JP2020077881A - Substrate processing apparatus, apparatus management controller, method of manufacturing semiconductor device, and program - Google Patents

Abstract

To provide a configuration which can shorten the time required for analytical investigation of defects.SOLUTION: A substrate processing apparatus includes: a storage unit which stores apparatus data generated during the execution of a recipe having a plurality of steps for processing a substrate; and a data matching control unit which collates, with each other, the multiple pieces of apparatus data stored in the storage unit. The data matching control unit has: a selection unit for selecting, from the storage unit, a recipe executed under the same conditions as those of a recipe which has caused a defect; an acquisition unit for acquiring apparatus data from each of the recipe which has caused the defect and the recipe selected by the selection unit; and a calculation unit for calculating a rate at which at least pieces of apparatus data, among the acquired apparatus data, generated in the steps executed at the same timing match each other.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a substrate processing apparatus, an apparatus management controller, a semiconductor device manufacturing method, and a program.

In the field of semiconductor manufacturing, in order to improve the operation rate and production efficiency of the device, the device information is stored in a server, and the information is used to analyze the device trouble and monitor the condition of the device.

The conventional method of identifying the cause of trouble is inefficient and takes a very long time in an apparatus that retains a large amount of data during substrate processing, and since the amount of data is large, it requires the skill of maintenance personnel to perform trouble analysis. Depended. Further, in the conventional trouble analysis, the cause of the trouble may not be identified due to the lack of confirmation of important data. Therefore, in the trouble analysis, various measures are tried in order to quickly identify the cause of the abnormality and improve the operation rate of the device. Incidentally, the trouble means an abnormality such as an apparatus stop due to an abnormal film formation or an apparatus failure.

For example, in Patent Document 1, file comparisons of files used in a substrate processing apparatus connected to a management apparatus are collectively performed, and as a result of this file comparison, a difference is extracted and the difference is corrected. Is listed. Further, according to the description of Patent Document 2, file comparison between conventional recipes, for example, file comparison between process recipe A and process recipe B is described. Such a file comparison function has an advantage that data different between files can be easily extracted. Trouble analysis using this file comparison function is expected to contribute to the efficiency of identifying the cause of an abnormality.

International publication WO2014 / 189045 Patent No. 4587753

  An object of the present invention is to provide a configuration capable of shortening the time required to analyze and analyze an abnormality.

According to one aspect of the invention,
A storage unit for storing device data generated during the execution of the recipe to process a substrate having a plurality of steps, and data integrity controller for collating a plurality of the device data stored in the storage unit, respectively, the The data consistency control unit includes a selecting unit that selects a recipe executed under the same condition as the recipe in which the abnormality has occurred from the storage unit, and a recipe in which the abnormality has occurred and a recipe selected by the selecting unit. A configuration is provided that includes an acquisition unit that acquires the device data, and a calculation unit that calculates a ratio of the device data in the steps executed at least at the same timing among the acquired device data. ..

According to the above configuration, it is possible to shorten the time taken to analyze the abnormality of the device in which an abnormality has occurred, and to reduce the device stop time.

It is a perspective view showing a substrate processing device used suitably for one embodiment of the present invention. It is a side sectional view showing a substrate processing device suitably used for one embodiment of the present invention. It is a figure showing the functional composition of the control system used suitably for one embodiment of the present invention. It is a figure which shows the function structure of the main controller used suitably for one Embodiment of this invention. It is a figure showing composition of a substrate processing system used suitably for one embodiment of the present invention. It is a figure explaining the functional composition of the device management controller used suitably for one embodiment of the present invention. (a) It is a figure which shows the function structure of the apparatus state monitoring control part which concerns on one Embodiment of this invention. (b) It is a figure which shows the function structure of the data matching control part which concerns on one Embodiment of this invention. It is a figure explaining the apparatus data acquired by the apparatus state monitoring control part which concerns on one Embodiment of this invention. It is a figure explaining the apparatus data used as the file comparison object which concerns on one Embodiment of this invention. It is an example of illustration of a processing flow which a data matching control part concerning one embodiment of the present invention performs. It is an example of illustration for explaining a matching rate concerning one embodiment of the present invention. It is an illustration example for explaining a method of calculating a threshold value used for calculating a matching rate according to an embodiment of the present invention. It is an example of displaying the matching rate of the device data according to the embodiment of the present invention in ascending order. It is a figure for demonstrating the file comparison function which concerns on other embodiment of this invention. It is an example of illustration of a performance evaluation waveform table concerning other embodiments of the present invention. It is an example of illustration of a collation history screen concerning an example of the present invention. It is an example of illustration of a data detailed display screen concerning an example of the present invention. 6 is a display example of raw waveform data according to the embodiment of the present invention. It is a display example which shows the recipe comparison result which concerns on the Example of this invention.

(Outline of substrate processing equipment)
An embodiment of the present invention will be described below with reference to the drawings. First, referring to FIGS. 1 and 2, a substrate processing apparatus (hereinafter, also simply referred to as an apparatus) 1 in which the present invention is implemented will be described.

  The substrate processing apparatus 1 is provided with a housing 2, and an opening (front maintenance port) 4 is provided in a lower portion of a front wall 3 of the housing 2 so as to be maintainable. It is opened and closed by the door 5.

  A pod loading / unloading port 6 is opened on the front wall 3 of the housing 2 so as to communicate with the inside and outside of the housing 2. The pod loading / unloading opening 6 is opened and closed by a front shutter 7, and the front of the pod loading / unloading opening 6 is shown. A load port 8 is installed on the front side, and the load port 8 is configured to align a mounted pod 9.

  The pod 9 is a hermetically sealed substrate transfer container, and is loaded into the load port 8 and unloaded from the load port 8 by an in-process transfer device (not shown).

