CN109873246B - Antenna device and antenna module - Google Patents

Abstract

The present disclosure provides an antenna apparatus and an antenna module, the antenna apparatus including: a feeder line; a first ground layer including a surface disposed above or below the feed line and spaced apart from the feed line; and an antenna pattern electrically connected to an end of the feed line and configured to transmit and/or receive a Radio Frequency (RF) signal, wherein the first ground layer includes: a first protruding region protruding toward the antenna pattern in a first longitudinal direction of the surface and at least partially overlapping the feed line above or below the feed line; a second and third protruding region protruding in the first longitudinal direction from a location spaced apart from the first protruding region in opposite lateral directions of the surface.

Description

Antenna device and antenna module

This application claims the rights of korean patent applications No. 10-2017-.

Technical Field

The following description relates to an antenna apparatus and an antenna module.

Background

Mobile communication data traffic tends to grow rapidly every year. Technology development is being sought to support the rapidly growing data in wireless networks in real time. For example, applications that generate content, such as from internet of things (IoT) -based data, Augmented Reality (AR), Virtual Reality (VR), real-time VR/AR in conjunction with Social Networking Services (SNS), autonomous driving, synchronized views (real-time image transmission of user views using compact cameras), etc., require communications (e.g., 5 th generation (5G) communications, millimeter wave (mmWave) communications, etc.) that support a large data exchange.

Therefore, mmWave communication including 5G communication has been studied, and research into commercialization/standardization of an antenna module capable of smoothly implementing mmWave communication has been performed.

RF signals in high frequency bands (e.g., 24GHz, 28GHz, 36GHz, 39GHz, 60GHz, etc.) are easily absorbed and cause loss during transmission, so that communication quality may be drastically reduced. Therefore, antennas for high-band communication may require technical approaches different from those of prior art antenna techniques, and for example, development of specialized techniques such as separate power amplifiers for ensuring antenna gain, integrated antennas and Radio Frequency Integrated Circuits (RFICs), and ensuring effective omni-directional radiated power may be beneficial.

In general, an antenna module providing an mmWave communication environment includes a structure in which an Integrated Circuit (IC) and an antenna are disposed on a board and connected through a coaxial cable to satisfy a high level of antenna performance (e.g., a transmission/reception ratio, gain, directivity, etc.) according to a high frequency. However, this structure may result in insufficient space for antenna layout, limited freedom in antenna shape, increased interference between the antenna and the IC, and increased size and/or cost of the antenna module.

Disclosure of Invention

This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

In one general aspect, an antenna apparatus includes: a feeder line; a first ground layer including a surface disposed above or below the feed line and spaced apart from the feed line; and an antenna pattern electrically connected to an end of the feed line and configured to transmit and/or receive a Radio Frequency (RF) signal, wherein the first ground layer includes: a first protruding region protruding toward the antenna pattern in a first longitudinal direction of the surface and at least partially overlapping the feed line above or below the feed line; a second and third protruding region protruding in the first longitudinal direction from a location spaced apart from the first protruding region in opposite lateral directions of the surface.

The antenna apparatus may further include: a second ground layer disposed above or below the first ground layer and spaced apart from the first ground layer, wherein the second ground layer includes a fourth protruding area protruding toward the antenna pattern in the first longitudinal direction to at least partially overlap with the feed line above or below the feed line, the second ground layer overlaps with a first recessed area recessed in a second longitudinal direction opposite to the first longitudinal direction and disposed between the first protruding area and a second protruding area of the first ground layer, and the second ground layer overlaps with a second recessed area recessed in the second longitudinal direction and disposed between the first protruding area and a third protruding area of the first ground layer.

The antenna apparatus may further include: a feed via disposed to electrically connect the antenna pattern and the feed line, wherein the antenna pattern is spaced apart from the second ground layer by the feed via.

The antenna apparatus may further include: a wiring electrically connected to the feeder line; and a third ground layer disposed above or below the first ground layer, spaced apart from the first ground layer, and surrounding the wiring, wherein the third ground layer includes a third recess region recessed in a horizontal direction opposite to the first longitudinal direction and disposed between the second and third protruding regions of the first ground layer.

The antenna apparatus may further include: a wiring via electrically connected to the wiring; and a fourth ground layer disposed above or below the first ground layer, spaced apart from the first ground layer, and having a through hole through which the routing via passes, wherein the fourth ground layer includes a fourth recessed area recessed in the horizontal direction and disposed between the second protruding area and the third protruding area of the first ground layer.

The first protruding area of the first ground layer may protrude farther in the first longitudinal direction than the second and third protruding areas of the first ground layer.

A distance between the antenna pattern and the first protruding area of the first ground layer in the first longitudinal direction may be shorter than a protruding length of the second protruding area or the third protruding area of the first ground layer in the first longitudinal direction.

The antenna pattern may have the form of a dipole. A length of a first pole of the dipole may be greater than a distance between the first protruding area and the second protruding area of the first ground layer. A length of a second pole of the dipole may be greater than a distance between the first protruding area and the third protruding area of the first ground layer.

The antenna apparatus may further include: a guide body pattern spaced apart from the antenna pattern, wherein a length of the guide body pattern in a lateral direction among the opposite lateral directions is less than a distance between the second protruding area and the third protruding area of the first ground layer and is greater than a length of the first protruding area of the first ground layer in the lateral direction.

The antenna apparatus may further include: a shielded via electrically connected to the first ground plane and disposed along a boundary of an area between the second and third protruding areas of the first ground plane.

In another general aspect, an antenna module includes: a connection member including a first ground layer and a second ground layer including a surface disposed above or below the first ground layer; antenna patterns, each of which is spaced apart from the first and second ground layers and configured to transmit and/or receive a Radio Frequency (RF) signal; feed lines each of which is electrically connected to and extends from a corresponding one of the antenna patterns toward the connection member in a first longitudinal direction parallel to the surface, a protruding ground pattern electrically connected to and protruding from the first ground layer in a second longitudinal direction opposite to the first longitudinal direction to at least partially overlap the feed lines above or below the feed lines, wherein the first ground layer is recessed in the first longitudinal direction in an area corresponding to each of the antenna patterns.

The antenna module may further include: feed vias, each of the feed vias being disposed to electrically connect a corresponding one of the antenna patterns with a corresponding one of the feed lines, wherein the protruding ground pattern is spaced apart from the feed via in the first longitudinal direction.

The feed line may be disposed between the protruding ground pattern and the second ground layer. Each of the protruding ground patterns may protrude in the second longitudinal direction with respect to a corresponding recessed area of the first ground layer. The second ground layer may protrude toward each of the antenna patterns in the second longitudinal direction.

The antenna module may further include: an Integrated Circuit (IC) disposed below the connection member, wherein the connection member includes: wires, each of the wires electrically connected to a corresponding one of the feed lines; wire vias, each of which has one end electrically connected to a corresponding one of the wires and the other end electrically connected to the IC.

The antenna module may further include: a passive component disposed below the connection member; and a shield member disposed under the connection member and surrounding the IC, wherein the first ground layer and the second ground layer are electrically connected to the passive component and the shield member.

The antenna module may further include: a patch antenna pattern disposed above the connection member; and second feeding vias each having one end electrically connected to a corresponding one of the patch antenna patterns, wherein the connection member further includes: second routing wires each electrically connected to a corresponding one of the second feeding vias; second wiring vias each having one end electrically connected to a corresponding one of the second wirings and the other end electrically connected to the IC.

In another general aspect, an antenna apparatus includes: a connection member including a first ground layer and a second ground layer separated from the first ground layer in a vertical direction; an antenna pattern separated from the first and second ground layers in a first longitudinal direction and configured to transmit and/or receive a Radio Frequency (RF) signal; and a feed line electrically connected to the antenna pattern and extending from the antenna pattern toward the first ground layer. Wherein the first ground layer includes: a first recess portion recessed from an end portion of the first ground layer in a second longitudinal direction opposite to the first longitudinal direction and aligned with a first pole of the antenna pattern, and a second recess portion recessed from an end portion of the first ground layer in the second longitudinal direction, spaced apart from the first recess portion in a transverse direction and aligned with a second pole of the antenna pattern.

The antenna apparatus may further include: a first cavity formed by the second ground layer and the first recess portion; and a second cavity formed by the second ground layer and the second recess portion.

The first ground layer may further include a first middle protrusion portion and a side end protrusion portion, wherein the first middle protrusion portion and the side end protrusion portion protrude in the first longitudinal direction at an end portion of the first ground layer and form a boundary of the first cavity and the second cavity.

