KR20190120136A - Antenna apparatus - Google Patents

Abstract

According to one embodiment of the present invention, provided is an antenna device, which comprises: an antenna pattern having a form of a dipole including first and second poles; a feed line electrically connected to the antenna pattern and extending rearward; and at least one ground layer disposed at the rear of the antenna pattern to be spaced apart from the feed line and providing first and second cavities spaced apart from each other toward the first and second poles, respectively.

Description

Antenna apparatus

The present invention relates to an antenna device.

Data traffic of mobile communication is increasing rapidly every year. Active technology development is under way to support such breakthrough data in real time in wireless networks. For example, the content of Internet-based data (IoT) -based data, Augmented Reality (AR), Virtual Reality (VR), Live VR / AR combined with SNS, Autonomous driving, Sync View, Micro-camera Applications such as real-time video transmission require communication (eg, 5G communication, mmWave communication, etc.) to support large data exchange.

Therefore, recently, millimeter wave (mmWave) communication including 5G (5G) communication has been actively studied, and research for commercialization / standardization of an antenna module for smoothly implementing it has been actively conducted.

RF signals in high frequency bands (e.g., 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz, etc.) are easily absorbed and lost in the way they are delivered, so the quality of communication can drop dramatically. Therefore, the antenna for high frequency communication requires a different technical approach from the conventional antenna technology, and it is necessary to separate the antenna gain (Gain), the integration of the antenna and the RFIC, and the effective isotropic radiated power (EIRP). It may require development of special technologies such as power amplifiers.

Japanese Patent Laid-Open No. 2012-191317

The present invention provides an antenna device.

An antenna device according to an embodiment of the present invention, the antenna pattern having the form of a dipole including a first pole and a second pole; A feedline electrically connected to the antenna pattern and extending rearward; And at least one ground layer disposed behind the antenna pattern and spaced apart from the feedline and providing first and second cavities spaced apart from each other toward the first and second poles, respectively. It may include.

An antenna device according to an embodiment of the present invention may have an advantageous structure for miniaturization while improving antenna performance (for example, transmission / reception rate, gain, bandwidth, directivity, etc.).

The antenna device according to an embodiment of the present invention may further maintain the antenna performance while having a reduced size by arranging the antenna pattern more compressively, and may improve the design freedom of the reflector of the antenna pattern. It can have a more precisely adjusted antenna performance, and can improve the isolation between the plurality of antenna devices.

1 is a perspective view showing an antenna device according to an embodiment of the present invention.
FIG. 2 is a side view illustrating the antenna device shown in FIG. 1.
3A to 3D are plan views illustrating first to fourth ground layers that may be included in an antenna device and an antenna module according to an embodiment of the present invention.
4A to 4C are plan views illustrating various sizes of first to third protruding regions of the antenna device according to an exemplary embodiment.
FIG. 4D is a rear view of the antenna device shown in FIG. 4A.
5 is a perspective view showing an antenna device according to an embodiment of the present invention.
FIG. 6 is a side view illustrating the antenna device shown in FIG. 5.
FIG. 7 is a diagram illustrating a transmission direction of an RF signal according to a plurality of cavities of an antenna device according to an exemplary embodiment.
8A to 8D are plan views illustrating various arrangements of the antenna apparatus included in the antenna module according to an exemplary embodiment.
9 is a perspective view showing the arrangement of the antenna device included in the antenna module according to an embodiment of the present invention.
10A to 10B are views illustrating a lower structure of a connection member included in an antenna module according to an embodiment of the present invention.
11 is a side view showing a schematic structure of an antenna module according to an embodiment of the present invention.
12A and 12B are side views illustrating various structures of the antenna module according to an embodiment of the present invention.
13A and 13B are plan views illustrating an arrangement in an electronic device of an antenna module according to an exemplary embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE INVENTION The following detailed description of the invention refers to the accompanying drawings that show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein may be embodied in other embodiments without departing from the spirit and scope of the invention with respect to one embodiment. In addition, it is to be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled. Like reference numerals in the drawings refer to the same or similar functions throughout the several aspects.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

1 is a perspective view showing an antenna device according to an embodiment of the present invention, Figure 2 is a side view showing the antenna device shown in FIG.

1 and 2, an antenna device according to an embodiment of the present invention may include an antenna pattern 120a and a connection member 200a. The antenna pattern 120a receives a radio frequency (RF) signal from the connection member 200a through the feed line 110a and transmits the signal remotely in the x direction, or remotely receives the RF signal in the x direction to receive the feed line 110a. Through the connection member 200a can be delivered. For example, since the antenna pattern 120a may have a dipole shape, the antenna pattern 120a may have a structure extending in the y direction.

1 and 2, the connection member 200a may include a first ground layer 221a, a second ground layer 222a, a third ground layer 223a, a fourth ground layer 224a, and a fifth ground. It may include at least a portion of the layer 225a, and may further include an insulating layer disposed between the plurality of ground layers. The first to fifth ground layers 221a, 222a, 223a, 224a, and 225a may be spaced apart from each other in the vertical direction (z direction).

The antenna device according to an embodiment of the present invention may include at least one of the first to fifth ground layers 221a, 222a, 223a, 224a, and 225a. The number and vertical relationship of the first to fifth ground layers 221a, 222a, 223a, 224a, and 225a may vary depending on the design of the antenna device.

The fourth and fifth ground layers 224a and 225a may provide grounds used in circuits and / or passive components of the IC as ICs and / or passive components. In addition, the fourth and fifth ground layers 224a and 225a may provide a path for transmitting power and signals used in ICs and / or passive components. Thus, the fourth and fifth ground layers 224a and 225a may be electrically connected to the IC and / or passive components.

Here, the fourth and fifth ground layers 224a and 225a may be omitted according to the ground demand of the IC and / or passive components. The fourth and fifth ground layers 224a and 225a may have through holes through which wiring vias pass.

