KR102287464B1 - Substrate processing apparatus, apparatus management controller, program and method of manufacturing semiconductor device - Google Patents

Abstract

A configuration capable of reducing the time for analysis and investigation of abnormalities is provided.
a storage unit for storing device data generated when executing a recipe including a plurality of steps; a selection unit for selecting a recipe executed under the same conditions as the recipe in which the abnormal phenomenon has occurred from the storage unit; an acquisition unit configured to acquire the device data from each of the recipe in which the abnormal phenomenon has occurred and the recipe selected by the selection unit; and a calculator configured to calculate a difference between the first device data acquired from the recipe in which the abnormal phenomenon has occurred and the second device data acquired from the recipe selected by the selector, wherein the calculator includes the first device data for each unit time. and calculating an absolute value of a data difference between the second device data and the second device data to calculate a matching ratio between the first device data and the second device data in the step unit.

Description

SUBSTRATE PROCESSING APPARATUS, APPARATUS MANAGEMENT CONTROLLER, PROGRAM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

The present invention relates to a substrate processing apparatus, a device management controller, a program, and a method for manufacturing a semiconductor device.

In the field of semiconductor manufacturing, information of a device such as a substrate processing apparatus is accumulated in a server in order to improve the device operation rate or production efficiency. The accumulated information can be used when analyzing device troubles or monitoring device status. In the present specification, "trouble" refers to an abnormal situation in forming a film or an abnormal situation such as stopping the device due to a failure of the device.

When the conventional method for specifying the cause of a trouble is applied to an apparatus in which a large amount of data is maintained during substrate processing, the efficiency is low, it takes a considerable time to identify the cause of the trouble, and the amount of data used is large. Therefore, the conventional method of specifying the cause of a trouble may vary depending on the skill of the repairman who analyzes the trouble. In addition, for reasons such as omission of confirmation of important data, in the case of analyzing a conventional trouble, the cause of the trouble may not be specified. Therefore, various studies have been attempted in order to improve the operation rate of the apparatus by quickly identifying the cause of the abnormality when analyzing the trouble.

For example, in Patent Document 1, files used in a substrate processing apparatus connected to a management apparatus are collectively compared, and when a difference is extracted as a result of comparing the files, a method of correcting the difference is described. Also, Patent Document 2 describes comparing files between conventional recipes, for example, comparing files of process recipe A and process recipe B. The function of comparing such files has the advantage that different data can be easily extracted between the files. According to analyzing the trouble using the function to compare files, it is expected to improve the efficiency of specifying the cause of the abnormality.

1. International Publication No. WO2014/189045 2. Japanese Patent No. 4587753

SUMMARY OF THE INVENTION It is an object of the present invention to provide a technology capable of reducing the time for analyzing an abnormality.

According to one aspect of the present invention, there is provided a storage unit comprising: a storage unit for storing device data generated when a recipe including a plurality of steps is executed; a selection unit for selecting a recipe executed under the same conditions as the recipe in which the abnormal phenomenon has occurred from the storage unit; an acquisition unit configured to acquire the device data from each of the recipe in which the abnormal phenomenon has occurred and the recipe selected by the selection unit; and a calculator configured to calculate a difference between the first device data acquired from the recipe in which the abnormal phenomenon has occurred and the second device data acquired from the recipe selected by the selector, wherein the calculator includes the first device data for each unit time. and a substrate processing apparatus configured to calculate an absolute value of a data difference of the second apparatus data to calculate a matching ratio of the first apparatus data and the second apparatus data in the step unit.

ADVANTAGE OF THE INVENTION According to this invention, the time for analyzing the abnormality of the apparatus in which the abnormality has occurred can be shortened, and the apparatus stop time can be reduced.

1 is a perspective view showing a substrate processing apparatus preferably used in an embodiment of the present invention;
2 is a side cross-sectional view showing a substrate processing apparatus preferably used in an embodiment of the present invention.
3 is a diagram showing a functional configuration of a control system preferably used in an embodiment of the present invention;
Fig. 4 is a diagram showing a functional configuration of a main controller preferably used in an embodiment of the present invention;
5 is a diagram showing the configuration of a substrate processing system preferably used in an embodiment of the present invention.
6 is a diagram for explaining a functional configuration of a device management controller preferably used in an embodiment of the present invention;
7A is a diagram illustrating a functional configuration of a device status monitoring control unit according to an embodiment of the present invention, and FIG. 7B is a diagram illustrating a functional configuration of a data matching control unit according to an embodiment of the present invention.
8 is a diagram for explaining device data acquired by a device status monitoring control unit according to an embodiment of the present invention;
9 is a view for explaining device data as a file comparison target according to an embodiment of the present invention;
10 is a diagram illustrating an example of a processing flow executed by a data matching control unit according to an embodiment of the present invention;
11 is a diagram illustrating an example for explaining a matching rate according to an embodiment of the present invention.
12 is a diagram illustrating an example for explaining a method of calculating a threshold value used for calculating a matching rate according to an embodiment of the present invention.
13 exemplarily shows a matching rate of device data in descending order according to an embodiment of the present invention.
14 is a view for explaining a file comparison function according to another embodiment of the present invention.
15 is a diagram exemplarily showing a performance evaluation waveform table according to another embodiment of the present invention;
16 is a diagram illustrating a comparison history screen according to an embodiment of the present invention.
17 is a diagram exemplarily illustrating a data detail display screen according to an embodiment of the present invention.
18 is a diagram exemplarily showing raw waveform data according to an embodiment of the present invention.
19 is a view exemplarily showing a recipe comparison result according to an embodiment of the present invention.

<Outline of substrate processing apparatus>

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. First, referring to Figs. 1 and 2, a substrate processing apparatus 1 (hereinafter simply referred to as "apparatus") in which the present invention is embodied will be described.

The substrate processing apparatus 1 has a housing 2 . An opening 4 (front maintenance opening) installed to enable maintenance is provided under the front wall 3 of the housing 2 , and the opening 4 is opened and closed by the front maintenance door 5 .

On the front wall 3 of the hull 2, a pod carry-in/out port 6 is opened so that the inside and outside of the hull 2 communicate with each other, and the pod carry-in/out port 6 is opened and closed by the front shutter 7 to carry in the pod A load port 8 is installed on the front front side of the discharge port 6 , and the load port 8 is configured to position the mounted pod 9 .

The pod 9 is an airtight substrate transport container, and is loaded onto the load port 8 by an in-process transport device (not shown) and is carried out from the load port 8 .

A rotary pod shelf 11 is provided at an upper portion in the substantially central portion in the front-rear direction in the housing 2 , and the rotary pod shelf 11 is configured to contain a plurality of pods 9 .

The rotary pod shelf 11 is provided with a vertically standing and intermittently rotating post 12 and a plurality of shelf plates 13 radially supported at each position of the upper, middle and lower ends on the post 12, the shelf plate Reference numeral 13 is configured to store the pods 9 in a state in which a plurality of them are placed.

A pod opener 14 is installed on the lower side of the rotary pod shelf 11, and the pod opener 14 has a configuration in which the pod 9 is placed and the cover of the pod 9 can be opened and closed. do.

A pod carrying mechanism 15 is provided between the load port 8, the rotary pod shelf 11, and the pod opener 14, and the pod carrying mechanism 15 holds the pod 9 and raises and lowers it. It is configured to be capable of moving forward and backward in the horizontal direction, and configured to transport the pod 9 between the load port 8 , the rotary pod shelf 11 , and the pod opener 14 .

