display panel and a display device, and aims to solve the problems that the edge of an OLED screen is yellow and the periphery of the OLED screen is dark due to the fact that an OLED device is affected by temperature.
In order to solve the above problem, the present application discloses a package cover plate, which is applied to a display panel, the display panel further includes a display substrate disposed opposite to the package cover plate, a pixel defining layer and a cathode layer are formed on the display substrate, and the package cover plate includes:
a substrate;
a transparent heat conducting layer and an auxiliary cathode layer which are arranged on the substrate in a stacked manner;
the auxiliary cathode layer is provided with a plurality of discontinuous first bulges facing the cathode layer, and one surface of each first bulge facing the cathode layer is exposed and is used for electrically contacting with the cathode layer on the pixel defining layer.
Optionally, the transparent heat conducting layer is located between the auxiliary cathode layer and the substrate, the transparent heat conducting layer has a plurality of discontinuous second protrusions facing the cathode layer, the first protrusions wrap sidewalls of the second protrusions, and a surface of the first protrusions facing the cathode layer is used for contacting with the cathode layer located on the pixel defining layer.
Optionally, the auxiliary cathode layer is located between the transparent heat conducting layer and the substrate, the transparent heat conducting layer has a plurality of discontinuous second protrusions facing the cathode layer, the second protrusions wrap the side walls of the first protrusions, and one surface of the second protrusions facing the cathode layer is exposed and is used for contacting with the cathode layer located on the pixel defining layer.
In order to solve the above problem, the present application further discloses a method for manufacturing a package cover plate, which is applied to a display panel, the display panel further includes a display substrate disposed in a box-to-box manner with the package cover plate, a pixel defining layer and a cathode layer are formed on the display substrate, and the method for manufacturing the package cover plate includes:
and forming a transparent heat conduction layer and an auxiliary cathode layer which are arranged in a stacking mode on the substrate, wherein the auxiliary cathode layer is provided with a plurality of discontinuous first bulges facing the cathode layer, and one surface, facing the cathode layer, of each first bulge is exposed and is used for being in electric contact with the cathode layer on the pixel defining layer.
Optionally, the step of forming a transparent heat conducting layer and an auxiliary cathode layer stacked on each other on the substrate includes:
forming the transparent heat conduction layer on the substrate in a magnetron sputtering mode;
forming a plurality of discontinuous second bulges on the transparent heat conduction layer in the direction towards the cathode layer in an etching mode;
forming an auxiliary cathode layer on the discontinuous plurality of second protrusions;
and forming a plurality of discontinuous first bulges in the direction of the auxiliary cathode layer facing the cathode layer by adopting an etching mode, wherein the side walls of the second bulges are coated by the first bulges, and one surface of the first bulges facing the cathode layer is used for contacting with the cathode layer positioned on the pixel defining layer.
Optionally, the step of forming a transparent heat conducting layer and an auxiliary cathode layer stacked on each other on the substrate includes:
forming an auxiliary cathode layer on the substrate;
forming a plurality of discontinuous first bulges on the auxiliary cathode layer in the direction towards the cathode layer in an etching mode;
forming the transparent heat conduction layer on the plurality of discontinuous first bulges in a magnetron sputtering mode;
and forming a plurality of discontinuous second bulges in the direction of the transparent heat conduction layer facing the cathode layer by adopting an etching mode, wherein the second bulges cover the side walls of the first bulges, and one surface of the second bulges facing the cathode layer is exposed and is used for contacting with the cathode layer positioned on the pixel defining layer.
In order to solve the above problem, the present application also discloses a display panel including the package cover plate of any one of claims 1 to 3.
In order to solve the above problem, the present application discloses a display device comprising the display panel of claim 7.
