CN110675760A - Display panel and display device - Google Patents
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- CN110675760A CN110675760A CN201910944965.9A CN201910944965A CN110675760A CN 110675760 A CN110675760 A CN 110675760A CN 201910944965 A CN201910944965 A CN 201910944965A CN 110675760 A CN110675760 A CN 110675760A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
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Abstract
The invention provides a display panel and a display device, and relates to the technical field of display. The display panel comprises a substrate, a TFT layer, a light emitting structure layer and a packaging layer which are sequentially stacked; at least one heat dissipation film layer is arranged between the substrate and the packaging layer, and a light hole for light emitted by the light-emitting structure to pass through is formed in the heat dissipation film layer. The display device comprises the display panel. In the invention, the heat dissipation film layer is arranged between the substrate and the packaging layer, so that heat can be conducted to the outside of the display panel through the heat dissipation film layer, and the service life of the display panel is prolonged.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel and a display device.
Background
The display panel has the advantages of low energy consumption, low cost, wide viewing angle, fast response speed, flexible display and the like, and is widely applied to various electronic devices, such as mobile phones, tablet computers and vehicle-mounted display screens.
The display panel generally includes the substrate, the TFT layer, the light emitting structure layer and the encapsulation layer that stack gradually, and display panel is in the use, and self can produce a large amount of heats and the service environment also can transmit the display panel heat simultaneously, and these heats can cause organic light emitting layer in the light emitting structure layer to take place to age, reduce display panel's life-span. In order to guide the heat generated by the display panel during the use process and the heat transferred to the display panel by the use environment to the outside of the display panel, a heat dissipation device is usually disposed outside the display panel, so that the heat generated by the display panel is dissipated through the heat dissipation device.
However, the heat dissipation rate of the above heat dissipation method is slow, so that the heat of the display panel cannot be conducted out in time, and the service life of the display panel is further reduced.
Disclosure of Invention
The embodiment of the invention provides a display panel and a display device, which can conduct heat of the display panel in time and prolong the service life of the display panel.
In order to achieve the above purpose, the embodiment of the present invention adopts the following technical solutions:
in one aspect, an embodiment of the present invention provides a display panel, including a substrate, a TFT layer, a light emitting structure layer, and an encapsulation layer, which are sequentially stacked; at least one heat dissipation film layer is arranged between the substrate and the packaging layer, and a light hole for light emitted by the light emitting structure layer to pass through is formed in the heat dissipation film layer.
The display panel as described above, wherein the light emitting structure layer includes a plurality of light emitting units, and the heat dissipation film layer is provided with a plurality of light holes corresponding to the light emitting units one to one.
The display panel as described above, wherein the heat dissipation film layer includes a plurality of first heat dissipation portions and a plurality of second heat dissipation portions arranged in a criss-cross manner, and the plurality of first heat dissipation portions and the plurality of second heat dissipation portions enclose the plurality of light holes.
The display panel as described above, wherein the heat dissipation film is a metal heat dissipation layer.
The display panel as described above, wherein the light hole is a through hole or a transparent region in the metal heat dissipation layer.
The display panel as described above, wherein the heat dissipation film layer is disposed between the TFT layer and the light emitting structure layer, or the heat dissipation film layer is disposed between the TFT layer and the substrate, or the TFT layer includes a plurality of functional film layers stacked one on another, and the heat dissipation film layer is disposed between the adjacent functional film layers.
The display panel comprises at least two heat dissipation film layers, and any two adjacent heat dissipation film layers are arranged at intervals.
The display panel as described above, wherein the projections of the heat dissipation film layers on the substrate overlap, or
Each heat dissipation film layer comprises a plurality of first heat dissipation parts and a plurality of second heat dissipation parts which are arranged in a criss-cross mode, in any two adjacent heat dissipation film layers, the projections of the first heat dissipation parts on the substrate are not overlapped, and the projections of the second heat dissipation parts on the substrate are not overlapped; preferably, in any two adjacent heat dissipation film layers, a plurality of the first heat dissipation parts and a plurality of the second heat dissipation parts enclose a plurality of the light holes.