The second ground layer may include a second middle protruding portion protruding in the first longitudinal direction at an end portion of the second ground layer. The feed line may be disposed between the first intermediate protruding portion and the second intermediate protruding portion in the vertical direction. The first and second intermediate protruding portions may at least partially overlap the feed line in the first longitudinal direction.

In another general aspect, an antenna apparatus includes: a first ground layer including a first recess and a second recess laterally spaced from the first recess; a second ground layer including a longitudinally and laterally extending surface disposed above the first ground layer, and side edges at edges of the surface, wherein portions of the surface are exposed through the first and second recessed portions; a feed line extending longitudinally away from the first and second ground planes and across the side edges; and an antenna pattern electrically connected to the feed line and configured to transmit and/or receive a Radio Frequency (RF) signal, wherein the antenna pattern is longitudinally separated from the first and second ground layers at an outer side of the side edge such that the antenna pattern is opposite to the first and second concave portions.

The antenna apparatus may further include: a feed via disposed to electrically connect the antenna pattern and the feed line, wherein the antenna pattern is distant from the surface in a direction perpendicular to the surface through the feed via.

The antenna device may further include the third ground layer disposed above the first ground layer, wherein the third ground layer includes a third recess portion exposing the portion of the surface.

The surface and the first recess may define a first cavity. The surface and the second recess may define a second cavity.

Other features and aspects will be apparent from the following detailed description, the accompanying drawings, and the claims.

Drawings

Fig. 1 is a perspective view illustrating an antenna apparatus according to an embodiment.

Fig. 2 is a side view illustrating the antenna apparatus shown in fig. 1.

Fig. 3A to 3D are plan views illustrating first to fourth ground layers that may be included in an antenna device and an antenna module according to an embodiment.

Fig. 4A to 4C are plan views illustrating various sizes of first to third protruding areas of the antenna apparatus according to the embodiment.

Fig. 4D is a rear view of the antenna apparatus shown in fig. 4A.

Fig. 5 is a perspective view illustrating an antenna apparatus according to an embodiment.

Fig. 6 is a side view illustrating the antenna apparatus shown in fig. 5.

Fig. 7 is a view illustrating a transmission direction of an RF signal according to a cavity of an antenna apparatus according to an embodiment.

Fig. 8A to 8D are plan views illustrating various arrangements of antenna devices included in an antenna module according to an embodiment.

Fig. 9 is a perspective view illustrating an arrangement of an antenna device included in an antenna module according to an embodiment.

Fig. 10A and 10B are views illustrating a lower structure of a connection member included in an antenna module according to an embodiment.

Fig. 11 is a side view showing a schematic structure of an antenna module according to the embodiment.

Fig. 12A and 12B are side views illustrating various structures of an antenna module according to an embodiment.

Fig. 13A and 13B are plan views illustrating the arrangement of antenna modules in an electronic device according to an embodiment.

Like reference numerals refer to like elements throughout the drawings and the detailed description. The figures may not be drawn to scale and the relative sizes, proportions and depictions of the elements in the figures may be exaggerated for clarity, illustration and convenience.

Detailed Description

The following detailed description is provided to assist the reader in obtaining a thorough understanding of the methods, devices, and/or systems described herein. However, various alternatives, modifications, and equivalents of the methods, apparatus, and/or systems described herein will be apparent to those skilled in the art in view of the disclosure of the present application. For example, the order of operations described herein is merely an example, and is not limited to the order set forth herein, but rather, obvious changes may be made in light of the disclosure herein, except to the extent that operations must occur in a specific order. Moreover, descriptions of features known in the art may be omitted for the sake of clarity and conciseness.

The features described herein may be implemented in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many possible ways to implement the methods, devices, and/or systems described herein that will be apparent upon understanding the disclosure of the present application.

Throughout the specification, when an element such as a layer, region or substrate is described as being "on," "connected to" or "coupled to" another element, it can be directly on, "connected to or" coupled to the other element or one or more other elements may be present therebetween. In contrast, when an element is referred to as being "directly on," "directly connected to" or "directly coupled to" another element, there may be no intervening elements present.

As used herein, the term "and/or" includes any one of the associated listed items and any combination of any two or more.

Although terms such as "first", "second", and "third" may be used herein to describe various elements, components, regions, layers or sections, these elements, components, regions, layers or sections should not be limited by these terms. Rather, these terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section referred to in the examples described herein may be termed a second element, component, region, layer or section without departing from the teachings of the examples.

Spatially relative terms, such as "above … …," "upper," "below … …," and "lower," may be used herein to describe one element's relationship to another element as illustrated in the figures for ease of description. These spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "upper" relative to other elements would then be oriented "below" or "lower" relative to the other elements. Thus, the term "above … …" includes both orientations "above … …" and "below … …" depending on the spatial orientation of the device. The device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative terms used herein interpreted accordingly.

The terminology used herein is for the purpose of describing various examples only and is not intended to be limiting of the disclosure. The singular is intended to include the plural unless the context clearly dictates otherwise. The terms "comprising," "including," and "having" specify the presence of stated features, integers, operations, elements, components, and/or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, operations, components, elements, and/or combinations thereof.

Here, it should be noted that the use of the term "may" with respect to an example or embodiment (e.g., with respect to what an example or embodiment may include or implement) means that there is at least one example or embodiment that includes or implements such a feature, but all examples and embodiments are not limited thereto.

The features of the examples described herein may be combined in various ways that will be apparent upon understanding the disclosure of the present application. Further, while the examples described herein have various configurations, other configurations are possible as will be apparent upon understanding the disclosure of the present application.

Fig. 1 is a perspective view illustrating an antenna apparatus 100 according to an embodiment. Fig. 2 is a side view showing the antenna apparatus 100.

Referring to fig. 1 and 2, the antenna device 100 may include an antenna pattern 120a and a connection member 200 a. The antenna pattern 120a may receive a Radio Frequency (RF) signal from the connection member 200a via the feed line 110a and remotely transmit the RF signal in the x-direction, or the antenna pattern 120a may remotely receive an RF signal in the x-direction and transmit the received RF signal to the connection member 200a via the feed line 110 a. For example, the antenna pattern 120a may have a dipole shape, and thus, the antenna pattern 120a may have a structure extending on the xy plane.

Referring to fig. 1 and 2, the connection member 200a may include at least portions of the first, second, third, fourth, and fifth ground layers 221a, 222a, 223a, 224a, and 225a, and may further include an insulating layer disposed between adjacent ones of the first, second, third, fourth, and fifth ground layers 221a, 222a, 223a, 224a, and 225 a. The first ground layer 221a, the second ground layer 222a, the third ground layer 223a, the fourth ground layer 224a, and the fifth ground layer 225a may be spaced apart from each other in the vertical direction (z direction).

The antenna device 100 may include at least one of a first ground layer 221a, a second ground layer 222a, a third ground layer 223a, a fourth ground layer 224a, and a fifth ground layer 225 a. The number and vertical relationship of the first ground layer 221a, the second ground layer 222a, the third ground layer 223a, the fourth ground layer 224a, and the fifth ground layer 225a may vary according to the design of the antenna device 100.

For example, the first ground layer 221a, the second ground layer 222a, the third ground layer 223a, the fourth ground layer 224a, and the fifth ground layer 225a may include surfaces extending in the x-direction and the y-direction (e.g., in the xy-plane), respectively. Therefore, each of the first ground layer 221a, the second ground layer 222a, the third ground layer 223a, the fourth ground layer 224a, and the fifth ground layer 225a may be (indirectly) disposed on a surface of an adjacent ground layer among the first ground layer 221a, the second ground layer 222a, the third ground layer 223a, the fourth ground layer 224a, and the fifth ground layer 225 a.

The fourth ground layer 224a and the fifth ground layer 225a may provide a ground for use in passive components and/or passive components of a circuit and/or Integrated Circuit (IC). In addition, the fourth ground layer 224a and the fifth ground layer 225a may provide transmission paths for signals and power used in the IC and/or passive components. Accordingly, the fourth ground layer 224a and the fifth ground layer 225a may be electrically connected to the IC and/or the passive components.

The fourth ground layer 224a and the fifth ground layer 225a may be omitted depending on the grounding requirements of the IC and/or the passive components. The fourth ground layer 224a and the fifth ground layer 225a may have through holes through which the routing vias pass.

The third ground layer 223a may be disposed above the fourth and fifth ground layers 224a and 225a, spaced apart from the fourth and fifth ground layers 224a and 225a, and may surround a wiring, through which an RF signal flows, at the same height as that of the wiring. The wires may be electrically connected to the IC via wire vias.

