CN110993827B

CN110993827B - OLED display panel and display device

Info

Publication number: CN110993827B
Application number: CN201911342863.6A
Authority: CN
Inventors: 郑颖
Original assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Current assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date: 2019-12-23
Filing date: 2019-12-23
Publication date: 2022-09-27
Anticipated expiration: 2039-12-23
Also published as: CN110993827A

Abstract

The embodiment of the application discloses an OLED display panel and a display device, which comprise a substrate, a thin film transistor layer, a light-emitting functional layer and a thin film packaging layer, wherein the thin film transistor layer, the light-emitting functional layer and the thin film packaging layer are arranged on the substrate in a stacked mode; the thin film packaging layer comprises a first inorganic layer, an organic layer and a second inorganic layer which are stacked, the first inorganic layer is far away from one side of the substrate and is provided with a first heat conduction insulating layer, and the first heat conduction insulating layer is used for absorbing and conducting heat generated by the OLED display panel. The scheme improves the heat dissipation performance of the OLED display panel, and further improves the display effect of the OLED display panel.

Description

OLED display panel and display device

Technical Field

The invention relates to the technical field of display, in particular to an OLED display panel and a display device.

Background

An Organic Light-Emitting Diode (OLED) display panel has the advantages of Light weight, wide viewing angle, fast response time, low temperature resistance, high Light-Emitting efficiency, and the like, and thus is considered as a next-generation novel display technology. In order to realize the encapsulation of the OLED device, thin film encapsulation is becoming a mainstream encapsulation technology.

In the thin film package structure, an inorganic/organic/inorganic overlapped film structure is often used as a water-blocking and oxygen-blocking layer to prevent the invasion of external water vapor and oxygen. However, the inorganic layer and the organic layer both have smaller heat conduction coefficients, and when the panel is lighted, because the panel has poor heat dissipation performance, the temperature rise caused by the factors of the operation of the driving circuit, the light emission of the OLED and the like can cause the instability of devices in the panel, thereby affecting the display effect.

Disclosure of Invention

The embodiment of the application provides an OLED display panel and a display device to solve the technical problem that the OLED display panel is poor in heat dissipation performance and further influences the display effect.

The OLED display panel is characterized by comprising a substrate, a thin film transistor layer, a light emitting functional layer and a thin film packaging layer, wherein the thin film transistor layer, the light emitting functional layer and the thin film packaging layer are stacked on the substrate;

the thin film packaging layer comprises a first inorganic layer, an organic layer and a second inorganic layer which are stacked, a first heat conduction insulating layer is arranged on one side, far away from the substrate, of the first inorganic layer, and the first heat conduction insulating layer is used for absorbing and conducting heat generated by the OLED display panel.

In the OLED display panel according to the embodiment of the present application, the OLED display panel includes a plurality of sub-pixel units disposed at intervals;

the first heat-conducting insulating layer comprises a plurality of first heat-conducting blocks, and a plurality of first heat-conducting blocks are arranged right above any one of the sub-pixel units.

In the OLED display panel according to the embodiment of the present application, the first thermal insulation layer further includes a plurality of second thermal conductive blocks, and a plurality of second thermal conductive blocks are disposed directly above an area between any adjacent sub-pixel units.

In the OLED display panel according to the embodiment of the present application, the first thermal conductive block and the second thermal conductive block are trapezoidal, semicircular, or square.

In the OLED display panel according to the embodiment of the present application, a density of the first heat conduction block disposed directly above any one of the sub-pixel units is greater than a density of the second heat conduction block disposed directly above a region between any adjacent sub-pixel units.

In the OLED display panel according to the embodiment of the present application, the first thermal insulation layer further includes a plurality of third thermal conduction blocks, one third thermal conduction block is disposed directly above an area between any adjacent sub-pixel units, and an orthogonal projection of the third thermal conduction block on the substrate coincides with an orthogonal projection of an area between the corresponding adjacent sub-pixel units on the substrate.

In the OLED display panel according to the embodiment of the application, the first thermal insulation layer includes a plurality of fourth thermal conduction blocks, and the plurality of fourth thermal conduction blocks are disposed at equal intervals on one side of the first inorganic layer away from the substrate.

In the OLED display panel according to the embodiment of the present application, the thin film encapsulation layer further includes a second thermal insulation layer, and the second thermal insulation layer is disposed on one side of the organic layer away from the substrate.