The display panel as described above, wherein the display panel further includes a heat conductive layer disposed on a side of the TFT layer, the heat conductive layer being in contact with the heat dissipation film layer; preferably, the thermally conductive layer is continuously disposed on at least two sides of the TFT layer.
Another aspect of the embodiments of the present invention provides a display device, including the display panel as described above.
In the display panel provided by the embodiment of the invention, the heat dissipation film layer is arranged between the substrate and the TFT layer, between the TFT layer and the light emitting structure layer, and/or between the light emitting structure layer and the encapsulation layer, and the heat dissipation film layer is provided with the light holes for light emitted by the light emitting structure layer to pass through, so that light normally displayed by the display panel can pass through the heat dissipation film layer, and the display effect of the display panel is ensured. Meanwhile, the heat dissipation film layer can be used for transferring the heat inside the display panel to the outside of the display panel, so that the heat is prevented from accumulating in the display panel, the aging of each film layer in the display panel is reduced, and the service life of the display panel is prolonged.
In addition to the technical problems solved by the embodiments of the present invention, the technical features constituting the technical solutions, and the advantages brought by the technical features of the technical solutions described above, other technical problems that can be solved by the display panel and the display device provided by the embodiments of the present invention, other technical features included in the technical solutions, and advantages brought by the technical features will be further described in detail in the detailed description.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
fig. 2 is a layout diagram of a heat-dissipating film layer and a heat-conducting layer according to an embodiment of the present invention;
fig. 3 is another layout diagram of a heat dissipation film layer and a heat conduction layer according to an embodiment of the present invention.
Description of reference numerals:
10: a substrate;
20: a TFT layer;
30: a light emitting structure layer;
40: a packaging layer;
50: a heat dissipation film layer;
501: a first heat sink portion;
502: a second heat sink member;
503: a light-transmitting hole;
60: a thermally conductive layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.
The embodiments and features of the embodiments of the present invention may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
The heat in the display panel generally originates from two aspects: on the one hand, the display panel displays heat generated during the process, and on the other hand, the display panel absorbs external heat, such as heat irradiated by sunlight.
The heat may cause various aging of the layers of the display panel, which may reduce the lifetime of the display panel. In order to guide the heat generated by the display panel during the use process and the heat transferred to the display panel by the use environment to the outside of the display panel, a heat dissipation device is usually disposed outside the display panel, so that the heat generated by the display panel is dissipated through the heat dissipation device.
However, in the above heat dissipation method, the heat dissipation device is disposed outside the display panel, and the heat generated by the display panel needs to be transferred to the heat dissipation device through the film layers of the display panel, and then is conducted out of the display panel through the heat dissipation device, and in the transfer process, the following defects exist: the heat is accumulated on the display panel before being conducted to the outside of the display panel, that is, the heat dissipation device located outside the display panel has a certain hysteresis to the heat dissipation outside the display panel, so that each film layer of the display panel still has a high aging risk, and the service life of the display panel is affected.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention; fig. 2 is a layout diagram of a heat-dissipating film layer and a heat-conducting layer according to an embodiment of the present invention; fig. 3 is another layout diagram of a heat dissipation film layer and a heat conduction layer according to an embodiment of the present invention.
Referring to fig. 1 to 3, an embodiment of the invention provides a display panel, which includes a substrate 10, a TFT layer 20, a light emitting structure layer 30, and an encapsulation layer 40, which are sequentially stacked; at least one heat dissipation film layer 50 is disposed between the substrate 10 and the encapsulation layer 40, and a light hole 503 through which light emitted from the light emitting structure layer 30 passes is disposed in the heat dissipation film layer 50.
