KR102260373B1 - Antenna module and antenna apparatus - Google Patents

Abstract

An antenna device according to an embodiment of the present invention includes a wiring package in which second, third, and fourth conductive layers are sequentially disposed, the second conductive layer includes a feeding line, and the fourth conductive layer a silver antenna member, the wiring package includes a feeding via electrically connecting the feeding line and the antenna member, and the third conductive layer is spaced apart from the feeding via and protrudes toward the feeding via. A ground member is included.

Description

Antenna module and antenna apparatus

The present invention relates to an antenna module and an antenna device.

Recently, millimeter wave (mmWave) communication including fifth generation (5G) communication has been actively studied, and research for commercialization of an antenna module that smoothly implements it is also being actively conducted.

Traditionally, the antenna module that provides millimeter wave communication environment has a coaxial cable by placing the IC and antenna on the board to satisfy the high level of antenna performance (eg transmission/reception rate, gain, directivity, etc.) according to the high frequency. has been using a structure that connects to

However, such a structure may cause insufficient antenna arrangement space, limited degree of freedom in antenna shape, increased interference between the antenna and IC, and increased size/cost of the antenna module.

Laid-Open Patent Publication No. 10-2014-0095808

The present invention provides an antenna module and an antenna device.

An antenna device according to an embodiment of the present invention includes a wiring package in which second, third, and fourth conductive layers are sequentially disposed, the second conductive layer includes a feeding line, and the fourth conductive layer a silver antenna member, the wiring package includes a feeding via electrically connecting the feeding line and the antenna member, and the third conductive layer is spaced apart from the feeding via and protrudes toward the feeding via. A ground member is included.

An antenna device according to an embodiment of the present invention includes a wiring package in which third, fourth, and fifth conductive layers are sequentially disposed, wherein the fourth conductive layer is a dipole including a first pole and a second pole a third ground including a dipole-shaped antenna member, wherein at least one of the third and fifth conductive layers is disposed to overlap the antenna member based on the stacking direction of the third, fourth, and fifth conductive layers include absence.

The antenna device according to an embodiment of the present invention may expand the RF signal transmission/reception direction in omni-directional directions by forming radiation patterns for RF signal transmission/reception in different first and second directions, Antenna performance in two directions (eg, transmission/reception rate, gain, bandwidth, directivity, etc.) may be improved, or dual-band transmission/reception in a second direction of the antenna member may be enabled.

In addition, the antenna device according to an embodiment of the present invention may have a structure advantageous for miniaturization while improving RF signal transmission/reception performance in the first and second directions.

The dual-band antenna device according to an embodiment of the present invention can transmit and receive a dual-band RF signal while having a simplified structure.

1 is a view showing an antenna module according to an embodiment of the present invention.
2 is a view showing an antenna module and a second ground member according to an embodiment of the present invention.
3 is a view showing an antenna module and third and fourth ground members according to an embodiment of the present invention.
4 is a view showing an antenna module, a fifth ground member, and widths of the ground member according to an embodiment of the present invention.
5 is a diagram illustrating an antenna module and a feeding via according to an embodiment of the present invention.
6 is a diagram illustrating an antenna module and a plurality of dipole shapes according to an embodiment of the present invention.
7 is a view showing an antenna module, a ground layer, and a plurality of shielding vias according to an embodiment of the present invention.
8 is a view showing an additional form of an antenna module and a ground layer according to an embodiment of the present invention.
9 is a view illustrating an antenna module and a director member according to an embodiment of the present invention.
10 is a view illustrating an antenna module, a folded dipole shape, and an additional shape of a director member according to an embodiment of the present invention.
11A and 11B are diagrams illustrating a dual-band antenna device according to an embodiment of the present invention.
12 is a diagram illustrating an antenna module, an IC, and an antenna package according to an embodiment of the present invention.
13 is a diagram illustrating an antenna module and an IC package according to an embodiment of the present invention.
14 is a diagram illustrating an arrangement position of an antenna module and a dual-band antenna device according to an embodiment of the present invention.
15A and 15B are diagrams illustrating S-parameters and gains according to frequencies of an antenna module and a dual-band antenna device according to an embodiment of the present invention, respectively.
16A and 16B are diagrams illustrating an arrangement of an antenna module in an electronic device according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0023] Reference is made to the accompanying drawings, which show by way of illustration specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the present invention. It should be understood that the various embodiments of the present invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein with respect to one embodiment may be embodied in other embodiments without departing from the spirit and scope of the invention. In addition, it should be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the present invention. Accordingly, the following detailed description is not intended to be taken in a limiting sense, and the scope of the present invention is limited only by the appended claims, along with all equivalents as claimed by the claims. Like reference numerals in the drawings refer to the same or similar functions throughout the various aspects.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art can easily practice the present invention.