The third ground layer 223a may be spaced apart from each other above the fourth and fifth ground layers 224a and 225a and may be disposed to surround the wiring at the same height as the wiring through which a radio frequency (RF) signal flows. have. The wiring may be electrically connected to the IC through the wiring via.

The first and second ground layers 221a and 222a may be spaced apart from each other above the fourth and fifth ground layers 224a and 225a and disposed below and above the third ground layer 223a, respectively. The first ground layer 221a may improve electromagnetic isolation between the wiring and the IC, and may provide ground as an IC and / or a passive component. The second ground layer 222a may improve the electromagnetic isolation between the wiring and the patch antenna pattern, provide a boundary condition in view of the patch antenna pattern, and reflect the RF signal transmitted and received by the patch antenna pattern. The transmission and reception direction of the patch antenna pattern can be more concentrated.

The second ground layer 222a may protrude more than the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a. Accordingly, since the second ground layer 222a may electromagnetically block the gap between the patch antenna pattern and the antenna pattern 120a, the electromagnetic isolation between the patch antenna pattern and the antenna pattern 120a may be improved. Can be.

The boundaries of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a may overlap each other when viewed in the vertical direction (z direction). Since the boundary may act as a reflector for the antenna pattern 120a, the boundary between the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a and the antenna pattern 120a is effective. The separation distance may affect the antenna performance of the antenna pattern 120a.

For example, when the effective separation distance is shorter than the reference distance, the gain of the antenna pattern 120a may be degraded according to the dispersion of the RF signal transmitted through the antenna pattern 120a, and the antenna pattern 120a The resonance frequency of may be difficult to be optimized according to an increase in capacitance between the first, third, fourth and fifth ground layers 221a, 223a, 224a, and 225a and the antenna pattern 120a.

In addition, when the antenna pattern 120a is separated from the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a, the size of the antenna device and the antenna module may be increased.

In addition, when the connection member 200a is small, the space for arranging the path and the wire for transmitting power and signals may be insufficient, the ground stability of the ground layer may be degraded, and the space for the patch antenna pattern may also be insufficient. have. That is, the performance of the antenna device and antenna module may be degraded.

In the antenna device and the antenna module according to an embodiment of the present invention, the antenna pattern 120a may be arranged closer to the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a. The third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a have a structure capable of securing an effective separation distance between the antenna pattern 120a. Accordingly, the antenna device and the antenna module according to an embodiment of the present invention may have a reduced size or improved performance.

1 and 2, at least one of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a included in the connection member 200a may move upward and downward (z direction). When viewed, the first protrusion region P1 protruding toward the antenna pattern 120a so as to overlap at least a portion of the feed line 110a and the first and second laterally spaced apart from the first protrusion region P1, respectively. It may have second and third protrusion regions P2 and P3 protruding from the position.

Due to the first to third protruding regions P1, P2, and P3, at least one of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a faces the antenna pattern 120a. The boundary may form an uneven structure. That is, the first cavity C1 may be formed between the first protrusion region P1 and the second protrusion region P2, and the second cavity C2 may protrude from the first protrusion region P1 and the third protrusion. It may be formed between the regions P3. The first and second cavities C1 and C2 may provide boundary conditions that are advantageous for securing antenna performance of the antenna pattern 120a.

In at least one of the first, third, fourth and fifth ground layers 221a, 223a, 224a, and 225a, the boundary facing the antenna pattern 120a may act as a reflector for the antenna pattern 120a. Some of the RF signals transmitted through the antenna pattern 120a may be reflected at the boundary of at least one of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a.

The first and second cavities C1 and C2 may include the first, third, fourth and fifth ground layers 221a, 223a, between one end and the other end of the first and second poles of the antenna pattern 120a, respectively. It may have a structure recessed in the direction toward at least one of the 224a, 225a. That is, the first and second cavities C1 and C2 may act as reflectors for each of the first and second poles of the antenna pattern 120a.

Accordingly, the effective separation distance from each pole of the antenna pattern 120a to at least one of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a is a substantial position of the antenna pattern 120a. It can be long without change. Alternatively, the antenna pattern 120a may be disposed closer to the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a without substantially sacrificing antenna performance.

For example, an RF signal transmitted to each of the first and second cavities C1 and C2 among the RF signals transmitted through each pole of the antenna pattern 120a is compared with when the first and second cavities C1 and C2 are not present. So that it can be more concentrated and reflected in the x direction. Therefore, the gain of the antenna pattern 120a can be further improved as compared with the absence of the first and second cavities C1 and C2.

For example, the capacitance between each pole of the antenna pattern 120a and the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a has the first and second cavities C1 and C2. Can be made smaller compared to when there is no. Therefore, the resonance frequency of the antenna pattern 120a can be more easily optimized.

In addition, the first protruding region P1 may provide an additional resonance point according to the electromagnetic coupling with the antenna pattern 120a. The resonance point may be dependent on the shape of the first protruding region P1 (eg, a width, a length, a thickness, a separation distance with respect to the second and third protrusion regions, a separation distance with respect to the antenna pattern, etc.).

When the additional resonance point is close to the frequency band of the antenna pattern 120a, the bandwidth of the antenna pattern 120a may be extended. In addition, the additional resonance point may support an additional frequency band of the antenna pattern 120a to enable multi-band communication of the antenna pattern 120a. Therefore, the first protruding region P1 may increase the bandwidth of the antenna pattern 120a or extend the communication band of the antenna pattern 120a.

In addition, the second and third protruding regions P2 and P3 may electromagnetically shield the antenna pattern 120a from the adjacent antenna device. Accordingly, the separation distance between the antenna pattern 120a and the adjacent antenna device may be further shortened, and the size of the antenna module according to an embodiment of the present invention may be reduced.

1 and 2, the connection member 200a is electrically connected to at least two of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a, and the vertical direction A plurality of shielding vias 245a arranged to surround at least a portion of each of the first and second cavities C1 and C2 when viewed in the (z direction) may be further included.