The display panel can be applied to various electronic devices, such as: the mobile phone, the tablet computer or the vehicle-mounted display screen. The display panel may be an OLED display panel, an LED display panel, a micro LED display panel, or an LCD display panel.
When the display panel is applied to the vehicle-mounted display screen, the heat generated by the display panel is derived from the heat generated by the display panel and the heat generated by the sunlight irradiating the display panel.
As shown in fig. 1, the display panel may include a substrate 10, a TFT layer 20, a light emitting structure layer 30, and an encapsulation layer 40, wherein the substrate 10 serves as a carrier of the display panel for supporting devices disposed thereon, and the material of the substrate may be selected from various materials, for example, the substrate 10 may be a rigid substrate, such as a glass substrate, a plastic substrate, or a flexible substrate, such as a polyimide substrate.
The TFT layer 20 is a functional layer located above the substrate 10, and may include a plurality of functional film layers stacked to implement different functions of the display panel.
The light emitting structure layer 30 may include, in order from top to bottom, a cathode layer, an electron injection layer, an electron transport layer, an organic light emitting layer, a hole transport layer, a hole injection layer, and an anode layer, wherein the organic light emitting layer may include a plurality of light emitting units for emitting light. The cathode layer is used for generating electrons, the electrons enter the organic light-emitting layer through the electron injection layer and the electron transport layer, the anode layer is used for generating holes, the holes enter the organic generation layer through the hole transport layer and the hole injection layer, and the electrons and the holes are combined in the organic light-emitting layer to emit light.
The packaging layer 40 is located above the light-emitting structure layer 30, the packaging layer 40 and the substrate 10 can be connected through packaging glue, the packaging layer 40 is used for packaging the TFT layer 20 and the light-emitting structure layer 30, water, oxygen and the like are prevented from entering the TFT layer and the light-emitting structure layer, and reliable work of the display panel is guaranteed.
In order to ensure that the heat in the display panel is conducted out in time, at least one heat dissipation film layer 50 is disposed between the substrate 10 and the encapsulation layer 40, wherein the number of the heat dissipation film layers 50 can be selected from various options, such as: when the heat dissipation film layer 50 is a single layer, the heat dissipation film layer 50 may be disposed between the substrate 10 and the TFT layer 20, between the TFT layer 20 and the light emitting structure layer 30, or between the light emitting structure layer 30 and the encapsulation layer 40. For another example: when the number of the heat dissipation film layers 50 is two, the heat dissipation film layers 50 may be disposed between the substrate 10 and the TFT layer 20 and between the TFT layer 20 and the light emitting structure layer 30, or between the substrate 10 and the TFT layer 20 and between the light emitting structure layer 30 and the encapsulation layer 40, or between the TFT layer 20 and the light emitting structure layer 30 and between the light emitting structure layer 30 and the encapsulation layer 40.
Or else: when the number of the heat dissipation film layers 50 is three, the heat dissipation film layers 50 are disposed between the substrate 10 and the TFT layer 20, between the TFT layer 20 and the light emitting structure layer 30, and between the light emitting structure layer 30 and the encapsulation layer 40.
The heat dissipation film layer 50 is provided therein with a light transmission hole 503 through which light emitted from the light emitting structure layer 30 passes. It is understood that the number of the light holes 503 in the heat dissipation film 50 can be selected, for example, one light hole 503 is disposed in the heat dissipation film 50, and all the light emitting units in the display panel are located in the light hole 503, so that the light emitted by each light emitting unit can be emitted from the light hole 503. For another example, the number of the light holes 503 is plural, the number of the light holes 503 may be smaller than the number of the light emitting units or larger than the number of the light emitting units, and when the number of the light holes 503 is smaller than the number of the light emitting units, the light emitted by two or more light emitting units may be emitted from one light hole 503. Or, when the number of the light holes 503 is the same as the number of the light emitting units, the light emitted by each light emitting unit is emitted from the corresponding light hole 503, thereby ensuring the normal display function of the display panel.