  A rotary pod shelf 11 is installed at an upper portion of the housing 2 in a substantially central portion in the front-rear direction, and the rotary pod shelf 11 is configured to store a plurality of pods 9. ..

  The rotary pod shelf 11 is provided with a column 12 vertically erected and intermittently rotated, and a plurality of stages of shelf plates 13 radially supported on the column 12 at upper, middle and lower positions, respectively. The shelf board 13 is configured to store a plurality of the pods 9 mounted thereon.

  A pod opener 14 is provided below the rotary pod shelf 11, and the pod opener 14 has a structure in which the pod 9 is placed and the lid of the pod 9 can be opened and closed.

  A pod transfer mechanism 15 is installed between the load port 8 and the rotary pod shelf 11 and the pod opener 14. The pod transfer mechanism 15 holds the pod 9 and can move up and down, and can move back and forth in the horizontal direction. And is configured to convey the pod 9 between the load port 8, the rotary pod shelf 11, and the pod opener 14.

  A sub-casing 16 is provided across the rear end of the sub-casing 16 in the lower portion of the housing 2 in the approximate center of the front-rear direction. A pair of wafer loading / unloading ports 19 for loading / unloading a wafer (hereinafter, also referred to as a substrate) 18 to / from the sub-casing 16 is arranged on the front wall 17 of the sub-casing 16 vertically in two stages. The pod openers 14 are provided for the upper and lower wafer loading / unloading ports 19, respectively.

  The pod opener 14 includes a mounting table 21 on which the pod 9 is mounted and an opening / closing mechanism 22 that opens and closes the lid of the pod 9. The pod opener 14 is configured to open / close the wafer entrance / exit of the pod 9 by opening / closing the lid of the pod 9 placed on the placing table 21 by the opening / closing mechanism 22.

  The sub-casing 16 forms a transfer chamber 23 that is airtight from the space (pod transfer space) in which the pod transfer mechanism 15 and the rotary pod shelf 11 are arranged. A wafer transfer mechanism (substrate transfer mechanism) 24 is installed in the front area of the transfer chamber 23, and the substrate transfer mechanism 24 has a required number (five in the figure) for mounting the substrates 18. A wafer mounting plate 25 is provided, and the wafer mounting plate 25 can be moved directly in the horizontal direction, can be rotated in the horizontal direction, and can be moved up and down. The substrate transfer mechanism 24 is configured to load and unload the substrate 18 with respect to the boat (substrate holder) 26.

  In the rear area of the transfer chamber 23, a standby unit 27 for accommodating the boat 26 and holding it in a standby state is configured, and above the standby unit 27, a vertical processing furnace 28 is provided. The processing furnace 28 has a processing chamber 29 formed therein, and a lower end portion of the processing chamber 29 is a furnace opening portion, and the furnace opening portion is opened and closed by a furnace opening shutter 31.

  A boat elevator 32 as an elevating mechanism for elevating the boat 26 is installed between the right end of the housing 2 and the right end of the standby portion 27 of the sub-housing 16. A seal cap 34 as a lid is horizontally attached to an arm 33 connected to a lift of the boat elevator 32. The lid 34 vertically supports the boat 26, and the boat 26 is supported by the treatment chamber 29. It is possible to hermetically close the furnace opening while it is charged into the furnace.

  The boat 26 is configured to hold a plurality of (for example, about 50 to 125) substrates 18 in the center thereof and hold them in a horizontal posture in multiple stages.

  A clean unit 35 is arranged at a position facing the boat elevator 32 side, and the clean unit 35 is composed of a supply fan and a dust filter so as to supply a clean atmosphere or a clean air 36 which is an inert gas. There is. Between the substrate transfer mechanism 24 and the clean unit 35, a notch aligning device (not shown) as a substrate aligning device for aligning the circumferential position of the substrate 18 is installed.

  The clean air 36 blown out from the clean unit 35 is circulated through a notch alignment device (not shown), the substrate transfer mechanism 24, and the boat 26, and then sucked by a duct (not shown) and exhausted to the outside of the housing 2. Or is blown out into the transfer chamber 23 by the clean unit 35.

  Next, the operation of the substrate processing apparatus 1 will be described.

  When the pod 9 is supplied to the load port 8, the pod loading / unloading port 6 is opened by the front shutter 7. The pod 9 on the load port 8 is carried into the inside of the housing 2 by the pod carrying device 15 through the pod carry-in / carry-out port 6 and placed on the designated shelf plate 13 of the rotary pod shelf 11. The pod 9 is temporarily stored in the rotary pod shelf 11 and then transferred from the shelf 13 to one of the pod openers 14 by the pod transfer device 15 and transferred to the mounting table 21 or to the load port. 8 is directly transferred to the mounting table 21.

  At this time, the wafer loading / unloading port 19 is closed by the opening / closing mechanism 22, and the transfer chamber 23 is filled with clean air 36. Since the transfer chamber 23 is filled with nitrogen gas as clean air 36, the oxygen concentration in the transfer chamber 23 is lower than the oxygen concentration inside the housing 2.

  The opening-side end surface of the pod 9 mounted on the mounting table 21 is pressed against the opening edge portion of the wafer loading / unloading port 19 in the front wall 17 of the sub-casing 16, and the lid is removed by the opening / closing mechanism 22. , The wafer entrance / exit is opened.

  When the pod 9 is opened by the pod opener 14, the substrate 18 is taken out of the pod 9 by the substrate transfer mechanism 24 and transferred to a notch aligning device (not shown), and the substrate 18 is aligned by the notch aligning device. After that, the substrate transfer mechanism 24 carries the substrate 18 into the standby unit 27 behind the transfer chamber 23, and loads (charges) the boat 26.

  The substrate transfer mechanism 24 that has transferred the substrate 18 to the boat 26 returns to the pod 9 and loads the next substrate 18 into the boat 26.