The plurality of shielding vias 245a may count an RF signal that is counted as a gap between the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a among the RF signals transmitted through the antenna pattern 120a. Can be reflected. Accordingly, the gain of the antenna pattern 120a may be further improved, and the electromagnetic isolation between the antenna pattern 120a and the wiring may be improved.

1 and 2, an antenna device according to an embodiment of the present disclosure may include a feed line 110a, a feed via 111a, an antenna pattern 120a, a director pattern 125a, and a connection member ( At least some of 200a).

Since the feed line 110a may be electrically connected to the wiring in the third ground layer 223a, the feed line 110a may serve as a transmission path of the RF signal. The feed line 110a may be viewed as a component included in the third ground layer 223a according to the viewpoint. Since the antenna pattern 120a may be disposed adjacent to the side surface of the connection member 200a, the feed line 110a may have a structure extending from the wiring of the third ground layer 223a toward the antenna pattern 120a. have.

The feed line 110a may be disposed between the first protruding regions P1 of at least two of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a. Accordingly, the feed line 110a may reduce electromagnetic noise that may be received from at least one of the antenna pattern 120a, the adjacent antenna device, and the patch antenna pattern. The electromagnetic noise of the feed line 110a may be further reduced as the width and length of the first protruding region P1 become larger.

The feed line 110a may include first and second feed lines. For example, the first feedline may be configured to transmit an RF signal to the antenna pattern 120a, and the second feedline may be configured to receive an RF signal from the antenna pattern 120a. For example, the first feed line may be configured to receive an RF signal from the antenna pattern 120a or to transmit an RF signal to the antenna pattern 120a, and the second feed line may be impedance to the antenna pattern 120a. It can be configured to provide.

For example, the first and second feed lines respectively transmit an RF signal to the antenna pattern 120a and receive an RF signal from the antenna pattern 120a, but have phase differences (eg, 180 degrees and 90 degrees) from each other. It can be configured in a differential feeding (differential feeding) method. The phase difference may be implemented through a phase shifter of the IC or an electrical length difference between the first and second feed lines.

According to the design, the feed line 110a may include a quarter-wave converter, a balun, or an impedance conversion line to improve RF signal transmission efficiency, but the quarter-wave converter, a balun, or an impedance conversion line may be improved. May be omitted depending on the design.

The feed via 111a may be arranged to electrically connect the antenna pattern 120a and the feed line 110a. The feed via 111a may be disposed perpendicularly to the antenna pattern 120a and the feedline 110a. When the antenna pattern 120a and the feed line 110a are disposed at the same height as each other, the feed via 111a may be omitted.

Due to the feed via 111a, the antenna pattern 120a may be disposed at a position higher or lower than the feed line 110a. Since the specific position of the antenna pattern 120a may vary depending on the length of the feed via 111a, the radiation pattern direction of the antenna pattern 120a may be slightly up and down (z direction) according to the length design of the feed via 111a. Can be tilted.

For example, the antenna pattern 120a may be disposed below the feedline 110a to be separated from the second ground layer 222a by the feed via 111a. Accordingly, the second ground layer 222a may further improve the electromagnetic isolation between the antenna pattern 120a and the patch antenna pattern.

Meanwhile, the via pattern 112a may be coupled to the feed via 111a and may support the upper and lower portions of the feed via 111a, respectively.

The antenna pattern 120a may be electrically connected to the feedline 110a and configured to transmit or receive an RF signal. Here, one end of each pole of the antenna pattern 120a may be electrically connected to the first and second lines of the feed line 110a.

The antenna pattern 120a may have a frequency band (eg, 28 GHz or 60 GHz) according to at least one of a pole length, a pole thickness, a gap between poles, a gap between the pole and the side of the connection member, and a dielectric constant of the insulating layer.

The antenna pattern 120a and the director pattern 125a may be viewed as components included in the fourth ground layer 224a according to the viewpoint. The director pattern 125a may be omitted according to design.

The director pattern 125a may be spaced apart from the antenna pattern 120a in the lateral direction. The director pattern 125a may be electromagnetically coupled to the antenna pattern 120a to improve the gain or bandwidth of the antenna pattern 120a. Since the director pattern 125a has a length shorter than the total length of the dipoles of the antenna pattern 120a, the concentration of the electromagnetic coupling of the antenna pattern 120a may be further improved, and thus the gain of the antenna pattern 120a may be increased. Directivity can be further improved.

3A to 3D are plan views illustrating first to fourth ground layers that may be included in an antenna device and an antenna module according to an embodiment of the present invention.

Referring to FIG. 3A, the first protruding regions P1 of the first ground layer 221a may protrude more than the second and third protruding regions P2 and P3. Accordingly, the antenna pattern may further improve the electromagnetic coupling to the first protruding region P1 while more easily securing the effective separation distance with respect to the first ground layer 221a. Therefore, the antenna performance of the antenna device and the antenna module according to an embodiment of the present invention can be further improved.

Here, the first protruding region P1 may be included in the first ground layer 221a, which may be viewed as a protruding ground pattern electrically connected to the first ground layer 221a as a separate component according to a viewpoint.

In addition, the plurality of shielding vias 245a may be electrically connected to the first ground layer 221a and may be arranged along a boundary between the regions between the second and third protruding regions P2 and P3. In addition, the first ground layer 221a may have a plurality of through holes through which the first and second wiring vias 231a and 232a respectively pass. Meanwhile, the via pattern 112a coupled to the feed via may be viewed as a component included in the first ground layer 221a according to the viewpoint.

3A and 3B, the second ground layer 222a has a fourth protruding region P4, and the first protruding region P1 of the first ground layer 221a when viewed in the vertical direction (z direction). ) And the second protruding region P2 (first cavity) overlap between the first protruding region P1 and the third protruding region P3 of the first ground layer 221a (the second cavity). Can overlap. Accordingly, the antenna pattern can further improve the electromagnetic coupling to the fourth protruding region P4, and can secure the electromagnetic isolation with respect to the patch antenna pattern disposed above. Therefore, the antenna performance of the antenna device and the antenna module according to an embodiment of the present invention can be further improved.