A sub housing 16 is provided at a lower portion in the substantially central portion in the front-rear direction in the housing 2 over the rear end. On the front wall 17 of the sub housing 16 , a pair of wafer loading and unloading ports 19 for loading and unloading wafers 18 (hereinafter also referred to as substrates) into and out of the sub housing 16 are provided vertically in the vertical direction. It is arranged and opened in two stages, and pod openers 14 are respectively installed with respect to the wafer carry-in/out ports 19 at the upper and lower ends.

The pod opener 14 includes a mounting table 21 on which the pod 9 is placed and an opening/closing mechanism 22 for opening and closing the cover of the pod 9 . The pod opener 14 is configured to open and close the wafer entrance and exit of the pod 9 by opening and closing the cover of the pod 9 placed on the mounting table 21 by the opening/closing mechanism 22 .

The sub housing 16 constitutes a transfer chamber 23 hermetically formed into a space (pod carrying space) in which the pod carrying mechanism 15 and the rotary pod shelf 11 are arranged. A wafer transfer mechanism 24 (a substrate transfer mechanism) is provided in the area in front of the transfer chamber 23 , and the substrate transfer mechanism 24 requires the number of substrates 18 to be placed (five in the illustration). and a wafer mounting plate 25 of It is comprised so that the board|substrate 18 may be loaded and unloaded with respect to a sieve.

A waiting section 27 for accommodating and waiting the boat 26 is configured in the rear area of the transfer chamber 23, and a bell-shaped processing furnace is located above the waiting section 27. (28) is installed. The processing furnace 28 forms a processing chamber 29 therein, and the lower end of the processing chamber 29 becomes a furnace-aperture part, and the furnace-aperture part is configured to be opened and closed by the furnace-aperture shutter 31 .

Between the right end of the housing 2 and the right end of the standby portion 27 of the sub housing 16, a boat elevator 32, which is a lifting mechanism for lifting and lowering the boat 26, is installed. A seal cap 34, which is an individual, is horizontally mounted on the arm 33 connected to the hoisting table of the boat elevator 32, and the seal cap 34 supports the boat 26 vertically. And, in a state in which the boat 26 is charged into the processing chamber 29, the furnace mouth part can be hermetically closed.

The boat 26 is configured to hold a plurality of (eg, about 50 to 125) substrates 18 in multiple stages in a horizontal posture in alignment with the center thereof.

A clean unit 35 is disposed at a position opposite to the boat elevator 32 side, and the clean unit 35 is provided with a supply fan and dustproof so as to supply a clean atmosphere or clean air 36 which is an inert gas. It consists of filters. A notch matching device (not shown) as a substrate matching device for matching the position of the substrate 18 in the circumferential direction is provided between the substrate transfer mechanism 24 and the clean unit 35 .

The clean air 36 discharged from the clean unit 35 is circulated to the notch matching device (not shown), the substrate transfer mechanism 24 , and the boat 26 , and then is sucked in by a duct (not shown), and It is configured to be exhausted to the outside or discharged into the transfer chamber 23 by the clean unit 35 .

Next, the operation of the substrate processing apparatus 1 will be described.

When the pod 9 is supplied to the load port 8 , the pod carry-in/out port 6 is opened by the front shutter 7 . The pod 9 on the load port 8 is carried into the inside of the housing 2 by the pod carrying device 15 through the pod carry-in/out port 6, and the designated shelf plate 13 of the rotary pod shelf 11 ) is witty. After the pod 9 is temporarily stored on the rotary pod shelf 11 , it is transported from the shelf plate 13 to one of the pod openers 14 by the pod transport device 15 , and then transferred to the mounting table 21 . ) or directly transferred from the load port 8 to the mounting table 21 .

At this time, the wafer loading/unloading port 19 is closed by the opening/closing mechanism 22 and the transfer chamber 23 is filled with clean air 36 circulating therein. Since the transfer chamber 23 is filled with nitrogen gas as the clean air 36 , the oxygen concentration in the transfer chamber 23 is lower than the oxygen concentration in the housing 2 .

The pod 9 mounted on the mounting table 21 has a cross section on the opening side of the edge of the opening of the wafer loading/unloading port 19 in the front wall 17 of the sub housing 16 . ), the cover is removed by the opening/closing mechanism 22 to open the wafer entrance and exit.

When the pod 9 is opened by the pod opener 14, the substrate 18 is taken out from the pod 9 by the substrate transfer mechanism 24, and transferred to a notch registration device (not shown), After the substrate 18 is aligned in the notch matching device, the substrate transfer mechanism 24 loads the substrate 18 into the waiting section 27 located at the rear of the transfer chamber 23 and loads it on the boat 26 .

The substrate transfer mechanism 24 that transfers the substrate 18 to the boat 26 returns to the pod 9 , and the next substrate 18 is loaded onto the boat 26 .

During the loading operation of the substrate 18 onto the boat 26 by the substrate transfer mechanism 24 in the pod opener 14 on one side (upper or lower), the other (lower or upper) pod opener 14 has a rotary pod. Another pod 9 is conveyed and transferred from the shelf 11 by the pod conveying device 15, and the opening operation of the pod 9 by the other pod opener 14 is simultaneously performed.

When the predetermined number of substrates 18 are loaded into the boat 26 , the furnace opening portion of the processing furnace 28 closed by the furnace opening shutter 31 is opened by the furnace opening shutter 31 . Subsequently, the boat 26 is lifted by the boat elevator 32 and loaded into the processing chamber 29 (loaded).

After loading, the furnace-aperture part is hermetically closed by the seal cap 34. In addition, the present embodiment includes a purge process (pre-purge process) in which the internal atmosphere of the processing chamber 29 is replaced with an inert gas after loading.

The process chamber 29 is evacuated by a gas exhaust mechanism (not shown) so as to attain a desired pressure (degree of vacuum). In addition, the processing chamber 29 is heated to a predetermined temperature by a heater driving unit (not shown) so as to achieve a desired temperature distribution.

In addition, a processing gas controlled at a predetermined flow rate is supplied by a gas supply mechanism (not shown), and the processing gas comes into contact with the surface of the substrate 18 while flowing through the processing chamber 29 and is formed on the surface of the substrate 18 . A predetermined process is performed. In addition, the process gas after the reaction is exhausted from the process chamber 29 by a gas exhaust mechanism.

When the preset processing time elapses, an inert gas is supplied from an inert gas supply source (not shown) by a gas supply mechanism to replace the processing chamber 29 with the inert gas, and the pressure in the processing chamber 29 returns to normal pressure ( after-purge process). Then, the boat 26 is lowered by the boat elevator 32 via the seal cap 34 .

Regarding the unloading of the substrate 18 after processing, the substrate 18 and the pod 9 are unloaded from the housing 2 in the order opposite to the above description. An unprocessed substrate 18 is also loaded into the boat 26 so that the processing of the substrate 18 is repeated.

<Functional configuration of the control system 200>

Next, with reference to FIG. 3, the functional structure of the control system 200 centering on the main controller 201 which is an operation part is demonstrated. In this specification, the main controller 201 may also be denoted as the operation unit 201 . As shown in FIG. 3 , the control system 200 includes a main controller 201 , a transport controller 211 serving as a transport control unit, a process system controller 212 serving as a processing control unit, and a device management controller 215 serving as a data monitoring unit. do. The device management controller 215 functions as a data collection controller, collects device data inside and outside the device 1 , and monitors the health of the device data in the device 1 . In this embodiment, the control system 200 is housed in the device 1 .