In the OLED display panel according to this embodiment of the application, the first thermal insulation layer includes a plurality of fifth thermal conduction blocks distributed at intervals, and an orthogonal projection of the second thermal insulation layer on the substrate coincides with an orthogonal projection of the organic layer on the substrate.

The embodiment of the present application further provides a display device, which is characterized in that the display device includes the OLED display panel described above.

The embodiment of the application provides an OLED display panel and a display device, and the heat dissipation performance of the display panel is improved by arranging the heat conduction insulating layer in the thin film packaging layer of the OLED display panel, so that the display effect of the display panel is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic view of a first structure of an OLED display panel provided in an embodiment of the present application;

fig. 2 is a schematic diagram of a second structure of an OLED display panel provided in an embodiment of the present application;

fig. 3 is a schematic structural diagram of a third OLED display panel provided in an embodiment of the present application;

fig. 4 is a schematic diagram of a fourth structure of an OLED display panel provided in an embodiment of the present application;

fig. 5 is a schematic structural diagram of a fifth OLED display panel provided in an embodiment of the present application;

fig. 6 is a schematic diagram of a sixth structure of an OLED display panel provided in an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "upper", "right above", "one side", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application. Furthermore, the terms "first", "second", "third", "fourth", "fifth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first," "second," etc. may explicitly or implicitly include one or more of the described features.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an OLED display panel according to an embodiment of the present disclosure. As shown in the figure, the OLED display panel 100 includes a substrate 10, and a thin film transistor layer 20, a light emitting function layer 30, and a thin film encapsulation layer 40 stacked on the substrate 10. The thin film encapsulation layer 40 includes a first inorganic layer 41, an organic layer 43, and a second inorganic layer 44, which are stacked. The first inorganic layer 41 is provided with a first thermal insulation layer 42 on a side away from the substrate 10. The first thermal insulation layer 42 serves to absorb and conduct heat generated from the OLED display panel 100.

The substrate 10 may be a glass substrate, a quartz substrate, a resin substrate, a PI flexible substrate (Polyimide Film), or other types of substrates, which are not described herein in detail.

The thin-film transistor layer 20 includes a buffer layer 21 disposed on the substrate 10, and the buffer layer 21 may be a single-layer or multi-layer structure of silicon dioxide, silicon nitride, silicon oxynitride or amorphous silicon; an active layer 22 disposed on the buffer layer 21, wherein the material of the active layer 22 may be an oxide semiconductor or low temperature polysilicon; a first gate insulating layer 23, a first gate layer 24, a second gate insulating layer 25, and a second gate layer 26 sequentially stacked on the active layer 22; the interlayer dielectric layer 27 is arranged on the second gate layer 26, a via hole 270 is arranged on the interlayer dielectric layer 27, and the via hole 270 extends to the first gate insulating layer 23 and exposes one side of the active layer 22, which is far away from the substrate 10; the source drain layer 28 is arranged on the interlayer dielectric layer 27, and the source drain layer 28 is connected with the active layer 22 through the through hole 270; a planarization layer 29 disposed on the source/drain layer 28, wherein a first opening 290 is disposed on the planarization layer 29, and the first opening 290 exposes a side of the source/drain layer 28 away from the substrate 10. It should be noted that the power supply voltage and data voltage lines are disposed in the same layer (not shown) as the source/drain layer 28.

The light emitting function layer 30 includes an anode 31, a pixel defining layer 32, and a light emitting layer 33. Wherein the anode 31 is connected to the source drain layer 28 through the first opening 290. The pixel defining layer 32 is provided with a second opening 320. The second opening 320 exposes a side of the anode 31 away from the substrate 10. The light emitting layer 33 is positioned in the second opening 320 and connected to the anode 31. It will be appreciated that the light-emitting functional layer 30 also includes a cathode, which is located on the light-emitting layer 33 (not shown). It should be noted that the light emitting layer 33 may include three materials, red, green, and blue, which respectively emit different colors of light. And the OLED display panel 100 includes a plurality of sub-pixel units 50 arranged at intervals. The sub-pixel unit 50 includes a red sub-pixel unit or a green sub-pixel unit or a blue sub-pixel unit.

