KR102307120B1 - Antenna apparatus - Google Patents

Abstract

An antenna device according to an embodiment of the present invention includes an antenna pattern having a dipole shape including first and second poles, a feed line electrically connected to the antenna pattern and extending backward, and an antenna It may include at least one ground layer disposed behind the pattern, spaced apart from the feed line, and providing first and second cavities spaced apart from each other toward the first and second poles, respectively.

Description

Antenna apparatus

The present invention relates to an antenna device.

Data traffic of mobile communication is rapidly increasing every year. Active technology development is in progress to support this breakthrough data in real time in the wireless network. For example, contentization of IoT (Internet of Thing)-based data, AR (Augmented Reality), VR (Virtual Reality), live VR/AR combined with SNS, autonomous driving, Sync View (User's point of view using a small camera) Applications such as real-time video transmission) require communication (eg, 5G communication, mmWave communication, etc.) that supports sending and receiving large amounts of data.

Therefore, recently, millimeter wave (mmWave) communication including fifth generation (5G) communication has been actively studied, and research for commercialization/standardization of an antenna module that smoothly implements this is being actively conducted.

Since RF signals in high frequency bands (eg, 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz, etc.) are easily absorbed and lost in the course of transmission, the quality of communication may drop sharply. Therefore, an antenna for communication in a high frequency band requires a technical approach different from that of the existing antenna technology, and a separate method for securing antenna gain, integrating antenna and RFIC, and securing EIRP (Effective Isotropic Radiated Power), etc. It may require the development of special technologies such as power amplifiers.

Japanese Patent Application Laid-Open No. 2012-191317

The present invention provides an antenna device.

An antenna device according to an embodiment of the present invention includes an antenna pattern having a dipole shape including first and second poles; a feed line electrically connected to the antenna pattern and extending toward the rear; and at least one ground layer disposed behind the antenna pattern and spaced apart from the feed line to provide first and second cavities spaced apart from each other toward the first and second poles, respectively. may include.

An antenna device according to an embodiment of the present invention may have a structure advantageous for miniaturization while improving antenna performance (eg, transmission/reception rate, gain, bandwidth, directivity, etc.).

The antenna device according to an embodiment of the present invention can maintain antenna performance while having a reduced size by arranging the antenna pattern more compressively, and can improve the design freedom of the reflector of the antenna pattern, It is possible to have more precisely adjusted antenna performance, and to improve the degree of isolation between a plurality of antenna devices.

1 is a perspective view showing an antenna device according to an embodiment of the present invention.
FIG. 2 is a side view illustrating the antenna device shown in FIG. 1 .
3A to 3D are plan views illustrating first to fourth ground layers that may be included in an antenna device and an antenna module according to an embodiment of the present invention.
4A to 4C are plan views illustrating various sizes of first to third protruding regions of an antenna device according to an embodiment of the present invention.
FIG. 4D is a rear view illustrating the antenna device shown in FIG. 4A.
5 is a perspective view illustrating an antenna device according to an embodiment of the present invention.
FIG. 6 is a side view illustrating the antenna device shown in FIG. 5 .
7 is a diagram illustrating a transmission direction of an RF signal according to a plurality of cavities of the antenna device according to an embodiment of the present invention.
8A to 8D are plan views illustrating various arrangements of antenna devices included in an antenna module according to an embodiment of the present invention.
9 is a perspective view illustrating an arrangement of an antenna device included in an antenna module according to an embodiment of the present invention.
10A to 10B are views illustrating a lower structure of a connection member included in an antenna module according to an embodiment of the present invention.
11 is a side view showing a schematic structure of an antenna module according to an embodiment of the present invention.
12A and 12B are side views illustrating various structures of an antenna module according to an embodiment of the present invention.
13A and 13B are plan views illustrating an arrangement of an antenna module in an electronic device according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0023] Reference is made to the accompanying drawings, which show by way of illustration specific embodiments in which the present invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the present invention. It should be understood that the various embodiments of the present invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein with respect to one embodiment may be embodied in other embodiments without departing from the spirit and scope of the invention. In addition, it should be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the present invention. Accordingly, the following detailed description is not intended to be taken in a limiting sense, and the scope of the present invention is limited only by the appended claims, along with all scope equivalents to those claimed. Like reference numerals in the drawings refer to the same or similar functions throughout the various aspects.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to enable those of ordinary skill in the art to easily practice the present invention.

1 is a perspective view showing an antenna device according to an embodiment of the present invention, and FIG. 2 is a side view showing the antenna device shown in FIG. 1 .

1 and 2 , the antenna device according to an embodiment of the present invention may include an antenna pattern 120a and a connection member 200a. The antenna pattern 120a receives a radio frequency (RF) signal from the connection member 200a through the feed line 110a and transmits it remotely in the x direction, or remotely receives the RF signal in the x direction to connect the feed line 110a. through the connection member 200a. For example, since the antenna pattern 120a may have a dipole shape, it may have a structure extending in the y-direction.

1 and 2 , the connection member 200a includes a first ground layer 221a, a second ground layer 222a, a third ground layer 223a, a fourth ground layer 224a, and a fifth ground. At least a portion of the layer 225a may be included, and an insulating layer disposed between the plurality of ground layers may be further included. The first to fifth ground layers 221a, 222a, 223a, 224a, and 225a may be disposed to be spaced apart from each other in the vertical direction (z-direction).

The antenna device according to an embodiment of the present invention may include at least one of the first to fifth ground layers 221a, 222a, 223a, 224a, and 225a. The number and vertical relationship of the first to fifth ground layers 221a, 222a, 223a, 224a, and 225a may vary depending on the design of the antenna device.

The fourth and fifth ground layers 224a and 225a may provide a ground used in circuits and/or passive components of the IC to the IC and/or passive components. In addition, the fourth and fifth ground layers 224a and 225a may provide power and signal transmission paths used in ICs and/or passive components. Accordingly, the fourth and fifth ground layers 224a and 225a may be electrically connected to the IC and/or passive components.