The first and second ground layers 221a and 222a may be disposed above the fourth and fifth ground layers 224a and 225a, spaced apart from the fourth and fifth ground layers 224a and 225a, and may be disposed below and above the third ground layer 223a, respectively. The first ground layer 221a may improve electromagnetic isolation between the wiring and the IC and provide a ground for the IC and/or passive components. The second ground layer 222a may enhance electromagnetic isolation between the wiring and the patch antenna pattern, provide a boundary condition for the patch antenna pattern, and reflect RF signals transmitted/received by the patch antenna pattern to further concentrate a transmission/reception direction of the patch antenna pattern.

The second ground layer 222a may protrude farther than the first ground layer 221a, the third ground layer 223a, the fourth ground layer 224a, and the fifth ground layer 225 a. For example, the second ground layer 222a may protrude farther in the x-direction than the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225 a. Accordingly, the second ground layer 222a may electromagnetically shield between the patch antenna pattern and the antenna pattern 120a, and thus, may improve electromagnetic isolation between the patch antenna pattern and the antenna pattern 120 a.

When viewed in the vertical direction (z direction), boundaries of the first ground layer 221a, the third ground layer 223a, the fourth ground layer 224a, and the fifth ground layer 225a may overlap each other. That is, the boundaries of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a may overlap each other in the x-direction and the y-direction. The boundaries may serve as reflectors of the antenna pattern 120a, and thus, the effective distances between the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a and the antenna pattern 120a may affect the antenna performance of the antenna pattern 120 a.

For example, if the effective distance is shorter than the reference distance, the gain of the antenna pattern 120a may be deteriorated according to the dispersion of the RF signal transmitted through the antenna pattern 120a and the resonant frequency of the antenna pattern 120a may be difficult to optimize due to the increase of the capacitance between the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a and the antenna pattern 120 a.

In addition, if the antenna pattern 120a is disposed away from the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a, the size of the antenna device 100 and the size of an antenna module including the antenna device 100 may increase.

In addition, if the connection member 200a is small, an arrangement space of transmission paths of power and signals and wirings may be insufficient, ground stability of the ground layers 221a, 223a, 224a, and 225a may be deteriorated, and an arrangement space of the patch antenna pattern may be insufficient. That is, the performance of the antenna apparatus 100 and the antenna module may be deteriorated.

The antenna device 100 and the antenna module may have such a structure: in this structure, an effective distance between the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a and the antenna pattern 120 is provided, while the antenna pattern 120a is disposed adjacent to the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225 a. Accordingly, the antenna device 100 and the antenna module may have a reduced size and/or improved performance.

Referring to fig. 1 and 2, at least one of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a included in the connection member 200a may have, as compared to the second ground layer 222 a: a first protruding region P1 protruding toward the antenna pattern 120a along the x direction to overlap with at least a part of the feed line 110a when viewed in the vertical direction (z direction); the second and third protrusion regions P2 and P3 protrude in the x direction from positions separated from the first protrusion region P1 in the first and second lateral directions (e.g., the y direction and a direction opposite to the y direction), respectively. The first protrusion area P1 may overlap at least a portion of the feed line 110a in the x-direction and the y-direction.

Due to the first, second, and third protruding areas P1, P2, and P3, at least one of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a may have a concave-convex structure at a boundary facing the antenna pattern 120 a. That is, the first cavity C1 may be formed between the first and second protrusion regions P1 and P2, and the second cavity C2 may be formed between the first and third protrusion regions P1 and P3. The first cavity C1 and the second cavity C2 may provide boundary conditions advantageous to ensure antenna performance of the antenna pattern 120 a.

Since the boundary of at least one of the first ground layer 221a, the third ground layer 223a, the fourth ground layer 224a, and the fifth ground layer 225a facing the antenna pattern 120a may serve as a reflector of the antenna pattern 120a, a portion of the RF signal transmitted through the antenna pattern 120a may be reflected from the boundary of at least one of the first ground layer 221a, the third ground layer 223a, the fourth ground layer 224a, and the fifth ground layer 225 a.

The first and second cavities C1 and C2 may be recessed between one and the other ends of the first and second poles of the antenna pattern 120a in a direction (e.g., a direction opposite to the x-direction) toward at least one of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a, respectively. That is, the first and second cavities C1 and C2 may function as reflectors of the first and second poles of the antenna pattern 120a, respectively.

Therefore, without a substantial change in the position of the antenna pattern 120a, an effective distance from each pole of the antenna pattern 120a to at least one of the first ground layer 221a, the third ground layer 223a, the fourth ground layer 224a, and the fifth ground layer 225a may be increased as compared to an antenna device without the first cavity C1 and the second cavity C2. Alternatively, the antenna pattern 120a may be disposed closer to the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a than an antenna device without the first and second cavities C1 and C2 without substantially sacrificing antenna performance.

For example, among the RF signals transmitted through each pole of the antenna pattern 120a, the RF signals moving toward the first and second cavities C1 and C2 may be further concentrated and reflected in the x-direction, as compared to the case where the first and second cavities C1 and C2 are not present. Accordingly, the gain of the antenna pattern 120a may be further improved as compared to the case where the first and second cavities C1 and C2 are not present.

For example, the capacitance between each pole of the antenna pattern 120a and the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a may be smaller than in the case where the first and second cavities C1 and C2 do not exist. Accordingly, the resonant frequency of the antenna pattern 120a may be further easily optimized.

In addition, the first protrusion area P1 may provide an additional resonance point according to electromagnetic coupling with the antenna pattern 120 a. The resonance point may depend on the shape of the first protrusion region P1 (e.g., width, length, thickness, distance from the second and third protrusion regions P2 and P3, distance from the antenna pattern 120a, and the like).

When the additional resonance point provided by the first protrusion region P1 is close to the frequency band of the antenna pattern 120a, the bandwidth of the antenna pattern 120a may be extended. In addition, the additional resonance point provided by the first protrusion area P1 may support an additional frequency band of the antenna pattern 120a to enable multi-band communication of the antenna pattern 120 a. Accordingly, the first protrusion region P1 may widen the bandwidth of the antenna pattern 120a or expand the communication band of the antenna pattern 120 a.

In addition, the second and third protruding regions P2 and P3 may electromagnetically shield between the antenna pattern 120a and an adjacent antenna device. Accordingly, the distance between the antenna pattern 120a and the adjacent antenna device may be further reduced and the size of the antenna module may be reduced, as compared to an antenna module in which the second and third protruding regions P2 and P3 are not present.

Referring to fig. 1 and 2, the connection member 200a may further include a shield via 245a electrically connected to at least two of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a and arranged to surround at least a portion of each of the first and second cavities C1 and C2 when viewed in a vertical direction (z direction). That is, the shielded via 245a may surround at least a portion of each of the first cavity C1 and the second cavity C2 in the x-direction and/or the y-direction.

The shielded via 245a may reflect an RF signal leaked to gaps between the first ground layer 221a, the third ground layer 223a, the fourth ground layer 224a, and the fifth ground layer 225a among the RF signal transmitted through the antenna pattern 120 a. Accordingly, the gain of the antenna pattern 120a may be further improved, and the electromagnetic isolation between the antenna pattern 120a and the wiring may be improved.

Still referring to fig. 1 and 2, the antenna device 100 may include at least some of a feed line 110a, a feed via 111a, an antenna pattern 120a, a director pattern 125a, and a connection member 200 a.

Since the feed line 110a may be electrically connected to the wiring in the third ground layer 223a, the feed line 110a may function as a transmission path of the RF signal. The feed line 110a may be considered as a component included in the third ground layer 223 a. Since the antenna pattern 120a may be disposed adjacent to the side of the connection member 200a, the feed line 110a may have a structure extending from the wiring of the third ground layer 223a toward the antenna pattern 120 a.

The feed line 110a may be disposed between at least two first protruding areas P1 of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225 a. Accordingly, the feed line 110a may reduce electromagnetic noise that may be received from at least one of the antenna pattern 120a, an adjacent antenna device, and a patch antenna pattern. As the width (y direction) and the length (x direction) of the first protrusion region P1 increase, the electromagnetic noise of the feed line 110a may further decrease.

The feed line 110a may include a first feed line and a second feed line. For example, the first feed line may transmit an RF signal to the antenna pattern 120a, and the second feed line may receive an RF signal from the antenna pattern 120 a. For example, the first feed line may receive an RF signal from the antenna pattern 120a or transmit an RF signal to the antenna pattern 120a, and the second feed line may provide an impedance to the antenna pattern 120 a.