As used herein, “device data” refers to data (hereinafter also referred to as control parameters) relating to substrate processing such as processing temperature, processing pressure and flow rate of processing gas when the apparatus 1 processes the substrate 18 , such as formed Data regarding the quality of the manufactured product substrate, such as the film thickness and the accumulated value of the thickness, and data regarding the component parts of the apparatus 1 such as a quartz reaction tube, a heater, a valve and a mass flow controller (MFC) (for example, a set value) , actual values), it means data generated by operating each component when the substrate processing apparatus 1 processes the substrate 18 .

Also, data collected while executing a recipe may be referred to as process data. The device data also includes process data, such as raw waveform data, which is data collected at a specific interval (eg, 1 second), for example, from the start of the recipe to the end of the recipe, and statistical data of each step in the recipe. Statistical data includes data such as maximum, minimum and average values. The device data may include event data (eg, data indicating a maintenance history) indicative of various device events when a recipe is not executed (eg, when the device 1 is idle in a state in which a substrate is not inserted).

The main controller 201 is electrically connected to the transport system controller 211 and the process system controller 212 via a LAN line such as 100BASE-T, for example. Accordingly, the main controller 201 can transmit/receive device data or download and upload files between the transport system controller 211 and the process system controller 212 .

The operation unit 201 is provided with a port, which is a mounting unit, into which a recording medium (eg, a USB key), which is an external storage device, is inserted or detached. An OS corresponding to the port is installed in the operation unit 201 . In addition, a host computer is connected to the operation unit 201 via, for example, a communication network. For this reason, even when the substrate processing apparatus 1 is installed in a clean room, the host computer can be placed in an office or the like outside the clean room.

The device management controller 215 is connected to the operation unit 201 through a LAN line, and is configured to collect device data from the operation unit 201, quantify the operating state of the device, and display it on the screen. Also, the device management controller 215 will be described in detail later.

The transfer system controller 211 is mainly composed of a rotary pod shelf 11 , a boat elevator 32 , a pod transfer device 15 , a substrate transfer mechanism 24 , a boat 26 , and a rotation mechanism (not shown). It is connected to the substrate transfer system 211A. The transfer system controller 211 controls the transfer operations of the rotary pod shelf 11 , the boat elevator 32 , the pod transfer device 15 , the substrate transfer mechanism 24 , the boat 26 , and the rotation mechanism (not shown), respectively. configured to control. In particular, the transfer system controller 211 is configured to control the transfer operations of the boat elevator 32 , the pod transfer device 15 , and the substrate transfer mechanism 24 via the motion controller 211a, respectively.

The process system controller 212 includes a temperature controller 212a, a pressure controller 212b, a gas flow controller 212c, and a sequencer 212d. These temperature controller 212a, pressure controller 212b, gas flow controller 212c, and sequencer 212d are sub-controllers. The temperature controller 212a, the pressure controller 212b, the gas flow controller 212c, and the sequencer 212d are electrically connected to the process system controller 212, and transmit/receive device data to and from the process system controller 212, respectively. It is configured to be able to download and upload files. Meanwhile, the process controller 212 and the sub-controller are illustrated as separate configurations, but the process controller 212 and the sub-controller may be integrally configured.

The temperature controller 212a is connected to a heating mechanism 212A mainly having a configuration such as a heater and a temperature sensor. The temperature controller 212a is configured to adjust the temperature in the processing furnace 28 by controlling the temperature of the heater of the processing furnace 28 . In addition, the temperature controller 212a is configured to perform switching (on-off) control of the thyristor (not shown), and to control the power supplied to the heater wire (not shown).

A pressure sensor, an APC valve serving as a pressure valve, and a gas exhaust mechanism 212B mainly constituted by a vacuum pump (not shown) are connected to the pressure controller 212b. The pressure controller 212b controls the opening degree of the APC valve and switching (on/off) of the vacuum pump so that the pressure in the processing chamber 29 becomes a desired pressure at a desired timing based on the pressure value detected by the pressure sensor. configured to do

The gas flow controller 212c is configured by MFC. The sequencer 212d is configured to control supply of gas to the process gas supply pipe or the purge gas supply pipe or stopping the supply of gas by opening and closing the valve 212D. In addition, the process system controller 212 is configured to control the MFC 212c and the valve 212D so that the flow rate of the gas supplied into the process chamber 29 becomes a desired flow rate at a desired timing.

In addition, the main controller 201, the transport system controller 211, the process system controller 212, and the device management controller 215 according to the present embodiment can be implemented by a dedicated system as well as a general computer system. It can also be implemented using For example, each controller that executes a predetermined process can be configured by installing the program in a general-purpose computer using a recording medium (eg, a USB key) storing the program for executing the above-described process.

And there are various methods for supplying these programs. As described above, not only the method of supplying through a predetermined recording medium, but also the method of supplying through, for example, a communication line, a communication network, and a communication system are possible. In this case, for example, the program can be posted on a bulletin board of a communication network, and the program can be provided over a carrier wave via the network. Then, a predetermined process can be executed by activating the program provided in this way and executing it similarly to other application programs under the control of the OS.

<Configuration of main controller 201>

Next, the configuration of the main controller 201 will be described with reference to FIG. 4 .

The main controller 201 includes an operation display unit 227 including a main controller control unit 220, a hard disk (HDD) 222 serving as a main controller storage unit, a display unit for displaying various information, and an input unit for receiving various instructions from the operator. , the device 1 is configured to include a transmit/receive module 228, which is a main controller communication unit communicating with the inside and outside. Operators may also include device operators, device managers, device engineers, maintenance personnel, and operators, as well as device operators. The main controller control unit 220 includes a CPU 224 (central processing unit) as a processing unit and a memory 226 as temporary storage units such as RAM and ROM, and is configured as a computer having a clock function (not shown).

The hard disk 222 includes, for example, a recipe file such as a recipe in which the processing conditions and processing order of the substrate are defined, a control program file for executing the recipe file, a parameter file in which parameters for executing the recipe are defined, and an error processing program file and various screen files including input screens for inputting process parameters as well as error processing parameter files and various icon files (both not shown) are stored.

In addition, on the operation screen of the operation display unit 227, operation instructions to the substrate transfer system 211A or the substrate processing system (heating mechanism 212A, gas exhaust mechanism 212B, and gas supply system 212C) shown in FIG. 3 are displayed. It is also possible to provide each operation button that is an input unit for input.

The operation display unit 227 is configured to display an operation screen for operating the device 1 . The operation display unit 227 displays information based on the apparatus data generated in the substrate processing apparatus 100 on the operation screen via the operation screen. The operation screen of the operation display unit 227 is, for example, a touch panel using liquid crystal. The operation display unit 227 receives input data (instruction for input) of the operator via the operation screen and transmits the input data to the main controller 201 . In addition, the operation display unit 227 provides an instruction (hereinafter also referred to as a process recipe) to execute a recipe stored in the memory 226 (RAM) or the like or an arbitrary substrate processing recipe (hereinafter also referred to as a process recipe) among a plurality of recipes stored in the main controller storage unit 222 . control instruction) is received and transmitted to the main controller control unit 220 .

Further, in the present embodiment, the device management controller 215 reads each screen file and data table stored in advance by executing various programs or the like at startup, and reads the device data to change the operating state of the device. Each screen shown is configured to be displayed on the operation display unit 227 .