Here, the fourth and fifth ground layers 224a and 225a may be omitted depending on the ground demand of the IC and/or passive components. Meanwhile, the fourth and fifth ground layers 224a and 225a may have through holes through which the wiring vias pass.

The third ground layer 223a may be spaced apart above the fourth and fifth ground layers 224a and 225a, and may be disposed to surround the wiring at the same height as the wiring through which a radio frequency (RF) signal flows. have. The wiring may be electrically connected to the IC through the wiring via.

The first and second ground layers 221a and 222a may be spaced apart above the fourth and fifth ground layers 224a and 225a and disposed below and above the third ground layer 223a, respectively. The first ground layer 221a may improve electromagnetic isolation between the wiring and the IC, and may provide a ground to the IC and/or passive components. The second ground layer 222a may improve the degree of electromagnetic isolation between the wiring and the patch antenna pattern, and provides a boundary condition in terms of the patch antenna pattern and reflects the RF signal transmitted and received by the patch antenna pattern. It is possible to further concentrate the transmission/reception directions of the patch antenna patterns.

The second ground layer 222a may protrude further than the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a. Accordingly, since the second ground layer 222a can electromagnetically block the patch antenna pattern and the antenna pattern 120a, the degree of electromagnetic isolation between the patch antenna pattern and the antenna pattern 120a can be improved. can

Boundaries of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a may overlap each other when viewed in the vertical direction (z-direction). Since the boundary may act as a reflector for the antenna pattern 120a, the effective distance between the first, third, fourth and fifth ground layers 221a, 223a, 224a, 225a and the antenna pattern 120a The separation distance may affect the antenna performance of the antenna pattern 120a.

For example, when the effective separation distance is shorter than the reference distance, the gain of the antenna pattern 120a may be deteriorated according to dispersion of the RF signal transmitted from the antenna pattern 120a, and the antenna pattern 120a It may be difficult to optimize the resonant frequency of , according to an increase in capacitance between the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a and the antenna pattern 120a.

Also, when the antenna pattern 120a moves away from the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a, the size of the antenna device and the antenna module may be increased.

In addition, when the connecting member 200a is reduced in size, the power and signal transmission paths and the arrangement space of the wiring may become insufficient, the ground stability of the ground layer may be deteriorated, and the arrangement space of the patch antenna pattern may become insufficient. have. That is, the performance of the antenna device and the antenna module may be deteriorated.

In the antenna device and antenna module according to an embodiment of the present invention, while disposing the antenna pattern 120a closer to the first, third, fourth and fifth ground layers 221a, 223a, 224a, 225a, the first , and the third, fourth, and fifth ground layers 221a, 223a, 224a, 225a and the antenna pattern 120a have a structure capable of securing an effective separation distance. Accordingly, the antenna device and the antenna module according to an embodiment of the present invention may have a reduced size or improved performance.

1 and 2 , at least one of the first, third, fourth, and fifth ground layers 221a , 223a , 224a and 225a included in the connection member 200a moves in the vertical direction (z direction). A first protrusion region P1 protruding toward the antenna pattern 120a to overlap at least a portion of the feed line 110a when viewed, and first and second lateral directions spaced apart from the first protrusion region P1, respectively It may have second and third protruding regions P2 and P3 protruding from the position.

Due to the first to third protruding regions P1, P2, and P3, at least one of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a faces the antenna pattern 120a. The boundary may form a concave-convex structure. That is, the first cavity C1 may be formed between the first protrusion region P1 and the second protrusion region P2 , and the second cavity C2 includes the first protrusion region P1 and the third protrusion region P1 . It may be formed between the regions P3 . The first and second cavities C1 and C2 may provide an advantageous boundary condition for securing antenna performance of the antenna pattern 120a.

The boundary toward the antenna pattern 120a in at least one of the first, third, fourth and fifth ground layers 221a, 223a, 224a, and 225a may act as a reflector for the antenna pattern 120a. , a portion of the RF signal transmitted from the antenna pattern 120a may be reflected at the boundary of at least one of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a.

The first and second cavities C1 and C2 have first, third, fourth and fifth ground layers 221a and 223a, respectively, between one end and the other end of the first and second poles of the antenna pattern 120a, respectively. 224a, 225a) may have a recessed structure in a direction toward at least one. That is, the first and second cavities C1 and C2 may act as reflectors for the first and second poles of the antenna pattern 120a, respectively.

Accordingly, an effective separation distance from each pole of the antenna pattern 120a to at least one of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a is a substantial position of the antenna pattern 120a. It can be lengthened without change. Alternatively, the antenna pattern 120a may be disposed closer to the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a without substantially sacrificing antenna performance.

For example, among the RF signals transmitted from each pole of the antenna pattern 120a, the RF signals directed to the first and second cavities C1 and C2 are compared with those without the first and second cavities C1 and C2. Therefore, it can be reflected more concentrated in the x-direction. Accordingly, the gain of the antenna pattern 120a may be further improved compared to when the first and second cavities C1 and C2 are absent.

For example, the capacitance between each pole of the antenna pattern 120a and the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a is formed in the first and second cavities C1 and C2. It may be smaller than when there is no Accordingly, the resonant frequency of the antenna pattern 120a may be more easily optimized.

Also, the first protruding region P1 may provide an additional resonance point according to electromagnetic coupling with the antenna pattern 120a. The resonance point may be dependent on the shape of the first protruding region P1 (eg, width, length, thickness, separation distance with respect to the second and third protrusion regions, separation distance with respect to the antenna pattern, etc.).

When the additional resonance point is close to the frequency band of the antenna pattern 120a, the bandwidth of the antenna pattern 120a may be extended. In addition, the additional resonance point may support the additional frequency band of the antenna pattern 120a to enable multi-band communication of the antenna pattern 120a. Accordingly, the first protruding region P1 may broaden the bandwidth of the antenna pattern 120a or expand the communication band of the antenna pattern 120a.

In addition, the second and third protruding regions P2 and P3 may electromagnetically shield the antenna pattern 120a and the adjacent antenna device. Accordingly, the separation distance between the antenna pattern 120a and the adjacent antenna device may be further shortened, and the size of the antenna module according to an embodiment of the present invention may be reduced.