For example, the first and second feed lines may each transmit and receive an RF signal to and from the antenna pattern 120a, and may be configured in a differential feed manner to have a phase difference (e.g., 180 ° and 90 °). The phase difference may be achieved by a phase shifter of the IC or an electrical length difference between the first and second feed lines.

Meanwhile, the feeding line 110a may include an 1/4 wavelength converter, a balun, or an impedance conversion line, according to design, to improve RF signal transmission efficiency. However, the 1/4 wavelength converter, balun, or impedance transformation line may be omitted depending on the design.

The feed via 111a may be provided to electrically connect the antenna pattern 120a and the feed line 110 a. The feed via 111a may be disposed perpendicular to the antenna pattern 120a and the feed line 110 a. In an alternative example in which the antenna pattern 120a and the feed line 110a are arranged at the same height in the z direction, the feed via 111a may be omitted.

Due to the feed via 111a, the antenna pattern 120a may be disposed at a position higher than the feed line 110a or lower than the feed line 110 a. The specific position of the antenna pattern 120a may vary according to the length of the feed via 111a, and thus, the radiation pattern direction of the antenna pattern 120a may be slightly inclined in the vertical direction (z direction) according to the length of the feed via 111 a.

For example, the antenna pattern 120a may be disposed under the feed line 110a to be vertically spaced apart from the second ground layer 222a by the feed via 111 a. Accordingly, the second ground layer 222a may further improve electromagnetic isolation between the antenna pattern 120a and the patch antenna pattern.

The via pattern 112a may be coupled to the feed via 111a and may support each of upper and lower portions of the feed via 111 a.

The antenna pattern 120a may be electrically connected to the feed line 110a and transmit or receive an RF signal. One end of each pole of the antenna pattern 120a may be electrically connected to the first and second feed lines of the feed line 110 a.

The antenna pattern 120a may have a frequency band (e.g., 28GHz, 60GHz) according to at least one of a pole length, a pole thickness, a spacing between poles, a distance between a pole and a side surface of the connection member, and a dielectric constant of the insulating layer.

The antenna pattern 120a and the director pattern 125a may be considered as components included in the fourth ground layer 224 a. Depending on design and performance considerations, the director pattern 125a may be omitted in alternative embodiments.

The director pattern 125a may be laterally spaced apart from the antenna pattern 120a in the x-direction. The director pattern 125a may be electromagnetically coupled to the antenna pattern 120a to improve the gain or bandwidth of the antenna pattern 120 a. Since the length of the director pattern 125a is shorter than the total length of the dipoles of the antenna pattern 120a, the concentration of electromagnetic coupling of the antenna pattern 120a may be further improved, and thus, the gain and directivity of the antenna pattern 120a may be further improved.

Fig. 3A to 3D are plan views illustrating a first ground layer 221a, a second ground layer 222a, a third ground layer 223A, and a fourth ground layer 224a that may be included in the antenna device 100 and the antenna module according to the embodiment, wherein fig. 3B is a plan view illustrating a portion of the second ground layer 222 a.

Referring to fig. 3A, the first protrusion area P1 of the first ground layer 221a may protrude more than the second and third protrusion areas P2 and P3 in the x-direction. Accordingly, the antenna pattern 120a may further improve electromagnetic coupling with respect to the first protruding area P1 while more easily providing an effective distance with respect to the first ground layer 221 a. Therefore, the antenna performance of the antenna device 100 can be further improved.

The first protruding area P1 may be included in the first ground layer 221a, and may be considered as a protruding ground pattern electrically connected to the first ground layer 221a as a separate component according to a viewpoint.

The shield via 245a may be electrically connected to the first ground layer 221a, and may be disposed along a boundary of an area between the second and third protruding areas P2 and P3. In addition, the first ground layer 221a may have through holes through which the first and second routing vias 231a and 232a pass. Meanwhile, the via hole pattern 112a coupled to the feed via hole 111a may be considered as a component included in the first ground layer 221a according to a viewpoint.

Referring to fig. 3A and 3B, when viewed in the vertical direction (z direction), the second ground layer 222a may have a fourth protruding area P4, and the second ground layer 222a overlaps an area (first cavity) between the first protruding area P1 and the second protruding area P2 of the first ground layer 221a and overlaps an area (second cavity) between the first protruding area P1 and the third protruding area P3 of the first ground layer 221 a. That is, the fourth protrusion area P4 may overlap the first cavity between the first and second protrusion areas P1 and P2 of the first ground layer 221a in the x and y directions, and the fourth protrusion area P4 may overlap the second cavity between the first and third protrusion areas P1 and P3 of the first ground layer 221a in the x and y directions. Accordingly, the antenna pattern 120a may further improve electromagnetic coupling with respect to the fourth protrusion region P4 and provide electromagnetic isolation with respect to the patch antenna pattern disposed at the upper side. Therefore, the antenna performance of the antenna device 100 and the antenna module can be further improved.

Further, the shielded vias 245a may be electrically connected to the second ground plane 222a and may be disposed along a boundary of the second ground plane 222 a. In addition, the second ground layer 222a may have a through hole through which the second feed via 1120a passes. The second feed via 1120a may electrically connect the patch antenna pattern and the second wire.

Referring to fig. 3C, the antenna apparatus 100 and the antenna module may include: a first wire 212a for electrically connecting the feed line 110a and the first wire via 231a to each other; and a second wire 214a electrically connecting the second feed via 1120a and the second wire via 232a to each other.

The third ground layer 223a may be disposed to surround each of the first and second wirings 212a and 214 a. Therefore, electromagnetic noise of each of the first wiring 212a and the second wiring 214a can be reduced.

The shielded via 245a may be electrically connected to the third ground layer 223a, and may be disposed along the third ground layer 223a and the boundary of the first and second routing lines 212a and 214 a. Therefore, the electromagnetic noise of each of the first wiring 212a and the second wiring 214a can be further reduced.

Referring to fig. 3A and 3C, the third ground layer 223A may be configured such that an area of the third ground layer 223A between the second protruding area P2 and the third protruding area P3 of the first ground layer 221a is recessed when viewed in the vertical direction (z direction). In other words, the area of the third ground layer 223a between the second protruding area P2 and the third protruding area P3 of the first ground layer 221a may be recessed in the direction opposite to the x-direction. That is, the third ground layer 223a may have a second protruding area P2-2 and a third protruding area P3-2.

Referring to fig. 3A and 3D, the fourth ground layer 224a may be configured such that an area of the fourth ground layer 224a between the second and third protruding areas P2 and P3 of the first ground layer 221a is recessed when viewed in the vertical direction (z direction). In other words, the area of the fourth ground layer 224a between the second and third protruding areas P2 and P3 of the first ground layer 221a may be recessed in the direction opposite to the x-direction. That is, the fourth ground layer 224a may have the second protruding area P2-3 and the third protruding area P3-3.

The shielded via 245a may be electrically connected to the fourth ground plane 224a and arranged to surround an area between the second protruding region P2-3 and the third protruding region P3-3.

The fourth ground layer 224a may have through holes through which the first and second routing vias 231a and 232a pass. The first and second routing vias 231a and 232a may be electrically connected to the IC disposed under the fourth ground layer 224 a.

The antenna pattern 120a and the director pattern 125a may be considered as components included in the fourth ground layer 224a according to a viewpoint.

As the number of ground layers providing the cavities in the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a increases, the length of the cavities in the vertical direction (z direction) may increase. The length of the cavity in the vertical direction (z direction) may affect the antenna performance of the antenna pattern 120 a. In the antenna device 100 and the antenna module, since the length of the cavity in the z direction can be easily adjusted by adjusting the number of ground layers providing the cavity, the antenna performance of the antenna pattern 120a can be more easily adjusted than in the conventional antenna device.

The recess regions of at least two of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a may have the same rectangular shape. Thus, the cavity may form a cuboid. When the cavity is a rectangular parallelepiped, the ratio of the x-vector component among the x-vector component and the y-vector component of the RF signal reflected from the boundary of the cavity can be further increased. Since the y-vector component is more easily cancelled than the x-vector component in the cavity, the antenna pattern 120a may have a higher gain ratio as the ratio of the x-vector component of the RF signal reflected from the boundary of the cavity increases. Therefore, the closer the cavity is configured to the rectangular parallelepiped, the more the antenna pattern 120a may have a further improved gain.