A configuration such as a switching hub (not shown) is connected to the main controller communication unit 228 so that the main controller 201 transmits and receives data to and from an external computer or other controller in the device 1 via a network. is composed

Also, the main controller 201 transmits device data such as the state of the device 1 to an external host computer, for example, a host computer via a network (not shown). Further, the substrate processing operation of the apparatus 1 is controlled by the control system 200 based on each recipe file, each parameter file, etc. stored in the main controller storage unit 222 .

<Substrate processing method>

Next, a description will be given of a substrate processing method including a predetermined processing step performed using the apparatus 1 according to the present embodiment. Here, the predetermined processing process is a case in which a substrate processing process (here, a film formation process), which is one process of a semiconductor device manufacturing process, is performed is exemplified.

When performing a substrate processing step, a substrate processing recipe (process recipe) corresponding to the substrate processing to be performed is stored in a memory such as a RAM in the process system controller 212 . Then, an operation instruction is given from the main controller 201 to the process system controller 212 and the transfer system controller 211 as necessary. The substrate processing process performed in this way includes at least a loading process, a film forming process, and a carrying out process.

<Transfer process>

The main controller 201 generates an instruction to drive the substrate transfer mechanism 24 to the transfer system controller 211 . Then, according to an instruction from the transfer system controller 211 , the substrate transfer mechanism 24 starts the transfer process of the substrate 18 from the pod 9 on the transfer stage 21 as a mounting table to the boat 26 . This transfer processing is performed until the loading (wafer charging) of all the substrates 18 to the boat 26 is completed.

<Import process>

When a predetermined number of substrates 18 are loaded into the boat 26 , the boat 26 is raised by the boat elevator 32 operating according to an instruction from the transport system controller 211 and formed in the processing furnace 28 . It is charged (boat loaded) into the processing chamber 29 . When the boat 26 is fully charged, the seal cap 34 of the boat elevator 32 hermetically closes the lower end of the manifold of the treatment furnace 28 .

<Film forming process>

Next, the internal atmosphere of the processing chamber 29 is evacuated by the vacuum evacuation device so as to reach a predetermined film forming pressure (vacuum degree) according to an instruction from the pressure control unit 212b. In addition, the inside of the processing chamber 29 is heated by a heater to a predetermined temperature according to an instruction from the temperature control unit 212a. Subsequently, according to the instruction from the transfer system controller 211, rotation of the boat 26 and the substrate 18 by the rotating mechanism is started. Then, a predetermined gas (processing gas) is supplied to the plurality of substrates 18 held by the boat 26 in a state maintained at a predetermined pressure and a predetermined temperature, and a predetermined process (eg, film formation) is supplied to the substrate 18 . processing) is done. In addition, the temperature may be lowered from the treatment temperature (predetermined temperature) before the next carrying out process.

<Carry out process>

When the film forming process on the substrate 18 placed on the boat 26 is completed, according to the instruction from the transfer system controller 211, the rotation of the boat 26 and the substrate 18 by the rotating mechanism is stopped and the boat The seal cap 34 is lowered by the elevator 32 to open the lower end of the manifold, and the boat 26 holding the processed substrate 18 is carried out to the outside of the processing furnace 28 (boat unloading). )do.

<Recovery process>

The boat 26 holding the processed substrate 18 is very effectively cooled by the clean air 36 blown out through the clean unit 35 . And, when cooled to, for example, 150° C. or less, the processed substrate 18 is herniated from the boat 26 (wafer discharge) and transferred to the pod 9, and then a new unprocessed substrate 18 is transferred to the boat 26 of the boat 26 . ) is transferred.

<Configuration of substrate processing system>

5 is a diagram showing the configuration of a substrate processing system used in the present embodiment. In this substrate processing system, the master apparatus 1-M and the repeat apparatuses 1-1 to 1-6 are connected via a network. In the example of FIG. 5 , six repeating devices 1-1 to 1-6 are shown, but the number of repeating devices is not limited to six. Further, the master apparatus 1-M and the repeat apparatuses 1-1 to 1-6 are each configured as a substrate processing apparatus, that is, the apparatus 1 . In this specification, the master device 1-M and the repeat devices 1-1 to 1-6 are also referred to as device 1, respectively, and the master device 1-M and the repeat devices 1-1 to 1 -6) is collectively referred to as device 1 .

The master device 1-M is the device 1 containing device data to be standard. The master apparatus 1-M includes the same hardware configuration as the substrate processing apparatus 1 , and also includes an apparatus management controller 215 . The master device 1-M is, for example, the first unit of the device 1 to which the device data has been appropriately adjusted. In this specification, the "first unit" is the device 1 delivered first to the customer's factory, and the "repeat device" is, for example, the device 1 delivered to the customer's factory after the second generation after the first unit. The repeating apparatuses 1-1 to 1-6 receive copies of various types of information included in the master apparatus 1-M from the master apparatus 1-M via a network, and each repeating apparatus 1-1 to 1-6 1-6) are stored in each memory section.

As such, in this embodiment, the device management controller 215 is installed in each device 1 . In addition, by network connection between the master device 1-M and the device management controllers 215 respectively installed in the repeat devices 1-1 to 1-6, each repeat device 1-1 to 1-6 is Various types of information of the master device 1-M can be shared. Specifically, each repeat device 1-1 to 1-6 copies the same file as the device data of the master device 1-M or compares and collates the same file with the file of the master device 1-M (to be described later). tool matching). In addition, since the network is used, there is no need to use a recording medium for copying device data, and the maintenance personnel of the device maker do not need to move to the front of the device 1 installed in the clean room, which is advantageous in that file editing can be performed easily. there is

<Function configuration of device management controller 215>

The device management controller 215, which is a health check controller for checking the health state of the device 1 shown in FIG. 6, includes information related to various health states of the device 1, for example, a matching state with the master device 1-M. , while performing quantification of information such as the amount of change over time of the device data from the time of shipment or set-up of the device 1, the deterioration state of the parts constituting the device 1, and the occurrence status of the fault information of the device 1 1) is a controller with a configuration that monitors whether it can continue to operate normally. Here, "at the time of setup" is when the device 1 is first started up (powered on) after being delivered into the customer's factory.

As shown in FIG. 6 , the device management controller 215 includes a data matching control unit 215c, a device status monitoring control unit 215e, a communication unit 215g for transmitting and receiving device data between the main controller 201, and various A storage unit 215h for storing data is provided. Specifically, the device management controller 215 includes a device status monitoring control unit 215e that monitors the health of device data obtainable from the operating status of components constituting the device, and a device status monitoring control section 215e that determines the validity of facility data provided from factory facilities. It includes at least a data matching control unit 215c. The device management controller 215 evaluates the operating status of the device 1 based on the device status monitoring result data obtained from the device status monitoring control unit 215e and the validity determination result data determined by the data matching control unit 215c. is configured to derive

In addition, the device management controller 215 monitors the health status based on the numerical value quantified information evaluating the operating status of the device 1, and when the health status deteriorates, for example, by outputting an alarm sound or displaying an alarm is configured to issue In addition, the device management controller 215 is configured so that functions useful for stable operation of the device 1, such as data matching and device status monitoring, for example, can be operated on the operation display unit 227 of the device 1 .

The device management controller 215 includes, as a hardware configuration, for example, a CPU (not shown) and a memory (not shown) for storing an operation program of the device management controller 215 and the like. The CPU operates according to the operation program. In the present embodiment, the device management controller 215 is a device status monitoring control section 215e that stores, in the storage section 215h, device data generated during execution of a recipe for processing a substrate by executing the operation program. and a data matching control unit 215c configured to collate the device data obtained from the recipe before and after the occurrence of the abnormality based on the data indicating that the abnormality has occurred.

