CN111244611B

CN111244611B - Antenna device

Info

Publication number: CN111244611B
Application number: CN201911006140.9A
Authority: CN
Inventors: 金楠基; 柳正基; 韩奎范; 任荣均
Original assignee: Samsung Electro Mechanics Co Ltd
Current assignee: Samsung Electro Mechanics Co Ltd
Priority date: 2018-11-29
Filing date: 2019-10-22
Publication date: 2024-02-13
Anticipated expiration: 2039-10-22
Also published as: CN111244611A; CN112201938A

Abstract

The invention provides an antenna device comprising a first dipole antenna pattern, a feed line, a first ground plane and a first barrier pattern. The feed lines are connected to corresponding ones of the first dipole antenna patterns. The first ground plane is disposed laterally of and spaced apart from each of the first dipole antenna patterns. The first blocking pattern connected to and extending from the first ground plane is disposed between adjacent ones of the first dipole antenna patterns.

Description

Antenna device

The present application claims the priority rights of korean patent application No. 10-2018-0151173, which was filed on the 11 th month 29 of 2018, korean patent application No. 10-2019-0001344, which was filed on the 1 st month 4 of 2019, and korean patent application No. 10-2019-0025311, which was filed on the 3 th month 5 of 2019, which are incorporated herein by reference in their entirety for all purposes.

Technical Field

The following description relates to an antenna device.

Background

Mobile communication data traffic is increasing every year. Various techniques have been developed to support rapid incremental of real-time data in wireless networks. For example, converting internet of things (IoT) -based data into content such as Augmented Reality (AR), virtual Reality (VR), on-site VR/AR linked with SNS, autopilot functionality, and applications such as synchronized views (transmitting real-time images from a user perspective using compact cameras) may require communications (e.g., 5G communications, mmWave communications, etc.) that support the sending and receiving of large amounts of data.

Accordingly, mmWave communications including the 5 th generation (5G) have been continuously studied, and commercialization and standardization of antenna devices for realizing such communications have been studied.

During transmission, RF signals of high frequency bands (e.g., 24GHz, 28GHz, 36GHz, 39GHz, 60GHz, etc.) may be easily absorbed and lost, and communication quality may be deteriorated. Accordingly, an antenna for performing communication in a high frequency band may require a different technical approach from that used in a general-purpose antenna, and may require a special technique such as a separate power amplifier or the like to achieve antenna gain, integration of an antenna and an RFIC, effective omni-directional radiated power (EIRP), and the like.

Disclosure of Invention

This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

In one general aspect, an antenna device includes a first dipole antenna pattern, a feed line, a first ground plane, and a first barrier pattern. The feed lines are connected to corresponding ones of the first dipole antenna patterns. The first ground plane is disposed on a side of the first dipole antenna patterns and spaced apart from each of the first dipole antenna patterns. The first blocking pattern connected to and extending from the first ground plane is disposed between adjacent ones of the first dipole antenna patterns.

The antenna apparatus may further include: a second ground plane disposed below the first ground plane; and a second blocking pattern. The second blocking pattern may be connected to the second ground plane, have at least a portion overlapping the first blocking pattern in a normal direction, and extend from the second ground plane.

The antenna device may further include a shielding via disposed along a perimeter of the first ground plane and connected to the second ground plane. The region between the first barrier pattern and the second barrier pattern may be filled with an insulating layer.

The antenna device may further include: a second dipole antenna pattern disposed under a corresponding one of the first dipole antenna patterns; and a radial via connecting the first dipole antenna pattern and the second dipole antenna pattern.

The antenna device may further include: a third ground plane disposed below the first ground plane; and a third blocking pattern connected to and extending from the third ground plane, disposed between adjacent ones of the second dipole antenna patterns.

The antenna apparatus may further include: a director pattern disposed outside and spaced apart from a corresponding one of the second dipole antenna patterns. A region overlapping the director pattern in a normal direction in an outer side of the first dipole antenna pattern may be filled with an insulating layer.

The antenna apparatus may further include: a director pattern disposed outside and spaced apart from a corresponding one of the first dipole antenna patterns. The first blocking pattern may extend outward by a length corresponding to an area between the first dipole antenna pattern and the director pattern.

An end of the first dipole antenna pattern may be received into a recessed portion of the first ground plane.

The first blocking pattern may extend from one of the concave portions.

The antenna apparatus may further include a first feed via connecting the first dipole antenna pattern and the feed line. The first ground plane may include a portion protruding toward the first feed via within one of the recessed portions of the first ground plane.

The antenna apparatus may further include a patch antenna pattern disposed under the first ground plane and a second feed via connecting the patch antenna pattern.

The antenna device may further include a coupling member surrounding each of the patch antenna patterns. A perimeter or portion of the coupling member may overlap a perimeter of the first ground plane in a normal direction.

In another general aspect, an antenna apparatus includes: a first dipole antenna pattern; a feed line connected to a corresponding one of the first dipole antenna patterns; a first ground plane disposed laterally of and spaced apart from each of the first dipole antenna patterns; and a first blocking pattern electrically isolated from the first ground plane and disposed between adjacent ones of the first dipole antenna patterns.

The first blocking pattern may include coupling patterns spaced apart from each other.

The first barrier pattern may have a width at one end thereof smaller than a width at the other end thereof.

The antenna apparatus may further include: a second ground plane disposed below the first ground plane; and a second blocking pattern connected to the second ground plane, having at least a portion overlapping the first blocking pattern in a normal direction, and extending from the second ground plane.

In another general aspect, an antenna apparatus includes: a first dipole antenna pattern; a ground plane disposed laterally of and spaced apart from each of the first dipole antenna patterns; a first feed line and a second feed line, one end of which is connected to one of the first dipole antenna patterns and the other end of which is connected to one of the ground planes; and a first blocking pattern connected to and extending from the ground plane, disposed between adjacent ones of the first dipole antenna patterns.

The outer edge of said one of the ground planes may have a stepped profile.

The antenna apparatus may further include: a director pattern disposed outside and spaced apart from a corresponding one of the first dipole antenna patterns.

The first barrier pattern may extend beyond the first dipole antenna pattern.

The first barrier pattern may extend below an upper surface of the first dipole antenna pattern.

The first barrier pattern may have a width at one end thereof smaller than a width at the other end thereof. The first and second feed lines may be configured to differentially receive signals from and/or to differentially transmit signals to corresponding ones of the first dipole antenna patterns.

Other features and aspects will be apparent from the following detailed description, the drawings, and the claims.

Drawings

Fig. 1A and 1B are perspective views illustrating an antenna apparatus according to an example embodiment of the present disclosure.

Fig. 2 is a side view of an antenna device according to an example embodiment of the present disclosure.

Fig. 3 is a plan view illustrating an antenna apparatus according to an example embodiment of the present disclosure.

Fig. 4A to 4G are plan views illustrating various structures of a blocking pattern of an antenna device according to an example embodiment of the present disclosure.

Fig. 5A to 5E are plan views sequentially showing first to fifth ground planes of an antenna device in a z-direction according to an example embodiment of the present disclosure.

Fig. 6 is a perspective view showing the arrangement of the antenna device shown in fig. 1A to 5E.

Fig. 7A and 7B are diagrams illustrating a structure of a lower portion of a connection member that may be included in the antenna apparatus illustrated in fig. 1A to 5E.

Fig. 8 is a side view of a rigid-flexible structure that can be implemented in the antenna device shown in fig. 1A to 5E.

Fig. 9A and 9B are side views of an example of an antenna package and an example of an IC package that may be included in the antenna device shown in fig. 1A to 5E.

Fig. 10A to 10C are plan views showing the arrangement of an antenna apparatus in an electronic device according to an example embodiment of the present disclosure.

Like numbers refer to like elements throughout the drawings and detailed description. The figures may not be drawn to scale and the relative sizes, proportions, and depictions of elements in the figures may be exaggerated for clarity, illustration, and convenience.

Detailed Description

The following detailed description is provided to assist the reader in obtaining a thorough understanding of the methods, apparatus, and/or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatuses, and/or systems described herein will be apparent after an understanding of the present disclosure. For example, the order of operations described herein is merely an example and is not limited to the order set forth herein, but rather, obvious variations may be made upon an understanding of the present disclosure, other than operations that must occur in a specific order. In addition, descriptions of features known in the art may be omitted for the sake of clarity and conciseness.