When the display panel is in the use, the display panel can emit heat, or, when the display panel is placed in a high-temperature environment, for example, the heat of sunlight can be transmitted to the display panel, the heat of the two forms can be transmitted to the display panel in time by utilizing the heat dissipation film layer 50, so that the heat is prevented from accumulating in the display panel, the aging of each film layer in the display panel is reduced, and the service life of the display panel is prolonged.
In an alternative embodiment, the light emitting structure layer 30 includes a plurality of light emitting units, and the heat dissipation film layer 50 has a plurality of light holes 503 corresponding to the light emitting units.
Can set up a plurality of light trap 503 on the heat dissipation rete 50, the number of light trap 503 is the same with the number of luminescence unit for the light that every luminescence unit produced is launched from the light trap 503 that corresponds, can guarantee that display panel in time dispels the heat and can guarantee display panel's luminous function again.
In a possible embodiment, the heat dissipation film layer 50 includes a plurality of first heat dissipation parts 501 and a plurality of second heat dissipation parts 502 arranged in a criss-cross manner, and the plurality of first heat dissipation parts 501 and the plurality of second heat dissipation parts 502 surround a plurality of light holes 503.
The heat dissipation film layer 50 can be prepared by the following method: firstly, forming a whole heat dissipation layer in a sputtering, evaporation or vapor deposition mode, wherein the whole heat dissipation layer can be formed on a substrate, a TFT layer 20 and a light-emitting structure layer; then, a plurality of first heat dissipation portions 501 and a plurality of second heat dissipation portions 502 arranged in a criss-cross manner are formed through processes such as masking, exposure, development, etching, and the like, and the plurality of first heat dissipation portions 501 and the plurality of second heat dissipation portions 502 constitute the heat dissipation film layer 50.
But not limited thereto, the heat dissipation film layer 50 can also be prepared as follows: first, a plurality of first heat dissipation strips which are arranged transversely are formed on the substrate, the TFT layer 20 and the light emitting structure layer, and the first heat dissipation strips are parallel to each other, and may be formed by sputtering, evaporation or vapor deposition. Then, a plurality of second heat dissipation bars are formed on the substrate, the TFT layer 20, and the light emitting structure layer, and the second heat dissipation bars are arranged in parallel with each other, and the second heat dissipation bars are formed in the same manner as or similar to the first heat dissipation bars. The plurality of first heat dissipation strips and the plurality of second heat dissipation strips which are staggered transversely and longitudinally form a latticed heat dissipation film layer 50, wherein the first heat dissipation strips are the first heat dissipation portions 501, and the second heat dissipation strips are the second heat dissipation portions 502.
In the display panel, there may be a case where the heat amount of a certain region is higher than that of another region, and when this is the case, the density of the first heat sink member 501 and the second heat sink member 502 in the region where the heat amount is high may be changed, or the width of the first heat sink member 501 and the width of the second heat sink member 502 in the region may be increased, so that the area of the heat dissipation film layer 50 in the region may be increased, the contact area between the heat dissipation film layer 50 and the element having a high heat generation amount may be increased, and the heat dissipation in the region may be accelerated.
In order to ensure the heat dissipation efficiency of the heat dissipation film layer 50, the heat dissipation film layer 50 is usually made of a material with high thermal conductivity, such as a metal or an alloy, and the heat dissipation film layer 50 may be a metal heat dissipation layer in this embodiment. The metal heat dissipation layer has high thermal conductivity, so that heat in the display panel can be quickly conducted out, the aging of the display panel is avoided, and the service life of the display panel is reduced. Wherein, the material of metal heat dissipation layer can be selected according to the actual condition, for example: silver, copper, gold, aluminum, and the like.
In order to ensure the light transmittance of the light hole 503, the light hole 503 may be a through hole or a transparent region in the metal heat dissipation layer. Wherein, the through hole can be a square hole, a round hole, a trapezoidal hole or other polygonal holes; the transparent region may be a light-transmitting region formed by performing a special process on a predetermined region of the metal heat dissipation layer, or a transparent region formed by filling a transparent material in the region, such as a transparent resin.