In the storage unit 215h, abnormal analysis information to be described later used in the data matching control unit 215c to be described later or device data obtained from the master device 1-M to be described later used in the device state monitoring control section 215e (to be described later) is stored in the storage unit 215h. standard data) is stored. In addition, various programs such as a data matching program, a device status monitoring program, and a waveform matching program, which will be respectively described later, are stored in at least the storage unit 215h. Alternatively, the main controller storage unit 222 or the temporary storage unit 226 may be used instead of the storage unit 215h. Then, the device management controller 215 (and/or the data matching control unit 215c, the device status monitoring control unit 215e, and the communication unit 215g) executes the screen display program, respectively, to convert the device data into the data for screen display. Control is performed so that screen display data is created by processing and displayed on the operation display unit 227 .

<Data matching control unit 215c>

The data matching control section 215c performs a copy or comparison between the file of the device 1 received from the main controller 201 and the file of the master device 1-M by executing a data matching program to be described later. Execute the tool matching function. In addition, in the present embodiment, the data matching control unit 215c is configured to compare the process recipe before and after the occurrence of the abnormality using the tool matching function. As a result, the data matching control unit 215c is configured to compare the waveform data of each device data before and after the occurrence of the abnormality and display it on the operation display unit 227 in the order in which the difference in the waveform data is greater.

Next, as shown in FIG. 7B , the data matching control unit 215c selects a recipe executed under the same conditions as the recipe in which the abnormality occurs from the storage unit 215h, a selection unit 321, and a recipe and a selection unit in which the abnormality occurs. It includes an acquisition unit 322 that acquires device data from each of the recipes selected at 321 , and an arithmetic unit 323 that calculates a difference between the acquired device data. In the present embodiment, the data matching control section 215c is configured to collate device data acquired from the recipe before and after the occurrence of the abnormality based on data indicating that the abnormality has occurred.

Also, as shown in FIG. 7B , the calculator 323 includes a calculator 324 that calculates a ratio at which the device data coincide while calculating the absolute value of the data difference between the device data, and the absolute value and a preset threshold. and a comparator 325 that compares values to determine whether the device data match, and a calculator 326 that calculates a standard deviation from the absolute value.

<Device status monitoring control unit 215e>

The device status monitoring control unit 215e includes a device status monitoring program and executes a device status monitoring function. The device status monitoring control section 215e receives device data of the device 1 from the main controller 201, updates and accumulates device data stored in the storage section 215h, and the master device 1-M ), i.e., monitoring of the device data of the device 1 is performed based on the standard data to be targeted by the device 1, such as, for example, the time-dependent waveform of the reaction chamber temperature, the upper limit value and the lower limit value. That is, the device data of the device 1 is compared with standard data and monitored.

Also, in the present embodiment, the device management controller 215 is provided separately from the main controller 201 having the substrate processing function and the upper level reporting function, but the present embodiment is not limited to such a configuration. For example, from the device data collected by the main controller 201, data related to device status monitoring (device status monitoring data), device performance evaluation data (evaluation item waveform data), abnormal analysis data (abnormal analysis data), and It goes without saying that various data such as alarm monitoring data (fault information data) may be generated.

<Device status monitoring function>

Next, the device status monitoring function of the present embodiment, that is, the device status monitoring program executed by the device status monitoring control unit 215e will be described with reference to FIG. 7A. The device status monitoring program is stored in the memory (for example, the storage unit 215h) of the device management controller 215, and implements the device status monitoring control unit 215e.

The device status monitoring control unit 215e includes a setting unit 311, a band generation unit 312, a Fault Detection & Classification (FDC) monitoring unit 313, a coefficient display unit 314, and a diagnostic unit (as shown in FIG. 7A). 315) is provided.

In response to an input from the operation display unit 227, such as input of an operation command, the setting unit 311 instructs the band generation unit 312, the FDC monitoring unit 313 and the diagnosis unit 315 to set the designated band management. do.

The band generating unit 312 generates a band based on the standard data set by the setting unit 311 and the upper limit designated value and the lower limit designated value. In this embodiment, "band" refers to a range determined to have a margin with respect to a waveform by standard data (here, device data of the master device 1-M). Specifically, the band refers to a range determined by designating an upper limit value or a lower limit value, or an upper limit value and a lower limit value based on the values of each data point constituting the standard data.

The FDC monitoring unit 313 includes a comparison unit 313a that compares the band generated by the band generation unit 312 with device data generated every moment from the device 1, and a counting unit that counts the number of times the device data deviates from the band ( 313b) and a determination unit 313c that determines that the device data is abnormal when the device data is out of the band more than a predetermined number of times. In addition, when an abnormality is detected, the FDC monitoring unit 313 is configured to display, for example, that the abnormality has been detected on the operation display unit 227 . In this way, the FDC monitoring unit 313 monitors the device data by comparing the device data received from the main controller 201 with the band generated with respect to the master data serving as a criterion for determining the device data. In addition, the above-described band generation unit 312 may be configured to be included in the FDC monitoring unit 313,

The count display unit 314 is configured to display on the operation display unit 227 the number of exclusion points for each batch processing for the exclusion points counted by the FDC monitoring unit 313 . In this embodiment, a data point deviating from a band by comparing the band and device data is referred to as an exclusion point.

The diagnosis unit 315 diagnoses statistical data among device data constituted from the number of excluded points by using the abnormal diagnosis rule. In addition, the diagnosis unit 315 is configured to display, for example, that the abnormality has been detected on the operation display unit 227 when it is diagnosed as abnormal.

In addition, the device data collected by the device status monitoring control unit 215e is stored in the storage unit 215h, but is not limited thereto. For example, the device data may be configured to be stored in the main controller storage unit 222 .

As shown in Fig. 8, the device status monitoring control section 215e accumulates device data from the start to the end of the process recipe in the storage section 215h at specific intervals by executing the above-described device status monitoring program, and further It is configured to calculate and store statistical data in the storage unit 215h at the end of the step by calculating the statistics (eg, the maximum value of the device data, the minimum value of the device data, the average value of the device data) for the section. Further, the device status monitoring control unit 215e is configured to accumulate event data including maintenance information while the process recipe is not being executed. Further, the device state monitoring control unit 215e is configured to accumulate, in the storage unit 215h, device data including a heating temperature waveform of a supply pipe or an exhaust pipe as well as a temperature increase waveform and a pressure decrease waveform as raw waveform data. Based on the temperature waveform, for example, a cold spot may occur and the possibility of the cause of by-product deposition can be confirmed.

As shown in Fig. 9, in a recently used device 1 holding a large amount of device data (500 or more types), data interpretation at the time of abnormal occurrence takes a considerable amount of time. In addition, since the amount of data is large, it takes time to specify the cause of the abnormality by missing important device data due to the skill of the maintenance person performing data analysis. In addition, it is difficult to confirm the change over time only by visually comparing the raw waveform data, and since the gradually changed data also appears as a difference, it becomes difficult to identify the cause of the abnormality. As a result, downtime is increased, which lowers device uptime.

<Analysis support processing>

Next, the processing flow of analysis support using the data matching function (tool matching function) executed by the data matching control unit 215c will be mainly described with reference to FIG. 10 .

<Data receiving process (S110)>

First, when the data matching control unit 215c receives the abnormality analysis information from the operation unit 201 via the communication unit 215g, it drives the waveform matching program. The data matching control unit 215c includes a selection unit 321 that selects a recipe executed under the same conditions as the recipe in which the abnormality occurred, and an acquisition unit 322 that acquires device data from each of the recipe in which the abnormality occurred and the recipe selected by the selection unit. ) and a calculating unit 323 for calculating a difference between the acquired device data.