The features described herein may be embodied in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein have been provided solely to illustrate some of the many possible ways of implementing the methods, devices, and/or systems described herein that will be apparent after a review of the disclosure of the present application.

In the entire specification, when an element such as a layer, region or substrate is described as being "on", "connected to" or "bonded to" another element, the element may be directly "on", "connected to" or "bonded to" the other element or there may be one or more other elements interposed therebetween. In contrast, when an element is referred to as being "directly on," "directly connected to," or "directly coupled to" another element, there may be no other element intervening elements present.

As used herein, the term "and/or" includes any one and any combination of any two or more of the relevant listed items.

Although terms such as "first," "second," and "third" may be used herein to describe various elements, components, regions, layers or sections, these elements, components, regions, layers or sections should not be limited by these terms. Rather, these terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first member, first component, first region, first layer, or first portion referred to in the examples described herein may also be referred to as a second member, second component, second region, second layer, or second portion without departing from the teachings of the examples.

Spatially relative terms, such as "above," "upper," "lower," and "lower," may be used herein for ease of description to describe one element's relationship to another element as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" relative to another element would then be "below" or "beneath" the other element. Thus, the term "above" includes both "above" and "below" depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing various examples only and will not be limiting of the disclosure. Singular forms also are intended to include plural forms unless the context clearly indicates otherwise. The terms "comprises," "comprising," and "having" are intended to specify the presence of stated features, integers, operations, elements, and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, operations, elements, and/or groups thereof.

The shapes of the illustrations as a result of manufacturing techniques and/or tolerances, can vary. Accordingly, examples described herein are not limited to the particular shapes shown in the drawings, but include changes in shapes that occur during manufacture.

The features of the examples described herein may be combined in various ways that will be apparent after an understanding of the disclosure of the present application. Moreover, while the examples described herein have a variety of configurations, other configurations are possible that will be apparent upon an understanding of the present disclosure.

Fig. 1A and 1B are perspective views illustrating an antenna apparatus according to an example embodiment. Fig. 2 is a side view of an antenna device according to an example embodiment. Fig. 3 is a plan view illustrating an antenna apparatus according to an example embodiment.

Referring to fig. 1A, 2 and 3, the antenna apparatus in example embodiments may include at least portions of a feed line 110a, a feed via 111A, a dipole antenna pattern 120a, a director pattern 125a and a connection member 200a.

The dipole antenna pattern 120a may receive a Radio Frequency (RF) signal from the connection member 200a via the feeder line 110a and may remotely transmit the signal in the x-direction, or may remotely receive an RF signal in the x-direction and may transmit the signal to the connection member 200a via the feeder line 110 a. For example, the dipole antenna pattern 120a may have a dipole form, and thus may have a structure extending in the y-direction.

The feeder line 110a may be electrically connected to wiring in the connection member 200a, and may serve as a transmission path of RF signals. Since the dipole antenna pattern 120a is disposed adjacent to the side surface of the connection member 200a, the feeder line 110a may have a structure extending from the wiring of the connection member 200a toward the dipole antenna pattern 120 a.

For example, the feed line 110a may include a first feed line and a second feed line. For example, the first feed line may be configured to transmit RF signals to the dipole antenna pattern 120a, and the second feed line may be configured to receive RF signals from the dipole antenna pattern 120 a. For example, the first feeder line may be configured to receive RF signals from the dipole antenna pattern 120a or transmit RF signals to the dipole antenna pattern 120a, and the second feeder line may be configured to provide impedance to the dipole antenna pattern 120 a.

For example, the first and second feeding lines transmitting RF signals to the dipole antenna pattern 120a and receiving RF signals from the dipole antenna pattern 120a may be configured to have a phase difference (e.g., 180 degrees, 90 degrees) between the first and second feeding lines by a differential feeding method. The phase difference may be achieved by a phase shifter of the IC or by a difference in electrical length between the first and second feed lines. In contrast to the conventional single-ended feeding method, the differential feeding method can improve co-polarization/cross-polarization characteristics by eliminating radiation pattern distortion of the dipole antenna.

In an example embodiment, the feed line 110a may include a 1/4 wavelength converter, a balun, or an impedance conversion line to improve RF signal transmission efficiency. However, depending on the design, any one of a 1/4 wavelength converter, a balun, or an impedance conversion line may not be required.

The feed via 111a may be provided to electrically connect the dipole antenna pattern 120a and the feed line 110a. The feed via 111a may be disposed perpendicular to the dipole antenna pattern 120a and the feed line 110a. When the dipole antenna pattern 120a and the feed line 110a are disposed at the same height, the feed via 111a may not be provided.

The dipole antenna pattern 120a may be located below or above the feed line 110a due to the feed via 111a. The specific position of the dipole antenna pattern 120a may vary according to the length of the feed-through hole 111a, and thus, the direction of the radiation pattern of the dipole antenna pattern 120a may be inclined in the vertical direction or the normal direction (z direction) according to the design of the length of the feed-through hole 111a.

The via pattern 112a may be coupled to the feed via 111a and may support upper and lower portions of the feed via 111 a.

The dipole antenna pattern 120a may be electrically connected to the feeder line 110a and may transmit or receive RF signals. Each pole of the dipole antenna pattern 120a may be electrically connected to the first and second lines of the feed line 110 a.

The dipole antenna pattern 120a may have a frequency band (e.g., 28GHz, 60 GHz) according to at least one of a length of the poles, a thickness of the poles, a gap between the poles and a side surface of the connection member, and a dielectric constant of the insulating layer.

The director pattern 125a may be spaced apart from the dipole antenna pattern 120a in the lateral direction. The director pattern 125a may be electromagnetically coupled to the dipole antenna pattern 120a and may improve the gain or bandwidth of the dipole antenna pattern 120 a. The director pattern 125a may have a length shorter than the total length of the dipoles of the dipole antenna pattern 120a, and thus, concentration of electromagnetic coupling of the dipole antenna pattern 120a may also be improved. Accordingly, the gain or directivity of the dipole antenna pattern 120a may be further improved.

Referring to fig. 1A, 2 and 3, the antenna device in an example embodiment may include barrier patterns 130 and 130a.

The barrier patterns 130 and 130a may be electrically connected to the connection member 200a and may extend forward from at least one of the first, second, third, and fifth ground planes 221a, 222a, 223a, and 225a such that portions of the barrier patterns 130 and 130a may be disposed between the plurality of dipole antenna patterns 120 a.

The blocking patterns 130 and 130a may serve as reflectors of the plurality of dipole antenna patterns 120a, and thus may reflect RF signals leaking in the y-direction in the plurality of dipole antenna patterns 120 a. The entire RF signal reflected from the blocking patterns 130 and 130a may be introduced in the x-direction according to destructive interference on the y-direction vector component and/or enhanced interference on the x-direction vector component. Accordingly, the gain and/or directivity of the plurality of dipole antenna patterns 120a may be improved.

The barrier patterns 130 and 130a may be provided to block a space between the plurality of dipole antenna patterns 120a, and may electromagnetically isolate the plurality of dipole antenna patterns 120a from each other. Accordingly, the plurality of dipole antenna patterns 120a may become adjacent to each other while preventing destructive interference therebetween. Accordingly, the overall size of the antenna performance based on the plurality of dipole antenna patterns 120a may be reduced.

The barrier patterns 130 and 130a may be stacked in the z-direction, and thus may provide a space for arranging the dipole antenna patterns 120a in the z-direction, and may improve electromagnetic isolation formed in the y-direction between the dipole antenna patterns 120a arranged in the z-direction.

For example, the dipole antenna pattern 120a may have a structure in which the first dipole antenna pattern 121a and the second dipole antenna pattern 122a are combined with the radial via 124 a. Accordingly, the dipole antenna patterns 120a may be stacked in the z-direction. The plurality of dipole antenna patterns 120a stacked in the z-direction may have a structure in which an electromagnetic surface expands in the x-direction, and thus may have improved gain and/or bandwidth. The plurality of dipole antenna patterns 120a stacked in the z-direction may be designed to transmit and receive horizontal pole RF signals (H-pole RF signals) and vertical pole RF signals (V-pole RF signals), respectively, in a polarized relationship with each other, or may have different bandwidths to support dual-band transmission and reception.