1 is a view showing an antenna module according to an embodiment of the present invention.

Referring to FIG. 1 , an antenna module according to an embodiment of the present invention may include a wiring package 200a. The wiring package 200a may include at least one wiring layer and at least one insulating layer, and a first surface (eg, a lower surface) on which the IC is disposed and a second surface (eg, an upper surface) on which the antenna package is disposed. can provide

The antenna package may be implemented as homogeneous or heterogeneous with respect to the wiring package 200a, and may transmit or receive an RF signal with respect to the direction in which the first surface of the wiring package 200a faces. have. Accordingly, the antenna module according to an embodiment of the present invention may form a radiation pattern in the first direction to transmit or receive an RF signal in the first direction.

Referring to FIG. 1 , the antenna module according to an embodiment of the present invention may include a feeding line 110a, an antenna member 120a, and a ground member 130a, so that in the second direction (eg, side). A radiation pattern may be formed in the second direction to transmit or receive an RF signal. That is, the antenna module may expand the RF signal transmission/reception direction in an omni-directional manner.

The feeding line 110a may be electrically connected to at least one wiring layer. That is, the feeding line 110a may transmit an RF signal to the IC through at least one wiring layer, and may receive an RF signal from the IC through at least one wiring layer.

The antenna member 120a may be electrically connected to the feeding line 110a and configured to transmit or receive an RF signal. For example, the antenna member 120a may have a dipole shape including a first pole and a second pole. Here, the first pole and the second pole may be electrically connected to the first and second feeding lines of the feeding line 110a, respectively.

The antenna member 120a may have an inherent frequency band (eg, 28 GHz) according to intrinsic factors (eg, pole length, pole thickness, spacing between poles, spacing between poles and the side of the wiring package, dielectric constant of an insulating layer, etc.) .

The ground member 130a may be disposed to be spaced apart from the feeding line 110a in a direction (eg, top or bottom) toward the first or second surface of the wiring package 200a.

The ground member 130a may be electromagnetically coupled to the antenna member 120a, and the shape of the ground member 130a (eg, width, length, thickness, separation distance from the feeding line, and the antenna member) The frequency characteristic of the antenna member 120a may be influenced depending on the degree of electrical isolation, etc.).

For example, the ground member 130a may provide an extended frequency band (eg, 38 GHz) to the antenna member 120a, and when the extended frequency band is similar to the intrinsic frequency band, the implicit frequency band of the antenna member 120a is It is also possible to improve the bandwidth or gain of the frequency band.

Accordingly, the antenna module according to an embodiment of the present invention improves the antenna performance (eg, transmit/receive rate, gain, bandwidth, directivity, etc.) in the second direction of the antenna member 120a, or the antenna member It is possible to enable dual-band transmission and reception in the second direction of 120a.

Meanwhile, referring to FIG. 1 , the antenna module according to an embodiment of the present invention may further include at least a portion of an impedance conversion line 115a, a third ground member 140a, and a fifth ground member 145a. have.

The impedance conversion line 115a may be electrically connected between the feeding line 110a and the antenna member 120a. For example, the impedance conversion line 115a may have a thickness different from that of the feeding line 110a, and thus may have an impedance different from that of the feeding line 110a. The impedance conversion line 115a may be directly connected to the antenna member 120a, but may be connected to one end of the feeding line 110a and disposed adjacent to the center of the wiring package 200a according to design.

The third ground member 140a may be disposed to be spaced apart from the antenna member 120a in a direction toward the first surface of the wiring package 200a. The third ground member 140a may be electromagnetically coupled to the antenna member 120a to improve a gain or transmit/receive rate of the antenna member 120a.

For example, the third ground member 140a may include a plurality of ground patterns with gaps therebetween to correspond to the shape (eg, dipole) of the antenna member 120a, and the antenna member 120a ) may have a greater width than the width of the antenna member 120a to completely cover the lower surface of the antenna member 120a.

The fifth ground member 145a may be erected adjacent to the inner boundary of the third ground member 140a. For example, the fifth ground member 145a blocks between a part of the antenna member 120a (eg, the end of a dipole) and the ground member 130a and the other part of the antenna member 120a (eg, a dipole). start portion) and the ground member 130a. Accordingly, the electromagnetic coupling of the ground member 130a to the antenna member 120a may be precisely controlled, and the isolation degree of the antenna member 120a to the wiring layer may be improved.

2 is a view showing an antenna module and a second ground member according to an embodiment of the present invention.