Fig. 4A to 4C are plan views illustrating various sizes of the first, second, and third protrusion regions P1, P2, and P3 of the antenna devices 100-1, 100-2, and 100-3 according to the embodiment. Fig. 4D is a rear view of the antenna device 100-1 shown in fig. 4A.

Referring to fig. 4A through 4C, the antenna device 100-1 and the corresponding antenna module may include a feeder line 110C, a feed via hole 111C, an antenna pattern 120C, a director pattern 125C, a first ground layer 221C, and a second ground layer 222C, the antenna device 100-2 and the corresponding antenna module may include a feeder line 110d, a feed via hole 111d, an antenna pattern 120d, a director pattern 125d, a first ground layer 221d, and a second ground layer 222d, and the antenna device 100-3 and the corresponding antenna module may include a feeder line 110e, a feed via hole 111e, an antenna pattern 120e, a director pattern 125e, a first ground layer 221e, and a second ground layer 222 e.

Referring to the antenna device 100-1 of fig. 4A, the first protruding area P1 of the first ground layer 221c may have a first width w1 and a first height h 1. Referring to the antenna apparatus 100-2 of fig. 4B, the first protruding area P1 of the first ground layer 221d may have a second width w2 and a first height h 1. Referring to the antenna apparatus 100-3 of fig. 4C, the first protruding area P1 of the first ground layer 221e may have a first width w1 and a second height h 2.

The second width w2 may be shorter than the first width w 1. Accordingly, the band positions and bandwidths of the antenna patterns 120c, 120d, and 120e may be changed.

The first height h1 of the first protrusion region P1 may be longer than the protrusion length of the second and third protrusion regions P2 and P3, and the second height h2 may be shorter than the protrusion length of the second and third protrusion regions P2 and P3.

The distance between the antenna patterns 120c, 120d, and 120e and the first protrusion region P1 in the x direction may be shorter than the protrusion length of the second and third protrusion regions P2 and P3 in the x direction. Accordingly, the antenna devices 100-1, 100-2, and 100-3 and the corresponding antenna modules may have a reduced size without significantly hindering the RF signal reflection performance of the first ground layers 221c, 221d, and 221e, as compared to conventional antenna devices and antenna modules.

The lengths of the first poles of the antenna patterns 120c and 120e in the y direction may be longer than the distance between the first and second protruding regions P1 and P2 (first cavities) of the first ground layers 221c and 221e in the y direction, and the lengths of the second poles of the antenna patterns 120c and 120e in the y direction may be longer than the distance between the first and third protruding regions P1 and P3 (second cavities) of the first ground layers 221c and 221e in the y direction. Accordingly, the first ground layers 221c and 221e may reflect the RF signals of the antenna patterns 120c and 120e, respectively, while further concentrating the RF signals in a specific direction (x-direction).

Further, the length of the guide body patterns 125c and 125e in the length direction (y direction) of the guide body patterns 125c and 125e may be shorter than the length of the space between the second and third protruding areas P2 and P3 of the first ground layers 221c and 221e in the y direction and longer than the length of the first protruding area P1 of the first ground layers 221c and 221e in the width direction (y direction) of the first protruding area P1 of the first ground layers 221c and 221 e. Accordingly, the antenna devices 100-1 and 100-3 and the corresponding antenna modules may have a reduced size while ensuring antenna performance (e.g., bandwidth, directivity, etc.).

Fig. 5 is a perspective view illustrating the antenna apparatus 100-4 according to the embodiment. Fig. 6 is a side view showing the antenna device 100-4.

Referring to fig. 5 and 6, the antenna pattern 120b may have the form of a folded dipole, and the feeding via and the director pattern may be omitted.

The feed line 110b may be disposed at the same height as the fourth ground layer 224b in the z direction, and may be electrically connected to the first wiring surrounded by the fourth ground layer 224 b.

The connection member 200b may include at least one of a first ground layer 221b, a second ground layer 222b, a third ground layer 223b, a fourth ground layer 224b, and a fifth ground layer 225b, and a shielded via 245 b. The fourth protruding area of the second ground layer 222b may be omitted.

The first ground layer 221b may be recessed in a direction (e.g., x-direction) in which the feed line 110b extends from the antenna pattern 120b, and may include a protruding ground pattern P1-2. The protruding ground pattern P1-2 may correspond to the first protruding region described above.

The fifth ground layer 225b may have a protruding area according to design. The protruding region and the protruding ground pattern P1-2 may be electromagnetically coupled to the antenna pattern 120b, and may provide the boundaries of the first cavity and the second cavity described above.

Fig. 7 is a view illustrating a transmission direction of an RF signal according to a cavity of an antenna apparatus according to an embodiment.

Referring to fig. 7, an RF signal transmitted through the wiring via 230, then through the feed line 110, and then through the feed via 111 may be transmitted through each pole of the antenna pattern 120. A portion of the RF signal transmitted through each pole of the antenna pattern 120 may be radiated forward by the director pattern 125.

Among the RF signals transmitted through each pole of the antenna pattern 120, the RF signals transmitted toward the first ground layer 221 may be further concentrated by the first and second cavities of the first ground layer 221 and may be reflected from the boundaries of the first and second cavities. The reflected RF signal may be further concentrated to be transmitted at the front side of the antenna pattern 120. Therefore, the gain of the antenna apparatus can be further improved as compared with the conventional antenna apparatus.

Fig. 8A to 8D are plan views illustrating various arrangements of antenna devices respectively included in the antenna modules 1000, 1000-1, 1000-2, and 1000-3 according to embodiments.

Referring to fig. 8A, the antenna module 1000 may include a first antenna device 101e, a second antenna device 102e, and a first ground layer 221 e.

Referring to fig. 8B, the antenna module 1000-1 may include a first antenna device 101f, a second antenna device 102f, a third antenna device 103f, a fourth antenna device 104f, and a first ground plane 221 f.

Referring to fig. 8C, the antenna module 1000-2 may include a first antenna device 101g, a second antenna device 102g, a third antenna device 103g, a fourth antenna device 104g, and a first ground plane 221 g.

In the antenna modules 1000-1, 1000-2, and 1000-3, the antenna package may be omitted.

Referring to fig. 8D, the antenna module 1000-3 may include a first antenna device 101h, a second antenna device 102h, a third antenna device 103h, a fourth antenna device 104h, a first ground plane 221h, and an IC1300 h.

The first ground layers 221e, 221f, 221g, and 221h improve isolation between the respective antenna devices therein, and may provide specific arrangement positions of the respective antenna devices.

Fig. 9 is a perspective view showing the arrangement of the antenna devices 100c and 100d included in the antenna module 1000-4.

Referring to fig. 9, the antenna module 1000-4 may include antenna devices 100c and 100d, a patch antenna pattern 1110d, a patch antenna cavity 1130d, dielectric layers 1140c and 1140d, a plating member 1160d, patch antennas 1170c and 1170d, and dipole antennas 1175c and 1175 d.

The antenna devices 100c and 100d may be similar to the antenna devices described above with reference to fig. 1 to 8 and may be arranged in parallel adjacent to the sides of the antenna module 1000-4. Accordingly, some of the antenna apparatuses 100c and 100d may transmit and receive RF signals in the x-axis direction, and other of the antenna apparatuses 100c and 100d may transmit and receive RF signals in the y-axis direction.

The patch antenna pattern 1110d may be disposed adjacent to an upper side of the antenna module 1000-4 and may transmit and receive an RF signal in a vertical direction (z direction). The number, arrangement, and shape of the patch antenna pattern 1110d are not limited. For example, the patch antenna patterns 1110d may have a circular shape or a rectangular shape and may be arranged in an n × n structure (where n is a natural number of 2 or more), and the number of patch antenna patterns may be 16.

The patch antenna cavity 1130d may be formed to cover side surfaces and an underside of the patch antenna pattern 1110d, respectively, and may provide boundary conditions for transmitting and receiving RF signals of the patch antenna pattern 1110d, respectively.

The chip antennas 1170c and 1170d may include two electrodes opposite to each other, may be disposed on an upper side or a lower side of the antenna module, and may be disposed to transmit and receive an RF signal in an x-axis direction and/or in a y-axis direction through one of the two electrodes.

The dipole antennas 1175c and 1175d may be disposed on the upper or lower side of the antenna module 1000-4 and may transmit and receive RF signals in the z-axis direction. That is, the dipole antennas 1175c and 1175d may be disposed upright in the vertical direction (z direction) so as to be perpendicular to the antenna devices 100c and 100 d. Depending on the design, at least some of the dipole antennas 1175c and 1175d may be replaced by monopole antennas.