The barrier patterns 130 and 130a may realize advantages of a structure in which the barrier patterns 130 and 130a are stacked in the z-direction, and may improve electromagnetic isolation in the y-direction.

The barrier patterns 130 and 130a may be electromagnetically coupled to the dipole antenna pattern 120a, and thus may provide impedance to the dipole antenna pattern 120 a. The dipole antenna pattern 120a may also have a resonant frequency or shift a fundamental resonant frequency based on the barrier patterns 130 and 130 a. Accordingly, the dipole antenna pattern 120a may easily widen the bandwidth and/or may have a dual bandwidth (e.g., a bandwidth covering 28GHz and 39 GHz) based on the design.

The barrier patterns 130 and 130a may be easily processed and/or changed as compared to the dipole antenna pattern 120a, and thus elements affecting antenna performance (e.g., gain, bandwidth, directivity, etc.) of the dipole antenna pattern 120a may be improved in addition to impedance. Accordingly, the antenna performance of the dipole antenna pattern 120a can be easily optimized. For example, the barrier patterns 130 and 130a may have a structure in which a plurality of patterns are repeatedly arranged, or may be designed to have an inclined circumference in the x direction/y direction.

The blocking patterns 130 and 130a may provide paths through which surface currents concentrated at specific locations of the antenna device may be outwardly emitted.

For example, the dipole antenna pattern 120a may transmit and receive a horizontal pole RF signal (H pole RF signal) and a vertical pole RF signal (V pole RF signal) in a polarized relationship with each other, and may improve a transmission rate and a reception rate. The H-pole RF signal may cause a surface concentrated at an edge of the antenna device and flowing in the y-direction, and the blocking patterns 130 and 130a may provide a path through which a surface current flowing in the y-direction is emitted in the x-direction. Accordingly, electromagnetic destructive interference between the plurality of dipole antenna patterns 120a may be prevented, and thus, the overall gain and/or directivity of the dipole antenna patterns 120a may be improved.

Referring to fig. 1B, the dipole antenna pattern 120B may be a folded dipole, and the feed via, the director pattern, and the first protruding region may be omitted.

The connection member 200a may be configured to be recessed to the rear of the dipole antenna pattern 120a or to receive the rear of the dipole antenna pattern 120 a. Accordingly, the connection member 200a may include a first cavity C1, a second cavity C2, a third cavity C3, and a fourth cavity C4.

The connection member 200a may include at least portions of the first ground plane 221a, the second ground plane 222a, the third ground plane 223a, the fourth ground plane 224a, the fifth ground plane 225a, and the sixth ground plane 226a, and may further include an insulating layer disposed between the plurality of ground planes. The first ground plane 221a, the second ground plane 222a, the third ground plane 223a, the fourth ground plane 224a, the fifth ground plane 225a, and the sixth ground plane 226a may be spaced apart from each other in a vertical direction or a normal direction (z direction).

The antenna device in example embodiments may include at least one of a first ground plane 221a, a second ground plane 222a, a third ground plane 223a, a fourth ground plane 224a, a fifth ground plane 225a, and a sixth ground plane 226 a. The number of first ground plane 221a, second ground plane 222a, third ground plane 223a, fourth ground plane 224a, fifth ground plane 225a, and sixth ground plane 226a, and the upper and lower relationship of first ground plane 221a, second ground plane 222a, third ground plane 223a, fourth ground plane 224a, fifth ground plane 225a, and sixth ground plane 226a may vary according to the design of the antenna device.

Thus, the specific configuration of each of the first ground plane 221a, the second ground plane 222a, the third ground plane 223a, the fourth ground plane 224a, the fifth ground plane 225a, and the sixth ground plane 226a, as well as the specific configuration of the other ground planes, may be substituted for one another.

The first ground plane 221a, the third ground plane 223a, and the sixth ground plane 226a may provide a ground for use as an IC and/or passive component in the circuitry of the IC and/or passive component. Further, the first ground plane 221a, the third ground plane 223a, and the sixth ground plane 226a may provide transmission paths for power and signals used in the IC and/or passive components. Thus, the first ground plane 221a, the third ground plane 223a, and the sixth ground plane 226a may be electrically connected to the IC and/or passive components.

The first ground plane 221a, the third ground plane 223a, and the sixth ground plane 226a may be omitted depending on the ground consumption of the IC and/or passive components. The first ground plane 221a, the third ground plane 223a, and the sixth ground plane 226a may have a via through which a wiring via passes.

The fifth ground plane 225a may be disposed at an upper portion of the first, third, and sixth ground planes 221a, 223a, and 226a, and may be spaced apart from the first, third, and sixth ground planes 221a, 223a, and 226a, and the fifth ground plane 225a may be configured to surround the wiring at the same height as the wiring in which the RF signal flows. The wiring may be electrically connected to the IC through the wiring vias.

The second ground plane 222a and the fourth ground plane 224a may be disposed at upper portions of the first, third, and sixth ground planes 221a, 223a, and 226a and may be spaced apart from the first, third, and sixth ground planes 221a, 223a, and 226a, and the second and fourth ground planes 222a and 224a may be disposed in lower and upper portions of the fifth ground plane 225a, respectively. The second ground plane 222a may improve electromagnetic isolation between the wiring and the IC and may provide a ground for the IC and/or passive components. The fourth ground plane 224a may improve electromagnetic isolation between the wiring and the patch antenna pattern, and may provide boundary conditions in view of the patch antenna pattern, and may reflect RF signals transmitted and received by the patch antenna pattern, so that the transmission and reception directions of the patch antenna pattern may be further concentrated.

The boundaries of the first ground plane 221a, the second ground plane 222a, the third ground plane 223a, the fifth ground plane 225a, and the sixth ground plane 226a may overlap each other in the vertical direction or the normal direction (z direction). The boundaries may act as reflectors for the dipole antenna pattern 120a and, thus, the effective separation distances between the first ground plane 221a, the second ground plane 222a, the third ground plane 223a, the fifth ground plane 225a, and the sixth ground plane 226a and the dipole antenna pattern 120a may affect the antenna performance of the dipole antenna pattern 120 a.

For example, when the effective separation distance is shorter than the reference distance, the gain of the dipole antenna pattern 120a may deteriorate with the dispersion of the RF signal penetrating the dipole antenna pattern 120a, and it may be difficult to optimize the resonant frequency of the dipole antenna pattern 120a with the increase of the capacitances between the first, second, third, fifth, and sixth ground planes 221a, 222a, 223a, 225a and 226a and the dipole antenna pattern 120 a. Accordingly, the destructive interference ratio between RF signals passing through the dipole antenna pattern 120a in the x-direction and RF signals reflected from the first, second, third, fifth and sixth ground planes 221a, 222a, 223a, 225a and 226a may be reduced.

In addition, when the dipole antenna pattern 120a is spaced apart from the first, second, third, fifth and sixth ground planes 221a, 222a, 223a, 225a and 226a, it is possible to increase the size of the antenna device.

When the size of the connection member 200a is reduced, a transmission path for power and signals and a space in which wiring is provided may be reduced, ground stability of the ground plane may be deteriorated, and a space in which a patch antenna pattern is provided may also be reduced. In other words, the performance of the antenna device may deteriorate.

The antenna device in the example embodiment may have a structure in which the dipole antenna pattern 120a may be disposed adjacent to the first, second, third, fifth, and sixth ground planes 221a, 222a, 223a, 225a, and 226a, and an effective separation distance between the first, third, fourth, and fifth ground planes 221a, 223a, 224a, and 225a and the dipole antenna pattern 120a may be achieved. Accordingly, the size of the antenna device may be reduced or may have improved performance.

At least one of the first ground plane 221a, the second ground plane 222a, the third ground plane 223a, the fifth ground plane 225a, and the sixth ground plane 226a included in the connection member 200a may have a plurality of second protruding areas P2.