Referring to FIG. 2 , in the antenna module according to an embodiment of the present invention, the second of the wiring package 200a from the feeding line so that the feeding line and/or the impedance conversion line is disposed between the ground member 130a and itself. It may further include a second ground member 135a spaced apart in a direction toward the surface or the first surface.

The second ground member 135a may be electromagnetically coupled to the antenna member 120a, and the shape of the second ground member 135a (eg, width, length, thickness, separation distance from the feeding line, The frequency characteristic of the antenna member 120a may be influenced depending on the degree of electrical isolation with respect to the antenna member, etc.).

The second ground member 135a may have the same shape as the ground member 130a, but design elements (eg, specific wiring arrangement of a wiring package, whether an IC package is applied, characteristics of an antenna member, frequency characteristics of an RF signal, Depending on the antenna module manufacturing process, the overall size of the antenna module, the manufacturing cost of the antenna module, etc.), it may have a shape different from that of the ground member 130a or be omitted.

Meanwhile, the third and fifth ground members shown in FIG. 1 may also be omitted according to the design elements.

3 is a view showing an antenna module and third and fourth ground members according to an embodiment of the present invention.

Referring to FIG. 3 , the antenna module according to an embodiment of the present invention may further include a fourth ground member 155a spaced apart from the antenna member in a direction toward the second surface of the wiring package 200a. . The fourth ground member 155a may be electromagnetically coupled to the antenna member to improve a gain or transmit/receive rate of the antenna member.

In addition, since the antenna member is disposed between the third ground member 140a and the fourth ground member 155a, the antenna member may improve directivity of the radiation pattern.

4 is a view showing an antenna module, a fifth ground member, and widths of the ground member according to an embodiment of the present invention.

* Referring to FIG. 4 , the fifth ground member 145b of the antenna module according to an embodiment of the present invention may be implemented in a structure in which a plurality of vias are arranged side by side.

For example, the width of the ground member 130a may match the first via of the fifth ground member 145b.

For example, the ground member 130a may have a short length (eg, L) width to increase the extended frequency band of the antenna member 120a, and a long length to lower the extended frequency band of the antenna member 120a. It may have a width of length (eg, L+M/2+M/2).

5 is a diagram illustrating an antenna module and a feeding via according to an embodiment of the present invention.

Referring to FIG. 5 , the antenna module according to an embodiment of the present invention may further include a feeding via 110b electrically connected between the feeding line 110a and the antenna member 120b. Here, the ground member 130a may be laterally spaced apart from the feeding via 110b.

Due to the feeding via 110b, the antenna member 120b may be disposed below the antenna member shown in FIGS. 1 to 4 , and according to a design, the first surface (eg, the lower surface) of the wiring package 200a. It may be arranged further down. Accordingly, the antenna member 120b may form a radiation pattern at the lower end of the antenna member shown in FIGS. 1 to 4 , and the RF signal transmission/reception direction of the antenna module may be expanded more efficiently.

On the other hand, the antenna module according to an embodiment of the present invention may include a ground via 131a erected on the lower surface of the ground member 130a. The ground via 131a may provide a connection path between the ground member 130a and the third ground member 140b.

6 is a diagram illustrating an antenna module and a plurality of dipole shapes according to an embodiment of the present invention.

Referring to FIG. 6 , the antenna module according to an embodiment of the present invention may include a plurality of antenna members 120a and 120b disposed side by side with each other. The plurality of antenna members 120a and 120b may be electrically connected to each other by a feeding via 110b.

In addition, the antenna module according to an embodiment of the present invention may further include a plurality of third antenna members 140a and 140b disposed to correspond to the plurality of antenna members 120a and 120b, respectively.

Accordingly, since the space occupied by each of the plurality of antenna members 120a and 120b can be efficiently distributed within the wiring package 200a, the antenna module according to an embodiment of the present invention has a size while further improving antenna performance. to prevent excessive expansion of

7 is a view showing an antenna module, a ground layer, and a plurality of shielding vias according to an embodiment of the present invention.

Referring to FIG. 7 , the antenna module according to an embodiment of the present invention may further include a ground layer 225a disposed on the same layer as the feeding line 110a in the wiring package and spaced apart from the feeding line 110a. can

The ground layer 225a may act as a reflector with respect to the antenna member 120a. That is, the ground layer 225a may assist the antenna performance of the antenna member 120a.

In addition, referring to FIG. 7 , in the antenna module according to an embodiment of the present invention, a plurality of shielding vias 245a erected on the ground layer 225a to block between the wiring layer 210a and the antenna member 120a. may further include.

The plurality of shielding vias 245a can reduce the RF signal transmission loss of the wiring layer 210a, can act as a reflector with respect to the antenna member 120a, and increase the isolation degree of the antenna member 120a with respect to the wiring layer 210a. can be improved

8 is a view showing an additional form of an antenna module and a ground layer according to an embodiment of the present invention.