  While the substrate 18 is being loaded into the boat 26 by the substrate transfer mechanism 24 in one (upper or lower) pod opener 14, the other (lower or upper) pod opener 14 is separated from the rotary pod shelf 11. The pod 9 is transferred by the pod transfer device 15 and transferred, and the opening work of the pod 9 by the other pod opener 14 is simultaneously advanced.

  When a predetermined number of substrates 18 are loaded in the boat 26, the furnace opening of the processing furnace 28, which was closed by the furnace opening shutter 31, is opened by the furnace opening shutter 31. Then, the boat 26 is lifted by the boat elevator 32 and loaded into the processing chamber 29.

  After loading, the furnace opening is hermetically closed by the seal cap 34. Note that the present embodiment has a purge step (pre-purge step) in which the processing chamber 29 is replaced with an inert gas at this timing (after loading).

  The processing chamber 29 is evacuated to a desired pressure (vacuum degree) by a gas exhaust mechanism (not shown). Further, the processing chamber 29 is heated to a predetermined temperature by a heater driving unit (not shown) so that the temperature distribution in the processing chamber 29 becomes a desired temperature distribution.

  Further, a processing gas controlled to a predetermined flow rate is supplied by a gas supply mechanism (not shown), and the processing gas comes into contact with the surface of the substrate 18 in the process of flowing through the processing chamber 29, so that the surface of the substrate 18 is contacted. Then, a predetermined process is performed. Further, the processing gas after the reaction is exhausted from the processing chamber 29 by the gas exhaust mechanism.

  When a preset processing time elapses, an inert gas is supplied from an inert gas supply source (not shown) by the gas supply mechanism, the processing chamber 29 is replaced with the inert gas, and the pressure of the processing chamber 29 is changed. Is returned to normal pressure (afterpurge step). Then, the boat 26 is lowered by the boat elevator 32 via the seal cap 34.

  Regarding the carry-out of the substrate 18 after the processing, the substrate 18 and the pod 9 are discharged to the outside of the housing 2 in the reverse order of the above description. The untreated substrate 18 is further loaded into the boat 26, and the treatment of the substrate 18 is repeated.

(Functional configuration of control system 200)
Next, with reference to FIG. 3, a functional configuration of the control system 200 centering on the main controller 201 as an operation unit will be described. As shown in FIG. 3, the control system 200 includes a main controller 201, a transport system controller 211 as a transport control unit, a process system controller 212 as a processing control unit, and a device management controller 215 as a data monitoring unit. Is equipped with. The device management controller 215 functions as a data collection controller, collects device data inside and outside the device 1, and monitors the soundness of the device data inside the device 1. In this embodiment, the control system 200 is housed in the device 1.

  Here, the apparatus data means data relating to substrate processing such as processing temperature, processing pressure, and flow rate of processing gas when the apparatus 1 processes the substrate 18 (hereinafter, also referred to as control parameters), and quality of manufactured product substrate ( For example, data relating to the film thickness formed and the cumulative value of the film thickness), data relating to the components of the apparatus 1 (quartz reaction tube, heater, valve, MFC, etc.) (for example, set values, measured values), etc. , Data generated by operating each component when the substrate processing apparatus 1 processes the substrate 18.

The data collected during the execution of the recipe may be referred to as process data. For example, the apparatus data also includes process data such as raw waveform data as a specific interval (for example, 1 second) data from the start to the end of the recipe and statistic data of each step in the recipe. The statistic data includes maximum value, minimum value, average value and the like. Further, the device data also includes event data (for example, data indicating maintenance history) indicating various device events when the recipe is not executed (for example, when the substrate is not loaded into the device and idle).

  The main controller 201 is electrically connected to the carrier system controller 211 and the process system controller 212 by a LAN line such as 100BASE-T, so that transmission / reception of each device data and download / upload of each file are possible. It is composed.

  The operation unit 201 is provided with a port as a mounting unit into which a recording medium (for example, a USB key or the like) as an external storage device is inserted and removed. The OS corresponding to this port is installed in the operation unit 201. A host computer is connected to the operation unit 201 via, for example, a communication network. Therefore, even if the substrate processing apparatus 1 is installed in a clean room, the host computer can be installed in an office or the like outside the clean room.

  The device management controller 215 is connected to the operation unit 201 via a LAN line, and is configured to collect device data from the operation unit 201, quantify the operating state of the device, and display it on the screen. The device management controller 215 will be described in detail later.

  The transport system controller 211 is connected to a substrate transport system 211A mainly composed of a rotary pod shelf 11, a boat elevator 32, a pod transport device 15, a substrate transfer mechanism 24, a boat 26 and a rotation mechanism (not shown). ing. The transfer system controller 211 is configured to control the transfer operation of each of the rotary pod rack 11, the boat elevator 32, the pod transfer device 15, the substrate transfer mechanism 24, the boat 26, and the rotation mechanism (not shown). .. In particular, the transport system controller 211 is configured to control the transport operations of the boat elevator 32, the pod transport device 15, and the substrate transfer mechanism 24 via the motion controller 211a.

  The process system controller 212 includes a temperature controller 212a, a pressure controller 212b, a gas flow rate controller 212c, and a sequencer 212d. The temperature controller 212a, the pressure controller 212b, the gas flow rate controller 212c, and the sequencer 212d form a sub-controller and are electrically connected to the process system controller 212. Therefore, each device data transmission / reception and each file download / upload are performed. Etc. are possible. Although the process system controller 212 and the sub-controller are shown as separate bodies, they may be integrated.

  A heating mechanism 212A mainly including a heater and a temperature sensor is connected to the temperature controller 212a. The temperature controller 212a is configured to adjust the temperature inside the processing furnace 28 by controlling the temperature of the heater of the processing furnace 28. The temperature controller 212a is configured to perform switching (on / off) control of the thyristor and control electric power supplied to the heater wire.