The boundary of at least one of the first ground plane 221a, the second ground plane 222a, the third ground plane 223a, the fifth ground plane 225a, and the sixth ground plane 226a facing the dipole antenna pattern 120a may have a saw-tooth structure due to the plurality of second protruding areas P2. Accordingly, the first, second, third and fourth cavities C1, C2, C3 and C4 may be formed between the plurality of second protrusion areas P2, and boundary conditions may be provided, which may achieve antenna performance of the dipole antenna pattern 120 a.

The boundary of at least one of the first ground plane 221a, the second ground plane 222a, the third ground plane 223a, the fifth ground plane 225a, and the sixth ground plane 226a facing the dipole antenna pattern 120a may serve as a reflector of the dipole antenna pattern 120a, and thus, a portion of the RF signal passing through the dipole antenna pattern 120a may be reflected from at least one of the boundaries of the first ground plane 221a, the second ground plane 222a, the third ground plane 223a, the fifth ground plane 225a, and the sixth ground plane 226a.

The first, second, third and fourth cavities C1, C2, C3 and C4 may have a concave structure toward at least one of the first, second, third, fifth and sixth ground planes 221a, 222a, 223a, 225a and 226a between one and the other ends of the first and second poles of the dipole antenna pattern 120 a. Accordingly, the first, second, third and fourth cavities C1, C2, C3 and C4 may serve as reflectors of the first and second poles of the dipole antenna pattern 120 a.

Accordingly, the effective separation distance from each pole of the dipole antenna pattern 120a to at least one of the first ground plane 221a, the second ground plane 222a, the third ground plane 223a, the fifth ground plane 225a, and the sixth ground plane 226a may be lengthened without substantially changing the position of the dipole antenna pattern 120 a. Alternatively, the dipole antenna pattern 120a may be disposed adjacent to the first ground plane 221a, the second ground plane 222a, the third ground plane 223a, the fifth ground plane 225a, and the sixth ground plane 226a without substantially sacrificing antenna performance.

For example, RF signals directed to the first, second, third, and fourth cavities C1, C2, C3, and C4 among RF signals penetrating at each pole of the dipole antenna pattern 120a may be more concentrated in the x-direction and reflected more than an example in which the first, second, third, and fourth cavities C1, C2, C3, and C4 are not provided. Accordingly, the gain of the dipole antenna pattern 120a may be further improved as compared to an example in which the first and second cavities C1 and C2 are not provided.

For example, the capacitance between each pole of the dipole antenna pattern 120a and the first, second, third, fifth, and sixth ground planes 221a, 222a, 223a, 225a, and 226a may be further reduced than an example in which the first, second, third, and fourth cavities C1, C2, C3, and C4 are not provided. Accordingly, the resonant frequency of the dipole antenna pattern 120a can be easily optimized.

Further, the plurality of second protrusion areas P2 may electromagnetically shield the space between the dipole antenna pattern 120a and the adjacent antenna device. Accordingly, the isolation distance between the dipole antenna pattern 120a and the adjacent antenna device may be further reduced, and the size of the antenna module in the example embodiment may be reduced.

The connection member 200a may further include a plurality of shielding vias 245a electrically connected to at least two of the first ground plane 221a, the second ground plane 222a, the third ground plane 223a, the fifth ground plane 225a, and the sixth ground plane 226a and surrounding at least a portion of each of the first, second, third, and fourth cavities C1, C2, C3, and C4 in a vertical or normal direction (z-direction).

The plurality of shielding vias 245a may reflect RF signals leaking from gaps between the first ground plane 221a, the second ground plane 222a, the third ground plane 223a, the fifth ground plane 225a, and the sixth ground plane 226a among RF signals penetrating the dipole antenna pattern 120 a. Accordingly, the gain of the dipole antenna pattern 120a may be further improved, and electromagnetic isolation between the dipole antenna pattern 120a and the wiring may be improved.

The patch antenna package 1100a may include a patch antenna pattern 1110a, an upper coupling pattern 1115a, and a coupling member 1125a, and may remotely transmit and/or receive RF signals in the +z direction.

The patch antenna package 1100a may be disposed at an upper portion of the connection member 200a and may be electrically connected to a wiring in the connection member 200a through the second feed via.

The antenna devices 101a and 102a and the patch antenna package 1100a may be arranged in a 1×n arrangement (for example, a 1×2 arrangement, a 1×3 arrangement, or a 1×4 arrangement, where n may be a natural number), the number of barrier walls may be (n-1), and if barrier walls are also added to the edge, the number of barrier walls may be (n+1).

The coupling member 1125a may have a structure in which a plurality of patterns are repeatedly arranged, and electromagnetic isolation between the plurality of patch antenna patterns 1110a may be improved, or an RF signal of the patch antenna pattern 1110a may be introduced to an upper portion (e.g., z-direction) and gain and/or directivity may be improved. Further, the coupling member 1125a may be electromagnetically coupled to the patch antenna pattern 1110a and may provide impedance to the patch antenna pattern 1110a, thereby expanding the bandwidth of the patch antenna pattern 1110 a. The coupling member 1125a may improve electromagnetic isolation between the patch antenna pattern 1110a and the dipole antenna pattern 120 a.

Referring to fig. 3, a perimeter or portion of the coupling member 1125a may overlap a front perimeter of the ground plane of the connection member 200a in a vertical or normal direction. Accordingly, the coupling member 1125a may effectively isolate the patch antenna pattern 1110a from the dipole antenna pattern 120a, and the overall size of the antenna apparatus in the example embodiment may be reduced according to the spatial efficiency of the arrangement of the coupling member 1125 a.

Although electromagnetic energy of the front periphery of the ground plane of the connection member 200a may be further concentrated due to the dipole antenna pattern 120a and the coupling member 1125a, the blocking patterns 130 and 130a may radiate the electromagnetic energy forward (e.g., in the x-direction). Accordingly, the total electromagnetic noise of the antenna device in example embodiments may be reduced, and electromagnetic isolation between the dipole antenna pattern 120a and the patch antenna pattern 1110a may be further improved.

Fig. 4A to 4G are plan views illustrating various structures of a blocking pattern of an antenna device according to example embodiments.

Referring to fig. 4A to 4C, the connection member may include a first ground plane 221e, and may provide a space in which a plurality of end-fire antennas 101e and 102e and barrier patterns 130b, 130C, and 130d are disposed. The term "endfire antennas" 101e and 102e may include the dipole antenna patterns and director patterns described in the foregoing example embodiments. However, the director patterns of end-fire antennas 101e and 102e may be omitted.

The first ground plane 221e may serve as a reflector for the plurality of end-fire antennas 101e and 102 e. According to design, the edge of the first ground plane 221e may be configured to be concave. Accordingly, RF signal reflection efficiency of the first ground plane 221e may be improved (e.g., a ratio between interference and destructive interference is enhanced), and the plurality of end-fire antennas 101e and 102e may be disposed more adjacent to the first ground plane 221e.

The blocking patterns 130b, 130c, and 130d may be disposed adjacent to the recessed area of the first ground plane 221e. Accordingly, the first ground plane 221e may have a structure in which the first ground plane 221e is organically coupled to the blocking patterns 130b, 130c, and 130d, and thus, the F signal reflection efficiency may be further improved by using the RF signal reflection performance of the blocking patterns 130b, 130c, and 130 d. Further, since the barrier patterns 130b, 130c, and 130d are adjacently disposed, the plurality of end-fire antennas 101e and 102e may be further close to each other.

Referring to fig. 4A, the blocking pattern 130b may be adjacently extended to the positions of the dipole antenna patterns of the plurality of end-fire antennas 101e and 102e, which are cut in the y-direction.

Referring to fig. 4B, the blocking pattern 130c may extend to a position farther than the positions of the dipole antenna patterns of the plurality of end-fire antennas 101e and 102e, which are cut in the y-direction. The extension length L2 of the barrier pattern 130c may extend forward by a length corresponding to a region between the plurality of dipole antenna patterns and the plurality of director patterns of the plurality of end-fire antennas 101e and 102 e. The blocking pattern 130c may be extended to block a space between the plurality of dipole antenna patterns of the plurality of end-fire antennas 101e and 102e and not to block a space between the plurality of director patterns. Accordingly, the radiation pattern of each of the plurality of end-fire antennas 101e and 102e can be further concentrated, and thus, the gain and/or directivity of the plurality of end-fire antennas 101e and 102e can be further improved.