Referring to FIG. 8 , the boundary from the ground layer 225b toward the antenna member 120a may be closer to the center of the wiring package. Accordingly, since the ground member 130a has an effect of extending its length, the antenna member 120a and the third ground member 140a may be further pulled toward the center of the wiring package. Accordingly, since the width of the wiring package can be reduced, the size of the antenna module according to an embodiment of the present invention can be reduced.

Meanwhile, the ground layer 225b may have a shape in which a partial region is removed from the ground layer shown in FIG. 7 , and a width of the partial region may correspond to the width of the ground member 130a, and the partial region The length of may vary depending on the arrangement position of the antenna member 120a, the frequency band, or the specific wiring arrangement of the wiring package.

9 is a view illustrating an antenna module and a director member according to an embodiment of the present invention.

Referring to FIG. 9 , the antenna module according to an embodiment of the present invention is disposed between the third ground member 140c and the fourth ground member and is disposed to pass between the gaps of the third ground member 140c. and may further include a director member 125a spaced apart from the antenna member 120a.

The director member 125a may be electromagnetically coupled to the antenna member 120a to improve a gain or bandwidth of the antenna member 120a. The director member 125a may be shorter than the total dipole length of the antenna member 120a. As the length of the director member 125a decreases, the antenna member 120a may concentrate electromagnetic coupling. Accordingly, the directivity of the antenna member 120a may be further improved.

10 is a view illustrating an antenna module, a folded dipole shape, and an additional shape of a director member according to an embodiment of the present invention.

Referring to FIG. 10 , the antenna member 120c included in the antenna module according to an embodiment of the present invention may have a folded dipole shape, and the director member 125b included in the antenna module has a curved shape. can have

Here, the size of the third ground member 140c may be designed to be larger than the third ground member shown in FIG. 9 according to the expanded shape of the antenna member 120c and the expanded shape of the director member 125b.

11A and 11B are diagrams illustrating a dual-band antenna device according to an embodiment of the present invention.

Referring to FIG. 11A , the dual-band antenna device according to an embodiment of the present invention may include a feeding line 110d, a pole 120d, and a ground member, and an impedance conversion line 115d and an arm member 130d. , 135d) may further include.

The feeding line 110d may be electrically connected to the IC. The feeding line 110d may be composed of first and second feeding lines having a symmetrical structure.

The pole 120d may be electrically connected to the feeding line 110d and configured to transmit or receive an RF signal. The pole 120d may have an intrinsic frequency band according to an intrinsic factor. The pole 120d may be implemented as first and second poles having a symmetric structure.

The ground member may be spaced apart from the feeding line 110d in the upper surface or lower surface direction, and may have a length greater than the distance between the two feeding lines 110d and shorter than the total length of the two poles 120d.

The ground member may be electromagnetically coupled to the pole 120d, and the width of the ground member may affect a frequency characteristic of the pole 120d. Accordingly, the pole 120d may further have an extended frequency band.

Therefore, the dual-band antenna device according to an embodiment of the present invention can transmit and receive a dual-band RF signal while having a simplified structure.

The arm members 130d and 135d may cover both surfaces of the pole 120d to be electromagnetically coupled to the pole 120d. For example, the arm members 130d and 135d may have a U shape when viewed from the side.

Referring to FIG. 11B , the dual-band antenna device according to an embodiment of the present invention may further include a pole via 150a connecting the arm members 130d and 135d and the pole 120d to each other.

The pole via 150a may control the direction of the current flowing through the pole 120d. For example, the pole via 150a may adjust the electrical distance of one of the two poles 120d so that the current direction or phase of each of the two poles 120d is the same.

Meanwhile, the pole via 150a may be included in the antenna module described above with reference to FIGS. 1 to 10 . The pole via included in the antenna module may be disposed to connect between the antenna member and the third or fourth ground member, and may perform a similar function to the pole via 150a.

12 is a diagram illustrating an antenna module, an IC, and an antenna package according to an embodiment of the present invention.

12 , the antenna module according to an embodiment of the present invention may have a heterogeneous structure in which an antenna package and a wiring package are combined. That is, the antenna module improves the antenna performance (eg, transmit/receive rate, gain, directivity, etc.) by utilizing both the characteristics that are easy to improve the antenna performance of the antenna package and the characteristics that are easy to arrange the circuit pattern or IC of the wiring package. It can be improved and miniaturized.