Compared with the prior art, the method has the following advantages:
the encapsulation apron of this application includes: the heat conducting layer and the auxiliary cathode layer are stacked on the substrate; the auxiliary cathode layer is provided with a plurality of discontinuous first bulges facing the cathode layer, one surface of the cathode layer is exposed and is used for being positioned on the pixel definition layer to electrically contact the cathode layer, and heat generated in the display panel can be dissipated by arranging the transparent heat conduction layer on the substrate, so that the local heat accumulation in the display panel is avoided, the property of the luminescent material is changed, and the problems of local yellowing and darkening periphery in the display screen are caused.
Of course, it is not necessary for any product to achieve all of the above-described advantages at the same time for practicing the present application.
Drawings
Fig. 1 is a schematic structural diagram of a package cover plate according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram of a package cover plate according to the second embodiment of the present application;
FIG. 3 is a flow chart of a method for manufacturing a package cover according to the third embodiment of the present application;
fig. 4 is a flowchart of a method for manufacturing a package cover according to example four of the present application.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description.
Example one
Referring to fig. 1, a schematic structural diagram of a package cover plate according to a first embodiment of the present application is shown and applied to a display panel.
The display panel further comprises a display substrate 2 which is arranged opposite to the packaging cover plate 1, and an anode layer 3, a pixel defining layer 4, an organic layer 5 and a cathode layer 6 are formed on the display substrate 2.
The package cover plate 1 specifically includes:
a substrate 7.
A transparent heat conductive layer 8 and an auxiliary cathode layer 9 are stacked on the substrate 7.
Wherein the auxiliary cathode layer 9 has a discontinuous plurality of first protrusions 10 thereon towards the cathode layer 6.
One of the implementation modes of the stacking arrangement is as follows:
the transparent heat conducting layer 8 is located between the auxiliary cathode layer 9 and the substrate 7, the transparent heat conducting layer 8 has a plurality of discontinuous second protrusions 11 facing the cathode layer, the first protrusions 10 wrap the side walls of the second protrusions 11, and the side of the first protrusions 10 facing the cathode layer 6 is used for electrically contacting the cathode layer 6 located on the pixel defining layer 4.
The transparent heat-conducting layer material comprises any one of the following materials: beryllium oxide BeO, aluminum nitride AlN, aluminum oxynitride AlON, organic composite materials such as: the composite material of Cellulose Nanofibers (CNFs) and boron nitride nanotubes may also be other materials, and the application is not particularly limited.
Furthermore, the packaging cover plate and the display substrate are attached to complete packaging, and in practical application, the packaging can be performed in a mode that frame sealing glue is coated on the edge of the packaging cover plate, filler glue is filled in the edge of the packaging cover plate, the packaging cover plate and the display substrate are attached to each other after being pre-cured by UV, and particularly, the transparent heat conduction layer and the auxiliary cathode are both in contact with the cathode layer.
In this embodiment, the package cover plate includes: the heat conducting layer and the auxiliary cathode layer are stacked on the substrate; the auxiliary cathode layer is provided with a plurality of discontinuous first bulges facing the cathode layer, one surface of the cathode layer is exposed and is used for being positioned on the pixel definition layer to electrically contact the cathode layer, and heat generated in the display panel can be dissipated by arranging the transparent heat conduction layer on the substrate, so that the local heat accumulation in the display panel is avoided, the property of the luminescent material is changed, and the problems of local yellowing and darkening periphery in the display screen are caused.
Example two
Referring to fig. 2, a schematic structural diagram of a package cover plate according to a second embodiment of the present application is shown and applied to a display panel.
The display panel further comprises a display substrate 2 which is arranged opposite to the packaging cover plate 1, and an anode layer 3, a pixel defining layer 4, an organic layer 5 and a cathode layer 6 are formed on the display substrate 2.
The package cover plate 1 specifically includes:
a substrate 7.
A transparent heat conductive layer 8 and an auxiliary cathode layer 9 are stacked on the substrate 7.
Wherein the auxiliary cathode layer 9 has a discontinuous plurality of first protrusions 10 thereon towards the cathode layer 6.