Referring to fig. 4C, the blocking pattern 130d may extend less than portions of dipole antenna patterns of the plurality of end-fire antennas 101e and 102e, which are cut along the y-direction.

Referring to fig. 4D, the blocking pattern 130e may be spaced apart from the plurality of end-fire antennas 101e and 102 e. Electromagnetic coupling between the plurality of end-fire antennas 101e and 102e and the blocking pattern 130e may be appropriately adjusted according to the separation distance between the blocking pattern 130e and the plurality of end-fire antennas 101e and 102 e.

Referring to fig. 4E, the blocking pattern 130f may be spaced apart from the first ground plane 221E. Accordingly, the blocking pattern 130f may be designed in consideration of electromagnetic coupling between the plurality of end-fire antennas 101e and 102e and the blocking pattern 130f.

Referring to fig. 4F, the barrier pattern 130g may have a structure in which a plurality of patterns are repeatedly arranged. Accordingly, the antenna performance of the plurality of end-fire antennas 101e and 102e can be designed according to the size of the plurality of patterns, the number of the plurality of patterns, the gap between the plurality of patterns, the number of layers of the plurality of patterns, and the like, and can be easily optimized.

Referring to fig. 4G, the barrier pattern 130h may have an inclined circumference in the x-direction and/or the y-direction. Accordingly, the RF signal reflecting the performance of the blocking pattern 130h is more accurately adjusted, and can be easily optimized.

The extension lengths L1, L2, and L3 of the barrier patterns 130b, 130c, and 130d may satisfy 0.125λ+.l+.0.25λ, where L is the extension length of the barrier pattern and λ is the wavelength of the RF signal, but the example embodiment thereof is not limited thereto. Further, the width D4 of the barrier pattern 130e, the spacing distance W4 between the barrier pattern 130e and the cavity, the spacing distance G5 of the barrier pattern 130f to the first ground plane 221e, the lengths L6, the widths D6 and the gaps G6 of the plurality of barrier patterns 130G, and the first and second widths D7 and G7 of the barrier pattern 130h may not be limited to any particular size.

Fig. 5A to 5E are plan views sequentially showing first to fifth ground planes of the antenna device in the z-direction according to example embodiments.

Referring to fig. 5A, a fourth ground plane 224a may be disposed at a lower portion of the plurality of patch antenna patterns 1110a, may have a plurality of through holes through which the plurality of second feed vias 1120a extend, and may include a first protruding region P4.

The plurality of patch antenna patterns 1110a may remotely transmit and/or receive RF signals in the z-direction. Accordingly, the antenna device in the example embodiment may transmit and receive RF signals in a horizontal direction through the dipole antenna pattern, and may also transmit and receive RF signals in a vertical direction through the plurality of patch antenna patterns 1110a, thereby remotely transmitting and receiving RF signals in all directions.

Referring to fig. 5B, the fifth ground plane 225a may be configured to surround the first wire 212a electrically connecting the feeder line 110a and the first wire via 231a and the second wire 214a electrically connecting the second feeder via 1120a and the second wire via 232a, and may be connected to the fifth blocking pattern 135a.

A plurality of shielding vias 245a may be disposed along the front perimeter of the stepped-profile cavity CS and may electrically connect the fifth ground plane 225a and the second ground plane 222a. Referring to fig. 5C, the second ground plane 222a may include a via through which the first and second wiring vias 231a and 232a pass, and may be connected to the second blocking pattern 132a. A plurality of shielding vias 245a may be disposed along the front perimeter of the stepped-profile cavity CS and may electrically connect the second ground plane 222a and the first ground plane 221a. The via pattern 112a may be electrically connected to the dipole antenna pattern.

Referring to fig. 5D, the first ground plane 221a may be configured to be recessed to the rear of the dipole antenna pattern 120a multiple times (e.g., twice), may include a via hole through which the first and second wiring vias 231a and 232a pass, and may be connected to the first blocking pattern 131a. A plurality of shielding vias 245a may be disposed along a front perimeter of the stepped-profile cavity CS and may electrically connect the first ground plane 221a and the third ground plane 223a. The dipole antenna pattern 120a may be disposed in front of the stepped profile cavity CS (e.g., in the x-direction).

Referring to fig. 5E, the third ground plane 223a may include a via hole through which the first and second wiring vias 231a and 232a pass, and may be connected to the third blocking pattern 133a. The dipole antenna pattern 120a and the director pattern 125a may be disposed in front of the stepped profile cavity CS (e.g., in the x-direction).

An overlapping area between a front region of the first ground plane 221a and the director pattern 125a in a vertical direction or a normal direction (z direction) may be filled with an insulating layer. Accordingly, the number of layered director patterns 125a may be less than the number of layered dipole antenna patterns 120 a. Accordingly, the radiation pattern of the dipole antenna pattern 120a may be more concentrated in three dimensions, and the gain and/or directivity of the dipole antenna pattern 120a may be further improved.

Since the first, second, third and fifth barrier patterns 131a, 132a, 133a and 135a are disposed to overlap each other in a vertical or normal direction (z-direction), a three-dimensional boundary condition may be formed with respect to the dipole antenna pattern 120 a. Accordingly, the first, second, third and fifth barrier patterns 131a, 132a, 133a and 135a may effectively isolate the plurality of dipole antenna patterns 120a from each other, and may improve gains of the plurality of dipole antenna patterns 120 a. Further, when the dipole antenna pattern 120a has a layered structure in the z-direction, the first, second, third, and fifth barrier patterns 131a, 132a, 133a, and 135a may increase the size of the electromagnetic coupling surface with respect to the dipole antenna pattern 120a, and thus, the design range of the resonance frequency of the dipole antenna pattern 120a may be expanded, and the bandwidth may be widened.

The shielding via 245a may be disposed only on the front circumferences of the first, second, third, fourth, and fifth ground planes 221a, 222a, 223a, 224a, and 225a, and not between the first, second, third, and fifth barrier patterns 131a, 132a, 133a, and 135 a. Accordingly, the spaces between the first, second, third, and fifth barrier patterns 131a, 132a, 133a, and 135a may be filled with an insulating layer. Accordingly, the first, second, third and fifth barrier patterns 131a, 132a, 133a and 135a may provide a three-dimensional boundary condition with respect to the dipole antenna pattern 120a and may effectively emit electromagnetic energy concentrated on the front circumferences of the first, second, third, fourth and fifth ground planes 221a, 222a, 223a, 224a, 225a, thereby improving electromagnetic isolation between the plurality of dipole antenna patterns 120a and also improving electromagnetic isolation between the dipole antenna pattern 120a and the patch antenna pattern 1110 a.

The greater the number of ground planes providing cavities between the first ground plane 221a, the second ground plane 222a, the third ground plane 223a, the fourth ground plane 224a, the fifth ground plane 225a, the longer the length of the cavity taken in the vertical or normal direction (z-direction). The length of the cavity taken in the vertical or normal direction (z-direction) may affect the antenna performance of the dipole antenna pattern 120 a. By adjusting the number of ground planes providing the cavity, the antenna apparatus in the example embodiment can easily adjust the length of the cavity taken in the vertical direction or the normal direction (z-direction), and thus, can easily adjust the antenna performance of the dipole antenna pattern 120 a.

The recessed areas of at least two of the first ground plane 221a, the second ground plane 222a, the third ground plane 223a, the fourth ground plane 224a, and the fifth ground plane 225a may have the same rectangular shape. Thus, the cavity may have a rectangular parallelepiped shape. When the cavity has a cuboid shape, the ratio of the x-vector component to the y-vector component of the RF signal may be increased. The y vector component can be easily cancelled out in the cavity as compared to the x vector component, and thus, the higher the ratio of the x vector components of the RF signal reflected from the boundary of the cavity, the more the gain improvement the dipole antenna pattern 120a can have. Accordingly, the more parallelpiped the cavity is, the more gain improvement the dipole antenna pattern 120a may have.