The thin film encapsulation layer 40 includes a first inorganic layer 41, an organic layer 43, and a second inorganic layer 44 that are stacked; the first inorganic layer 41 is provided with a first thermal insulation layer 42 on a side away from the substrate 10. The first inorganic layer 41 and the second inorganic layer 44 may be a single layer or a multi-layer structure of silicon oxide, silicon nitride, silicon oxynitride, or amorphous silicon, to prevent the intrusion of external moisture and oxygen. The first inorganic layer 41 and the second inorganic layer 44 may be formed using an evaporation process, a chemical vapor deposition process, or other processes. The first thermal conductive insulating layer 42 is continuously disposed directly above the sub-pixel units 50 and directly above the region between any adjacent sub-pixel units 50, i.e., the orthographic projection of the first thermal conductive insulating layer 42 on the substrate 10 coincides with the orthographic projection of the first inorganic layer 41 on the substrate 10. The first thermal insulation layer 42 may be made of an insulating material with good thermal conductivity and high light transmittance, such as magnesium oxide or magnesium nitride, so as to conduct heat generated by the OLED display panel 100 away without affecting the light transmittance of the OLED display panel 100. The organic layer 43 may be one or more of acrylic resin, polycarbonate, and polystyrene. The organic layer 43 may be formed by inkjet printing or plasma enhanced chemical vapor deposition, or the like. The embodiments of the present application do not specifically limit the above contents.

According to the OLED display panel 100 provided by the embodiment of the application, the first heat conduction insulating layer 42 is arranged on the side, away from the substrate 10, of the first inorganic layer 41 of the film packaging layer 40, so that the heat dissipation performance of the OLED display panel 100 is improved, the influence of temperature rise on a driving circuit or a light emitting layer in the panel is avoided, and the display effect of the OLED display panel 100 is further improved.

In some embodiments, referring to fig. 2, the OLED display panel 100 shown in fig. 1 is different in that the first thermal insulation layer 42 includes a plurality of first thermal conductive blocks 421; a plurality of first heat conduction blocks 421 are arranged right above any one of the sub-pixel units 50; the first thermally conductive, insulating layer 42 further includes a plurality of second thermally conductive blocks 422; a plurality of second heat-conductive blocks 422 are disposed directly above the region between any adjacent sub-pixel units 50. The shapes of the first heat conduction block 421 and the second heat conduction block 422 may be a trapezoid, a semicircle or a square, which is not specifically limited in this embodiment of the application.

In the embodiment of the present application, by configuring the first heat conduction insulation layer 42 into the first heat conduction block 421 and the second heat conduction block 422, the heat dissipation performance of the OLED display panel 200 is improved, and meanwhile, the light transmittance of the first heat conduction insulation layer 42 can be improved, so that the display effect is further improved. In addition, the provision of the first and second heat

conductive blocks

421 and 422 increases the contact area between the first inorganic layer 41 and the organic layer 43, thereby improving the adhesion between the first inorganic layer 41 and the organic layer 43.

Further, in some embodiments, the density of the first thermal conductive block 421 disposed directly above any one of the sub-pixel units 50 is greater than the density of the second thermal conductive block 422 disposed directly above the region between any adjacent sub-pixel units 50. It can be understood that, when the OLED display panel 200 works, the driving circuit and the light emitting layer 33 mainly generate heat to raise the temperature, and the light emitting layer 33 is located in the sub-pixel unit 50, the heat generated when the light emitting layer 33 emits light can be quickly conducted out by the technical solution, and the requirement of the OLED display panel 200 on the light transmittance is met.

In some embodiments, referring to fig. 3, the OLED display panel 100 shown in fig. 1 is different in that the first thermal insulation layer 42 includes a plurality of first thermal conductive blocks 421; a plurality of first heat conduction blocks 421 are arranged right above any one of the sub-pixel units 50; the first thermally conductive, insulating layer 42 further includes a plurality of third thermally conductive blocks 423; a third heat conduction block 423 is arranged right above the region between any adjacent sub-pixel units 50; the orthographic projection of the third thermal conductive block 423 on the substrate 10 is overlapped with the orthographic projection of the areas between the corresponding adjacent sub-pixel units 50 on the substrate 10.