In a possible embodiment, the heat dissipation film layer 50 is disposed between the TFT layer 20 and the light emitting structure layer 30, or the heat dissipation film layer is disposed between the TFT layer 20 or the substrate 10, or the TFT layer 20 includes a plurality of functional film layers stacked and disposed between any adjacent functional film layers.
When the heat dissipation film layer 50 is one layer, the heat dissipation film layer can have three kinds of arrangement modes, firstly, the heat dissipation film layer 50 can be arranged between the TFT layer 20 and the light emitting structure layer 30, so that when the heat generated by the TFT layer 20 and the light emitting structure layer 30 can be conducted out through the heat dissipation film layer 50, the wires on the TFT layer can be connected with the light emitting structure layer after penetrating through the light holes 503, and the signal transmission between the TFT layer 20 and the light emitting structure layer 30 is realized.
Secondly, the heat dissipation film layer may be disposed between the TFT layer 20 or the substrate 10, so that the heat dissipation film layer 50 may conduct heat in the display panel to the outside of the display panel, and the heat dissipation film layer 50 may not block light generated by each light emitting unit from being emitted from the encapsulation layer 40.
Thirdly, the heat dissipation film layer 50 may be disposed in the TFT layer 20, because the TFT layer 20 generally includes a plurality of functional film layers, wherein the functional film layers may include a buffer layer, an active layer, a gate insulating layer, a gate electrode layer, an inter-gate insulating layer, a source/drain electrode layer, and a planarization layer, and in order to rapidly conduct heat between the plurality of functional film layers to the outside of the display panel, a heat dissipation film layer 50 may be disposed between two adjacent functional film layers.
In one possible embodiment, the display panel includes at least two heat dissipation film layers 50, and any two adjacent heat dissipation film layers 50 are disposed at an interval.
In order to ensure the heat dissipation capability of the display panel and improve the service life of the display panel, the heat dissipation film layer 50 is at least two layers, and when the heat dissipation film layer 50 is two layers, the arrangement mode thereof can be selected variously, for example, the two layers of heat dissipation film layers 50 can be arranged between the substrate 10 and the TFT layer 20 and between the TFT layer 20 and the light emitting structure layer 30, so that the heat dissipation film layer 50 between the substrate 10 and the TFT layer 20 can conduct a part of heat in the TFT layer to the outside of the display panel, and the heat dissipation film layer 50 between the TFT layer 20 and the light emitting structure layer 30 can conduct the heat in the light emitting structure layer 30 and another part of heat in the TFT layer to the outside of the display panel, and through the arrangement of the two layers of heat dissipation film layers 50, the heat in the display panel can be conducted to the outside of the display panel rapidly, thereby avoiding the aging of the display panel and reducing.
As another example, a heat dissipation film 50 may be disposed between the substrate 10 and the TFT layer 20, and another heat dissipation film layer may be disposed within the TFT layer 20, i.e., between two functional film layers of the TFT layer 20.
Further, one heat dissipation film layer 50 is disposed between the TFT layer 20 and the light emitting structure layer 30, and another heat dissipation film layer 50 may be disposed within the TFT layer 20, i.e., between two functional film layers of the TFT layer 20.
When the number of the heat dissipation film layers 50 is greater than two, the arrangement manner is similar to the above description as long as the adjacent heat dissipation film layers 50 are arranged at intervals.
It can be understood that, because there are several regions with high heat productivity in the display panel, for example, the anode in the light emitting structure layer, each functional layer of the TFT layer, and the conducting wire for connecting the light emitting structure layer and the TFT layer, in the actual manufacturing process, the heat dissipation film layer 50 can be disposed below or around these regions to ensure that the heat can be quickly conducted to the outside of the display panel, so as to avoid the heat accumulating in the display panel and reduce the service life of the display panel.