The wiring package may include at least one wiring layer 1210b and at least one insulating layer 1220b, a wiring via 1230b connected to the at least one wiring layer 1210b, and a connection connected to the wiring via 1230b. The pad 1240b may be included and may have a structure similar to that of a copper redistribution layer (RDL). An antenna package may be disposed on the upper surface of the wiring package.

The antenna package may include at least a portion of a plurality of director members 1110b, a plurality of antenna members 1115b, a plurality of through vias 1120b, a dielectric layer 1140b, a finishing member 1150b, and a plating member 1160b. have.

The plurality of director members 1110b may be disposed adjacent to one surface (upper surface of FIG. 12 ) of the antenna module, and receive RF signals together with the plurality of antenna members 1115b disposed at the bottom or generated by the IC 1301b. RF signal can be transmitted.

Depending on the design, the plurality of director members 1110b may be omitted, and at least one director member may be further disposed on the plurality of director members 1110b.

The plurality of antenna members 1115b may be electromagnetically coupled to the plurality of director members 1110b disposed thereon and may receive RF signals or transmit RF signals generated by the IC 1301b together with the corresponding director members. . For example, the plurality of antenna members 1115b may have a shape similar to that of a corresponding director member (eg, a patch antenna).

The plurality of through vias 1120b may be electrically connected to the plurality of antenna members 1115b to provide a path of an RF signal. The plurality of through vias 1120b may extend by a length greater than a thickness of at least one insulating layer 1220b of the wiring package. Accordingly, the transmission efficiency of the RF signal may be improved.

The dielectric layer 1140b may be disposed to surround a side surface of each of the plurality of through vias 1120b. The dielectric layer 1140b may have a height greater than a height of at least one insulating layer 1220b of the wiring package. The antenna package may be advantageous in terms of securing antenna performance as the height and/or width of the dielectric layer 1140b is increased, and boundary conditions (eg, small manufacturing tolerance, short electrical) advantageous for the RF signal transmission/reception operation of the plurality of antenna members 1115b. length, smooth surface, large size of the dielectric layer, control of the dielectric constant, etc.).

For example, the dielectric layer 1140b and the at least one insulating layer 1220b may be formed of a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or glass fiber (Glass Fiber, Glass Cloth, Resin impregnated into core material such as Glass Fabric, prepreg, ABF (Ajinomoto Build-up Film), FR-4, BT (Bismaleimide Triazine), Photo Imagable Dielectric (PID) resin, general copper clad laminate (Copper Clad Laminate, CCL) or a glass or ceramic-based insulating material may be implemented.

The dielectric layer 1140b may have a dielectric constant greater than the dielectric constant Dk of the at least one insulating layer 220a. For example, the dielectric layer 1140b may be made of glass, ceramic, or silicon having a large dielectric constant (eg, 5 or more), and at least one insulating layer 220a has a relatively small dielectric constant. It may be implemented as a copper clad laminate (CCL) or prepreg having a

An encapsulation member 1150b may be disposed on the dielectric layer 1140b, and may improve durability of the plurality of antenna members 1115b and/or the plurality of director members 1110b against impact or oxidation. For example, the finishing member 1150b may be implemented with a photo imageable encapsulant (PIE), an Ajinomoto build-up film (ABF), an epoxy molding compound (EMC), or the like, but is not limited thereto.

The plating member 1160b may be disposed in the dielectric layer 1140b to surround side surfaces of the plurality of through-vias 1120b, respectively. That is, the plating member 1160b may form a plurality of cavities corresponding to the plurality of antenna members 1115b, respectively, to provide boundary conditions for RF signal transmission/reception of the corresponding antenna members.

Meanwhile, the IC 1301b, the PMIC 1302b, and the plurality of passive components 1351b, 1352b, and 1353b may be disposed on the lower surface of the wiring package.

The IC 1301b may generate RF signals transmitted to the plurality of antenna members 1115b and may receive RF signals from the plurality of antenna members 1115b.

The PMIC 1302b may generate power and transfer the generated power to the IC 1301b through at least one wiring layer 1210b of a wiring package.

The plurality of passive components 1351b, 1352b, and 1353b may provide impedance to the IC 1301b and/or the PMIC 1302b. For example, the plurality of passive components 1351b, 1352b, and 1353b may include at least some of a capacitor (eg, a multi-layer ceramic capacitor (MLCC)), an inductor, and a chip resistor.

Meanwhile, the wiring package may include an antenna device 100e including a feeding line 110e, a second antenna member, a ground member 130e, and a second ground member 135e. The feeding line 110e, the second antenna member, the ground member 130e, and the second ground member 135e are the feeding line, the antenna member, the ground member and the second ground member described above with reference to FIGS. 1 to 11, respectively. may be similar to , and the antenna device 100e may further include the impedance conversion line described above with reference to FIGS. 1 to 11 , third, fourth and fifth ground members, a ground layer, and a shielding via.