It is understood that, since the light-emitting layer 33 is located within the sub-pixel unit 50, the light-emitting layer 33 has the maximum light-emitting intensity at the region directly above any one of the sub-pixel units 50. At this time, by providing a plurality of first heat-conductive blocks 421 at intervals directly above any one of the sub-pixel units 50, the light transmittance can be improved. Meanwhile, the third heat conduction block 423 is arranged, so that the orthographic projection of the third heat conduction block 423 on the substrate 10 is overlapped with the orthographic projection of the area between the corresponding adjacent sub-pixel units 50 on the substrate 10, and the requirement of the OLED display panel 300 on the heat dissipation efficiency can be met on the basis of improving the light transmittance.

In some embodiments, referring to fig. 4, the difference from the OLED display panel 100 shown in fig. 1 is that the first thermal insulation layer 42 includes a plurality of fourth thermal conduction blocks 424; a plurality of fourth heat conduction blocks 424 are disposed at equal intervals on a side of the first inorganic layer 43 away from the substrate 10. The shape of the fourth heat conduction block 424 is a trapezoid, a semicircle or a square, which is not specifically limited in this embodiment. In the embodiment of the present application, the fourth heat conduction blocks 424 arranged at equal intervals form a scattering microstructure, which can effectively improve the light transmittance of the OLED display panel 400, and further improve the display effect. Meanwhile, the contact area between the first inorganic layer 41 and the organic layer 43 is increased by the plurality of fourth heat conduction blocks 424 arranged at equal intervals, so that the adhesion between the first inorganic layer 41 and the organic layer 43 is improved, and the problem of falling off between the first inorganic layer 41 and the organic layer 43 is effectively solved.

In some embodiments, please refer to fig. 5, which is different from the OLED display panel 100 shown in fig. 1 in that the film encapsulation layer 40 further includes a second thermal insulation layer 45. The second thermal insulation layer 45 is disposed on a side of the organic layer 43 away from the substrate 10. According to the embodiment of the application, the first heat conduction insulating layer 42 and the second heat conduction insulating layer 45 are arranged in the film packaging layer 40, so that the heat dissipation performance of the OLED display panel 500 is further improved, the heat generated in the working process of the OLED display panel 500 can be conducted out in time, and the display effect is improved.

Further, referring to fig. 6, in some embodiments, the first thermal insulation layer 42 includes a plurality of fifth thermal conductive blocks 425 spaced apart from each other. The orthographic projection of the second heat conductive insulating layer 45 on the substrate 10 coincides with the orthographic projection of the organic layer 43 on the substrate 10. The interval between the fifth heat conduction blocks 42 may be selected according to actual conditions, which is not limited in this application.

It can be understood that, since the second thermal conductive and insulating layer 45 continuously covers the organic layer 43 and the first thermal conductive and insulating layer 42 includes a plurality of fifth thermal conductive blocks 425 spaced apart from each other, the thermal conductivity of the second thermal conductive and insulating layer 45 is better than that of the first thermal conductive and insulating layer 42, and a thermal conductivity gradient difference is formed in a direction from the substrate 10 to the substrate 10. Accordingly, heat generated when the OLED display panel 600 operates can be effectively conducted out of the inside of the OLED display panel 600.

The embodiment of the application also provides a display device, which comprises the OLED display panel. The display device may be a smart phone, a tablet computer, or the like.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The OLED display panel is characterized by comprising a substrate, a thin film transistor layer, a light emitting functional layer and a thin film packaging layer, wherein the thin film transistor layer, the light emitting functional layer and the thin film packaging layer are arranged on the substrate in a stacked mode;

the thin film packaging layer comprises a first inorganic layer, an organic layer and a second inorganic layer which are arranged in a stacked mode, wherein a first heat conduction insulating layer is arranged on one side, away from the substrate, of the first inorganic layer, and the first heat conduction insulating layer is used for absorbing and conducting heat generated by the OLED display panel;

the first heat conduction insulating layer comprises a plurality of fourth heat conduction blocks, the fourth heat conduction blocks are arranged on one side, far away from the substrate, of the first inorganic layer at equal intervals, the fourth heat conduction blocks are located right above the sub-pixel units and right above the area between the adjacent sub-pixels, the fourth heat conduction blocks are trapezoidal, semicircular or square in shape, and the fourth heat conduction blocks distributed at equal intervals form a scattering microstructure;

the film packaging layer further comprises a second heat conduction insulating layer, the second heat conduction insulating layer is arranged on one side, far away from the substrate, of the organic layer, and the second heat conduction insulating layer continuously covers the organic layer.

2. A display device comprising the OLED of claim 1

A display panel is provided.