In addition, the plurality of shielding vias 245a may be electrically connected to the second ground layer 222a and may be arranged along a boundary of the second ground layer 222a. In addition, the second ground layer 222a may have a through hole through which the second feed via 1120a passes. The second feed via 1120a may electrically connect the patch antenna pattern and the second wiring.

Referring to FIG. 3C, an antenna device and an antenna module according to an embodiment of the present disclosure may include a first wiring 212a electrically connecting a feed line 110a and a first wiring via 231a, and A second wiring 214a may be further included to electrically connect the second feed via 1120a and the second wiring via 232a.

The third ground layer 223a may be disposed to surround the first wiring 212a and the second wiring 214a, respectively. Accordingly, electromagnetic noise of each of the first wiring 212a and the second wiring 214a can be reduced.

The plurality of shielding vias 245a may be electrically connected to the third ground layer 223a and may be arranged along the boundary of the third ground layer 223a and the first and second wirings 212a and 214a. Accordingly, the electromagnetic noise of each of the first wiring 212a and the second wiring 214a can be further reduced.

3A and 3C, the third ground layer 223a is formed of the second protrusion region P2 and the third protrusion region P3 of the first ground layer 221a when viewed in the vertical direction (z direction). The interregion may have a recessed shape. That is, the third ground layer 223a may have a second protruding region P2-2 and a third protruding region P3-2.

3A and 3D, the fourth ground layer 224a is formed of the second protrusion region P2 and the third protrusion region P3 of the first ground layer 221a when viewed in the vertical direction (z direction). The interregion may have a recessed shape. That is, the fourth ground layer 224a may have a second protruding region P2-3 and a third protruding region P3-3.

The plurality of shielding vias 245a may be electrically connected to the fourth ground layer 224a and arranged to enclose an area between the second protrusion area P2-3 and the third protrusion area P3-3. .

In addition, the fourth ground layer 224a may have a plurality of through holes through which the first and second wiring vias 231a and 232a respectively pass. The first and second wiring vias 231a and 232a may be electrically connected to an IC disposed under the fourth ground layer 224a.

Meanwhile, the antenna pattern 120a and the director pattern 125a may be viewed as components included in the fourth ground layer 224a according to the viewpoint.

Meanwhile, as the number of ground layers providing cavities among the first, third, fourth and fifth ground layers 221a, 223a, 224a, and 225a increases, the vertical direction of the cavity (z direction) The length can be long. The length of the cavity (z direction) of the cavity may affect the antenna performance of the antenna pattern 120a. The antenna device and the antenna module according to an embodiment of the present invention can easily adjust the length of the cavity in the vertical direction (z direction) by adjusting the number of ground layers that provide the cavity, so that the antenna pattern The antenna performance of 120a can be more easily adjusted.

In addition, recessed regions of at least two of the first, third, fourth, and fifth ground layers 221a, 223a, 224a, and 225a may have the same rectangular shape. Accordingly, the cavity may form a cuboid. When the cavity is a cuboid, the ratio of the x vector component and the x vector component of the RF signal reflected at the boundary of the cavity may be higher. Since the yvector component is more easily canceled in the cavity than the xvector component, the antenna pattern 120a has an improved gain as the ratio of the xvector component of the RF signal reflected at the boundary of the cavity is higher. Can have Therefore, the antenna pattern 120a may have an improved gain as the cavity is closer to the rectangular parallelepiped.

4A to 4C are plan views illustrating various sizes of the first to third protruding regions of the antenna device according to an embodiment of the present invention, and FIG. 4D is a rear view of the antenna device shown in FIG. 4A.

3A to 4, the antenna device and the antenna module according to an exemplary embodiment of the present invention may include feed lines 110c, 110d, and 110e, feed vias 111c, 111d, and 111e, and antenna patterns 120c and 120d. , 120e), director patterns 125c, 125d. 125e, first ground layers 221c, 221d, and 221e and second ground layers 222c, 222d and 222e.

3A and 4, the first protruding region P1 of the first ground layer 221c may have a first width w1 and a first height h1. Referring to FIG. 3B, the first protruding region P1 of the first ground layer 221d may have a second width w2 and a first height h1. Referring to FIG. 3C, the first protruding region P1 of the first ground layer 221e may have a first width w1 and a second height h2.

Here, the second width w2 may be shorter than the first width w1. Accordingly, the band position or the bandwidth of the antenna patterns 120c, 120d, and 120e may be changed.

In addition, the first height h1 of the first protruding region P1 may be longer than the protruding lengths of the second and third protruding regions P2 and P3, and the second height of the first protruding region P1 ( h2) may be shorter than the protruding length of the second and third protruding regions P2 and P3.

3A through 4, the separation distance between the antenna patterns 120c, 120d, and 120e and the first protrusion region P1 in the up and down direction (z direction) is the second or third protrusion region P2. , P3) may be shorter than the protruding length. Accordingly, the antenna device and the antenna module according to an embodiment of the present invention may have a reduced size without significantly impairing the RF signal reflection performance of the first ground layers 221c, 221d, and 221e.

3A, 3C, and 4, the lengths of the first poles of the antenna patterns 120c and 120e are the first protruding region P1 and the second protruding region of the first ground layers 221c and 221e. It is longer than the separation distance between (P2) (the first cavity), the length of the second pole of the antenna pattern (120c, 120e) is the first protrusion area (P1) and the third protrusion of the first ground layer (221c, 221e). The distance between the regions P3 (the second cavity) may be longer. Accordingly, the first ground layers 221c and 221e may reflect the RF signals of the antenna patterns 120c and 120e while further concentrating them in a specific direction (x direction).