  A gas exhaust mechanism 212B mainly including a pressure sensor, an APC valve as a pressure valve, and a vacuum pump is connected to the pressure controller 212b. The pressure controller 212b switches the opening degree of the APC valve and the vacuum pump (ON / OFF) based on the pressure value detected by the pressure sensor so that the pressure in the processing chamber 29 becomes a desired pressure at a desired timing. Is configured to control.

  The gas flow rate controller 212c is configured by MFC. The sequencer 212d is configured to control supply and stop of gas from the processing gas supply pipe and the purge gas supply pipe by opening and closing the valve 212D. Further, the process system controller 212 is configured to control the MFC 212c and the valve 212D so that the flow rate of the gas supplied into the processing chamber 29 becomes a desired flow rate at a desired timing.

  The main controller 201, the transfer system controller 211, the process system controller 212, and the apparatus management controller 215 according to this embodiment can be realized by using a normal computer system instead of a dedicated system. For example, by installing the program in a general-purpose computer from a recording medium (USB key or the like) that stores the program for executing the above-described processing, each controller that executes the predetermined processing can be configured.

  And the means for supplying these programs is arbitrary. In addition to being able to be supplied via a predetermined recording medium as described above, it may be supplied via a communication line, a communication network, a communication system, or the like. In this case, for example, the program may be posted on a bulletin board of a communication network, and this program may be provided by being superimposed on a carrier wave via the network. Then, by activating the program thus provided and executing it under the control of the OS in the same manner as other application programs, it is possible to execute a predetermined process.

(Configuration of main controller 201)
Next, the configuration of the main controller 201 will be described with reference to FIG.

  The main controller 201 includes an operation display unit 227 including a main controller control unit 220, a hard disk 222 as a main controller storage unit, a display unit that displays various types of information, and an input unit that receives various instructions from an operator, the device 1. It is configured to include a transmission / reception module 228 as a main control communication unit that communicates with inside and outside. In addition to the device operator, the operator includes a device manager, a device engineer, a maintenance worker, and a worker. The main controller control unit 220 includes a CPU (central processing unit) 224 as a processing unit and a memory (RAM, ROM, etc.) 226 as a temporary storage unit, and is configured as a computer having a clock function (not shown). ing.

  On the hard disk 222, recipe files such as recipes in which substrate processing conditions and processing procedures are defined, control program files for executing these recipe files, parameter files in which parameters for executing recipes are defined, In addition to the error processing program file and the error processing parameter file, various screen files including an input screen for inputting process parameters, various icon files, etc. (none of which are shown) are stored.

  Further, on the operation screen of the operation display unit 227, an input for inputting an operation instruction to the substrate transfer system 211A and the substrate processing system (the heating mechanism 212A, the gas exhaust mechanism 212B, and the gas supply system 212C) shown in FIG. It is also possible to provide each operation button as a part.

  The operation display unit 227 is configured to display an operation screen for operating the device 1. The operation display unit 227 displays information based on the device data generated in the substrate processing apparatus 100 on the operation screen via the operation screen. The operation screen of the operation display unit 227 is, for example, a touch panel using liquid crystal. The operation display unit 227 receives the operator's input data (input instruction) from the operation screen and transmits the input data to the main controller 201. In addition, the operation display unit 227 executes a recipe developed in the memory (RAM) 226 or the like, or an arbitrary substrate processing recipe (hereinafter also referred to as a process recipe) among a plurality of recipes stored in the main controller storage unit 222. The instruction (control instruction) to be performed is received and transmitted to the main controller control unit 220.

  In the present embodiment, when the device management controller 215 starts up, various programs are executed to expand each stored screen file and data table, and the device data is read so that the operating state of the device can be improved. Each screen shown is configured to be displayed on the operation display unit 227.

  A switching hub or the like is connected to the main controller communication unit 228 so that the main controller 201 transmits and receives data to and from an external computer or another controller in the device 1 via a network. It is configured.

  The main controller 201 also transmits device data such as the state of the device 1 to an external host computer, such as a host computer, via a network (not shown). The substrate processing operation of the apparatus 1 is controlled by the control system 200 based on each recipe file, each parameter file, and the like stored in the main controller storage unit 222.

(Substrate processing method)
Next, a substrate processing method having a predetermined processing step, which is performed by using the apparatus 1 according to the present embodiment, will be described. Here, the case where the predetermined processing step is a substrate processing step (here, a film forming step), which is one of the steps of manufacturing a semiconductor device, is taken as an example.

  In performing the substrate processing step, a substrate processing recipe (process recipe) corresponding to the substrate processing to be performed is expanded in a memory such as a RAM in the process system controller 212. Then, if necessary, an operation instruction is given from the main controller 201 to the process system controller 212 and the transfer system controller 211. The substrate processing process carried out in this manner has at least a carrying-in process, a film-forming process, and a carrying-out process.

(Transfer process)
The main controller 201 issues a drive instruction for the substrate transfer mechanism 24 to the transport system controller 211. Then, the substrate transfer mechanism 24 starts the transfer process of the substrate 18 from the pod 9 on the transfer stage 21 as a mounting table to the boat 26 while following the instruction from the transport system controller 211. This transfer process is performed until all scheduled loading of the substrates 18 into the boat 26 (wafer charging) is completed.

(Loading process)
When a predetermined number of substrates 18 are loaded in the boat 26, the boat 26 is lifted by the boat elevator 32 that operates according to an instruction from the transfer system controller 211 and is loaded into the processing chamber 29 formed in the processing furnace 28. (Boat load). When the boat 26 is completely loaded, the seal cap 34 of the boat elevator 32 hermetically closes the lower end of the manifold of the processing furnace 28.