Meanwhile, referring to FIGS. 1 and 2 , the connection member 200a is electrically connected to at least two of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a, and in the vertical direction. A plurality of shielding vias 245a arranged to surround at least a portion of each of the first and second cavities C1 and C2 when viewed in the (z direction) may be further included.

The plurality of shielding vias 245a includes an RF signal counted as a gap between the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a among the RF signals transmitted from the antenna pattern 120a. can reflect. Accordingly, the gain of the antenna pattern 120a may be further improved, and the degree of electromagnetic isolation between the antenna pattern 120a and the wiring may be improved.

Meanwhile, referring to FIGS. 1 and 2 , the antenna device according to an embodiment of the present invention includes a feed line 110a, a feed via 111a, an antenna pattern 120a, a director pattern 125a, and a connection member ( 200a) may be included.

Since the feed line 110a may be electrically connected to the wiring in the third ground layer 223a, it may serve as a transmission path of the RF signal. The feed line 110a may be viewed as a component included in the third ground layer 223a depending on the viewpoint. Since the antenna pattern 120a may be disposed adjacent to the side surface of the connection member 200a, the feed line 110a may have a structure extending from the wiring of the third ground layer 223a toward the antenna pattern 120a. have.

The feed line 110a may be disposed between the first protruding regions P1 of at least two of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a. Accordingly, the feed line 110a may reduce electromagnetic noise that may be received from at least one of the antenna pattern 120a, the adjacent antenna device, and the patch antenna pattern. The electromagnetic noise of the feed line 110a may be further reduced as the width and length of the first protruding region P1 increase.

The feed line 110a may include first and second feed lines. For example, the first feed line may be configured to transmit an RF signal to the antenna pattern 120a, and the second feed line may be configured to receive an RF signal from the antenna pattern 120a. For example, the first feedline may be configured to receive an RF signal from the antenna pattern 120a or to transmit an RF signal to the antenna pattern 120a, and the second feedline may have an impedance to the antenna pattern 120a. can be configured to provide

For example, the first and second feed lines each transmit an RF signal to the antenna pattern 120a and receive the RF signal from the antenna pattern 120a, but have a phase difference (eg, 180 degrees, 90 degrees) from each other. It may be configured in a differential feeding method. The phase difference may be implemented through a phase shifter of an IC or a difference in electrical length between the first and second feedlines.

Meanwhile, depending on the design, the feed line 110a may include a quarter-wave converter, a balun, or an impedance conversion line to improve RF signal transmission efficiency, but a quarter-wave converter, a balun, or an impedance conversion line. may be omitted depending on the design.

The feed via 111a may be disposed to electrically connect the antenna pattern 120a and the feed line 110a. The feed via 111a may be disposed perpendicular to the antenna pattern 120a and the feed line 110a. When the antenna pattern 120a and the feed line 110a are disposed at the same height as each other, the feed via 111a may be omitted.

Due to the feed via 111a, the antenna pattern 120a may be disposed at a position higher or lower than the feed line 110a. Since the specific position of the antenna pattern 120a may vary depending on the length of the feed via 111a, the direction of the radiation pattern of the antenna pattern 120a is slightly in the vertical direction (z-direction) according to the length design of the feed via 111a. can be tilted

For example, the antenna pattern 120a may be disposed below the feed line 110a so as to move away from the second ground layer 222a by the feed via 111a. Accordingly, the second ground layer 222a may further improve the electromagnetic isolation between the antenna pattern 120a and the patch antenna pattern.

Meanwhile, the via pattern 112a may be coupled to the feed via 111a, and may support upper and lower portions of the feed via 111a, respectively.

The antenna pattern 120a may be electrically connected to the feed line 110a and configured to transmit or receive an RF signal. Here, one end of each pole of the antenna pattern 120a may be electrically connected to the first and second lines of the feed line 110a.

The antenna pattern 120a may have a frequency band (eg, 28 GHz, 60 GHz) according to at least one of a pole length, a pole thickness, a spacing between poles, a spacing between a pole and a side surface of a connection member, and a dielectric constant of an insulating layer.

The antenna pattern 120a and the director pattern 125a may be viewed as components included in the fourth ground layer 224a depending on the viewpoint. The director pattern 125a may be omitted depending on the design.

The director pattern 125a may be laterally spaced apart from the antenna pattern 120a. The director pattern 125a may be electromagnetically coupled to the antenna pattern 120a to improve a gain or bandwidth of the antenna pattern 120a. Since the director pattern 125a has a shorter length than the total length of the dipole of the antenna pattern 120a, the concentration of electromagnetic coupling of the antenna pattern 120a can be further improved, so that the gain or Directivity can be further improved.

3A to 3D are plan views illustrating first to fourth ground layers that may be included in an antenna device and an antenna module according to an embodiment of the present invention.

Referring to FIG. 3A , the first protruding region P1 of the first ground layer 221a may protrude more than the second and third protruding regions P2 and P3 . Accordingly, the antenna pattern may more easily secure an effective separation distance with respect to the first ground layer 221a and further improve electromagnetic coupling to the first protruding region P1. Accordingly, the antenna performance of the antenna device and the antenna module according to an embodiment of the present invention can be further improved.

Here, the first protruding region P1 may be included in the first ground layer 221a, and may be viewed as a protruding ground pattern electrically connected to the first ground layer 221a as a separate component depending on the viewpoint.

In addition, the plurality of shielding vias 245a may be electrically connected to the first ground layer 221a and may be arranged along a boundary between the second and third protruding regions P2 and P3 . Also, the first ground layer 221a may have a plurality of through holes through which the first and second wiring vias 231a and 232a pass, respectively. Meanwhile, the via pattern 112a coupled to the feed via may be viewed as a component included in the first ground layer 221a depending on the viewpoint.