3A, 3C, and 4, the lengths of the director patterns 125c and 125e in the lengthwise direction are the second protrusion region P2 and the third protrusion region P3 of the first ground layers 221c and 221e. It may be shorter than the interval between the and, and longer than the width direction (y direction) length of the first protrusion area (P1) of the first ground layer (221c, 221e). Accordingly, the antenna device and the antenna module according to an embodiment of the present invention may have a reduced size while securing antenna performance (eg, bandwidth, straightness, etc.).

5 is a perspective view illustrating an antenna device according to an embodiment of the present invention, and FIG. 6 is a side view illustrating the antenna device shown in FIG. 5.

5 and 6, the antenna pattern 120b may have a form of a folded dipole, and the feed via and the director pattern may be omitted.

The feed line 110b may be disposed at the same height as the fourth ground layer 224b, and may be electrically connected to the first wiring surrounded by the fourth ground layer 224b.

The connection member 200b may include at least one of the first, second, third, fourth, and fifth ground layers 221b, 222b, 223b, 224b, and 225b and a plurality of shielding vias 245b. . The fourth protruding region of the second ground layer 222b may be omitted.

The first ground layer 221b may have a shape in which the feed line 110b is recessed in a direction extending from the antenna pattern 120b and may include a protruding ground pattern P1-2. The protruding ground pattern P1-2 may correspond to the first protruding region described above.

According to the design, the fifth ground layer 225b may have a protruding region. The protruding region and the protruding ground pattern P1-2 may be electromagnetically coupled to the antenna pattern 120b and may provide a boundary between the aforementioned first and second cavities.

FIG. 7 is a diagram illustrating a transmission direction of an RF signal according to a plurality of cavities of an antenna device according to an exemplary embodiment.

Referring to FIG. 7, RF signals transmitted in the order of the wiring via 230, the feed line 110, and the feed via 111 may be transmitted through each pole of the antenna pattern 120. Some of the RF signals transmitted from each pole of the antenna pattern 120 may be radiated forward through the director pattern 125.

The RF signal transmitted toward the first ground layer 221 among the RF signals transmitted from each pole of the antenna pattern 120 may be further concentrated by the first and second cavities of the first ground layer 221. It may be reflected at the boundary of the first and second cavities. The reflected RF signal may be more concentrated and transmitted toward the front of the antenna pattern 120. Therefore, the gain of the antenna device according to an embodiment of the present invention may be further improved.

8A to 8D are plan views illustrating various arrangements of the antenna apparatus included in the antenna module according to an exemplary embodiment.

Referring to FIG. 8A, an antenna module according to an exemplary embodiment may include a first antenna device 101e, a second antenna device 102e, and a first ground member 130e.

Referring to FIG. 8B, an antenna module according to an exemplary embodiment may include a first antenna device 101f, a second antenna device 102f, a third antenna device 103f, a fourth antenna device 104f, and a third antenna device. One ground member 130f may be included.

Referring to FIG. 8C, an antenna module according to an exemplary embodiment may include a first antenna device 101g, a second antenna device 102g, a third antenna device 103g, a fourth antenna device 104g, and a third antenna device. One ground member 130g may be included.

The antenna module illustrated in FIGS. 8A to 8C may omit an antenna package.

Referring to FIG. 8D, an antenna module according to an exemplary embodiment may include a first antenna device 101h, a second antenna device 102h, a third antenna device 103h, a fourth antenna device 104h, and a third antenna device. One ground member 130h and an IC 1300h may be included.

The first ground members 130e, 130f, 130g, and 130h may improve isolation between the plurality of antenna devices and provide specific arrangement positions of the plurality of antenna devices.

9 is a perspective view showing the arrangement of the antenna device included in the antenna module according to an embodiment of the present invention.

Referring to FIG. 9, an antenna module according to an exemplary embodiment may include a plurality of antenna devices 100c and 100d, a plurality of patch antenna patterns 1110d, a plurality of patch antenna cavities 1130d, a dielectric layer 1140c, 1140d, the plating member 1160d, the plurality of chip antennas 1170c and 1170d, and the plurality of dipole antennas 1175c and 1175d.

The plurality of antenna devices 100c and 100d may be designed similar to the antenna device described above with reference to FIGS. 1 to 8, respectively, and may be arranged side by side adjacent to the side of the antenna module. Accordingly, some of the plurality of antenna apparatuses 100c and 100d may transmit and receive RF signals in the x-axis direction, and others may transmit and receive RF signals in the y-axis direction.

The plurality of patch antenna patterns 1110d may be disposed adjacent to an upper side of the antenna module and may transmit and receive an RF signal in a vertical direction (z direction). The number, arrangement and shape of the plurality of patch antenna patterns 1110d are not particularly limited. For example, the shape of the plurality of patch antenna patterns 1110d may be circular, and the plurality of patch antenna patterns 1110d may be arranged in a structure of 1 X n (n is a natural number of 2 or more), and a plurality of patches The number of antenna patterns may be 16.

Each of the plurality of patch antenna cavities 1130d may be formed to cover side and bottom sides of each of the plurality of patch antenna patterns 1110d, and provide boundary conditions for transmitting and receiving RF signals of each of the plurality of patch antenna patterns 1110d. can do.

The plurality of chip antennas 1170c and 1170d may have two electrodes facing each other, and may be disposed above or below the antenna module, and may be disposed in the x-axis direction and / or the y-axis direction through one of the two electrodes. It may be arranged to transmit and receive the RF signal.

The plurality of dipole antennas 1175c and 1175d may be disposed above or below the antenna module, and may transmit and receive an RF signal in the z-axis direction. That is, the plurality of dipole antennas 1175c and 1175d may be vertically arranged in a vertical direction (z direction) to be perpendicular to the plurality of antenna devices 100c and 100d. Depending on the design, at least some of the plurality of dipole antennas 1175c and 1175d may be replaced with a monopole antenna.

10A and 10B are views illustrating a lower structure of a connection member of an antenna module including an antenna device according to an embodiment of the present invention.