Referring to fig. 6, the antenna device in the example embodiment may include a plurality of antenna devices 100c and 100d, a plurality of patch antenna patterns 1110d, a plurality of patch antenna cavities 1130d, dielectric layers 1140c and 1140d, a plating member 1160d, a plurality of patch antennas 1170c and 1170d, and a plurality of dipole antennas 1175c and 1175d.

The plurality of antenna devices 100c and 100d may be designed similar to the antenna devices described with reference to fig. 1A to 5E, and may be disposed adjacent to side surfaces of the antenna module, and may be arranged parallel to each other. Accordingly, portions of the plurality of antenna devices 100c and 100d may transmit and receive RF signals in the x-axis direction, and other antenna devices may transmit and receive RF signals in the y-axis direction.

The plurality of patch antenna patterns 1110d may be disposed adjacent to an upper portion of the antenna module, and may transmit and receive RF signals in a vertical direction or a normal direction (z direction). The number and arrangement of the plurality of patch antenna patterns 1110d may not be limited to any particular number and arrangement. For example, the plurality of patch antenna patterns 1110d may have a circular form, and may be arranged in a structure of 1×n (n is a natural number equal to or greater than 2), and the number of the plurality of patch antenna patterns may be 16.

The plurality of patch antenna cavities 1130d may each be configured to cover a side surface and a lower portion of each of the plurality of patch antenna patterns 1110d, and may provide boundary conditions for each of the plurality of patch antenna patterns 1110d to transmit and receive RF signals.

The plurality of chip antennas 1170c and 1170d may have two electrodes facing away from each other, may be disposed at an upper or lower portion of the antenna module, and may be configured to transmit and receive RF signals in an x-axis direction and/or a y-axis direction through one of the two electrodes.

A plurality of dipole antennas 1175c and 1175d may be disposed below an upper portion of the antenna module and may transmit and receive RF signals in the z-axis direction. Accordingly, the plurality of dipole antennas 1175c and 1175d may be disposed perpendicular to the plurality of antenna devices 100c and 100d in a vertical direction or a normal direction (z direction).

Referring to fig. 7A, the antenna device in an example embodiment may include a connection member 200, an IC 310, an adhesive member 320, an electrical connection structure 330, an encapsulant 340, a passive component 350, and at least a portion of a submount 410.

The connection member 200 may have a structure similar to that of the connection member described with reference to fig. 1 to 8.

The IC 310 may be the same as the IC described in the foregoing example embodiment, and may be disposed at a lower portion of the connection member 200. IC 310 may be electrically connected to wiring of connection member 200 and may transmit or receive RF signals, and may be electrically connected to a ground plane of connection member 200 and may be provided with a ground. For example, IC 310 may perform at least part of the operations of frequency conversion, amplification, filtering, phase control, and power generation to generate a converted signal.

The adhesive member 320 may adhere the IC 310 to the connection member 200.

Electrical connection structure 330 may electrically connect IC 310 to connection member 200. For example, the electrical connection structure 330 may have a structure such as a solder ball, a pin, a pad, or a pad. The electrical connection structure 330 may have a melting point lower than that of the wiring and ground planes of the connection member 200, and the IC 310 may be electrically connected to the connection member 200 through a specific process using the low melting point.

The encapsulant 340 may encapsulate at least a portion of the IC 310 and may improve heat dissipation and impact protection. For example, the encapsulant 340 may be implemented as a photo encapsulant (PIE), ABF (Ajinomoto Build-up Film), epoxy Molding Compound (EMC), or the like.

The passive component 350 may be disposed on a lower surface of the connection member 200 and may be electrically connected to a wiring and/or ground plane of the connection member 200 through the electrical connection structure 330.

The sub-substrate 410 may be disposed at a lower portion of the connection member 200 and may be electrically connected to the connection member 200, receive an Intermediate Frequency (IF) signal or a baseband signal from an external entity, and transmit the signal to the IC 310, or receive the IF signal or the baseband signal from the IC 310, and transmit the signal to the external entity. The frequencies of the RF signals (e.g., 24GHz, 28GHz, 36GHz, 39GHz, and 60 GHz) may be greater than the frequencies of the IF signals (e.g., 2GHz, 5GHz, 10GHz, etc.).

For example, submount 410 may transmit the IF signal or baseband signal to IC 310, or may receive the IF signal or baseband signal from IC 310 via wiring included in the IC ground plane of connection member 200. Since the first ground plane of the connection member 200 is disposed between the IC ground plane and the wiring, the IF signal or the baseband signal and the RF signal may be electrically isolated from each other in the antenna module.

Referring to fig. 7B, the antenna apparatus in the example embodiment may include a shielding member 360, a connector 420, and at least part of a patch antenna 430.

The shielding member 360 may be disposed at a lower portion of the connection member 200, and may shield the IC 310 together with the connection member 200. For example, the shielding member 360 may cover or conformally shield the IC 310 and the passive component 350 together, or may individually cover or shield the IC 310 and the passive component 350 in a compartment form. For example, the shielding member 360 may have a hexahedral shape with one surface thereof opened, and may have a hexahedral receiving space by being coupled to the connection member 200. The shielding member 360 may be implemented of a material having high conductivity (e.g., copper), may have a relatively short skin depth, and may be electrically connected to a ground plane of the connection member 200. Accordingly, the shielding member 360 may reduce electromagnetic noise that may be received by the IC 310 and the passive components 350.

The connector 420 may have a connection structure of a cable (e.g., coaxial cable, flexible PCB, etc.), may be electrically connected to an IC ground plane of the connection member 200, and may function similar to the sub-substrate described in the foregoing example embodiments. Accordingly, connector 420 may receive the IF signal, baseband signal, and/or power from the cable, or may provide the IF signal and/or baseband signal to the cable.

In an example embodiment, the patch antenna 430 may transmit or receive RF signals as an auxiliary element of the antenna device. For example, the chip antenna 430 may include a dielectric block having a dielectric constant greater than that of the insulating layer and a plurality of electrodes disposed on both surfaces of the dielectric block. One of the plurality of electrodes may be electrically connected to the wiring of the connection member 200, and the other may be electrically connected to the ground plane of the connection member 200.

Referring to fig. 8, the antenna device 100f may have a structure in which a patch antenna pattern 1110f, an IC 310f, and a passive component 350f are integrated into a connection member 500 f.

The antenna device 100f and the patch antenna pattern 1110f may be configured to be the same as those described in the foregoing example embodiments, and may receive an RF signal from the IC 310 and transmit the received signal, or may transmit the received RF signal to the IC 310.

The connection member 500f may have a structure (e.g., a structure of a printed circuit board) in which at least one conductive layer 510f and at least one insulating layer 520f are stacked. The conductive layer 510f may have the ground plane and wiring described in the foregoing example embodiments.

The antenna device in the example embodiment may further include a flexible connection member 550f. The flexible connection member 550f may include a first flexible region 570f overlapping the connection member 500f in a vertical or normal direction and a second flexible region 580f not overlapping the connection member 500 f.

The second flexible region 580f may be flexibly bent in a vertical direction or a normal direction. Thus, the second flexible region 580f may flexibly connect to connectors on the group substrate and/or adjacent antenna modules.

The flexible connection member 550f may include a signal line 560f. Intermediate Frequency (IF) signals and/or baseband signals may be transmitted to IC 310f via signal line 560f or may be transmitted to connectors on the group substrate and/or adjacent antenna modules.

Referring to fig. 9A, the antenna apparatus in the example embodiment may have a structure in which an antenna package and a connection member are coupled to each other.

The connection member may include at least one conductive layer 1210b and at least one insulating layer 1220b, and may further include a wire via 1230b connected to the at least one conductive layer 1210b and a connection pad 1240b connected to the wire via 1230 b. The connection member may have a structure similar to that of a copper redistribution layer (RDL). The antenna package may be disposed on an upper surface of the connection member.

The antenna package may include a plurality of patch antenna patterns 1110b, a plurality of upper coupling patterns 1115b, a plurality of second feed vias 1120b, a dielectric layer 1140b, and at least a portion of an encapsulation member 1150 b.