In a possible specific embodiment, projections of the heat dissipation film layers 50 on the substrate 10 overlap, or each of the heat dissipation film layers 50 includes a plurality of first heat dissipation parts 501 and a plurality of second heat dissipation parts 502 arranged in a criss-cross manner, in any two adjacent heat dissipation film layers 50, projections of the first heat dissipation parts 501 on the substrate 10 do not overlap, and projections of the second heat dissipation parts 502 on the substrate 10 do not overlap; preferably, in any two adjacent heat dissipation film layers 50, the plurality of first heat dissipation parts 501 and the plurality of second heat dissipation parts 502 enclose the plurality of light transmission holes 503.
Each layer of heat dissipation film layer 50 includes a plurality of first heat dissipation portions 501 and a plurality of second heat dissipation portions 502 arranged in a criss-cross manner, the plurality of first heat dissipation portions 501 and the plurality of second heat dissipation portions 502 form a grid shape, and the shape of the grid is affected by the distance between any two adjacent first heat dissipation portions 501 and any two adjacent second heat dissipation portions 502.
When the mesh shapes of the heat dissipation film layers 50 are the same, the projections of the heat dissipation film layers 50 on the substrate 10 overlap.
When the mesh shapes of the heat dissipation film layers 50 are different, the projections of the heat dissipation film layers 50 on the substrate do not overlap, and the number of the heat dissipation film layers 50 is two, for example, the present embodiment is explained, for example: when the first heat dissipation part is located on the left side of the display panel, the distance from the first heat dissipation part to the left side of the display panel is greater than or less than, and the second heat dissipation part is located on the left side of the display panel, the projections of the first heat dissipation part on the substrate do not overlap.
For another example, in two heat dissipation film layers, the distance between any two first heat dissipation parts 501 and the distance between any two second heat dissipation parts 502 may be different, and the sizes of the meshes formed in this way are also different, so that the projections of the first heat dissipation parts 501 on the substrate do not overlap, and the projections of the second heat dissipation parts 502 on the substrate do not overlap.
When the shape of two-layer heat dissipation rete was inconsistent, be convenient for come the position or the width of reasonable setting first heat dissipation part, second heat dissipation part according to the heat dissipation part position of reality, guarantee that the heat in the display panel conducts outside display panel fast.
In one possible embodiment, the display panel further includes a heat conductive layer 60 disposed on the side of the TFT layer 20, the heat conductive layer 60 being in contact with the heat dissipation film layer 50, preferably, the heat conductive layer is disposed continuously on at least two sides of the TFT layer.
To illustrate the example of the heat dissipation film layer 50 disposed between the TFT layer and the light emitting structure layer, the shape of the heat conduction layer 60 may be a rectangular heat dissipation strip, and the number of the heat conduction layers 60 may be selected from various options, such as: when the number of the heat conduction layers is one, the heat conduction layer 60 may be disposed on the left side surface of the TFT layer 20, and the heat conduction layer 60 is further connected to the heat dissipation film layer 50, so as to conduct heat on the heat dissipation film layer 50 to the outside of the display panel. For another example, when the number of the heat conduction layers 60 is four, the four heat conduction layers may be attached to four sides of the TFT layer 20 along the circumferential direction of the TFT layer 20, and the heat conduction layers 60 are in contact with the heat dissipation film layer 50 to quickly conduct heat to the outside of the display panel.
But not limited thereto, the heat conductive layer 60 may be formed on the upper surface of the TFT layer 20 by sputtering, evaporation or vapor deposition.