Fig. 10A and 10B are views illustrating a lower structure of a connection member 200 of an antenna module including an antenna device according to an embodiment.

Referring to fig. 10A, the antenna module may include at least some of a connection member 200, an IC 310, an adhesive member 320, an electrical connection structure 330, an encapsulant 340, a passive component 350, and a sub-board 410.

The connection member 200 may have a structure similar to that of the connection members 200a and 200b described above with reference to fig. 1 to 8.

The IC 310 is the same as the IC described above, and may be disposed at the lower side of the connection member 200. The IC 310 may be electrically connected to a wiring of the connection member 200 to transmit or receive an RF signal, and may be electrically connected to a ground layer of the connection member 200 to be grounded. For example, IC 310 may perform at least some of frequency conversion, amplification, filtering, phase control, and power generation to produce a converted signal.

The adhesive member 320 may adhere the IC 310 and the connection member 200 to each other.

The electrical connection structure 330 may electrically connect the IC 310 and the connection member 200. For example, the electrical connection structure 330 may have a structure such as a solder ball, a pin, a pad, or a pad. The electrical connection structure 330 may have a melting point lower than that of the wiring and ground layers of the connection member 200, and thus, the electrical connection structure 330 may electrically connect the IC 310 and the connection member 200 using a low melting point through a predetermined process.

Encapsulant 340 may encapsulate at least a portion of IC 310 and improve heat dissipation and shock resistance of IC 310. For example, the encapsulant 340 may be a photosensitive encapsulant (PIE), ABF (Ajinomoto build-up film), or an Epoxy Molding Compound (EMC).

The passive components 350 may be disposed on the lower surface of the connection member 200 and may be electrically connected to the wiring and/or ground layer of the connection member 200 through the electrical connection structure 330.

The sub board 410 may be disposed under the connection member 200 and may be electrically connected to the connection member 200 to receive an Intermediate Frequency (IF) signal or a baseband signal from the outside and transmit the received signal to the IC 310, or to receive the IF signal or the baseband signal from the IC 310 and transmit the received signal to the outside. For example, the frequency of the RF signal (e.g., 24GHz, 28GHz, 36GHz, 39GHz, and 60GHz) may be higher than the frequency of the IF signal (e.g., 2GHz, 5GHz, 10GHz, etc.).

For example, the sub board 410 may transmit or receive an IF signal or a baseband signal to or from the IC 310 through a wiring included in an IC ground layer of the connection member 200. Since the first ground layer of the connection member 200 is disposed between the IC ground layer and the wiring, the IF signal or the baseband signal and the RF signal may be electrically isolated in the antenna module.

Referring to fig. 10B, the antenna module may include at least some of the shielding member 360, the connector 420, and the chip antenna 430.

The shielding member 360 may be disposed under the connection member 200 and confine the IC 310 and the connection member 200 together. For example, the shielding member 360 may be provided to cover the IC 310 and the passive component 350 together (e.g., conformal shielding) or to cover the IC 310 and the passive component 350, respectively (e.g., compartment shielding). For example, the shielding member 360 may have a hexahedral shape with one side thereof opened, and a hexahedral receiving space may be formed by combination with the connection member 200. The shielding member 360 may be formed using a material having high conductivity such as copper, may have a short skin depth, and may be electrically connected to the ground layer of the connection member 200. Accordingly, the shielding member 360 may reduce electromagnetic noise that may act on the IC 310 and the passive components 350.

The connector 420 may have a connection structure of a cable (e.g., a coaxial cable or a flexible PCB), may be electrically connected to an IC ground layer of the connection member 200, and may have a similar function to that of the daughter board described above. That is, the connector 420 may be supplied with the IF signal, the baseband signal, and/or the power from the cable, or may supply the IF signal and/or the baseband signal to the cable.

According to an embodiment, the patch antenna 430 may transmit or receive an RF signal to assist the antenna apparatus. For example, the chip antenna 430 may include a dielectric block having a dielectric constant higher than that of the insulating layer and a plurality of electrodes disposed on both sides of the dielectric block. One of the plurality of electrodes may be electrically connected to the wiring of the connection member 200, and the other of the plurality of electrodes may be electrically connected to the ground layer of the connection member 200.

Fig. 11 is a side view illustrating a schematic structure of an antenna module 1000-5 including the antenna device 100f according to the embodiment.

Referring to fig. 11, the antenna module 1000-5 may include an antenna device 100f, a patch antenna pattern 1110f, an IC 310f, and a passive component 350f integrated in a connection member 500 f.

The antenna device 100f and the patch antenna pattern 1110f may be designed to be the same as the antenna device 100c/100d and the patch antenna pattern 1110d described above, and may receive an RF signal from the IC 310f and transmit the received RF signal, or transmit the received RF signal to the IC 310 f.

The connection member 500f may have a structure (e.g., a structure of a Printed Circuit Board (PCB)) in which at least one conductive layer 510f and at least one insulating layer 520f are stacked. The conductive layer 510f may include the ground layer and the wiring described above.

In addition, the antenna module 1000-5 may further include a flexible connection member 550 f. When viewed in a vertical direction, the flexible connecting member 550f may include a first flexible region 570f overlapping the connecting member 500f and a second flexible region 580f not overlapping the connecting member 500 f. That is, first flexible region 570f may overlap connecting member 500f in the xy plane, and second flexible region 580f may not overlap connecting member 500f in the xy plane.

The second flexible region 580f can be flexibly bent in the vertical direction. Accordingly, the second flexible region 580f may be flexibly connected to an adjacent antenna module and/or connector of the set board (set board).

The flexible connecting member 550f may include a signal line 560 f. Intermediate Frequency (IF) signals and/or baseband signals may be sent to IC 310f via signal line 560f or to adjacent antenna modules and/or connectors of the panel.

Fig. 12A and 12B are side views illustrating various structures of antenna modules 1000-6 and 1000-7 respectively including antenna devices 100e and 100f according to an embodiment.

Referring to fig. 12A, the antenna module 1000-6 may have a structure in which an antenna package 100e and a connection member are combined.

The connection member may include at least one conductive layer 1210b and at least one insulating layer 1220b, may include a routing via 1230b connected to the at least one conductive layer 1210b and a connection pad 1240b connected to the routing via 1230b, and may have a structure similar to that of a copper redistribution layer (RDL). The antenna package may be disposed on an upper surface of the connection member.

The antenna package may include at least some of the patch antenna pattern 1110b, the upper coupling pattern 1115b, the patch antenna feed via 1120b, the dielectric layer 1140b, and the encapsulating member 1150 b.

First ends of the patch antenna feed vias 1120b may be electrically connected to the patch antenna patterns 1110b, respectively, and second ends of the patch antenna feed vias 1120b may be electrically connected to the wirings of the connection member corresponding to the at least one conductive layer 1210b, respectively.

The dielectric layer 1140b may be disposed to surround a side surface of each of the feed vias 1120 b. The height of the dielectric layer 1140b may be greater than the height of the at least one insulating layer 1220b of the connection member. In an antenna package, the greater height and/or width of the dielectric layer 1140b may be more advantageous in ensuring antenna performance and may provide boundary conditions (e.g., small manufacturing tolerances, short electrical length, smooth surface, large size dielectric layer, dielectric constant control, etc.) that facilitate RF signal transmission/reception operations of the antenna pattern 1115 b.

The encapsulation member 1150b may be disposed on the dielectric layer 1140b and may enhance durability with respect to impact or oxidation of the plurality of patch antenna patterns 1110b and/or the plurality of upper coupling patterns 1115 b. For example, the encapsulation member 1150b may be implemented as a photosensitive encapsulant (PIE), ABF (Ajinomoto build-up film), Epoxy Molding Compound (EMC), but is not limited thereto.

The IC 1301b, PMIC 1302b and the plurality of passive components 1351b, 1352b and 1353b may be disposed on the lower surface of the connection member, e.g., the passive components 1351b, 1352b and 1353b may be electrically connected to the connection pad 1240b by solder ball 1260 b.

The PMIC 1302b may generate power and transfer the generated power to the IC 1301b through at least one conductive layer 1210b of the connection member.

The passive components 1351b, 1352b, and 1353b may provide impedance to the IC 1301b and/or the PMIC 1302 b. For example, the plurality of passive components 1351b, 1352b, and 1353b may include at least some of a capacitor (e.g., a multilayer ceramic capacitor (MLCC)), an inductor, and a chip resistor.