One ends of the plurality of second feed vias 1120b may be electrically connected to the plurality of patch antenna patterns 1110b, respectively, and the other ends of the plurality of second feed vias 1120b may be electrically connected to wirings corresponding to the at least one conductive layer 1210b of the connection member, respectively.

The dielectric layer 1140b may be disposed around a side surface of each of the plurality of feed-through vias 1120 b. The height of the dielectric layer 1140b may be higher than the height of at least one of the insulating layers 1220b of the connection member. The greater the height and/or width of the dielectric layer 1140b, the more likely the antenna package will achieve antenna performance and may provide boundary conditions (e.g., reduced manufacturing tolerances, shorter electrical lengths, smooth surfaces, increased dielectric layer dimensions, adjacent dielectric constants, etc.) for transmitting and receiving RF signals for the plurality of upper coupling patterns 1115 b.

The encapsulation member 1150b may be disposed on the dielectric layer 1140b, and may improve the durability against impact or oxidation of the plurality of patch antenna patterns 1110b and/or the plurality of upper coupling patterns 1115 b. For example, the encapsulation member 1150b may be implemented as a photo-encapsulant (PIE), ABF (Ajinomoto Build-up Film), an Epoxy Molding Compound (EMC), or the like, but example embodiments thereof are not limited thereto.

The IC 1301b, PMIC 1302b, and a plurality of passive components 1351b, 1352b, and 1353b may be disposed on a lower surface of the connection member.

The PMIC 1302b may generate power, and the generated power may be transmitted to the IC 1301b through the at least one conductive layer 1210b of the connection member.

The plurality of passive components 1351b, 1352b, and 1353b may provide impedance to the IC 1301b and/or the PMIC 1302 b. For example, the plurality of passive components 1351b, 1352b, and 1353b may include a capacitor (e.g., a multilayer ceramic capacitor (MLCC)) and at least a portion of an inductor or chip resistor.

Referring to fig. 9b, the IC package may include an IC 1300a, an encapsulant 1305a encapsulating at least a portion of the IC 1300a, a support member 1355a (a first side surface of which may be configured to be opposite to the IC 1300 a), at least one conductive layer 1310a electrically connected to the IC 1300a and the support member 1355a, and a connection member including an insulating layer 1280a, and the IC package may be bonded to the connection member or the antenna package.

The connection member may include at least one conductive layer 1210a, at least one insulating layer 1220a, a wire via 1230a, a connection pad 1240a, and a passivation layer 1250a. The antenna package may include a plurality of patch antenna patterns 1110a, 1110b, 1110c, and 1110d, a plurality of upper coupling patterns 1115a, 1115b, 1115c, and 1115d, a plurality of second feed vias 1120a, 1120b, 1120c, and 1120d, a dielectric layer 1140a, and an encapsulation member 1150a.

The IC package may be bonded to the connection member. The RF signal generated in the IC 1300a included in the IC package may be transmitted to the antenna package through the at least one conductive layer 1310a and may be transmitted toward the upper surface of the antenna module, and the RF signal received in the antenna package may be transmitted to the IC 1300a through the at least one conductive layer 1310 a.

The IC package may also include connection pads 1330a disposed on an upper surface and/or a lower surface of the IC 1300a. The connection pads provided on the upper surface of the IC 1300a may be electrically connected to at least one conductive layer 1310a, and the connection pads provided on the lower surface of the IC 1300a may be electrically connected to the support member 1355a or the core plating member 1365a through the lower conductive layer 1320 a. Core plating member 1365a may provide a ground area for IC 1300a.

The support member 1355a may include a core dielectric layer 1356a in contact with the connection member, a core conductive layer 1359a disposed on an upper and/or lower surface of the core dielectric layer 1356a, and at least one core via 1360a, the at least one core via 1360a extending through the core dielectric layer 1356a, electrically connecting the core conductive layer 1359a, and electrically connecting to the connection pad 1330a. At least one core via 1360a may be electrically connected to an electrical connection structure 1340a such as a solder ball, a pin, and a ground pad.

Accordingly, the support member 1355a may be supplied with baseband signals or power from a lower surface, and the support member 1355a may transmit baseband signals and/or power to the IC 1300a through the at least one conductive layer 1310a of the connection member.

IC 1300a may utilize baseband signals and/or power to generate RF signals in the mmWave band. For example, the IC 1300a may receive a baseband signal of a low frequency, and may perform frequency conversion and amplification, filter phase control, and power generation on the baseband signal, and may be implemented as a compound semiconductor (e.g., gaAs) or may be implemented as a silicon semiconductor in consideration of frequency characteristics.

The IC package may further include a passive component 1350a electrically connected to the wiring corresponding to the at least one conductive layer 1310 a. The passive component 1350a may be disposed in the receiving space 1306a provided by the support member 1355 a.

The IC package may include core plating members 1365a and 1370a disposed on side surfaces of the support member 1355 a. The core plating members 1365a and 1370a may provide a ground area to the IC 1300a, and may radiate heat of the IC 1300a to the outside or may remove noise of the IC 1300a.

The IC package and the connection member may be manufactured independently and bonded to each other, but may also be manufactured together according to design. The process of bonding the plurality of packages may be omitted.

The IC package may be bonded to the connection member through the electrical connection structure 1290a and the passivation layer 1285a, but the electrical connection structure 1290a and the passivation layer 1285a may be omitted according to design.

Fig. 10A to 10C are plan views showing the arrangement of an antenna apparatus in an electronic device according to an example embodiment.

Referring to fig. 10A, an antenna module including an antenna apparatus 100g, a patch antenna pattern 1110g, and a dielectric layer 1140g may be disposed adjacent to a side boundary of the electronic device 700g on a group substrate 600g of the electronic device 700 g.

The electronic device 700g may be implemented as a smart phone, a personal digital assistant, a digital video camera, a digital camera, a network system, a computer, a monitor, a tablet, a laptop, a netbook, a television, a video game console, a smartwatch, an automobile, etc., but example embodiments thereof are not limited thereto.

The communication module 610g and the baseband circuit 620g may also be disposed on the pack substrate 600 g. The antenna module may be electrically connected to the communication module 610g and/or the baseband circuitry 620g by a coaxial cable 630 g.

The communication module 610g may include at least some of the following: memory chips such as volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), flash memory, etc.; an application processor chip such as a central processing unit (e.g., CPU), a graphics processor (e.g., GPU), a digital signal processor, an encryption processor, a microprocessor, a microcontroller, etc.; logic chips such as analog-to-digital converters, application Specific ICs (ASICs), and the like.

The baseband circuit 620g may generate a baseband signal by performing analog-to-digital conversion, amplification, filtering, and frequency conversion of the analog signal. The baseband signal input to the baseband circuit 620g and output from the baseband circuit 620g may be transmitted to the antenna module via a cable.

For example, baseband signals may be transmitted to the IC via electrical connection structures, core vias, and wiring. The IC may convert the baseband signal to an RF signal in the mmWave band.

Referring to fig. 10B, a plurality of antenna modules each including an antenna apparatus 100h, a patch antenna pattern 1110h, and a dielectric layer 1140h may be disposed adjacent to a boundary on one side surface and a boundary on the other side surface of the electronic device 700h on the group substrate 600h of the electronic device 700h, and the communication module 610h and the baseband circuit 620h may be further disposed on the group substrate 600 h. The plurality of antenna modules may be electrically connected to the communication module 610h and/or the baseband circuitry 620h via coaxial cables 630 h.

Referring to fig. 10C, a plurality of antenna modules each including the antenna apparatus 100i and the patch antenna pattern 1110i may be disposed adjacent to a side center of the polygonal electronic device 700i on the group substrate 600i, and the communication module 610i and the baseband circuit 620i may be further disposed on the group substrate 600 i. The antenna device and antenna module may be electrically connected to the communication module 610i and/or the baseband circuitry 620i via a coaxial cable 630 i.

According to the foregoing example embodiments, the antenna apparatus may improve antenna performance (transmission and reception rates, gains, bandwidths, directivities, etc.) using a blocking pattern, or may have a structure that is easily miniaturized.