(Film forming process)
Next, the inside of the processing chamber 29 is evacuated by a vacuum evacuation device so as to have a predetermined film forming pressure (vacuum degree), according to an instruction from the pressure control unit 212b. Further, the inside of the processing chamber 29 is heated by the heater so as to reach a predetermined temperature while following the instruction from the temperature control unit 212a. Then, the rotation of the boat 26 and the substrate 18 is started by the rotation mechanism while following the instruction from the transport system controller 211. Then, while maintaining a predetermined pressure and a predetermined temperature, a predetermined gas (processing gas) is supplied to the plurality of substrates 18 held in the boat 26 to perform a predetermined processing (for example, film formation) on the substrates 18. Processing) is performed. The temperature may be lowered from the processing temperature (predetermined temperature) before the next carrying-out step.

(Unloading process)
When the film forming process for the substrate 18 placed on the boat 26 is completed, the rotation of the boat 26 and the substrate 18 by the rotation mechanism is stopped while following the instruction from the transport system controller 211, and the boat elevator 32 seals the seal cap 34. Is lowered to open the lower end of the manifold, and the boat 26 holding the processed substrate 18 is carried out of the processing furnace 28 (boat unloading).

(Collection process)
Then, the boat 26 holding the processed substrate 18 is cooled very effectively by the clean air 36 blown from the clean unit 35. Then, when cooled to, for example, 150 ° C. or lower, the processed substrate 18 is removed from the boat 26 (wafer discharging) and transferred to the pod 9, and then a new unprocessed substrate 18 is transferred to the boat 26. Is done.

(Structure of substrate processing system)
FIG. 5 is a diagram showing the configuration of the substrate processing system used in this embodiment. In this substrate processing system, the master device and the repeat devices 1 (1) to 1 (6) are connected by a network. In the example of FIG. 5, the repeat device 1 is six devices 1 (1) to 1 (6), but the number is not limited to six.

  The master device is the device 1 having standard device data. The master device has the same hardware configuration as the substrate processing apparatus 1, and also has a device management controller 215. The master device is, for example, the first device of the device 1 adjusted so that the device data is appropriate. Here, the first machine is the apparatus 1 first delivered to the customer factory, and the repeat apparatus is, for example, the apparatus 1 delivered to the second or subsequent customer factory after the first machine. Yes, a copy of various information that the master device has is received from the master device via the network and stored in the storage unit of each repeat device.

  As described above, in this embodiment, the device management controller 215 is installed in each device 1. Further, by connecting the master devices and the device management controllers 215 respectively installed in the repeat devices 1 with a network, each repeat device 1 can share various information of the master device. Specifically, each repeat device 1 copies a file of the master device, and compares and collates with the file of the master device (tool matching described later). Further, by using the network, it is not necessary to use a recording medium for copying the device data, and the maintenance staff of the device manufacturer can easily perform file editing work without moving to the front of the device 1 installed in the clean room. There is.

(Functional configuration of the device management controller 215)
The device management controller 215 as a health check controller for checking the health condition of the device 1 shown in FIG. 6 includes information related to various health conditions of the device 1 (for example, the matching condition with the master device, the device 1 at the time of shipment, Is it possible to continue the normal operation of the device 1 while quantifying the amount of change over time in the device data from the time of startup, the deterioration state of the components that make up the device 1, the failure information occurrence state of the device 1, etc.) It is a controller having a configuration for monitoring. Here, the start-up time is the time when the apparatus 1 is activated (powered on) for the first time after being delivered to the customer factory.

  As illustrated in FIG. 6, the device management controller 215 includes a data matching control unit 215c, a device state monitoring control unit 215e, a communication unit 215g that transmits and receives device data to and from the main controller 201, and a storage unit that stores various data. 215h. Specifically, the device management controller 215 is a device state monitoring control unit 215e that monitors the soundness of the device data obtained from the operating states of the constituent components of the device, and the validity of the facility data supplied from the factory facility. And a data matching control unit 215c that determines whether the device 1 based on the device status monitoring result data acquired by the device status monitoring control unit 215e and the validity determination result data determined by the data matching control unit 215c. Is configured to derive information that evaluates the operational status of the.

Then, the device management controller 215 monitors the health condition based on the numerical value obtained by quantifying the information on the evaluation of the operation condition of the device 1, and issues an alarm when the health condition deteriorates (alarm sound or display). Etc.). Further, the device management controller 215 is configured so that a function useful for stable operation of the device 1 (for example, data matching, device status monitoring, etc.) can be operated on the operation display unit 227 of the device 1.

  The device management controller 215 has, for example, a CPU and a memory that stores an operation program of the device management controller 215 as a hardware configuration, and the CPU operates according to the operation program. In the present embodiment, the device management controller 215 executes the operation program to store the device data generated during the execution of the recipe for processing the substrate in the storage unit 215h, and the device status monitoring control unit 215e. Is configured to at least be realized with the data matching control unit 215c configured to collate the device data acquired from the recipes before and after the abnormality has occurred based on the data indicating that the error has occurred.

The storage unit 215h stores abnormality analysis information, which will be described later, used by the data matching control unit 215c, and device data (standard data, which will be described later) acquired from the master device, which will be described later, used by the device state monitoring control unit 215e. And various programs such as a data matching program, a device status monitoring program, and a waveform matching program, which will be described later, are stored in at least the storage unit 215h. Note that the main control storage unit 222 and the temporary storage unit 226 may be used instead of the storage unit 215h. Then, each control unit 215 (215c, 215e, 215g) executes the screen display program to process the device data into data for screen display, create screen display data, and display it on the operation display unit 227. Control to display.