Meanwhile, depending on the design, the antenna package may be implemented in the same way as the wiring package. For example, the antenna package may include a plurality of antenna members each implemented through a ground pattern and a plurality of through-vias each implemented to have a structure in which the plurality of vias are connected to each other. Whether the antenna package is the same as or different from the wiring package may be classified according to the characteristics of the dielectric layer.

13 is a diagram illustrating an antenna module and an IC package according to an embodiment of the present invention.

Referring to FIG. 13 , the IC package includes an IC 1300a, an encapsulant 1305a sealing at least a portion of the IC 1300a, and a core member 1355a disposed so that the first side faces the IC 1300a. and a connection member including at least one wiring layer 1310a and an insulating layer 280a electrically connected to the IC 1300a and the core member 1355a, and may be coupled to a wiring package or an antenna package. .

The wiring package may include at least one wiring layer 1210a, at least one insulating layer 1220a, a wiring via 1230a, a connection pad 1240a, and a passivation layer 1250a, and the antenna package , a plurality of director members 1110a, 1110b, 1110c, 1110d, a plurality of antenna members 1115a, 1115b, 1115c, 1115d, a plurality of through vias 1120a, 1120b, 1120c, 1120d, a plurality of cavities 1130a, 1130b, 1130c, and 1130d), a dielectric layer 1140a, a finishing member 1150a, and a plating member 1170a may be included.

The IC package may be coupled to the above-described wiring package. The first RF signal generated by the IC 1300a included in the IC package may be transmitted to the antenna package through at least one wiring layer 1310a and transmitted in the direction of the top surface of the antenna module, and the first RF signal received from the antenna package A signal may be transmitted to the IC 1300a through at least one wiring layer 1310a.

The IC package may further include a connection pad 1330a disposed on an upper surface and/or a lower surface of the IC 1300a. The connection pad disposed on the upper surface of the IC 1300a may be electrically connected to at least one wiring layer 1310a, and the connection pad disposed on the lower surface of the IC 1300a may be connected to the core member 1355a through the lower wiring layer 1320a. Alternatively, it may be electrically connected to the core plating member 1365a. Here, the core plating member 1365a may provide a ground region to the IC 1300a.

The core member 1355a includes a core dielectric layer 356a in contact with the connection member, a core wiring layer 1359a disposed on upper and/or lower surfaces of the core dielectric layer 356a, and a core wiring layer passing through the core dielectric layer 356a. At least one core via 1360a electrically connected to 1359a and electrically connected to the connection pad 1330a may be included. The at least one core via 1360a may be electrically connected to an electrical connection structure 1340a such as a solder ball, a pin, or a land.

Accordingly, the core member 1355a may receive a base signal or power from a lower surface and transmit the base signal and/or power to the IC 1300a through at least one wiring layer 1310a of the connection member.

The IC 1300a may generate an RF signal of a millimeter wave (mmWave) band using the base signal and/or power. For example, the IC 1300a may receive a low-frequency base signal and perform frequency conversion, amplification, filtering phase control, and power generation of the base signal, and a compound semiconductor (eg, GaAs) in consideration of high-frequency characteristics. It may be implemented with or may be implemented with a silicon semiconductor.

Meanwhile, the IC package may further include a passive component 1350a electrically connected to a corresponding wiring of the at least one wiring layer 1310a. The passive component 1350a may be disposed in the receiving space 1306a provided by the core member 1355a, and may provide impedance to the IC 1300a and/or the at least one second directional antenna member 1370a. have. For example, the passive component 1350a may include at least a portion of a multi-layer ceramic capacitor (MLCC), an inductor, and a chip resistor.

Meanwhile, the IC package may include core plating members 1365a and 370a disposed on side surfaces of the core member 1355a. The core plating members 1365a and 370a may provide a grounding region to the IC 1300a, and may dissipate heat of the IC 1300a to the outside or remove noise from the IC 1300a.

Meanwhile, the IC package and the wiring package may be independently manufactured and combined, but may also be manufactured together according to design. That is, a separate coupling process between the plurality of packages may be omitted.

Meanwhile, the IC package may be coupled to the wiring package through the electrical connection structure 1290a and the passivation layer 285a, but depending on the design, the electrical connection structure 1290a and the passivation layer 285a may be omitted. .

Meanwhile, the wiring package may include an antenna device 100f including a feeding line 110f, a second antenna member, a ground member 130f, and a second ground member 135f. The feeding line 110f, the second antenna member, the ground member 130f, and the second ground member 135f are the feeding line, the antenna member, the ground member and the second ground member described above with reference to FIGS. 1 to 11, respectively. may be similar to , and the antenna device 100f may further include the impedance conversion line described above with reference to FIGS. 1 to 11 , third, fourth and fifth ground members, a ground layer, and a shielding via.