Referring to FIGS. 3A and 3B , the second ground layer 222a has a fourth protruding area P4 , and when viewed in the vertical direction (z direction), the first protruding area P1 of the first ground layer 221a ) and the second protrusion region P2 (first cavity), and between the first protrusion region P1 and the third protrusion region P3 of the first ground layer 221a (second cavity) can overlap. Accordingly, the antenna pattern may further improve electromagnetic coupling with respect to the fourth protruding region P4 and secure electromagnetic isolation for the patch antenna pattern disposed on the upper side thereof. Accordingly, the antenna performance of the antenna device and the antenna module according to an embodiment of the present invention can be further improved.

Also, the plurality of shielding vias 245a may be electrically connected to the second ground layer 222a and may be arranged along the boundary of the second ground layer 222a. Also, the second ground layer 222a may have a through hole through which the second feed via 1120a passes. The second feed via 1120a may electrically connect the patch antenna pattern and the second wiring.

Referring to FIG. 3C , the antenna device and the antenna module according to an embodiment of the present invention include a first wiring 212a electrically connecting a feed line 110a and a first wiring via 231a, and a A second wiring 214a electrically connecting the second feed via 1120a and the second wiring via 232a may be further included.

The third ground layer 223a may be disposed to surround the first wiring 212a and the second wiring 214a, respectively. Accordingly, electromagnetic noise of each of the first wiring 212a and the second wiring 214a may be reduced.

The plurality of shielding vias 245a may be electrically connected to the third ground layer 223a and may be arranged along the boundary of the third ground layer 223a and the first and second wirings 212a and 214a. Accordingly, electromagnetic noise of each of the first wiring 212a and the second wiring 214a may be further reduced.

3A and 3C , the third ground layer 223a is formed between the second protruding area P2 and the third protruding area P3 of the first ground layer 221a when viewed in the vertical direction (z direction). The in-between region may have a recessed shape. That is, the third ground layer 223a may have a second protrusion region P2 - 2 and a third protrusion region P3 - 2 .

3A and 3D , the fourth ground layer 224a is formed between the second protruding area P2 and the third protruding area P3 of the first ground layer 221a when viewed in the vertical direction (z direction). The in-between region may have a recessed shape. That is, the fourth ground layer 224a may have a second protrusion region P2 - 3 and a third protrusion region P3 - 3 .

The plurality of shielding vias 245a may be electrically connected to the fourth ground layer 224a and may be arranged to surround a region between the second protrusion region P2 - 3 and the third protrusion region P3 - 3 . .

In addition, the fourth ground layer 224a may have a plurality of through holes through which the first and second wiring vias 231a and 232a respectively pass. The first and second wiring vias 231a and 232a may be electrically connected to an IC disposed under the fourth ground layer 224a.

Meanwhile, the antenna pattern 120a and the director pattern 125a may be viewed as components included in the fourth ground layer 224a depending on the viewpoint.

On the other hand, as the number of ground layers providing cavities among the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a increases, the vertical direction (z-direction) of the cavity increases. The length can be long. The vertical (z-direction) length of the cavity may affect the antenna performance of the antenna pattern 120a. Since the antenna device and the antenna module according to an embodiment of the present invention can easily adjust the vertical (z-direction) length of the cavity by adjusting the number of ground layers providing the cavity, the antenna pattern The antenna performance of 120a can be adjusted more easily.

Also, the recessed regions of at least two of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a may have the same rectangular shape. Accordingly, the cavity may form a rectangular parallelepiped. When the cavity is a rectangular parallelepiped, the ratio of the x vector component among the x vector component and the y vector component of the RF signal reflected at the boundary of the cavity may be further increased. Since the y vector component is more likely to be canceled within the cavity than the x vector component, the antenna pattern 120a has more improved gain as the ratio of the x vector component of the RF signal reflected from the cavity boundary is higher. can have Accordingly, the antenna pattern 120a may have a more improved gain as the cavity is closer to a rectangular parallelepiped.

4A to 4C are plan views illustrating various sizes of first to third protruding regions of the antenna device according to an embodiment of the present invention, and FIG. 4D is a rear view illustrating the antenna device shown in FIG. 4A.

3A to 4 , an antenna device and an antenna module according to an embodiment of the present invention include feed lines 110c, 110d, 110e, feed vias 111c, 111d, 111e, and antenna patterns 120c and 120d. , 120e), director patterns 125c, 125d, and 125e, first ground layers 221c, 221d, and 221e, and second ground layers 222c, 222d, and 222e.

3A and 4 , the first protruding region P1 of the first ground layer 221c may have a first width w1 and a first height h1. Referring to FIG. 3B , the first protruding region P1 of the first ground layer 221d may have a second width w2 and a first height h1 . Referring to FIG. 3C , the first protruding region P1 of the first ground layer 221e may have a first width w1 and a second height h2.

Here, the second width w2 may be shorter than the first width w1. Accordingly, the band positions or bandwidths of the antenna patterns 120c, 120d, and 120e may be changed.

Also, the first height h1 of the first protrusion region P1 may be longer than the protrusion lengths of the second and third protrusion regions P2 and P3, and the second height h1 of the first protrusion region P1 ( h2) may be shorter than the protrusion lengths of the second and third protrusion regions P2 and P3.

In addition, referring to FIGS. 3A to 4 , when viewed in the vertical direction (z-direction), the separation distance between the antenna patterns 120c , 120d , 120e and the first protrusion region P1 is the second or third protrusion region P2 . , may be shorter than the protrusion length of P3). Accordingly, the antenna device and the antenna module according to an embodiment of the present invention may have a reduced size without significantly impairing the RF signal reflection performance of the first ground layers 221c, 221d, and 221e.

Also, referring to FIGS. 3A, 3C and 4 , the lengths of the first poles of the antenna patterns 120c and 120e are the first and second protruding regions P1 and the second protruding regions of the first ground layers 221c and 221e. The length of the second pole of the antenna patterns 120c and 120e is longer than the separation distance between (P2) (the first cavity), and the length of the first protrusion region P1 and the third protrusion of the first ground layers 221c and 221e are It may be longer than the separation distance between the regions P3 (the second cavity). Accordingly, the first ground layers 221c and 221e may reflect the RF signals of the antenna patterns 120c and 120e while more concentrating them in a specific direction (x-direction).