(Data matching control unit 215c)
The data matching control unit 215c executes a data matching program to copy or compare the file of the device 1 received from the main controller 201 with the file of the master device 1 (0), which will be described later. Perform a function. In the present embodiment, the data matching control unit 215c is configured to use this tool matching function to compare process recipes before and after an abnormality occurs. As a result, the data matching control unit 215c is configured to compare the waveform data of each device data before and after the occurrence of the abnormality and to display the waveforms on the operation display unit 227 in the descending order of the difference in the waveform data.

  Next, as illustrated in FIG. 7B, the data matching control unit 215c selects the recipe executed from the storage unit 215h under the same conditions as the recipe in which the abnormality has occurred, and the recipe in which the abnormality has occurred. And a calculation unit 323 that calculates device data from each of the recipes selected by the selection unit 321 and a calculation unit 323 that calculates the difference between the acquired device data. In the present embodiment, the data matching control unit 215c. Is configured to collate the device data acquired from the recipes before and after the abnormality has occurred based on the data indicating that the abnormality has occurred.

  Further, as shown in FIG. 7B, the calculation unit 323 calculates the absolute value of the data difference between the device data and the calculation unit 324 that calculates the ratio of the matching of the device data. It is configured to have a comparison unit 325 that compares the generated threshold values and determines whether the device data match, and a calculation unit 326 that calculates the standard deviation from the absolute value.

(Device state monitoring control unit 215e)
The device status monitoring controller 215e has a device status monitoring program and executes a device status monitoring function. The device state monitoring control unit 215e receives the device data of the device 1 from the main controller 201, updates and stores the device data stored in the storage unit 215h, and at the same time, the standard data obtained from the master device, that is, The device data of the device 1 is monitored based on standard data to be targeted by the device 1 (for example, time-dependent waveform of reaction chamber temperature, upper limit value, lower limit value, etc.). That is, the device data of the device 1 is monitored by comparing it with the standard data.

    In the present embodiment, the device management controller 215 is provided separately from the main controller 201 having the substrate processing function and the upper report function, but the present invention is not limited to this. For example, the main controller 201 collects device data from the device state monitoring data (device state monitoring data), device performance evaluation data (evaluation item waveform data), abnormality analysis data (abnormality analysis data), alarm monitoring. It goes without saying that various data such as data (fault information data) regarding the above may be generated.

(Device status monitoring function)
Next, the device state monitoring function in this embodiment, that is, the device state monitoring program executed by the device state monitoring control unit 215e will be described with reference to FIG. The device status monitoring program is stored in the memory of the device management controller 215 (for example, the storage unit 215h), and implements the device status monitoring control unit 215e.

  As shown in FIG. 7A, the device state monitoring control unit 215e includes a setting unit 311, a band generation unit 312, an FDC (Fault Detection & Classification) monitoring unit 313, a count display unit 314, and a diagnosis unit 315.

  The setting unit 311 instructs the band generation unit 312, the FDC monitoring unit 313, and the diagnosis unit 315 to set the band management designated by the input from the operation display unit 227 (input of operation command, etc.).

  The band generation unit 312 generates a band based on the standard data set by the setting unit 311 and the upper limit specified value and the lower limit specified value. Here, the band refers to a range defined by giving a width to a waveform based on standard data (here, device data of a master device). Specifically, it refers to a range determined by designating an upper limit value, a lower limit value, or an upper limit value and a lower limit value based on the value of each data point forming standard data.

  The FDC monitoring unit 313 includes a comparing unit 313a for comparing the band generated by the band generating unit 312 with device data generated from the device 1 every moment, a counting unit 313b for counting the number of times the device data is out of the band, and When the device data is out of the band a predetermined number of times or more, the determination unit 313c determines that there is an abnormality. Further, when an abnormality is detected, for example, the fact that the abnormality is detected is displayed on the operation display unit 227. In this way, the FDC monitoring unit 313 monitors the device data by comparing the device data received from the main controller 201 with the band generated for the master data that is the criterion for the device data. Note that the band generation unit 312 described above may be included in the FDC monitoring unit 313.

  The count display unit 314 is configured to display, on the operation display unit 227, the number of outliers for each batch process regarding the outliers counted by the FDC monitoring unit 313. Here, the band and the device data are compared, and the data point deviating from the band is called a deviating point.

  The diagnosis unit 315 uses the abnormality diagnosis rule to diagnose the statistical amount data of the device data including the number of outliers. Further, when the abnormality is diagnosed, for example, the operation display unit 227 is configured to display that the abnormality is detected.

  Although the device data collected by the device status monitoring control unit 215e is stored in the storage unit 215h, the device data is not limited to this form and may be stored in the main control storage unit 222.

  As shown in FIG. 8, the device state monitoring control unit 215e stores the device data from the start to the end of the process recipe in the storage unit 215h at a specific interval by executing the above-described device state monitoring program. The statistic amount data is configured to calculate a statistic amount (for example, the maximum value of the device data, the minimum value of the device data, the average value of the device data) of the section at the end of the step, and store the statistic amount data in the storage unit 215h. Further, it is configured to accumulate event data including maintenance information while the process recipe is not being executed. Further, the apparatus state monitoring control unit 215e includes, as the raw waveform data, a heating temperature waveform and a depressurizing waveform as well as a heating temperature waveform of a supply pipe and an exhaust pipe (a possibility that a cold spot occurs and a by-product is deposited). It is configured to store the device data in the storage unit 215h.

As shown in FIG. 9, for the device 1 that has a large amount of device data (500 or more types) in recent years, data analysis at the time of occurrence of an abnormality takes a very long time. Also, since the amount of data is large, it takes time to miss important device data and identify the cause of the abnormality, depending on the skill of the maintenance staff who analyzes the data. Further, it is difficult to confirm the change over time only by visually comparing the raw waveform data, and the gradually changed data also appears as a difference, which makes it difficult to identify the cause of the abnormality. As a result, the downtime increases and the operating rate of the device decreases.