Referring to fig. 12B, the antenna module 1000-7 may be an IC package including: IC1300 a; an encapsulant 1305a encapsulating at least a portion of IC1300 a; the support member 1355a is disposed such that a first side surface thereof faces the IC1300 a. The connection member may include at least one conductive layer 1310a and an insulating layer 1280a electrically connected to the IC1300a and the support member 1355a, and the IC package may be coupled to the connection member or the antenna package 100 f.

The connection member may include at least one conductive layer 1210a, at least one insulating layer 1220a, a routing via 1230a, a connection pad 1240a, and a passivation layer 1250 a. The antenna package may include patch antenna patterns 1110a, 1110b, 1110c, and 1110d, upper coupling patterns 1115a, 1115b, 1115c, and 1115d, patch antenna feed vias 1120a, 1120b, 1120c, and 1120d, a dielectric layer 1140a, and an encapsulation member 1150 a.

The IC package may be coupled to the connection member described above. RF signals generated in the IC1300a included in the IC package may be transmitted to the antenna package through the at least one conductive layer 1310a and transmitted in a direction toward the upper surface of the antenna module, and RF signals received by the antenna package may be transmitted to the IC1300a through the at least one conductive layer 1310 a.

The IC package may also include connection pads 1330a disposed on the top and/or bottom surfaces of IC1300 a. The connection pad 1330a disposed on the upper surface of the IC1300a may be electrically connected to the at least one conductive layer 1310a, and the connection pad 1330a disposed on the lower surface of the IC1300a may be connected to the support member 1355a or the core plating member 1365a through the lower conductive layer 1320 a. The core plating member 1365a may provide a ground area for the IC1300 a.

The support member 1355a may include: a core dielectric layer 1356a in contact with the connection member; a core conductive layer 1359a disposed on an upper surface and/or a lower surface of the core dielectric layer 1356 a; at least one core via 1360a penetrates the core dielectric layer 1356a, electrically connecting the core conductive layer 1359a and the connection pad 1330 a. The at least one core via 1360a may be electrically connected to an electrical connection structure 1340a, such as a solder ball, pin, or pad.

Accordingly, the support member 1355a may receive baseband signals or power from its lower surface and transmit the baseband signals and/or power to the IC1300a through the at least one conductive layer 1310a of the connection member.

IC1300a may generate an RF signal in the millimeter wave (mmWave) band using a baseband signal and/or power. For example, IC1300a may receive a baseband signal at a low frequency, perform frequency conversion, amplification, filtering, and phase control on the baseband signal, and generate power. The IC1300a may be formed using a compound semiconductor (e.g., GaAs) or a silicon semiconductor in consideration of high-frequency characteristics.

The IC package may also include passive components 1350a, the passive components 1350a being electrically connected to respective routing of the at least one conductive layer 1310 a. The passive components 1350a may be disposed in the accommodating space 1306a provided by the support member 1355 a.

The IC package may include core plating members 1365a and 1370a disposed on side surfaces of the support member 1355 a. The core plating members 1365a and 1370a may provide the IC1300a with a ground region, and may radiate heat from the IC1300a to the outside or eliminate noise with respect to the IC1300 a.

The IC package and the connection member may be manufactured separately and combined with each other or may be manufactured together according to design. That is, a separate process of bonding packages may be omitted.

The IC package may be coupled to the connection member through the electrical connection structure 1290a and the passivation layer 1285a, but the electrical connection structure 1290a and the passivation layer 1285a may be omitted according to design.

Fig. 13A and 13B are plan views illustrating arrangements of antenna modules in electronic devices 700g and 700h, respectively, according to embodiments.

Referring to fig. 13A, an antenna module including an antenna apparatus 100g, a patch antenna pattern 1110g, and a dielectric layer 1140g may be mounted on a set board 600g of an electronic device 700g adjacent to a side boundary of the electronic device 700 g.

The electronic device 700g may be a smart phone, a personal digital assistant, a digital video camera, a digital camera, a network system, a computer, a monitor, a tablet, a laptop, a netbook, a television, a video game, a smart watch, or an automotive system, but is not limited to the above examples.

The communication module 610g and the baseband circuit 620g may be further disposed on the gang board 600 g. The antenna module may be electrically coupled to the communication module 610g and/or the baseband circuitry 620g via a coaxial cable 630 g.

The communication module 610g may include at least some of the following chips: a memory chip such as a volatile memory (e.g., DRAM), a nonvolatile memory (e.g., ROM), a flash memory, or the like; an application processor chip, such as a central processing unit (e.g., CPU), a graphics processor (e.g., GPU), a digital signal processor, a cryptographic processor, a microprocessor, or a microcontroller; and a logic chip such as an analog-to-digital converter (ADC) or an Application Specific Integrated Circuit (ASIC).

The baseband circuitry 620g may perform analog-to-digital conversion and amplification, filtering, and frequency conversion on the analog signal to generate a baseband signal. The baseband signal input/output from the baseband circuit 620g may be transmitted to the antenna module via a cable.

For example, baseband signals may be transmitted to the IC through electrical connection structures, core vias, and wiring. The IC may convert the baseband signal to an RF signal in the millimeter wave (mmWave) band.

Referring to fig. 13B, antenna modules respectively including the antenna apparatus 100h, the patch antenna pattern 1110h, and the dielectric layer 1140h are mounted on the set board 600h of the electronic device 700h adjacent to one and the other boundaries of the electronic device 700h, and the communication module 610h and the baseband circuit 620h may be further disposed on the set board 600 h. The antenna module may be electrically connected to the communication module 610h and/or the baseband circuit 620h via a coaxial cable 630 h.

The conductive layer, the ground layer, the feed line, the feed via, the antenna pattern, the patch antenna pattern, the shield via, the director pattern, the electrical connection structure, the plating member, and the core via described in the present disclosure may include a metal (e.g., a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof) and may be formed by a plating method such as Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), sputtering, subtractive, additive, semi-additive process (SAP), modified semi-additive process (MSAP), and the like, but are not limited to the above examples.

The dielectric layer and/or the insulating layer described in the present disclosure may be formed using a Liquid Crystal Polymer (LCP), a low temperature co-fired ceramic (LTCC), a resin (a thermosetting resin such as, for example, an epoxy resin, a thermoplastic resin such as polyimide, a resin obtained by impregnating a core material of glass fiber, glass cloth, or the like in these resins (prepreg, ABF (Ajinomoto build-up film), FR-4, the insulating layer may fill at least a portion of a position where a conductive layer, a ground layer, a feeder line, a feed via, an antenna pattern, a patch antenna pattern, a shield via, a guide pattern, an electrical connection structure, a plating member, or a core via is not provided in the antenna device and the antenna module disclosed in the present disclosure.

The RF signals described in this disclosure may have the form: such as Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, Long Term Evolution (LTE), Ev-DO, HSPA +, HSDPA +, HSUPA +, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, bluetooth, 3G, 4G, 5G, and subsequent protocols according to some specified wireless and wired protocols, but are not limited to these examples.

As described above, the antenna module and/or the antenna apparatus according to the embodiments of the present disclosure may have a structure advantageous for miniaturization while improving antenna performance (e.g., transmission/reception ratio, gain, bandwidth, directivity, etc.).

The antenna module and/or the antenna device according to the embodiment may have a reduced size by arranging the antenna patterns in a more compressed manner while maintaining antenna performance, improve the degree of freedom of the reflector of the antenna patterns to have more precisely adjusted antenna performance, and improve isolation between the antenna devices.

While this disclosure includes specific examples, it will be apparent, after understanding the disclosure of the present application, that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered in a descriptive sense only and not for purposes of limitation. The description of features or aspects in each example will be understood to be applicable to similar features or aspects in other examples. Suitable results may be achieved if the described techniques are performed in a different order and/or if components in the described systems, architectures, devices, or circuits are combined in a different manner and/or replaced or added by other components or their equivalents. Therefore, the scope of the present disclosure is defined not by the detailed description but by the claims and their equivalents, and all modifications within the scope of the claims and their equivalents are to be understood as being included in the present disclosure.

Claims (24)

1. An antenna apparatus, comprising:

a feeder line;

a first ground layer including a surface disposed above or below the feed line and spaced apart from the feed line; and

an antenna pattern electrically connected to an end of the feed line and configured to transmit and/or receive a radio frequency signal,

wherein the first ground layer includes: a first protruding region protruding toward the antenna pattern in a first longitudinal direction of the surface and at least partially overlapping the feed line above or below the feed line; a second protruding region and a third protruding region protruding in the first longitudinal direction from a position spaced apart from the first protruding region in opposite lateral directions of the surface,

wherein the antenna pattern faces an area between the first protrusion area and the second protrusion area, and an area between the first protrusion area and the third protrusion area, when viewed in a vertical direction.