One of the implementation modes of the stacking arrangement is as follows:
the auxiliary cathode layer 9 is located between the transparent heat conducting layer 8 and the substrate 7, the transparent heat conducting layer 8 has a plurality of discontinuous second protrusions 11 facing the cathode layer, the second protrusions 11 cover the side walls of the first protrusions 10, and one surface of the second protrusions 11 facing the cathode layer 6 is exposed and is used for electrically contacting the cathode layer 6 located on the pixel defining layer 4.
The transparent heat-conducting layer material comprises any one of the following materials: beryllium oxide BeO, aluminum nitride AlN, aluminum oxynitride AlON, organic composite materials such as: the composite material of Cellulose Nanofibers (CNFs) and boron nitride nanotubes may also be other materials, and the application is not particularly limited.
Furthermore, the packaging cover plate and the display substrate are attached to complete packaging, and in practical application, the packaging can be performed in a mode that frame sealing glue is coated on the edge of the packaging cover plate, filler glue is filled in the edge of the packaging cover plate, the packaging cover plate and the display substrate are attached to each other after being pre-cured by UV, and particularly, the transparent heat conduction layer and the auxiliary cathode are both in contact with the cathode layer.
In this embodiment, the package cover plate includes: the heat conducting layer and the auxiliary cathode layer are stacked on the substrate; the auxiliary cathode layer is provided with a plurality of discontinuous first bulges facing the cathode layer, one surface of the cathode layer is exposed and is used for being positioned on the pixel definition layer to electrically contact the cathode layer, and heat generated in the display panel can be dissipated by arranging the transparent heat conduction layer on the substrate, so that the local heat accumulation in the display panel is avoided, the property of the luminescent material is changed, and the problems of local yellowing and darkening periphery in the display screen are caused.
EXAMPLE III
Referring to fig. 3, which shows a schematic flow chart of a manufacturing method of an encapsulation cover plate according to a third embodiment of the present application, and is applied to a display panel, the display panel further includes a display substrate that is paired with the encapsulation cover plate, a pixel defining layer and a cathode layer are formed on the display substrate, and the manufacturing method of the encapsulation cover plate includes:
step 301: a transparent heat conductive layer and an auxiliary cathode layer are formed on a substrate in a stacked arrangement.
The auxiliary cathode layer is provided with a plurality of discontinuous first bulges facing the cathode layer, and one surface of each first bulge facing the cathode layer is exposed and is used for electrically contacting with the cathode layer on the pixel defining layer.
As one of the implementation ways: step 301 comprises the following sub-steps:
substep 3011: and forming the transparent heat conduction layer on the substrate in a magnetron sputtering mode.
And forming the continuous transparent heat conduction layer on the substrate in a magnetron sputtering mode.
The transparent heat-conducting layer material comprises any one of the following materials: beryllium oxide BeO, aluminum nitride AlN, aluminum oxynitride AlON, organic composite materials such as: the composite material of Cellulose Nanofibers (CNFs) and boron nitride nanotubes may also be other materials, and the application is not particularly limited.
Furthermore, the packaging cover plate and the display substrate are attached to complete packaging, and in practical application, the packaging can be performed in a mode that frame sealing glue is coated on the edge of the packaging cover plate, filler glue is filled in the edge of the packaging cover plate, the packaging cover plate and the display substrate are attached to each other after being pre-cured by UV, and particularly, the transparent heat conduction layer and the auxiliary cathode are both in contact with the cathode layer.
Substep 3012: and forming a plurality of discontinuous second bulges in the direction of the transparent heat conduction layer towards the cathode layer by adopting an etching mode.
Substep 3013: forming an auxiliary cathode layer on the discontinuous plurality of second protrusions.
Substep 3014: and forming a plurality of discontinuous first bulges on the auxiliary cathode layer in the direction towards the cathode layer by adopting an etching mode.