Also, referring to FIGS. 3A, 3C and 4 , the lengthwise lengths of the director patterns 125c and 125e are the second protrusion region P2 and the third protrusion region P3 of the first ground layers 221c and 221e. ), and may be longer than the width (y-direction) length of the first protruding region P1 of the first ground layers 221c and 221e. Accordingly, the antenna device and the antenna module according to an embodiment of the present invention may have a reduced size while securing antenna performance (eg, bandwidth, straightness, etc.).

5 is a perspective view showing an antenna device according to an embodiment of the present invention, and FIG. 6 is a side view showing the antenna device shown in FIG. 5 .

5 and 6 , the antenna pattern 120b may have a folded dipole shape, and the feed via and director pattern may be omitted.

The feed line 110b may be disposed at the same height as the fourth ground layer 224b and may be electrically connected to a first wiring surrounded by the fourth ground layer 224b.

The connection member 200b may include at least one of the first, second, third, fourth, and fifth ground layers 221b, 222b, 223b, 224b, and 225b and a plurality of shielding vias 245b. . The fourth protruding region of the second ground layer 222b may be omitted.

The first ground layer 221b may have a shape in which the feed line 110b is depressed in a direction extending from the antenna pattern 120b, and may include a protruding ground pattern P1-2. The protruding ground pattern P1 - 2 may correspond to the above-described first protruding region.

Depending on the design, the fifth ground layer 225b may have a protruding region. The protruding region and the protruding ground pattern P1 - 2 may be electromagnetically coupled to the antenna pattern 120b, and may provide a boundary between the first and second cavities.

7 is a diagram illustrating a transmission direction of an RF signal according to a plurality of cavities of the antenna device according to an embodiment of the present invention.

Referring to FIG. 7 , the RF signal transmitted in the order of the wiring via 230 , the feed line 110 , and the feed via 111 may be transmitted through each pole of the antenna pattern 120 . A portion of the RF signal transmitted from each pole of the antenna pattern 120 may be radiated forward through the director pattern 125 .

Among the RF signals transmitted from each pole of the antenna pattern 120 , the RF signal transmitted toward the first ground layer 221 may be more concentrated by the first and second cavities of the first ground layer 221 , It may be reflected at the boundary of the first and second cavities. The reflected RF signal may be transmitted more concentrated in the front of the antenna pattern 120 . Accordingly, the gain of the antenna device according to an embodiment of the present invention can be further improved.

8A to 8D are plan views illustrating various arrangements of antenna devices included in an antenna module according to an embodiment of the present invention.

Referring to FIG. 8A , the antenna module according to an embodiment of the present invention may include a first antenna device 101e, a second antenna device 102e, and a first ground member 130e.

Referring to FIG. 8B , an antenna module according to an embodiment of the present invention includes a first antenna device 101f, a second antenna device 102f, a third antenna device 103f, a fourth antenna device 104f, and a second antenna device. One ground member 130f may be included.

Referring to FIG. 8C , the antenna module according to an embodiment of the present invention includes a first antenna device 101g, a second antenna device 102g, a third antenna device 103g, a fourth antenna device 104g, and a second antenna device 104g. One ground member 130g may be included.

The antenna module shown in FIGS. 8A to 8C may omit the antenna package.

Referring to FIG. 8D , the antenna module according to an embodiment of the present invention includes a first antenna device 101h, a second antenna device 102h, a third antenna device 103h, a fourth antenna device 104h, and a second antenna device. 1 may include a ground member 130h and an IC 1300h.

The first ground members 130e, 130f, 130g, and 130h may improve the degree of isolation between the plurality of antenna devices and provide a specific arrangement position of the plurality of antenna devices.

9 is a perspective view illustrating an arrangement of an antenna device included in an antenna module according to an embodiment of the present invention.

Referring to FIG. 9 , the antenna module according to an embodiment of the present invention includes a plurality of antenna devices 100c and 100d, a plurality of patch antenna patterns 1110d, a plurality of patch antenna cavities 1130d, a dielectric layer 1140c, 1140d), a plating member 1160d, a plurality of chip antennas 1170c and 1170d, and a plurality of dipole antennas 1175c and 1175d may be included.

The plurality of antenna devices 100c and 100d may be designed similarly to the antenna devices described above with reference to FIGS. 1 to 8 , respectively, and may be arranged side by side adjacent to the side of the antenna module. Accordingly, some of the plurality of antenna devices 100c and 100d may transmit/receive RF signals in the x-axis direction, and others may transmit/receive RF signals in the y-axis direction.

The plurality of patch antenna patterns 1110d are disposed adjacent to the upper side of the antenna module, and may transmit/receive RF signals in the vertical direction (z-direction). The number, arrangement, and shape of the plurality of patch antenna patterns 1110d are not particularly limited. For example, the plurality of patch antenna patterns 1110d may have a circular shape, and the plurality of patch antenna patterns 1110d may be arranged in a structure of 1 X n (n is a natural number equal to or greater than 2), and a plurality of patches The number of antenna patterns may be 16.

Each of the plurality of patch antenna cavities 1130d may be formed to cover the side and lower sides of each of the plurality of patch antenna patterns 1110d, and provide a boundary condition for transmitting and receiving RF signals of each of the plurality of patch antenna patterns 1110d can do.

The plurality of chip antennas 1170c and 1170d may each have two electrodes facing each other, and may be disposed above or below the antenna module, in the x-axis direction and/or the y-axis direction through one of the two electrodes. It may be arranged to transmit and receive an RF signal.

The plurality of dipole antennas 1175c and 1175d may be disposed above or below the antenna module, and may transmit/receive RF signals in the z-axis direction. That is, the plurality of dipole antennas 1175c and 1175d may be disposed to be erected in the vertical direction (z-direction) to be perpendicular to the plurality of antenna devices 100c and 100d. According to design, at least some of the plurality of dipole antennas 1175c and 1175d may be replaced with monopole antennas.

10A and 10B are views illustrating a lower structure of a connection member of an antenna module including an antenna device according to an embodiment of the present invention.