(Analysis support processing)
Next, a processing flow of analysis support using the data matching function (tool matching function) executed by the data matching control unit 215c will be described mainly using FIG.

(Data receiving step (S110))
First, when the data matching control unit 215c receives the abnormality analysis information from the operation unit 201 via the communication unit 215g, the data matching control unit 215c activates the waveform matching program. Then, the data matching control unit 215c acquires device data from each of the selection unit 321 that selects a recipe executed under the same condition as the recipe in which the abnormality has occurred, and the recipe in which the abnormality has occurred and the recipe selected by the selection unit. It is configured to realize at least an acquisition unit 322 and a calculation unit 323 that calculates a difference between the acquired device data.

Here, in the abnormality analysis information, at least information for identifying the abnormality and recipe specifying information for identifying the recipe executed by the apparatus 1 in which the abnormality has occurred are defined. Further, the data matching control unit 215c may be configured to receive the abnormality analysis information via the communication unit 215g according to the condition input by the operator on the operation display unit 227. Further, the abnormality analysis information may be configured such that at least one or more of a group consisting of a threshold, a step, a group (Group), and an item described later can be set by a condition input by the operator on the operation display unit 227. .

(File selection process (S120))
Then, the data matching control unit 215c acquires the recipe specifying information based on the received abnormality analysis information. The data matching control unit 215c refers to the production history information in the device data in the storage unit 215h, and searches for the presence or absence of a recipe having the same condition as the acquired recipe specifying information. The search by the data matching control unit 215c is performed, for example, by tracing back a plurality of recipes recorded in the production history information from the recipe in which the abnormality has occurred toward the past recipe. When the data matching control unit 215c detects a recipe with matching conditions from the production history information, it acquires the start time and end time of the recipe specified by the recipe specifying information. Also, the step information from the start time to the end time of the steps constituting the recipe is acquired. In this way, the data matching control unit 215c selects the recipe executed under the same conditions as the recipe in which the abnormality has occurred.

(Data acquisition step (S130))
Then, the data matching control unit 215c reads, from the storage unit 215h, the device data that occurs between the start time and the end time of the step based on the acquired step information and is associated with the recipe specifying information. Specifically, the data matching control unit 215c stores the device data defined in FIG. 9 stored in the storage unit 215h by the device state monitoring control unit 215e for each of the recipe in which the abnormality has occurred and the recipe detected by the search. Is configured to get. Data acquisition for each step is repeated until the recipe is completed.

  Here, recent recipes have many steps and may exceed 100. In this case, the combination of the item type of the device data shown in FIG. 9 and this step is 500 × 100 = 50000, and it is difficult to find out which waveform is bad and which waveform is bad. Therefore, it is preferable to set in advance which step of data is to be acquired according to the abnormality by the condition input by the operator on the operation display unit 227. Similarly, Group and item may be set in advance.

(Data matching step (S140))
Next, the data matching control unit 215c compares the device data acquired for each step with respect to each of the recipe in which the abnormality has occurred and the recipe having the same condition as the recipe detected by the search. Specifically, the data matching control unit 215c calculates the absolute value of the data difference of the device data for each unit time while aligning the start times of the recipes based on the data time information associated with the abnormality analysis information, The absolute value is compared with a preset threshold for each unit time, it is determined whether the device data match, and the ratio (matching rate) of matching the device data in a certain period within the step is calculated. Has been done. Here, the matching rate means a rate of a period in which a standard deviation σ is obtained from a difference for each specific period and a difference of a certain value or more (for example, 3σ) is present. In the present embodiment, the specific period is a period for collecting device data. However, the step time may differ from the start to the end even if the recipe has the same condition. Therefore, it is preferable that a certain period within the step can be set.

  As shown in FIG. 11, two waveform data (for example, device data read from a recipe in which an abnormality has occurred and a recipe executed before that) are used for every unit time (here, 5 s) to obtain waveform data (for example, temperature data). ), The absolute value of the difference is calculated as a dotted line (NG) when the absolute value of the difference is equal to or more than a threshold value (eg, 30), and a total line (here, 10) of the difference data for each unit time is used as a denominator and a solid line The ratio of the number of (OK), that is, the ratio of the number determined to be coincident by comparison (the difference is less than the threshold value) is set as the matching rate. In FIG. 11, comparing the recipe in which the abnormality has occurred with line A and the recipe executed before the recipe as line B, matching in a predetermined period (here, 00:00 to 00:50:00) is performed. The rate is 90%.

Then, the threshold value (30) is configured to be set by the condition input by the operator on the operation display unit 227. It should be noted that FIG. 11 merely shows a part of the recipe cut and displayed for the purpose of explaining the matching rate calculation.

In the present embodiment, the data matching control unit 215c is configured to include a calculation unit 326 that calculates an absolute value of a data difference between device data within a predetermined period and calculates a standard deviation from this absolute value. Specifically, the calculation unit calculates the absolute value of the data difference of the device data for each unit time (for example, 0.1 s, 1 s, etc.), and in step units, the ratio of matching device data and the device data It is configured to calculate the standard deviation of the absolute values of the data differences.

Further, the calculation unit 326 is configured to update the threshold value using the standard deviation. Further, the calculation unit 323 is configured to compare the absolute value of the data difference of the device data with the calculated threshold value and determine whether the device data match.

The threshold in FIG. 11 is a fixed value manually input. However, there are many types of process data, and thresholds suitable for each type are set in advance, so the thresholds are calculated automatically. For example, it is possible to set whether or not to automatically calculate the threshold value by the condition input by the operator on the operation display unit 227.