In the present embodiment, the abnormality analysis information includes at least information specifying the abnormality, and recipe specifying information specifying the recipe executed by the apparatus 1 in which the abnormality occurred. Moreover, the data matching control part 215c may be comprised so that abnormality analysis information may be received via the communication part 215g by the condition input by the operator on the operation display part 227. As shown in FIG. Moreover, the abnormality analysis information may be comprised so that it can set by the condition input by the operator on the operation display part 227 at least one from the group which consists of a threshold value, a step, a group, and an item mentioned later.

<File selection process (S120)>

The data matching control unit 215c acquires recipe specifying information based on the received abnormality analysis information. The data matching control unit 215c searches for the presence or absence of a recipe having the same condition as the recipe specific information obtained by referring to the production history information among the device data in the storage unit 215h. The search by the data matching control unit 215c is performed while, for example, a plurality of recipes recorded in the production history information are traced from the recipe in which the abnormality occurred to the past recipe. When the data matching control unit 215c detects a recipe that matches the conditions in the production history information, the data matching control unit 215c acquires the start time and the end time of the recipe specified by the recipe specifying information, respectively. The data matching control unit 215c also acquires step information from the start time to the end time of the steps constituting the recipe. In this way, the data matching control unit 215c selects a recipe executed under the same conditions as the recipe in which the abnormality occurred.

<Data acquisition process (S130)>

Based on the acquired step information, the data matching control unit 215c reads from the storage unit 215h device data related to the recipe specifying information that is generated between the start time and the end time of the step. Specifically, the data matching control unit 215c stores the device data defined in FIG. 9 stored by the device status monitoring control unit 215e from the storage unit 215h for each of the recipe in which the abnormality occurred and the recipe detected by the search. configured to acquire. Acquiring data for each step is repeated until the recipe is finished.

A recent recipe has a large number of steps, and the number of steps may exceed 100, for example. In this case, the combination of the item type and this step of the device data shown in Fig. 9 is 500 x 100 = 50000, so it is difficult to find out which waveform is bad. Therefore, it is preferable to set in advance which step data is to be acquired according to the abnormality by condition input by the operator on the operation display unit 227 . Similarly, you can set Groups and Items in advance.

<Data matching process (S140)>

Next, the data matching control unit 215c compares the device data acquired at each step for each of the recipe in which the abnormality has occurred and the recipe detected by the search and the same condition as the recipe. Specifically, the data matching control unit 215c calculates the absolute value of the data difference of the device data for each unit time while matching the start time of the recipe based on the data time information related to the abnormal analysis information, and sets the absolute value to a preset threshold value. and each unit time to determine whether the device data match, and calculate a ratio (match rate) at which the device data coincides in a predetermined period within the step. In the present embodiment, the "matching rate" refers to the ratio of a period in which there is a difference of more than a certain level (eg, 3σ) after finding the standard deviation σ from the difference in data for each specific period. Also, in this embodiment, a specific period is a period for collecting device data. However, since the time from the start to the end of a step may be different even for a recipe with the same conditions, it is preferable that a predetermined period within the step can be set as the step time.

As shown in Fig. 11, waveform data (e.g., temperature) for every unit time (5 seconds in the example of Fig. 11) in two waveform data (e.g., the recipe in which the abnormality occurred and the device data read from each of the recipe executed before) Find the absolute value of the difference between , and the case where the absolute value of the difference is greater than or equal to the threshold (eg, 30) is called a dotted line (NG), and the case where it is less than the threshold is called the solid line (OK), and the number of data in a predetermined period (Fig. In the example of 11, with 10) as the denominator, the ratio of the number of solid lines OK, that is, the ratio of the number determined to match through comparison (the difference is less than the threshold value), is used as the matching ratio. In FIG. 11 , if the recipe in which the abnormality occurred is compared with line A and the recipe executed before the recipe is compared with line B, the matching rate in a predetermined period (here, 00:00:00 to 00:50:00) is 90%. .

The threshold value 30 is configured to be set in accordance with a condition input by an operator on the operation display unit 227 . In addition, FIG. 11 shows only a part of the recipe separated and displayed for explanation of the matching rate calculation.

In the present embodiment, the data matching control unit 215c is configured to include a calculation unit 326 that calculates an absolute value of a data difference between device data within a predetermined period and calculates a standard deviation from this absolute value. Specifically, the calculator 326 calculates the absolute value of the data difference of the device data for each unit time (eg, time such as 0.1 second or 1 second), and the ratio of device data matching and the data difference of device data in units of steps is configured to calculate the standard deviation of the absolute value of .

Also, the calculator 326 is configured to update the threshold using the calculated standard deviation. Further, the calculating unit 323 is configured to compare the absolute value of the data difference of the device data with the calculated threshold value to determine whether the device data matches.

The threshold in FIG. 11 is a fixed value by manual input. However, there are many types of process data, and a threshold value suitable for each type may be set in advance to automatically calculate the threshold value. Also, for example, an operator on the operation display unit 227 can set whether or not to automatically calculate the threshold value by inputting a condition.

Also, the waveform data of lines A and B in FIG. 12 are the same as in FIG. 11 . For example, as shown in Fig. 12, the standard deviation σ (10.25) is found from the absolute value of the data difference (difference data) of the waveform data to be compared. A method of finding the waveform data matching rate by considering the excess difference data as a non-match (NG) is shown. Thereby, since the threshold value is automatically set, the effort of manually inputting the threshold value can be omitted. However, this method can be used for waveform data where the difference in waveforms intersect, but it is not suitable for waveform data along parallel lines. Therefore, it is preferable to first use a threshold value by automatic calculation in which the threshold value is automatically set, and to switch to a threshold value by manual input that requires adjustment. In addition, the threshold value may be 2? (20.5), and it may be set so that the value of this threshold value may be changed according to a step. For example, you may configure so that the threshold value may be set to 3 sigma in the temperature increase step with large temperature fluctuation|variation, and the threshold value may be set to 2 sigma in the film-forming step in which temperature fluctuation|variation is comparatively stable.

When comparing the entire recipe, it is necessary to consider the delay of the steps. For example, when a delay occurs in the temperature raising step and the start of the subsequent steps is delayed, the erroneous judgment is made by comparing the shifted waveforms. Since the present embodiment has been improved to compare step by step, matching (matching) is possible regardless of the case in which the step end condition is not satisfied and the waiting (HOLD) is made.

In addition, the data matching process ( S140 ) may be configured to compare a recipe executed when an abnormality occurs with respect to device data of all categories and all items with recipes before and after it. In addition, if the type or item can be specified in response to the abnormality, the specific device data extracted for the specific type or specific item may be collated. For example, the specific device data is selected from the group consisting of temperature data, pressure data, gas flow rate data, heater power data, concentration data, and valve data.