Referring to FIG. 10A , the antenna module according to an embodiment of the present invention includes a connection member 200 , an IC 310 , an adhesive member 320 , an electrical connection structure 330 , an encapsulant 340 , and a passive component. At least a portion of the 350 and the sub-substrate 410 may be included.

The connecting member 200 may have a structure similar to that of the connecting member described above with reference to FIGS. 1 to 8 .

The IC 310 is the same as the aforementioned IC, and may be disposed below the connection member 200 . The IC 310 may be electrically connected to the wiring of the connecting member 200 to transmit or receive an RF signal, and may be electrically connected to the ground layer of the connecting member 200 to receive a ground. For example, the IC 310 may generate a converted signal by performing at least some of frequency conversion, amplification, filtering, phase control, and power generation.

The adhesive member 320 may adhere the IC 310 and the connection member 200 to each other.

The electrical connection structure 330 may electrically connect the IC 310 and the connection member 200 . For example, the electrical connection structure 330 may have a structure such as a solder ball, a pin, a land, or a pad. The electrical connection structure 330 has a melting point lower than that of the wiring and the ground layer of the connection member 200 , so that the IC 310 and the connection member 200 can be electrically connected through a predetermined process using the low melting point.

The encapsulant 340 may encapsulate at least a portion of the IC 310 , and may improve heat dissipation performance and impact protection performance of the IC 310 . For example, the encapsulant 340 may be implemented with a photo imageable encapsulant (PIE), an Ajinomoto build-up film (ABF), an epoxy molding compound (EMC), or the like.

The passive component 350 may be disposed on the lower surface of the connection member 200 , and may be electrically connected to the wiring and/or the ground layer of the connection member 200 through the electrical connection structure 330 .

The sub-board 410 may be disposed below the connection member 200 , and receives an intermediate frequency (IF) signal or a base band signal from the outside and transmits it to the IC 310 or from the IC 310 . It may be electrically connected to the connection member 200 so as to receive the IF signal or the baseband signal and transmit it to the outside. Here, the frequency of the RF signal (eg, 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz) is greater than the frequency of the IF signal (eg, 2 GHz, 5 GHz, 10 GHz, etc.).

For example, the sub-board 410 may transmit an IF signal or a baseband signal to or from the IC 310 through a wiring that may be included in the IC ground layer of the connection member 200 . Since the first ground layer of the connecting member 200 is disposed between the IC ground layer and the wiring, the IF signal or the baseband signal and the RF signal can be electrically isolated in the antenna module.

Referring to FIG. 10B , the antenna module according to an embodiment of the present invention may include at least a portion of a shielding member 360 , a connector 420 , and a chip antenna 430 .

The shielding member 360 may be disposed below the connecting member 200 to confine the IC 310 together with the connecting member 200 . For example, the shielding member 360 may be disposed to cover the IC 310 and the passive component 350 together (eg, a conformal shield) or respectively cover (eg, a compartment shield). For example, the shielding member 360 may have a hexahedral shape with one open surface, and may have a hexahedral accommodation space through coupling with the connecting member 200 . The shielding member 360 may be implemented with a material of high conductivity, such as copper, to have a short skin depth, and may be electrically connected to the ground layer of the connecting member 200 . Accordingly, the shielding member 360 may reduce electromagnetic noise that the IC 310 and the passive component 350 may receive.

The connector 420 may have a connection structure of a cable (eg, a coaxial cable, a flexible PCB), may be electrically connected to the IC ground layer of the connection member 200, and may perform a role similar to the above-described sub-board. have. That is, the connector 420 may receive an IF signal, a baseband signal, and/or power from a cable, or may provide an IF signal and/or a baseband signal through a cable.

The chip antenna 430 may transmit or receive an RF signal by assisting the antenna device according to an embodiment of the present invention. For example, the chip antenna 430 may include a dielectric block having a higher permittivity than the insulating layer, and a plurality of electrodes disposed on both surfaces of the dielectric block. One of the plurality of electrodes may be electrically connected to the wiring of the connecting member 200 , and the other may be electrically connected to the ground layer of the connecting member 200 .

11 is a side view illustrating a schematic structure of an antenna module including an antenna device according to an embodiment of the present invention.

Referring to FIG. 11 , the antenna module according to an embodiment of the present invention has a structure in which an antenna device 100f, a patch antenna pattern 1110f, an IC 310f, and a passive component 350f are integrated into a connection member 500f. can have

The antenna device 100f and the patch antenna pattern 1110f may be designed the same as the aforementioned antenna device and the aforementioned patch antenna pattern, respectively, and receive and transmit an RF signal from the IC 310f or transmit the received RF signal. may be transmitted to the IC 310f.

The connection member 500f may have a structure in which at least one conductive layer 510f and at least one insulating layer 520f are stacked (eg, a structure of a printed circuit board). The conductive layer 510f may have the above-described ground layer and wiring.

In addition, the antenna module according to an embodiment of the present invention may further include a flexible connection member (550f). The flexible connection member 550f may include a first flexible region 570f overlapping the connection member 500f and a second flexible region 580f not overlapping the connection member 500f when viewed in the vertical direction.

The second flexible region 580f may be flexibly bent in the vertical direction. Accordingly, the second flexible region 580f may be flexibly connected to the connector of the set board and/or to the adjacent antenna module.

The flexible connection member 550f may include a signal line 560f. An intermediate frequency (IF) signal and/or a baseband signal may be transmitted to the IC 310f through a signal line 560f or may be transmitted to a connector of a set board and/or an adjacent antenna module.

12A and 12B are side views illustrating various structures of an antenna module including an antenna device according to an embodiment of the present invention.

Referring to FIG. 12A , the antenna module according to an embodiment of the present invention may have a structure in which an antenna package and a connection member are combined.

The connection member may include at least one conductive layer 1210b and at least one insulating layer 1220b, a wiring via 1230b connected to the at least one conductive layer 1210b, and a wiring via 1230b. It may include a connection pad 1240b connected thereto, and may have a structure similar to that of a copper redistribution layer (RDL). An antenna package may be disposed on the upper surface of the connection member.