The first bulges cover the side walls of the second bulges, and one surface of the first bulges, facing the cathode layer, is used for contacting with the cathode layer positioned on the pixel defining layer.
In this embodiment, the package cover plate includes: the heat conducting layer and the auxiliary cathode layer are stacked on the substrate; the auxiliary cathode layer is provided with a plurality of discontinuous first bulges facing the cathode layer, one surface of the cathode layer is exposed and is used for being positioned on the pixel definition layer to electrically contact the cathode layer, and heat generated in the display panel can be dissipated by arranging the transparent heat conduction layer on the substrate, so that the local heat accumulation in the display panel is avoided, the property of the luminescent material is changed, and the problems of local yellowing and darkening periphery in the display screen are caused.
Example four
Referring to fig. 4, which shows a schematic flow chart of a manufacturing method of an encapsulation cover plate according to a fourth embodiment of the present application, applied to a display panel, the display panel further includes a display substrate disposed in a box-to-box relationship with the encapsulation cover plate, a pixel defining layer and a cathode layer are formed on the display substrate, and the manufacturing method of the encapsulation cover plate includes:
step 401: a transparent heat conductive layer and an auxiliary cathode layer are formed on a substrate in a stacked arrangement.
The auxiliary cathode layer is provided with a plurality of discontinuous first bulges facing the cathode layer, and one surface of each first bulge facing the cathode layer is exposed and is used for electrically contacting with the cathode layer on the pixel defining layer.
As one of the implementation ways: step 401 comprises the following substeps:
substep 4011: an auxiliary cathode layer is formed on the substrate.
Sub-step 4012: and forming a plurality of discontinuous first bulges on the auxiliary cathode layer in the direction towards the cathode layer by adopting an etching mode.
Sub-step 4013: and forming the transparent heat conduction layer on the plurality of discontinuous first bulges in a magnetron sputtering mode.
And forming the continuous transparent heat conduction layer on the substrate in a magnetron sputtering mode.
The transparent heat-conducting layer material comprises any one of the following materials: beryllium oxide BeO, aluminum nitride AlN, aluminum oxynitride AlON, organic composite materials such as: the composite material of Cellulose Nanofibers (CNFs) and boron nitride nanotubes may also be other materials, and the application is not particularly limited.
Sub-step 4014: and forming a plurality of discontinuous second bulges in the direction of the transparent heat conduction layer towards the cathode layer by adopting an etching mode.
The side wall of the first bulge is coated by the second bulge, and one surface, facing the cathode layer, of the second bulge is exposed and is used for being in contact with the cathode layer on the pixel defining layer.
In this embodiment, the package cover plate includes: the heat conducting layer and the auxiliary cathode layer are stacked on the substrate; the auxiliary cathode layer is provided with a plurality of discontinuous first bulges facing the cathode layer, one surface of the cathode layer is exposed and is used for being positioned on the pixel definition layer to electrically contact the cathode layer, and heat generated in the display panel can be dissipated by arranging the transparent heat conduction layer on the substrate, so that the local heat accumulation in the display panel is avoided, the property of the luminescent material is changed, and the problems of local yellowing and darkening periphery in the display screen are caused.
It should be noted that the foregoing method embodiments are described as a series of acts or combinations for simplicity in explanation, but it should be understood by those skilled in the art that the present application is not limited by the order of acts described, as some steps may occur in other orders or concurrently depending on the application. Further, those skilled in the art will also appreciate that the embodiments described in the specification are presently preferred and that no particular act is required to implement the invention.
EXAMPLE five
The application also discloses a display panel comprising the packaging cover plate in the first embodiment and the second embodiment.
The display panel has all the advantages of the package cover plate in the first and second embodiments, and details are not repeated herein.
EXAMPLE six
The application also discloses a display device, which comprises the display substrate in the fifth embodiment.