In example embodiments, the conductive layer, the ground plane, the feed line, the feed via, the dipole antenna pattern, the patch antenna pattern, the shield via, the director pattern, the electrical connection structure, the plating member, the core via, and the barrier pattern may include a metal material (e.g., a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof), and may be formed by a plating method such as Chemical Vapor Deposition (CVD), physical Vapor Deposition (PVD), a sputtering process, a subtractive process, an additive process, a semi-additive process, a modified semi-additive process (MSAP), or the like, but the material and method are not limited thereto.

The dielectric layer and/or insulating layer described in the foregoing example embodiments may be a thermosetting resin such as FR4, a Liquid Crystal Polymer (LCP), a low temperature co-fired ceramic (LTCC), an epoxy resin, a thermoplastic resin such as a polyimide resin, a resin in which the thermosetting resin or thermoplastic resin is mixed with an inorganic filler or impregnated with an inorganic filler in a core material such as glass fiber (glass fiber, glass cloth), prepreg, ABF (Ajinomoto Build-up Film), FR-4, bismaleimide Triazine (BT), a photosensitive dielectric (PID) resin, a Copper Clad Laminate (CCL), a glass or ceramic-based insulating material, or the like. The insulating layer may be filled in at least a portion of the locations where the conductive layer, the ground plane, the feed line, the feed via, the dipole antenna pattern, the patch antenna pattern, the shield via, the director pattern, the electrical connection structure, the plating member, the core via, and the blocking pattern are not provided in the antenna device described in the example embodiments.

The RF signals described in the foregoing example embodiments may have a form based on Wi-Fi (IEEE 802.11 series, etc.), wiMAX (IEEE 802.16 series, etc.), IEEE 802.20, LTE (long term evolution), ev-DO, hspa+, hsdpa+, hsupa+, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, bluetooth, 3G, 4G, 5G, and other recent random wireless and wired protocols, but example embodiments thereof are not limited thereto.

By way of non-exhaustive example only, the electronic device described herein may be: mobile devices such as cellular phones, smart phones, wearable smart devices (such as rings, watches, glasses, bracelets, foot chains, waistbands, necklaces, earrings, headbands, helmets, or clothing-embedded devices), portable Personal Computers (PCs) (such as laptops, notebooks, mini-notebooks, netbooks, ultra Mobile PCs (UMPCs), tablet PCs (tablet PCs), tablet handsets), personal Digital Assistants (PDAs), digital cameras, portable game consoles, MP3 players, portable/Personal Multimedia Players (PMPs), hand-held electronic books, global Positioning System (GPS) navigation devices, or sensors; or a stationary device such as a desktop PC, a High Definition Television (HDTV), a DVD player, a blu-ray player, a set-top box, or a home appliance; or any other mobile or fixed device configured to perform wireless or network communications. In one example, the wearable device is a device designed to be mounted directly on the user's body, such as glasses or a bracelet. In another example, the wearable device is any device that is mounted on the user's body using an attachment device, such as a smartphone or tablet that is attached to the user's arm using an armband or hung on the user's neck using a lanyard.

While this disclosure includes particular examples, it will be apparent, after an understanding of the disclosure of the present application, that various changes in form and details may be made therein without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered in descriptive sense only and not for purposes of limitation. The descriptions of features or aspects in each example are considered to be applicable to similar features or aspects in other examples. Suitable results may be obtained if the described techniques are performed in a different order and/or if components in the described systems, architectures, devices or circuits are combined in a different manner and/or replaced or added by other components or their equivalents. Thus, the scope of the disclosure is not to be limited by the specific embodiments, but by the claims and their equivalents, and all modifications within the scope of the claims and their equivalents are to be construed as being included in the disclosure.

Claims

1. An antenna apparatus comprising:

a first dipole antenna pattern;

a feed line connected to a corresponding one of the first dipole antenna patterns;

A first feed via connecting the first dipole antenna pattern and the feed line;

a first ground plane disposed rearward of and spaced apart from each of the first dipole antenna patterns; and

a first blocking pattern connected to and extending from the first ground plane, disposed between adjacent ones of the first dipole antenna patterns,

wherein an end of the first dipole antenna pattern is received into a recessed portion of the first ground plane,

wherein the first ground plane includes a portion protruding toward the first feed via within one of the recessed portions of the first ground plane.

2. The antenna device of claim 1, further comprising:

a second ground plane disposed above the first ground plane; and

a second blocking pattern connected to the second ground plane, having at least a portion overlapping the first blocking pattern in a vertical direction, and extending from the second ground plane.

3. The antenna device of claim 2, further comprising:

A shield via disposed along a perimeter of the first ground plane and connected to the second ground plane,

wherein an area between the first barrier pattern and the second barrier pattern is filled with an insulating layer.

4. The antenna device of claim 1, further comprising:

a second dipole antenna pattern disposed under a corresponding one of the first dipole antenna patterns; and

and a radial via connecting the first dipole antenna pattern and the second dipole antenna pattern.

5. The antenna device of claim 4, further comprising:

a third ground plane disposed below the first ground plane; and

and a third blocking pattern connected to and extending from the third ground plane, disposed between adjacent ones of the second dipole antenna patterns.

6. The antenna device of claim 4, further comprising:

a director pattern disposed outside and spaced apart from a corresponding one of the second dipole antenna patterns,

Wherein a region overlapping the director pattern in a vertical direction in an outer side of the first dipole antenna pattern is filled with an insulating layer.

7. The antenna device of claim 1, further comprising:

a director pattern disposed outside and spaced apart from a corresponding one of the first dipole antenna patterns,

wherein the first blocking pattern extends to the outside by a length corresponding to an area between the first dipole antenna pattern and the director pattern.

8. The antenna device of claim 1, wherein the protruding portion of the first ground plane overlaps with a projection of the feed line in a vertical direction.

9. The antenna device of claim 8, wherein the first blocking pattern extends from one of the recessed portions.

10. The antenna device of claim 2, wherein the second ground plane includes a recessed portion, and the recessed portion of the first ground plane and the recessed portion of the second ground plane each have a rectangular parallelepiped shape.

11. The antenna device of claim 1, further comprising:

a patch antenna pattern disposed above the first ground plane; and

and a second feed via connected to the patch antenna pattern.

12. The antenna device of claim 11, further comprising:

a coupling member surrounding each of the patch antenna patterns,

wherein a perimeter or portion of the coupling member overlaps a perimeter of the first ground plane in a vertical direction.

13. An antenna apparatus comprising:

a first dipole antenna pattern;

a first barrier pattern electrically isolated from the first ground plane, disposed between adjacent ones of the first dipole antenna patterns,

wherein, the width of one end of the first barrier pattern is smaller than the width of the other end of the first barrier pattern.

14. The antenna device of claim 13, wherein the first blocking pattern comprises coupling patterns spaced apart from each other.

15. The antenna device of claim 13, wherein the first ground plane comprises a protruding portion that overlaps with a projection of the feed line in a vertical direction.

16. The antenna device of claim 13, further comprising:

a second ground plane disposed above the first ground plane; and

17. An antenna apparatus comprising:

a first dipole antenna pattern;

a ground plane disposed behind and spaced apart from each of the first dipole antenna patterns;

a first feed line and a second feed line, one end of which is connected to one of the first dipole antenna patterns and the other end of which is connected to one of the ground planes; and

a first barrier pattern connected to and extending from the ground plane, disposed between adjacent ones of the first dipole antenna patterns,

wherein an outer edge of said one of the ground planes has a stepped profile.

18. The antenna device of claim 17, further comprising a shielding via disposed along a perimeter of the one ground plane and connected to another of the ground planes.

19. The antenna device of claim 17, further comprising: a director pattern disposed outside and spaced apart from a corresponding one of the first dipole antenna patterns.

20. The antenna device of claim 17, wherein the first barrier pattern extends beyond the first dipole antenna pattern.

21. The antenna device of claim 17, wherein the first barrier pattern extends no more than the first dipole antenna pattern in the x-direction.

22. The antenna device of claim 17, wherein a width of one end of the first barrier pattern is smaller than a width of the other end of the first barrier pattern.

23. The antenna device of claim 17, wherein the first and second feed lines are configured to differentially receive signals from and/or to differentially transmit signals to corresponding ones of the first dipole antenna patterns.