Referring to FIG. 10A, an antenna module according to an embodiment of the present disclosure may include a connection member 200, an IC 310, an adhesive member 320, an electrical connection structure 330, an encapsulant 340, and a passive component. At least some of the 350 and the sub-substrate 410 may be included.

The connection member 200 may have a structure similar to the connection member described above with reference to FIGS. 1 to 8.

The IC 310 is the same as the above-described IC, and may be disposed under the connection member 200. The IC 310 may be electrically connected to a wire of the connection member 200 to transmit or receive an RF signal, and may be electrically connected to a ground layer of the connection member 200 to receive ground. For example, the IC 310 may generate a converted signal by performing at least some of frequency conversion, amplification, filtering, phase control, and power generation.

The adhesive member 320 may bond the IC 310 and the connection member 200 to each other.

The electrical connection structure 330 may electrically connect the IC 310 and the connection member 200. For example, the electrical connection structure 330 may have a structure such as solder balls, pins, lands, and pads. The electrical connection structure 330 may have a lower melting point than the wiring and the ground layer of the connection member 200 to electrically connect the IC 310 and the connection member 200 through a predetermined process using the low melting point.

The encapsulant 340 may seal at least a portion of the IC 310, and may improve heat dissipation performance and impact protection performance of the IC 310. For example, the encapsulant 340 may be implemented with a photo imageable encapsulant (PIE), an Ajinomoto build-up film (ABF), an epoxy molding compound (EMC), or the like.

The passive component 350 may be disposed on the bottom surface of the connection member 200, and may be electrically connected to the wiring and / or the ground layer of the connection member 200 through the electrical connection structure 330.

The sub-substrate 410 may be disposed under the connection member 200, and may receive an intermediate frequency (IF) signal or a base band signal from the outside and transmit the received signal to the IC 310 or from the IC 310. It may be electrically connected to the connection member 200 to receive the IF signal or the baseband signal to transmit to the outside. Here, the frequency (eg, 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz) of the RF signal is greater than the frequency of the IF signal (eg, 2 GHz, 5 GHz, 10 GHz, etc.).

For example, the sub-substrate 410 may transfer an IF signal or a baseband signal to or from the IC 310 through a wire that may be included in the IC ground layer of the connection member 200. Since the first ground layer of the connection member 200 is disposed between the IC ground layer and the wiring, the IF signal or the baseband signal and the RF signal may be electrically isolated in the antenna module.

Referring to FIG. 10B, the antenna module according to an exemplary embodiment may include at least some of the shielding member 360, the connector 420, and the chip antenna 430.

The shielding member 360 may be disposed under the connection member 200 to confine the IC 310 together with the connection member 200. For example, the shielding member 360 may be arranged to cover (eg, conformal shield) the IC 310 and the passive component 350 together or to cover each other (eg, the compartment shield). For example, the shielding member 360 may have a shape of a hexahedron having one surface open, and may have a hexahedral receiving space through coupling with the connection member 200. The shielding member 360 may be made of a high conductivity material such as copper to have a short skin depth, and may be electrically connected to the ground layer of the connection member 200. Accordingly, the shielding member 360 may reduce electromagnetic noise that may be received by the IC 310 and the passive component 350.

The connector 420 may have a connection structure of a cable (eg, a coaxial cable, a flexible PCB), may be electrically connected to the IC ground layer of the connection member 200, and may play a role similar to that of the above-described sub substrate. have. That is, the connector 420 may receive an IF signal, a baseband signal and / or a power from a cable, or provide an IF signal and / or a baseband signal to a cable.

The chip antenna 430 may transmit or receive an RF signal in support of an antenna device according to an exemplary embodiment. For example, the chip antenna 430 may include a dielectric block having a dielectric constant greater than that of the insulating layer, and a plurality of electrodes disposed on both surfaces of the dielectric block. One of the plurality of electrodes may be electrically connected to the wiring of the connection member 200, and the other may be electrically connected to the ground layer of the connection member 200.

11 is a side view showing a schematic structure of an antenna module including an antenna device according to an embodiment of the present invention.

Referring to FIG. 11, an antenna module according to an exemplary embodiment has a structure in which an antenna device 100f, a patch antenna pattern 1110f, an IC 310f, and a passive component 350f are integrated into a connection member 500f. It can have

The antenna device 100f and the patch antenna pattern 1110f may be designed in the same manner as the antenna device and the patch antenna pattern described above, respectively, and receive and transmit an RF signal from the IC 310f, or transmit the received RF signal. May be communicated to IC 310f.

The connection member 500f may have a structure in which at least one conductive layer 510f and at least one insulating layer 520f are stacked (eg, a structure of a printed circuit board). The conductive layer 510f may have wiring as described above with the ground layer.

In addition, the antenna module according to an exemplary embodiment may further include a flexible connection member 550f. The flexible connecting member 550f may include a first flexible region 570f overlapping the connecting member 500f and a second flexible region 580f not overlapping the connecting member 500f when viewed in the vertical direction.

The second flexible region 580f may be flexibly curved in the vertical direction. Accordingly, the second flexible region 580f may be flexibly connected to the connector of the set board and / or the adjacent antenna module.

The flexible connection member 550f may include a signal line 560f. The intermediate frequency (IF) signal and / or the baseband signal may be transmitted to the IC 310f through the signal line 560f or to a connector and / or an adjacent antenna module of the set board.

12A and 12B are side views illustrating various structures of an antenna module including an antenna device according to an embodiment of the present invention.

Referring to FIG. 12A, an antenna module according to an exemplary embodiment may have a structure in which an antenna package and a connection member are coupled to each other.

The connection member may include at least one conductive layer 1210b and at least one insulating layer 1220b, and may include a wiring via 1230b connected to the at least one conductive layer 1210b and a wiring via 1230b. It may include a connection pad 1240b connected thereto, and may have a structure similar to a copper redistribution layer (RDL). An antenna package may be disposed on an upper surface of the connection member.

The antenna package may include at least some of a plurality of patch antenna patterns 1110b, a plurality of upper coupling patterns 1115b, a plurality of patch antenna feed vias 1120b, a dielectric layer 1140b, and a closure member 1150b. .