The display device has all the advantages of the display substrate in the fifth embodiment, and details are not repeated herein.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
As is readily imaginable to the person skilled in the art: any combination of the above embodiments is possible, and thus any combination between the above embodiments is an embodiment of the present application, but the present disclosure is not necessarily detailed herein for reasons of space.
While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.
The above detailed description is given to the manufacturing method of the package cover plate, the display panel and the display device, and a specific example is applied in the description to explain the principle and the implementation of the present application, and the description of the above embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (6)

1. A package cover plate applied to a display panel, the display panel further comprising a display substrate arranged opposite to the package cover plate, a pixel defining layer and a cathode layer formed on the display substrate, the package cover plate comprising:
a substrate;
a transparent heat conducting layer and an auxiliary cathode layer which are arranged on the substrate in a stacked manner;
wherein the auxiliary cathode layer has a discontinuous plurality of first protrusions facing the cathode layer, and one surface of the first protrusions facing the cathode layer is exposed to be electrically contacted with the cathode layer on the pixel defining layer;
the auxiliary cathode layer is located between the transparent heat conduction layer and the substrate, the transparent heat conduction layer is provided with a plurality of discontinuous second bulges facing the cathode layer, the second bulges cover the side walls of the first bulges, and one surface of the second bulges facing the cathode layer is exposed and is used for contacting with the cathode layer located on the pixel defining layer.
2. The encapsulating cover according to claim 1, wherein the transparent thermally conductive layer is located between the auxiliary cathode layer and the substrate, the transparent thermally conductive layer has a plurality of discontinuous second protrusions facing the cathode layer, the first protrusions wrap sidewalls of the second protrusions, and a side of the first protrusions facing the cathode layer is configured to contact the cathode layer located on the pixel defining layer.
3. A preparation method of a package cover plate is applied to a display panel, the display panel further comprises a display substrate arranged in a box-to-box manner with the package cover plate, a pixel defining layer and a cathode layer are formed on the display substrate, and the preparation method of the package cover plate comprises the following steps:
forming a transparent heat conduction layer and an auxiliary cathode layer which are arranged in a stacked mode on a substrate, wherein the auxiliary cathode layer is provided with a plurality of discontinuous first bulges facing the cathode layer, and one surface, facing the cathode layer, of each first bulge is exposed and is used for being in electric contact with the cathode layer on the pixel defining layer;
the step of forming a transparent heat conducting layer and an auxiliary cathode layer stacked on top of each other on a substrate includes:
forming an auxiliary cathode layer on the substrate;
forming a plurality of discontinuous first bulges on the auxiliary cathode layer in the direction towards the cathode layer in an etching mode;
forming the transparent heat conduction layer on the plurality of discontinuous first bulges in a magnetron sputtering mode;
and forming a plurality of discontinuous second bulges in the direction of the transparent heat conduction layer facing the cathode layer by adopting an etching mode, wherein the second bulges cover the side walls of the first bulges, and one surface of the second bulges facing the cathode layer is exposed and is used for contacting with the cathode layer positioned on the pixel defining layer.
4. The method of claim 3, wherein the step of forming the transparent heat conducting layer and the auxiliary cathode layer on the substrate in a stacked arrangement comprises:
forming the transparent heat conduction layer on the substrate in a magnetron sputtering mode;
forming a plurality of discontinuous second bulges on the transparent heat conduction layer in the direction towards the cathode layer in an etching mode;
forming an auxiliary cathode layer on the discontinuous plurality of second protrusions;
and forming a plurality of discontinuous first bulges in the direction of the auxiliary cathode layer facing the cathode layer by adopting an etching mode, wherein the side walls of the second bulges are coated by the first bulges, and one surface of the first bulges facing the cathode layer is used for contacting with the cathode layer positioned on the pixel defining layer.
5. A display panel comprising the cover sheet according to any one of claims 1 to 2.
6. A display device characterized by comprising the display panel according to claim 5.
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