The antenna package may include at least a portion of a plurality of patch antenna patterns 1110b, a plurality of upper coupling patterns 1115b, a plurality of patch antenna feed vias 1120b, a dielectric layer 1140b, and a closing member 1150b. .

One end of the plurality of patch antenna feed vias 1120b may be electrically connected to each of the plurality of patch antenna patterns 1110b, and the other ends of the plurality of patch antenna feed vias 1120b may each have at least one conductive layer ( 1210b) may be electrically connected to the corresponding wiring.

The dielectric layer 1140b may be disposed to surround the side surfaces of each of the plurality of feed vias 1120b. The dielectric layer 1140b may have a height greater than a height of the at least one insulating layer 1220b of the connecting member. The antenna package may be advantageous in terms of securing antenna performance as the height and/or width of the dielectric layer 1140b is increased, and boundary conditions (eg, small manufacturing tolerance, short electrical) advantageous for the RF signal transmission/reception operation of the plurality of antenna patterns 1115b. length, smooth surface, large size of the dielectric layer, control of the dielectric constant, etc.).

An encapsulation member 1150b may be disposed on the dielectric layer 1140b, and may improve durability against impact or oxidation of the plurality of patch antenna patterns 1110b and/or the plurality of upper coupling patterns 1115b. can For example, the finishing member 1150b may be implemented with a photo imageable encapsulant (PIE), an Ajinomoto build-up film (ABF), an epoxy molding compound (EMC), or the like, but is not limited thereto.

The IC 1301b, the PMIC 1302b, and the plurality of passive components 1351b, 1352b, and 1353b may be disposed on a lower surface of the connecting member.

The PMIC 1302b may generate power and transfer the generated power to the IC 1301b through at least one conductive layer 1210b of the connection member.

The plurality of passive components 1351b, 1352b, and 1353b may provide impedance to the IC 1301b and/or the PMIC 1302b. For example, the plurality of passive components 1351b, 1352b, and 1353b may include at least some of a capacitor (eg, a multi-layer ceramic capacitor (MLCC)), an inductor, and a chip resistor.

12B, the IC package includes an IC 1300a, an encapsulant 1305a for sealing at least a portion of the IC 1300a, and a support member 1355a disposed so that the first side faces the IC 1300a and a connecting member including at least one conductive layer 1310a and an insulating layer 1280a electrically connected to the IC 1300a and the supporting member 1355a, and may be coupled to the connecting member or the antenna package. have.

The connection member may include at least one conductive layer 1210a , at least one insulating layer 1220a , a wiring via 1230a , a connection pad 1240a , and a passivation layer 1250a . The antenna package includes a plurality of patch antenna patterns 1110a, 1110b, 1110c, 1110d, a plurality of upper coupling patterns 1115a, 1115b, 1115c, 1115d, a plurality of patch antenna feed vias 1120a, 1120b, 1120c, 1120d, It may include a dielectric layer 1140a and a finishing member 1150a.

The IC package may be coupled to the above-described connection member. The RF signal generated by the IC 1300a included in the IC package may be transmitted to the antenna package through at least one conductive layer 1310a and transmitted in the direction of the top surface of the antenna module, and the RF signal received from the antenna package is at least It may be transferred to the IC 1300a through one conductive layer 1310a.

The IC package may further include a connection pad 1330a disposed on an upper surface and/or a lower surface of the IC 1300a. The connection pad disposed on the upper surface of the IC 1300a may be electrically connected to at least one conductive layer 1310a, and the connection pad disposed on the lower surface of the IC 1300a may be electrically connected to the support member through the lower conductive layer 1320a. 1355a) or the core plating member 1365a. Here, the core plating member 1365a may provide a ground region to the IC 1300a.

The support member 1355a includes a core dielectric layer 1356a in contact with the connection member, a core conductive layer 1359a disposed on upper and/or lower surfaces of the core dielectric layer 1356a, and a core passing through the core dielectric layer 1356a. At least one core via 1360a electrically connected to the conductive layer 1359a and electrically connected to the connection pad 1330a may be included. The at least one core via 1360a may be electrically connected to an electrical connection structure 1340a such as a solder ball, a pin, or a land.

Accordingly, the support member 1355a may receive a base signal or power from a lower surface and transmit the base signal and/or power to the IC 1300a through at least one conductive layer 1310a of the connection member.

The IC 1300a may generate an RF signal of a millimeter wave (mmWave) band using the base signal and/or power. For example, the IC 1300a may receive a low-frequency base signal and perform frequency conversion, amplification, filtering phase control, and power generation of the base signal, and a compound semiconductor (eg, GaAs) in consideration of high-frequency characteristics. It may be implemented with or may be implemented with a silicon semiconductor.

Meanwhile, the IC package may further include a passive component 1350a electrically connected to a wiring corresponding to the at least one conductive layer 1310a. The passive component 1350a may be disposed in the accommodation space 1306a provided by the support member 1355a.

Meanwhile, the IC package may include core plating members 1365a and 1370a disposed on side surfaces of the support member 1355a. The core plating members 1365a and 1370a may provide a grounding region to the IC 1300a , and may dissipate heat of the IC 1300a to the outside or remove noise from the IC 1300a.

Meanwhile, the IC package and the connecting member may be independently manufactured and combined, but may also be manufactured together according to design. That is, a separate coupling process between the plurality of packages may be omitted.

Meanwhile, the IC package may be coupled to the connection member through the electrical connection structure 1290a and the passivation layer 1285a, but the electrical connection structure 1290a and the passivation layer 1285a may be omitted depending on the design. .

13A and 13B are plan views illustrating an arrangement of an antenna module in an electronic device according to an embodiment of the present invention.

Referring to FIG. 13A , the antenna module including the antenna device 100g, the patch antenna pattern 1110g and the dielectric layer 1140g is on the set substrate 600g of the electronic device 700g on the side boundary of the electronic device 700g. They may be disposed adjacent to each other.

The electronic device 700g includes a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, and a computer. ), monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, etc., but may be not limited

A communication module 610g and a baseband circuit 620g may be further disposed on the set substrate 600g. The antenna module may be electrically connected to the communication module 610g and/or the baseband circuit 620g through a coaxial cable 630g.