14 is a diagram illustrating an arrangement position of an antenna module and a dual-band antenna device according to an embodiment of the present invention.

Referring to FIG. 14 , the antenna module according to an embodiment of the present invention includes a plurality of director members 1110d, a cavity 1130d, a dielectric layer 1140d, a plating member 1160d, and a plurality of chip antennas 1170c and 1170d. ) and a plurality of dipole antennas 1175c and 1175d.

The plurality of director members 1110d may transmit and receive RF signals in the z-axis direction together with the corresponding antenna members. The number, arrangement, and shape of the plurality of director members 1110d and the plurality of antenna members disposed below are not particularly limited. For example, the shape of the plurality of director members 1110d may be a circle, and the number of the plurality of director members 1110d may be two or more.

The plurality of chip antennas 1170c and 1170d may be disposed adjacent to the edge of the antenna package, standing up in the z-axis direction, and one of the plurality of chip antennas 1170c and 1170d transmits and receives RF signals in the x-axis direction, and the One may transmit and receive an RF signal in the y-axis direction. Since the plurality of chip antennas 1170c and 1170d are disposed inside the antenna package, the antenna module can minimize a problem of size increase due to an increase in the number of the plurality of chip antennas 1170c and 1170d.

The plurality of dipole antennas 1175c and 1175d may be disposed between the dielectric layer 1140d and the closing member adjacent to the edge of the antenna package, and one of the plurality of dipole antennas 1175c and 1175d may be disposed in the third direction in the x-axis direction. The RF signal may be transmitted/received, and the other may transmit/receive a third RF signal in the y-axis direction. According to design, at least some of the plurality of dipole antennas 1175c and 1175d may be replaced with monopole antennas.

Also, the antenna module may include a plurality of antenna devices 100c and 100d each including a feeding line, a second antenna member, and a ground member. Some of the plurality of antenna devices 100c and 100d may transmit and receive RF signals in the x-axis direction, and others may transmit/receive RF signals in the y-axis direction.

Also, the plurality of antenna devices 100c and 100d may be arranged side by side in a lateral direction of the antenna module, and may be sealed by a dielectric layer 1140c.

15A and 15B are diagrams illustrating S-parameters and gains according to frequencies of an antenna module and a dual-band antenna device according to an embodiment of the present invention, respectively.

15A and 15B , the first cases 510a and 510b having the shortest width of the ground member, the second cases 520a and 520b having the second shortest width of the ground member, and the width of the ground member Among the third cases 530a and 530b having the second longest width and the fourth cases 540a and 540b having the longest width of the ground member, the extension frequency band (about 41 GHz) of the first cases 510a and 510b is the highest. , the extension frequency band (about 36 GHz) of the fourth cases 540a and 540b may be the lowest.

16A and 16B are diagrams illustrating an arrangement of an antenna module in an electronic device according to an embodiment of the present invention.

Referring to FIG. 16A , the antenna module including the antenna device 100g, the director member 1110g, and the dielectric layer 1140g is disposed on the substrate 300g of the electronic device 400g adjacent to the side boundary of the electronic device 400g. can be placed.

The electronic device 400g includes a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, and a computer. ), monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, etc., but may be not limited

A communication module 310g and a baseband circuit 320g may be further disposed on the substrate 300g. The communication module 310g may include a memory chip such as a volatile memory (eg, DRAM), a non-volatile memory (eg, ROM), a flash memory, etc. to perform digital signal processing; application processor chips such as a central processor (eg, CPU), a graphics processor (eg, GPU), a digital signal processor, an encryption processor, a microprocessor, and a microcontroller; It may include at least a part of logic chips such as analog-to-digital converters and application-specific ICs (ASICs).

The baseband circuit 320g may generate a base signal by performing analog-to-digital conversion, amplification, filtering, and frequency conversion on the analog signal. The base signal input/output from the baseband circuit 320g may be transmitted to the antenna module through a cable.

For example, the base signal may be transmitted to the IC through the electrical connection structure shown in FIG. 13 , the core via, and the wiring layer. The IC may convert the base signal into an RF signal of a millimeter wave (mmWave) band.

Referring to FIG. 16B , a plurality of antenna modules each including an antenna device 100h, a director member 1110h, and a dielectric layer 1140h are disposed on a substrate 300h of the electronic device 400h on one side of the electronic device 400h. The boundary and the other side boundary may be disposed adjacent to each other, and a communication module 310h and a baseband circuit 320h may be further disposed on the substrate 300h.