One end of the plurality of patch antenna feed vias 1120b may be electrically connected to the plurality of patch antenna patterns 1110b, respectively, and the other end of the plurality of patch antenna feed vias 1120b may each include at least one conductive layer ( 1210b) may be electrically connected to the corresponding wiring.

The dielectric layer 1140b may be disposed to surround side surfaces of each of the plurality of feed vias 1120b. The dielectric layer 1140b may have a height longer than that of at least one insulating layer 1220b of the connection member. The antenna package may be advantageous in view of securing antenna performance as the height and / or width of the dielectric layer 1140b is increased, and boundary conditions (eg, small manufacturing tolerances and short electrical currents) that are advantageous for RF signal transmission / reception operations of the plurality of antenna patterns 1115b. Length, smooth surface, large size of dielectric layer, dielectric constant control, etc.).

The encapsulation member 1150b may be disposed on the dielectric layer 1140b and may improve durability against impact or oxidation of the plurality of patch antenna patterns 1110b and / or the plurality of upper coupling patterns 1115b. Can be. For example, the finishing member 1150b may be implemented as a photo imageable encapsulant (PIE), an Ajinomoto build-up film (ABF), an epoxy molding compound (EMC), or the like, but is not limited thereto.

The IC 1301b, the PMIC 1302b, and the plurality of passive components 1351b, 1352b, and 1353b may be disposed on the bottom surface of the connection member.

The PMIC 1302b generates power and may transfer the generated power to the IC 1301b through at least one conductive layer 1210b of the connection member.

The plurality of passive components 1351b, 1352b, and 1353b may provide an impedance to the IC 1301b and / or the PMIC 1302b. For example, the plurality of passive components 1351b, 1352b, and 1353b may include at least some of a capacitor (eg, a multi-layer ceramic capacitor (MLCC)), an inductor, and a chip resistor.

Referring to FIG. 12B, the IC package includes an IC 1300a, an encapsulant 1305a sealing at least a portion of the IC 1300a, and a support member 1355a disposed so that the first side faces the IC 1300a. And a connecting member including at least one conductive layer 1310a and an insulating layer 1280a electrically connected to the IC 1300a and the supporting member 1355a, and may be coupled to the connecting member or the antenna package. have.

The connection member may include at least one conductive layer 1210a, at least one insulating layer 1220a, a wiring via 1230a, a connection pad 1240a, and a passivation layer 1250a. The antenna package includes a plurality of patch antenna patterns 1110a, 1110b, 1110c, and 1110d, a plurality of upper coupling patterns 1115a, 1115b, 1115c, and 1115d, a plurality of patch antenna feed vias 1120a, 1120b, 1120c, and 1120d, The dielectric layer 1140a and the closure member 1150a may be included.

The IC package may be coupled to the aforementioned connection member. The RF signal generated by the IC 1300a included in the IC package may be transmitted to the antenna package through at least one conductive layer 1310a to be transmitted toward the top surface of the antenna module, and the RF signal received by the antenna package may be at least It may be transferred to the IC 1300a through one conductive layer 1310a.

The IC package may further include a connection pad 1330a disposed on an upper surface and / or a lower surface of the IC 1300a. The connection pads disposed on the upper surface of the IC 1300a may be electrically connected to at least one conductive layer 1310a, and the connection pads disposed on the lower surface of the IC 1300a may be supported by the lower conductive layer 1320a. 1355a or the core plating member 1365a. Here, the core plating member 1365a may provide a ground region to the IC 1300a.

The support member 1355a penetrates the core through the core dielectric layer 1356a in contact with the connection member, the core conductive layer 1359a disposed on the top and / or bottom surfaces of the core dielectric layer 1356a, and the core dielectric layer 1356a. At least one core via 1360a may be electrically connected to the conductive layer 1359a and electrically connected to the connection pad 1330a. The at least one core via 1360a may be electrically connected to an electrical connection structure 1340a such as a solder ball, a pin, and a land.

Accordingly, the support member 1355a may receive a base signal or power from a lower surface to transfer the base signal and / or power to the IC 1300a through at least one conductive layer 1310a of the connection member.

The IC 1300a may generate an RF signal of a millimeter wave (mmWave) band using the base signal and / or the power source. For example, the IC 1300a may receive a low frequency base signal, perform frequency conversion, amplification, filtering phase control, and power generation of the base signal, and may include a compound semiconductor (eg, GaAs) in consideration of high frequency characteristics. It may be implemented as or may be implemented as a silicon semiconductor.

The IC package may further include a passive component 1350a electrically connected to a corresponding wiring of the at least one conductive layer 1310a. The passive component 1350a may be disposed in the accommodation space 1306a provided by the support member 1355a.

The IC package may include core plating members 1365a and 1370a disposed on side surfaces of the support member 1355a. The core plating members 1365a and 1370a may provide a ground area to the IC 1300a and may radiate heat from the IC 1300a to the outside or remove noise of the IC 1300a.

On the other hand, the IC package and the connecting member may be independently manufactured and combined, but may also be manufactured together according to the design. That is, a separate combining process between the plurality of packages may be omitted.

Meanwhile, the IC package may be coupled to the connection member through the electrical connection structure 1290a and the passivation layer 1285a, but the electrical connection structure 1290a and the passivation layer 1285a may be omitted according to design. .

13A and 13B are plan views illustrating an arrangement in an electronic device of an antenna module according to an exemplary embodiment of the present disclosure.

Referring to FIG. 13A, an antenna module including an antenna device 100g, a patch antenna pattern 1110g, and a dielectric layer 1140g is disposed on the side boundary of the electronic device 700g on the set substrate 600g of the electronic device 700g. Can be arranged adjacently.

The electronic device 700g is a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer. ), Monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, etc. It is not limited.