<Data display process (S150)>

The data matching control section 215c is configured to display on the operation display section 227 in order from the calculated matching ratios for the device data of all categories and all items, from the device data with the smallest matching ratio. For example, 10 data having a bad matching rate (that is, 10 data in order of lower matching rate) are displayed in FIG. 13 for a recipe executed at the time of abnormal occurrence and a recipe executed before it. However, not according to this form, for example, the device data having the smallest matching rate may be displayed on the operation display unit 227 in order, for example, by group, by item, or by step. In this embodiment, "group" is a type of data such as temperature, pressure, and gas flow rate, and "item" is, for example, in the case of temperature data, measured temperature in U zone, measured temperature in CU zone, measured temperature in zone C, It is the same temperature data as the temperature measurement value of the CL zone and the temperature measurement value of the L zone. Also "gas flow" is, for example, the channel number of the MFC. In addition, the data matching control unit 215c may distinguish and display according to the matching rate. For example, the data matching controller 215c may display the matching rate in red for device data having a matching rate of less than 80%, and may display the matching rate in blue for device data having a matching rate of 80% or more. Also, in the present embodiment, 10 pieces of device data are displayed in the order of the bad matching rate, but the number is not limited thereto.

As described above, the data matching control unit 215c is configured to display on the operation display unit 227 in the order of device data having a small calculated matching rate, in other words, in the order of device data having a large data difference. As a result, it can be determined immediately which device data of which step caused the trouble, thereby contributing to reduction of trouble analysis time and reduction of analysis errors due to non-uniformity of skills of maintenance personnel.

Further, as shown in FIG. 19 , the result of the data matching step S140 may be configured to be displayed on the operation display unit 227 as a data detail confirmation screen. The data detail confirmation screen is configured to display the matching rate of the entire recipe (TOTAL) on the upper side. This is an average of the matching rates calculated from each of all categories and all items. In addition, it is preferable that the matching rate of the entire recipe is 80% or more.

In addition, the matching rate by type is displayed under the matching rate of the entire recipe (TOTAL). Further, as shown in Fig. 19, the data detail confirmation screen may be displayed for each type. In addition, when a recipe (Recipe) is selected on the history reference screen to be described later, FIG. 19 may be displayed as a data detail confirmation screen.

As shown in FIG. 19 , it is possible to suggest which type (type such as temperature and pressure) caused the abnormality on the detailed data confirmation screen. In addition, in this embodiment, it is configured to be displayed by changing the color for each item (item) having a matching rate of less than 50%.

In the present embodiment, the result of comparing two recipes, a recipe executed at the time of abnormal occurrence and a recipe executed before that through the data display step S150, is displayed, but the present embodiment is not limited to this form. For example, the result of calculating the matching rate by comparing the recipe executed at the time of abnormal occurrence and a plurality of recipes, respectively, may be displayed in time series. For example, you may make it display collectively the matching rate of the whole recipe (TOTAL), the matching rate of the whole specific step, and the matching rate in specific apparatus data. Accordingly, it is possible to check the history of changes in the matching rate until abnormality occurs.

According to the present embodiment described above, it has been described when a recipe having the same condition as the recipe in which the abnormality occurred in the file selection process S120 exists in the storage unit 215h, but as a result of the search, a recipe with the same condition is stored in the storage unit 215h The case where it does not exist in this is demonstrated below.

When the data matching control unit 215c searches the storage unit 215h of the device management controller 215 of the master device 1-M and detects a recipe with the same condition, a corresponding recipe file and a file related to the recipe file All are received from the master device 1-M, and are stored in the storage unit 215h of the device 1 in which the abnormality occurred. Since the subsequent steps are the same, they are omitted. Also, if there is no recipe with the same condition even when the storage unit 215h in the master device is searched, the storage unit 215h of the device management controller 215 of the other device 1 is searched. As a result, if a recipe with the same condition is not found, there is a clear misconfiguration and the parameter setting becomes abnormal.

According to this embodiment, there are one or more effects described below.

(a) The data matching control unit 215c according to the present embodiment extracts device data before and after abnormality occurs by referring to the abnormal analysis information, and displays the device data in the order of the lowest matching rate (the largest difference). is configured to be displayed in This makes it possible to efficiently analyze data even if a maintenance worker with low skill performs a large amount of time-consuming abnormal analysis, and downtime can be reduced when an abnormality occurs.

(b) The data matching control unit 215c according to the present embodiment is configured to extract the device data before and after the occurrence of the abnormality with reference to the abnormal analysis information, and display the device data on the screen in order of the greatest difference. This makes it possible to reduce the burden on the maintenance personnel who perform the abnormal analysis, and it also becomes possible to shorten the time required for the maintenance personnel to analyze the factors.

(c) The data matching control unit 215c according to the present embodiment is configured to extract the device data before and after the occurrence of the abnormality and display the device data on the screen in the order of the greatest difference. Thereby, even when there is an artificial error (for example, an error in inputting the set value of device data) by the maintenance personnel, it becomes possible to shorten the time taken to identify the abnormal factor. In particular, even when there is an erroneous setting, which is one of the factors causing the film formation abnormality, the time required for factor specification can be reduced.

(d) The data matching control unit 215c according to the present embodiment is configured to display on the screen a result of matching device data in time series from the time the recipe is executed in which the abnormality occurs. Thereby, by viewing the history of changes in the matching rate until the occurrence of abnormality, changes in device data can be confirmed over time, so that it is possible to shorten the time required for the maintenance personnel to analyze the abnormality factors.

<Another embodiment>

Next, a file (data) matching function (tool matching function) at the time of device setup by the data matching control unit 215c will be described with reference to FIGS. 14 to 19 . In the present embodiment, the only difference is that the object of file comparison is a file held by each of the repeat devices 1-1 to 1-6 and the master device 1-M, and the flow shown in FIG. 215c) executes the same.

In this embodiment, each of the data matching control units 215c of the repeat devices 1-1 to 1-6 communicates directly with the data matching control unit 215c of the master device 1-M, and the master device 1-M ), the method of acquiring the necessary device data from In the present embodiment, the data matching control unit 215c executes a program for realizing the tool matching function, so that the repeat devices 1-1 to 1-6 are not interposed through a management device or a HOST computer, which is a type of higher-level computer. ) can be compared with files already used and tracked by the master device 1-M.

14, as initial information in the main controller storage 222 of the repeating devices 1-1 to 1-6, for example, the repeating device 1-2, the name and This is done so that an IP address (Internet Protocol Address) can be set. The name and IP address of this master device 1-M are, for example, set by the operator from the operation display unit 227 of the repeat device 1-2, but are set by the operator from the master device 1-M to the repeat device 1-2 It may be configured to transmit to . The reason for using two pieces of information, an IP address and a name, for connection with the master device 1-M is that after a communication connection by IP address is established between the master device 1-M and the device name is collated. because it is structured. Thereby, erroneous connection due to a misconfiguration of the IP address can be prevented, and the worker can perform matching (data matching) work without being aware of the master device 1-M.

In the data matching control shown in Fig. 14, the data matching control section 215c of the device 1 including the repeating device 1-2 receives the recipe file from the main controller storage 222 of the master device 1-M. Alternatively, the parameter file is read and stored in the main controller storage 222 of the device 1, and collated (matched). In this embodiment, comparison and comparison between the recipe file of the master device 1-M and the recipe file of the device 1 is performed. In addition, the recipe file received from the master device 1-M may not be stored in the main controller storage unit 222, but may be stored in the storage unit 215h of the device 1 to perform file matching.

15 is a table defining performance evaluation waveforms. It is registered in advance in the master device 1-M, and up to 20 waveforms can be registered. This is because, after the first unit of the device 1, that is, the master device 1-M is delivered, the user acquires the optimal parameters while operating the device 1 and manages them as know-how. In order to match the performance of the apparatus 1 and the master apparatus 1-M at the time of the setup (granular) operation, the waveform data of the matching (matching) object related to the performance is defined in advance as shown in FIG. 15 . For example, specific waveform data, such as a temperature rise waveform up to 1200°C or a pressure reduction waveform up to 2 Pa, are targeted, and temperature waveform data of pipe heating that is not related to performance (not defined in FIG. 15) is not a matching object. By using the table shown in Fig. 15, it is possible to efficiently proceed with the setup operation.