The communication module 610g may include a memory chip such as a volatile memory (eg, DRAM), a non-volatile memory (eg, ROM), a flash memory, etc. to perform digital signal processing; application processor chips such as a central processor (eg, CPU), a graphics processor (eg, GPU), a digital signal processor, an encryption processor, a microprocessor, and a microcontroller; It may include at least a part of logic chips such as analog-to-digital converters and application-specific ICs (ASICs).

The baseband circuit 620g may generate a base signal by performing analog-to-digital conversion, amplification, filtering, and frequency conversion on the analog signal. The base signal input/output from the baseband circuit 620g may be transmitted to the antenna module through a cable.

For example, the base signal may be transmitted to the IC through an electrical connection structure, a core via, and a wiring. The IC may convert the base signal into an RF signal of a millimeter wave (mmWave) band.

Referring to FIG. 13B , a plurality of antenna modules each including an antenna device 100h, a patch antenna pattern 1110h, and a dielectric layer 1140h are formed on a set substrate 600h of the electronic device 700h of the electronic device 700h. It may be disposed adjacent to the boundary of one side and the boundary of the other side, respectively, and a communication module 610h and a baseband circuit 620h may be further disposed on the set substrate 600h. The plurality of antenna modules may be electrically connected to the communication module 610h and/or the baseband circuit 620h through a coaxial cable 630h.

On the other hand, the conductive layer, ground layer, feed line, feed via, antenna pattern, patch antenna pattern, shield via, director pattern, electrical connection structure, plating member, and core via disclosed in this specification are made of a metal material (eg, copper ( conductive material such as Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof). CVD (chemical vapor deposition), PVD (Physical Vapor Deposition), sputtering, Subtractive, Additive, SAP (Semi-Additive Process), MSAP (Modified Semi-Additive Process) ) may be formed according to a plating method, such as, but is not limited thereto.

On the other hand, the dielectric layer and / or insulating layer disclosed herein is a thermosetting resin such as FR4, liquid crystal polymer (LCP), low temperature co-fired ceramic (LTCC), epoxy resin, thermoplastic resin such as polyimide, or these resins Resin impregnated into core material such as glass fiber (Glass Fiber, Glass Cloth, Glass Fabric) along with temporary inorganic fillers, prepreg, Ajinomoto Build-up Film (ABF), FR-4, BT (Bismaleimide Triazine), Photo Imagable Dielectric (PID) resin, a general copper clad laminate (CCL), or a glass or ceramic-based insulating material may be implemented. The insulating layer is a conductive layer, a ground layer, a feed line, a feed via, an antenna pattern, a patch antenna pattern, a shielding via, a director pattern, an electrical connection structure, a plating member, and a core via in the antenna device and antenna module disclosed herein. At least a portion of the non-deployed position may be filled.

On the other hand, the RF signal presented herein is Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, It may have a format according to, but not limited to, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G and any other wireless and wired protocols designated thereafter.

In the above, the present invention has been described with specific matters such as specific components and limited embodiments and drawings, but these are provided to help a more general understanding of the present invention, and the present invention is not limited to the above embodiments. , those of ordinary skill in the art to which the present invention pertains can make various modifications and variations from these descriptions.

100: antenna device
110: feed line (feeding line)
111: feed via (feeding via)
112: via pattern (via pattern)
120: antenna pattern (antenna pattern)
125: director pattern
200: connection member
212: first wiring
214: second wiring
221: first ground layer
222: second ground layer
223: third ground layer
224: fourth ground layer
225: fifth ground layer
231: first wiring via
232: second wiring via
245: a plurality of shielded vias
310: IC (Integrated Circuit)
350: passive parts
360: shield member
P1: first protrusion area
P2: second protrusion area
P3: third protrusion area
C1: first cavity
C2: second cavity
1110: patch antenna pattern
1120: patch antenna feed via

Claims (12)

An antenna pattern having a dipole shape including first and second poles;
a feed line electrically connected to the antenna pattern and extending toward the rear; and
at least one ground layer disposed behind the antenna pattern and spaced apart from the feed line to provide first and second cavities spaced apart from each other toward the first and second poles, respectively; An antenna device comprising a.
The method of claim 1, wherein the at least one ground layer comprises:
an upper ground layer disposed above the feed line; and
a lower ground layer disposed below the feed line and providing the first and second cavities; An antenna device comprising a.
The method of claim 1, wherein the at least one ground layer comprises:
The antenna device further comprising a plurality of ground layers disposed at different heights and protruding forward between the first and second cavities.
4. The method of claim 3,
In the plurality of ground layers, a forwardly protruding portion between the first and second cavities does not overlap the antenna pattern in a vertical direction.
The method of claim 1, wherein the at least one ground layer comprises:
Further comprising a plurality of ground layers disposed at different heights,
A portion of the plurality of ground layers covers the first and second cavities in a vertical direction.
6. The method of claim 5,
Further comprising a feed via electrically connected between the antenna pattern and the feed line,
The antenna pattern is disposed to be farther away from a ground layer covering the first and second cavities among the plurality of ground layers by the feed via.
According to claim 1,
Further comprising a feed via electrically connected between the antenna pattern and the feed line,
The at least one ground layer protrudes toward the feed via.
The method of claim 7, wherein the at least one ground layer comprises:
An antenna device comprising: a middle ground layer disposed at a height between the antenna pattern and the feed line; a lower ground layer disposed below the antenna pattern; and an upper ground layer disposed above the feed line.
8. The method of claim 7,
The antenna device further comprising a director pattern spaced apart in front of the first and second poles at the same height as the first and second poles.
According to claim 1, wherein the feed line,
a first feedline electrically connected to the first pole; and
a second feedline electrically connected to the second pole; An antenna device comprising a.
According to claim 1,
and a plurality of shielding vias electrically connected to the at least one ground layer and arranged along at least a portion of a boundary line of the first and second cavities.
12. The method of claim 11,
The plurality of shielding vias are further arranged along an extension line connecting a rear boundary line of the first and second cavities, and are not arranged along a boundary line in a direction toward each other of the first and second cavities.

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