Meanwhile, the wiring layer, feeding line, antenna member, ground member, second to fifth ground member, impedance conversion line, ground layer, shielding via, pole via, ground via, director member, antenna member, and through via disclosed herein. , the electrical connection structure and the plating member are made of a metal material (eg, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium). (Ti) or a conductive material such as an alloy thereof), CVD (chemical vapor deposition), PVD (Physical Vapor Deposition), sputtering (sputtering), subtractive (Subtractive), additive (Additive) , SAP (Semi-Additive Process), MSAP (Modified Semi-Additive Process), etc. may be formed according to a plating method, but is not limited thereto.

On the other hand, the RF signal presented herein is Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, It may have a format according to, but not limited to, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G and any other wireless and wired protocols designated thereafter.

In the above, the present invention has been described with specific matters such as specific components and limited embodiments and drawings, but these are provided to help a more general understanding of the present invention, and the present invention is not limited to the above embodiments. , those of ordinary skill in the art to which the present invention pertains can make various modifications and variations from these descriptions.

100: antenna device
110a: feeding line (feeding line)
110b: feeding via (feeding via)
115: impedance conversion line
120: antenna member
125: director (director) absent
130: ground member
131: ground via
135: second ground member
140: third ground member
145: fifth ground member
150: pole via
155: fourth ground member
200: wiring package
210: wiring layer
225: ground layer
245: shielded via
1110: Director absent
1115: antenna member
1120: through via (through via)
1130: cavity (cavity)
1140: dielectric layer
1150: absence of encapsulation
1160: plating (plating) member
1170: chip antenna
1175: dipole antenna
1210, 1310: wiring layer
1220, 280: insulating layer
1230: wiring via
1240, 1330: connection pad
1250, 285: passivation layer
1290, 1340: electrical connection structure
1300, 1301: IC (Integrated Circuit)
1302: PM (Power Management) IC
1305: suture material
1306: accommodation space
1320: lower wiring layer
1330: connection pad
1350, 1351, 1352, 1353: Passive parts
1355: core member
356: core dielectric layer
1357, 1358, 1359: core wiring layer
1360: core via
1365, 370: core plating member

Claims (10)

and a wiring package in which second, third and fourth conductive layers are sequentially disposed,
The second conductive layer includes a feeding line,
the fourth conductive layer comprises an antenna member;
The wiring package includes a feeding via electrically connecting the feeding line and the antenna member,
and the third conductive layer is spaced apart from the feeding via and includes a first ground member protruding toward the feeding via.
According to claim 1,
The antenna member has a dipole shape including a first pole and a second pole,
The feeding line is composed of a first feeding line and a second feeding line electrically connected to the first pole and the second pole, respectively,
The first ground member has a width greater than a distance from the first feeding line to the second feeding line and shorter than a total length of the first pole and the second pole.
According to claim 1, wherein the wiring package,
a first conductive layer including a second ground member protruding toward the feeding via when viewed in a stacking direction of the second, third and fourth conductive layers;
The first conductive layer is arranged such that the first, second, third and fourth conductive layers are sequentially disposed.
According to claim 1, wherein the wiring package,
A fifth conductive layer including a third ground member disposed to overlap the antenna member based on a stacking direction of the second, third and fourth conductive layers,
The fifth conductive layer is arranged such that the second, third, fourth and fifth conductive layers are sequentially disposed.
According to claim 1,
The second conductive layer further includes a ground layer spaced apart from the feeding line,
The wiring package further includes a plurality of shielding vias arranged along a boundary line of the ground layer.
a wiring package in which third, fourth and fifth conductive layers are sequentially disposed;
The fourth conductive layer includes an antenna member in the form of a dipole including a first pole and a second pole,
and at least one of the third and fifth conductive layers includes a third ground member disposed to overlap the antenna member based on a stacking direction of the third, fourth, and fifth conductive layers.
7. The method of claim 6,
the third conductive layer includes a fourth ground member disposed to overlap the antenna member based on a stacking direction of the third, fourth and fifth conductive layers;
and the third ground member is disposed on the fifth conductive layer.
The method of claim 7, wherein the wiring package,
a fifth ground member disposed closer to the center of the wiring package than the antenna member to connect the third ground member and the fourth ground member to each other;
The fifth ground member has a length shorter than a total length of the first pole and the second pole and is disposed side by side on the first pole and the second pole.
7. The method of claim 6,
The third ground member has a gap at a position overlapping a space between the first pole and the second pole based on the stacking direction of the third, fourth, and fifth conductive layers, respectively.
The method of claim 6, wherein the wiring package,
and a pole via connecting one of the first pole and the second pole to the third ground member.

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