In addition, the heat conduction layer 60 can also be arranged on the side surface of the whole display panel, so that the heat conduction layer 60 can be in direct contact with the substrate 10, the TFT layer 20, the light emitting structure layer 30, the encapsulation layer 40 and the heat dissipation film layer 50, the diffusion speed of heat in the display panel is increased, the aging of the display panel is avoided, and the service life of the display panel is shortened. In this embodiment, the arrangement of the heat conductive layer 60 is the same as the arrangement in which the heat conductive layer 60 is provided on the side of the TFT layer 20, and the description of this embodiment is omitted. In order to ensure the heat conduction rate of the heat conduction layer, the heat conduction layer 60 may be a metal heat conduction layer, and the material of the heat conduction layer may be any one of silver, copper, gold, and aluminum with high conductivity.
An embodiment of the present invention further provides a display device, which includes the display panel in any of the above embodiments, where the display device in the embodiment of the present invention may be a mobile phone, a tablet computer, or a vehicle-mounted display screen.
It can be understood that, when display panel used vehicle-mounted display screen, heat-conducting layer 60 can be connected with external air cooling equipment or water cooling equipment, and outside exporting display panel's heat to display panel fast, reduce vehicle-mounted display screen's temperature, promote vehicle-mounted display screen's temperature resistance and life.
In the display device of the embodiment of the invention, the heat dissipation speed of the display device is improved by combining the heat dissipation film layer 50 inside the display panel and the heat conduction layer 60 positioned outside the display panel, so that the service life of the display device is prolonged.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description above, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A display panel is characterized by comprising a substrate, a TFT layer, a light emitting structure layer and an encapsulation layer which are sequentially stacked;
at least one heat dissipation film layer is arranged between the substrate and the packaging layer, and a light hole for light emitted by the light emitting structure layer to pass through is formed in the heat dissipation film layer.
2. The display panel according to claim 1, wherein the light emitting structure layer comprises a plurality of light emitting units, and a plurality of light holes corresponding to the light emitting units are disposed in the heat dissipation film layer.
3. The display panel according to claim 2, wherein the heat dissipation film layer comprises a plurality of first heat dissipation parts and a plurality of second heat dissipation parts arranged in a criss-cross manner, and the plurality of first heat dissipation parts and the plurality of second heat dissipation parts enclose the plurality of light-transmitting holes.
4. The display panel according to any one of claims 1 to 3, wherein the heat dissipation film is a metal heat dissipation layer.
5. The display panel of claim 4, wherein the light hole is a through hole or a transparent region in the metal heat dissipation layer.
6. The display panel according to claim 1, wherein the heat dissipation film layer is provided between the TFT layer and the light emitting structure layer, or the heat dissipation film layer is provided between the TFT layer and the substrate, or the TFT layer includes a plurality of functional film layers stacked, and the heat dissipation film layer is provided between adjacent functional film layers.
7. The display panel of claim 1, wherein the display panel comprises at least two heat dissipation film layers, and any two adjacent heat dissipation film layers are disposed at intervals.
8. The display panel according to claim 7, wherein projections of the heat dissipation film layers on the substrate overlap, or
Each heat dissipation film layer comprises a plurality of first heat dissipation parts and a plurality of second heat dissipation parts which are arranged in a criss-cross mode, in any two adjacent heat dissipation film layers, the projections of the first heat dissipation parts on the substrate are not overlapped, and the projections of the second heat dissipation parts on the substrate are not overlapped;
preferably, in any two adjacent heat dissipation film layers, a plurality of the first heat dissipation parts and a plurality of the second heat dissipation parts enclose a plurality of the light holes.
9. The display panel according to claim 1, wherein the display panel further comprises a heat conductive layer provided on a side of the TFT layer, the heat conductive layer being in contact with the heat dissipation film layer;
preferably, the thermally conductive layer is continuously disposed on at least two sides of the TFT layer.
10. A display device characterized by comprising the display panel according to any one of claims 1 to 9.
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| CN201910944965.9A CN110675760A (en) | 2019-09-30 | 2019-09-30 | Display panel and display device |
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| CN201910944965.9A CN110675760A (en) | 2019-09-30 | 2019-09-30 | Display panel and display device |
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Application publication date: 20200110 |