16 shows an example of a history reference screen displayed when a button for referencing a history of data matching (tool matching) is pressed on a menu screen (not shown). 17 illustrates a data matching detailed confirmation screen displayed when the temperature Temp is selected.

As shown in FIG. 17 , information on the number of steps of 80% or more and less than 80% of all the number of steps (eg, 20) of the process recipe is displayed, and each item (U, CU, The matching rates for C, CL, L) are configured to be displayed. In addition, 84% of the matching rate described below shows the matching rate of the device data regarding the temperature (Temp) throughout the recipe. That is, it is the average value of the entire recipe of the matching rate calculated for each item on a step-by-step basis.

And at 80% or more and less than 80%, an identification mark is made, and it is easy to know which item has a lower matching rate at which step. Then, when the button (Trace) for displaying the raw waveform data is pressed, the raw waveform data shown in FIG. 18 is displayed.

18 shows raw waveform data of each item (U, CU, C, CL, L) of the process file of the master device 1-M and each item (U, CU, C, CL) of the process file of the device 1 , L) is configured to be displayed from a preset step.

As described above, for items with a poor matching rate, comparison in raw waveform data is also possible.

According to this embodiment, there are one or a plurality of effects described below.

(a) The data matching control unit 215c according to the present embodiment calculates a matching rate for each step of the process recipe, and matches each item of a plurality of types (temperature, gas, etc.) (eg, measured temperature in U zone, etc.) It is configured to easily extract device data with a small rate. As a result, only information about the performance of the device can be displayed, so that downtime during setup can be reduced.

(b) The data matching control unit 215c according to the present embodiment calculates the matching rate for each step of the process recipe, and matches each item of a plurality of types (temperature, gas, etc.) (eg, measured temperature in U zone, etc.) It is configured to easily extract device data with a small rate. Thereby, it is possible to reduce the burden on the operator who performs the setup operation, and it becomes possible to shorten the time required for the operator to perform the setup operation.

In addition, the substrate processing apparatus 1 in the embodiment of the present invention is applicable not only to a semiconductor manufacturing apparatus for manufacturing a semiconductor, but also to an apparatus for processing a glass substrate such as an LCD device. Moreover, it cannot be overemphasized that it is applicable also to various substrate processing apparatuses, such as an exposure apparatus, a lithographic apparatus, a coating apparatus, and the processing apparatus using plasma.

1: substrate processing unit 215: device management controller
215c: data matching control unit 215e: device status monitoring control unit
215h: storage unit 227: operation display unit

Claims (13)

a storage unit for storing device data generated when executing a recipe including a plurality of steps;
a selection unit for selecting a recipe executed under the same conditions as the recipe in which the abnormal phenomenon has occurred from the storage unit;
an acquisition unit configured to acquire the device data from each of the recipe in which the abnormal phenomenon has occurred and the recipe selected by the selection unit; and
A calculation unit for calculating a difference between the first device data obtained from the recipe in which the abnormal phenomenon occurred and the second device data obtained from the recipe selected by the selection unit
including,
wherein the calculating unit is configured to calculate an absolute value of a data difference between the first device data and the second device data for each unit time to calculate a ratio at which the first device data and the second device data match each step substrate processing equipment. According to claim 1,
and the calculation unit is configured to collate the first device data and the second device data, and display a result of the collation on a display device. According to claim 1,
The calculation unit,
A comparison unit that compares the absolute value with a preset threshold to determine whether the first device data and the second device data match
A substrate processing apparatus further comprising a. 4. The method of claim 3,
A calculation unit for calculating a standard deviation using an absolute value of a data difference between the first device data and the second device data within the step period
further comprising,
The calculation unit compares the absolute value with a threshold value calculated using the standard deviation to determine whether the first apparatus data and the second apparatus data match. According to claim 1,
The calculation unit acquires the data abnormality analysis related information from the storage unit, and matches the start time of the recipe selected by the selection unit with the recipe in which the abnormal phenomenon occurs based on the data time information related to the data abnormal analysis related information. and calculate a ratio at which the first apparatus data and the second apparatus data match within a time period. 6. The method of claim 5,
and the calculator is configured to calculate a matching rate based on a difference between the first device data and the second device data. 7. The method of claim 6,
Further comprising a display device for displaying the matching rate,
and the display device is configured to display a matching rate with a recipe in which the abnormal phenomenon occurs for each batch in which the recipe is executed. 7. The method of claim 6,
Further comprising a display device for displaying the matching rate,
and the display device is configured to display a matching rate with a recipe in which the abnormal phenomenon occurs with respect to specific device data among the device data. 9. The method of claim 8,
and the specific device data is selected from the group consisting of temperature data, pressure data, gas flow rate data, heater power data, concentration data, and valve data. According to claim 1,
When the operation unit selects from the storage unit a recipe executed under the same condition as the recipe in which the abnormal phenomenon occurs, and there is no recipe executed under the same condition in the storage unit, the recipe and the recipe in which the abnormal phenomenon occurs from an external device A substrate processing apparatus, configured to search for and receive recipes executed under the same conditions. a storage unit for storing device data generated when executing a recipe including a plurality of steps; and
a selection unit that selects, from the storage unit, a recipe executed under the same conditions as the recipe in which the abnormal phenomenon occurs, and an acquisition unit that acquires the device data from each of the recipe in which the abnormal phenomenon occurs and the recipe selected by the selection unit; and a calculator configured to calculate a difference between the first device data acquired from the recipe in which the abnormal phenomenon has occurred and the second device data acquired from the recipe selected by the selection unit, wherein the first device data and the second device are each unit time. a data control unit, configured to calculate an absolute value of a data difference of data to calculate a ratio at which the first device data and the second device data match each step
A device management controller comprising a. A device management controller comprising: a storage unit for storing device data generated when a recipe including a plurality of steps is executed;
a sequence of selecting, from the storage unit, a recipe executed under the same conditions as the recipe in which the abnormal phenomenon occurred;
an order of acquiring the device data from each of the recipe in which the abnormal phenomenon has occurred and the selected recipe; and
A procedure for calculating the difference between the first device data acquired from the recipe in which the abnormal phenomenon occurred and the second device data acquired from the selected recipe
As a computer program recorded on a recording medium for executing
In the order of calculating the difference between the first device data and the second device data,
an order of calculating an absolute value of a data difference between the first device data and the second device data for each unit time; and
A sequence of calculating the ratio at which the first device data and the second device data match each step
A computer program recorded on a recording medium comprising a. A method of manufacturing a semiconductor device comprising a substrate processing step of processing a substrate by executing a recipe including a plurality of steps, the method comprising:
In the substrate processing step, a step of storing device data generated when the recipe is executed in a storage unit;
selecting, from the storage unit, a recipe executed under the same conditions as the recipe in which the abnormal phenomenon occurred;
acquiring the device data from each of the recipe in which the abnormal phenomenon has occurred and the selected recipe; and
A step of calculating a difference between the first device data acquired from the recipe in which the abnormal phenomenon occurred and the second device data acquired from the selected recipe
including,
In the step of calculating the difference between the first device data and the second device data,
calculating an absolute value of a data difference between the first device data and the second device data for each unit time; and calculating a ratio at which the first device data and the second device data match each step.
A method of manufacturing a semiconductor device comprising a.

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