The communication module 610g and the baseband circuit 620g may be further disposed on the set substrate 600g. The antenna module may be electrically connected to the communication module 610g and / or the baseband circuit 620g through the coaxial cable 630g.

The communication module 610g may include a memory chip such as volatile memory (eg, DRAM), non-volatile memory (eg, ROM), and flash memory to perform digital signal processing; Application processor chips such as central processors (eg, CPUs), graphics processors (eg, GPUs), digital signal processors, cryptographic processors, microprocessors, microcontrollers; It may include at least a portion of a logic chip, such as an analog-digital converter, an application-specific IC (ASIC).

The baseband circuit 620g may generate a base signal by performing analog-to-digital conversion, amplification, filtering, and frequency conversion on the analog signal. The base signal input and output from the baseband circuit 620g may be transmitted to the antenna module through a cable.

For example, the base signal may be transmitted to the IC through an electrical connection structure, core vias, and wiring. The IC may convert the base signal into an RF signal of a millimeter wave (mmWave) band.

Referring to FIG. 13B, a plurality of antenna modules each including the antenna device 100h, the patch antenna pattern 1110h, and the dielectric layer 1140h may be configured to include the electronic device 700h on the set substrate 600h of the electronic device 700h. One side boundary and the other side boundary may be disposed adjacent to each other, and the communication module 610h and the baseband circuit 620h may be further disposed on the set substrate 600h. The plurality of antenna modules may be electrically connected to the communication module 610h and / or the baseband circuit 620h through the coaxial cable 630h.

Meanwhile, the conductive layer, the ground layer, the feed line, the feed via, the antenna pattern, the patch antenna pattern, the shield via, the director pattern, the electrical connection structure, the plating member, and the core via disclosed herein are metal materials (eg, copper ( Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or conductive materials such as alloys thereof). Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), Sputtering, Subtractive, Additive, Semi-Additive Process (SAP), Modified Semi-Additive Process (MSAP) It may be formed according to the plating method such as), but is not limited thereto.

Meanwhile, the dielectric layers and / or insulating layers disclosed herein may be FR4, liquid crystal polymer (LCP), low temperature co-fired ceramic (LTCC), thermosetting resins such as epoxy resins, thermoplastic resins such as polyimide, or these resins. Resin, prepreg, Ajinomoto build-up film (ABF), FR-4, Bisaleimide Triazine (BT), impregnated into core materials such as glass fiber, glass cloth, and glass fabric with inorganic fillers Photo Imagable Dielectric (PID) resin, Copper Clad Laminate (CCL), or glass or ceramic-based insulation may be implemented. The insulating layer may include a conductive layer, a ground layer, a feed line, a feed via, an antenna pattern, a patch antenna pattern, a shield via, a director pattern, an electrical connection structure, a plating member, and a core via in the antenna device and the antenna module disclosed herein. It can be filled in at least part of the unplaced position.

On the other hand, RF signals disclosed herein are Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA +, HSDPA +, HSUPA +, EDGE, It may have a format in accordance with, but not limited to, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G and any other wireless and wired protocols designated.

Although the present invention has been described by specific embodiments such as specific components and the like, but the embodiments and the drawings are provided to assist in a more general understanding of the present invention, the present invention is not limited to the above embodiments. For those skilled in the art, various modifications and variations can be made from these descriptions.

100: antenna device
110: feeding line
111: feeding via
112: via pattern
120: antenna pattern
125: director pattern
200: connecting member
212: first wiring
214: second wiring
221: first ground layer
222: second ground layer
223: third ground layer
224: fourth ground layer
225: fifth ground layer
231: first wiring via
232: second wiring via
245: plurality of shielded vias
310: integrated circuit (IC)
350: passive components
360: shield member
P1: first protrusion area
P2: second protrusion area
P3: third protrusion area
C1: first cavity
C2: second cavity
1110: patch antenna pattern
1120: patch antenna feed via

Claims (12)

An antenna pattern having a form of a dipole including first and second poles;
A feedline electrically connected to the antenna pattern and extending rearward; And
At least one ground layer disposed behind the antenna pattern to be spaced apart from the feed line and providing first and second cavities spaced apart from each other toward the first and second poles, respectively; Antenna device comprising a.
The method of claim 1, wherein the at least one ground layer,
An upper ground layer disposed above the feed line; And
A lower ground layer disposed below the feed line and providing the first and second cavities; Antenna device comprising a.
The method of claim 1, wherein the at least one ground layer,
And a plurality of ground layers disposed at different heights and protruding forward between the first and second cavities.
The method of claim 3,
And a portion of the plurality of ground layers that protrudes forward between the first and second cavities does not overlap the antenna pattern in the vertical direction.
The method of claim 1, wherein the at least one ground layer,
Further comprising a plurality of ground layers disposed at different heights,
Some of the plurality of ground layers cover the first and second cavities in the vertical direction.
The method of claim 5,
Further comprising a feed via electrically connected between the antenna pattern and the feed line,
The antenna pattern is disposed so as to be separated by the feed via from the ground layer covering the first and second cavity of the plurality of ground layers.
The method of claim 1,
Further comprising a feed via electrically connected between the antenna pattern and the feed line,
And the at least one ground layer protrudes toward the feed via.
The method of claim 7, wherein the at least one ground layer,
And an intermediate ground layer disposed at a height between the antenna pattern and the feed line, a lower ground layer disposed below the antenna pattern, and an upper ground layer disposed above the feed line.
The method of claim 7, wherein
And a director pattern spaced apart from the front of the first and second poles at the same height as the first and second poles.
The method of claim 1, wherein the feed line,
A first feedline electrically connected to the first pole; And
A second feedline electrically connected to the second pole; Antenna device comprising a.
The method of claim 1,
And a plurality of shielding vias electrically connected to the at least one ground layer and arranged along at least a portion of a boundary of the first and second cavities.
The method of claim 11,
And the plurality of shielding vias are further arranged along an extension line connecting rear boundaries of the first and second cavities and not along a boundary line in a direction toward each other of the first and second cavities.

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