2. The antenna apparatus of claim 1, further comprising:

a second ground layer disposed above or below the first ground layer and spaced apart from the first ground layer,

wherein the second ground layer includes a fourth protruding area protruding toward the antenna pattern in the first longitudinal direction to at least partially overlap with the feed line above or below the feed line, the second ground layer overlaps with a first recessed area recessed in a second longitudinal direction opposite to the first longitudinal direction and provided between the first protruding area and the second protruding area of the first ground layer, and the second ground layer overlaps with a second recessed area recessed in the second longitudinal direction and provided between the first protruding area and the third protruding area of the first ground layer.

3. The antenna apparatus of claim 2, further comprising:

a feed via provided to electrically connect the antenna pattern and the feed line,

wherein the antenna pattern is spaced apart from the second ground layer by the feed via.

4. The antenna apparatus of claim 1, further comprising:

a wiring electrically connected to the feeder line; and

a third ground layer disposed above or below the first ground layer, spaced apart from the first ground layer, and surrounding the wiring,

wherein the third ground layer includes a third recessed area recessed in a horizontal direction opposite the first longitudinal direction and disposed between the second and third protruding areas of the first ground layer.

5. The antenna apparatus of claim 4, further comprising:

a wiring via electrically connected to the wiring; and

a fourth ground layer disposed above or below the first ground layer, spaced apart from the first ground layer, and having a through hole through which the routing via passes,

wherein the fourth ground layer includes a fourth recessed area recessed in the horizontal direction and disposed between the second protruding area and the third protruding area of the first ground layer.

6. The antenna device according to claim 1, wherein the first protruding area of the first ground plane protrudes further in the first longitudinal direction than the second and third protruding areas of the first ground plane.

7. The antenna device according to claim 1, wherein a distance of the antenna pattern from the first protruding area of the first ground layer in the first longitudinal direction is shorter than a protruding length of the second protruding area or the third protruding area of the first ground layer in the first longitudinal direction.

8. The antenna device of claim 1,

the antenna pattern has the form of a dipole,

a length of a first pole of the dipole is greater than a distance between the first protruding area and the second protruding area of the first ground layer, and

a length of a second pole of the dipole is greater than a distance between the first protruding area and the third protruding area of the first ground layer.

9. The antenna apparatus of claim 8, further comprising:

a director pattern spaced apart from the antenna pattern,

wherein a length of the guide body pattern in a lateral direction among the opposite lateral directions is smaller than a distance between the second protruding area and the third protruding area of the first ground layer and is larger than a length of the first protruding area of the first ground layer in the lateral direction.

10. The antenna apparatus of claim 1, further comprising:

a shielded via electrically connected to the first ground layer and arranged along a boundary of an area between the second protruding area and the third protruding area of the first ground layer, the first protruding area not overlapping with the antenna pattern when viewed in a vertical direction, or the antenna pattern being disposed further forward than a front boundary of the second protruding area and the third protruding area, or the first protruding area having a width wider than a width of the feed line and narrower than a length of the antenna pattern, or at least a portion of the antenna pattern being disposed directly forward of the second protruding area or the third protruding area when viewed in the vertical direction.

11. An antenna module, comprising:

a connection member including a first ground layer and a second ground layer including a surface disposed above or below the first ground layer;

antenna patterns, each of which is spaced apart from the first and second ground layers and configured to transmit and/or receive a radio frequency signal;

feed lines each of which is electrically connected to a corresponding one of the antenna patterns and extends from the corresponding antenna pattern toward the connection member along a first longitudinal direction parallel to the surface; and

a protruding ground pattern electrically connected to the first ground layer and protruding from the first ground layer in a second longitudinal direction opposite to the first longitudinal direction to at least partially overlap with the feed line above or below the feed line,

wherein the first ground layer is recessed in the first longitudinal direction at a region corresponding to each of the antenna patterns.

12. The antenna module of claim 11, further comprising:

feed vias, each of the feed vias being arranged to electrically connect a corresponding one of the antenna patterns with a corresponding one of the feed lines,

wherein the protruding ground pattern is spaced apart from the feed via in the first longitudinal direction.

13. The antenna module of claim 11,

the feed line is disposed between the protruding ground pattern and the second ground layer,

each of the protruding ground patterns protrudes in the second longitudinal direction with respect to a corresponding recessed area of the first ground layer, and

the second ground layer protrudes toward each of the antenna patterns in the second longitudinal direction.

14. The antenna module of claim 11, further comprising:

an integrated circuit disposed under the connection member,

wherein the connecting member includes: wires, each of the wires electrically connected to a corresponding one of the feed lines; wire vias, each of which has one end electrically connected to a corresponding one of the wires and the other end electrically connected to the integrated circuit.

15. The antenna module of claim 14, further comprising:

a passive component disposed below the connection member; and

a shield member disposed below the connection member and surrounding the integrated circuit,

wherein the first and second ground layers are electrically connected to the passive components and the shielding member.

16. The antenna module of claim 14, further comprising:

a patch antenna pattern disposed above the connection member; and

second feeding vias each having one end electrically connected to a corresponding one of the patch antenna patterns,

wherein the connecting member further comprises: second routing wires each electrically connected to a corresponding one of the second feeding vias; second wiring vias each having one end electrically connected to a corresponding one of the second wirings and the other end electrically connected to the integrated circuit,

wherein the protruding ground pattern does not overlap with the antenna pattern when viewed in a vertical direction.

17. An antenna apparatus, comprising:

a connection member including a first ground layer and a second ground layer separated from the first ground layer in a vertical direction;

an antenna pattern separated from the first and second ground layers in a first longitudinal direction and configured to transmit and/or receive a radio frequency signal; and

a feed line electrically connected to the antenna pattern and extending from the antenna pattern toward the first ground layer,

wherein the first ground layer includes:

a first recess portion recessed from an end portion of the first ground layer in a second longitudinal direction opposite to the first longitudinal direction and aligned with a first pole of the antenna pattern, an

A second recess portion recessed from an end portion of the first ground layer in the second longitudinal direction, spaced apart from the first recess portion in a transverse direction, and aligned with a second pole of the antenna pattern.

18. The antenna apparatus of claim 17, further comprising:

a first cavity formed by the second ground layer and the first recess portion; and

a second cavity formed by the second ground layer and the second recess portion.

19. The antenna device of claim 18, wherein the first ground plane further comprises a first middle protruding portion and a side end protruding portion, wherein the first middle protruding portion and the side end protruding portion protrude in the first longitudinal direction at an end portion of the first ground plane and form boundaries of the first cavity and the second cavity.

20. The antenna device of claim 19,

the second ground layer includes a second intermediate protruding portion protruding in the first longitudinal direction at an end portion of the second ground layer,

the feed line is disposed between the first intermediate projecting portion and the second intermediate projecting portion in the vertical direction, and

the first and second intermediate projecting portions at least partially overlap the feed line in the first longitudinal direction,

wherein the first middle protrusion portion does not overlap with the antenna pattern when viewed in a vertical direction.

21. An antenna apparatus, comprising:

a first ground layer including a first protruding area, a first recessed portion, and a second recessed portion laterally separated from the first recessed portion;

a second ground layer including a longitudinally and laterally extending surface disposed above the first ground layer, and side edges at edges of the surface, wherein portions of the surface are exposed through the first and second recessed portions;

a feed line extending longitudinally away from the first and second ground planes and across the side edges; and

an antenna pattern electrically connected to the feed line and configured to transmit and/or receive a radio frequency signal, wherein the antenna pattern is longitudinally separated from the first ground layer and the second ground layer outside the side edge such that the antenna pattern is opposite to the first concave portion and the second concave portion,

wherein the first protruding area at least partially overlaps the feed line above or below the feed line.

22. The antenna apparatus of claim 21, further comprising:

a feed via provided to electrically connect the antenna pattern and the feed line,

wherein the antenna pattern is distant from the surface in a direction perpendicular to the surface through the feed via.

23. The antenna device of claim 21, further comprising a third ground plane disposed above the first ground plane, wherein the third ground plane includes a third recess exposing the portion of the surface.

24. The antenna device of claim 21,

the surface and the first recess define a first cavity, and

the surface and the second recess define a second cavity,

wherein the first protruding area does not overlap with the antenna pattern when viewed in a vertical direction.

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