The waveform data of line A and line B in FIG. 12 are the same as in FIG. For example, as shown in FIG. 12, the standard deviation σ (10.25) is obtained from the absolute value of the data difference (difference data) of the waveform data to be compared, and 3 times 3σ (30.75) is set as the threshold value, We have developed a method for determining the matching rate of waveform data by regarding the difference data that exceeds this threshold as a mismatch (NG). As a result, the threshold value is automatically set, and the labor of manually inputting the threshold value can be saved. However, this method can be used for waveform data in which waveform differences intersect, but is not suitable for waveform data in which parallel lines are traced. Therefore, it is preferable to first use the threshold value by automatic calculation in which the threshold value is automatically set, and switch to the threshold value by manual input for those that require adjustment. The threshold value may be 2σ (20.5), and the value of this threshold value may be changed in steps. For example, the threshold value may be set to 3σ in the temperature raising step where the temperature fluctuation is large, and may be set to 2σ in the film forming step where the temperature fluctuation is relatively stable.

Step delays should be considered when comparing the entire recipe. For example, when a delay occurs in the temperature raising step and the start of the subsequent steps is delayed, the shifted waveforms are compared with each other, resulting in an erroneous determination. In the present embodiment, since the comparison is made on a step-by-step basis, it is possible to perform matching regardless of whether the step termination condition is not satisfied and the machine is in a standby (HOLD).

In the data matching step (S140), the device data of all types and all items may be compared with the recipe executed when the abnormality occurs and the recipes before and after the recipe. Furthermore, if the type and the item can be specified according to the abnormality, the specific device data extracted by the specific type and the specific item may be collated. For example, the specific device data is selected from the group consisting of temperature data, pressure data, gas flow rate data, heater power data, concentration data, and valve data.

(Data display step (S150))
The data matching control unit 215c is configured to sequentially display on the operation display unit 227 from the matching rates calculated for the device data of all types and all items, from the device data with the smallest matching rate. For example, the worst 10 (10 pieces of data in ascending order of matching rate) is displayed in FIG. 13 for the recipe executed when the abnormality occurs and the recipe executed before that. However, irrespective of this mode, for example, device data having a smaller matching rate may be displayed on the operation / display unit 227 by group (Group), item (Item), and step (Step). Here, the group is a data type such as temperature, pressure, and gas flow rate, and the item is, for example, in the temperature data, the actual temperature value of the U zone, the actual temperature value of the CU zone, and the actual temperature value of the C zone. The temperature measurement value, the CL zone temperature measurement value, the L zone temperature measurement value, and the like. The gas flow rate is the MFC channel number. Further, the colors may be displayed according to the matching rate. For example, device data having a matching rate of less than 80% may be displayed in red, and device data having a matching rate of 80% or more may be displayed in blue. In the present embodiment, 10 pieces of device data are displayed in descending order of matching rate, but the number is not limited to this.

In this way, the operation display unit 227 is configured to display the calculated device data in the ascending order of the matching rate, in other words, the device data in the descending order of the data difference. As a result, it is possible to immediately determine which device data in which step caused the trouble, which contributes to reduction of analysis time and reduction of analysis error due to variation in skill of maintenance personnel.

Further, the result of the data matching step (S140) as shown in FIG. 19 may be displayed on the operation display unit 227 as a data detail confirmation screen. On this data detail confirmation screen, the matching rate of the entire recipe (TOTAL) is displayed on the upper side. This is a numerical value obtained by averaging the matching rates calculated for all types and all items. Further, it is preferable that the matching rate of the entire recipe is 80% or more.

The matching rate is displayed for each type under the matching rate of the entire recipe (TOTAL). Further, the data detail confirmation screen may be displayed for each type in FIG. Further, FIG. 19 may be displayed as a data detail confirmation screen when a recipe (Recipe) is selected on a history reference screen described later.

On the data detail confirmation screen shown in FIG. 19, it is possible to suggest which type (temperature, pressure ...) Causes the abnormality. Further, here, each item (item) having a matching rate of less than 50% is displayed in a different color.

In the present embodiment, in the data display step (S150), the result of collating two recipes, that is, the recipe executed when the abnormality occurred and the recipe executed before that is displayed, but the present invention is not limited to this form. .. For example, the recipe executed when the abnormality occurs may be collated with each of the plurality of recipes, and the calculation result of the matching rate may be displayed in time series. For example, the matching rate of the entire recipe (TOTAL), the matching rate of the entire specific step, and the matching rate of the specific device data may be collectively displayed. Thereby, the change history of the matching rate until the abnormality occurs can be confirmed.

  According to the present embodiment described above, in the file selection step (S120), the description has been made regarding the case where a recipe having the same condition as the recipe in which the abnormality has occurred exists in the storage unit 215h. The case where the storage unit 215h does not exist will be described below.

When the data matching control unit 215c searches the storage unit 215h of the device management controller 215 of the master device and detects a recipe under the same conditions, the data matching control unit 215c receives the corresponding recipe file and all files related to the recipe file from the master device. , Is stored in the storage unit 215h of the device 1 in which the abnormality has occurred. Since the subsequent steps are the same, the description thereof will be omitted. Further, even if the storage unit 215h in the master device is searched, if there is no recipe with the same condition, the storage unit 215h of the device management controller 215 of another device 1 is searched. Furthermore, if there is no recipe with the same conditions, there will be an erroneous setting, and the parameter setting will be abnormal.

  According to this embodiment, one or more of the following effects are exhibited.

  (A) The data matching control unit 215c according to the present embodiment refers to the abnormality analysis information, extracts the device data before and after the occurrence of the abnormality, and displays the device data in ascending order of matching rate (in the order of large difference). Is configured to display. As a result, a large amount of time-consuming abnormality analysis can be efficiently performed by maintenance personnel with low skills, and downtime when an abnormality occurs can be reduced.

  (B) The data matching control unit 215c according to the present embodiment is configured to refer to the abnormality analysis information, extract the device data before and after the occurrence of the abnormality, and display the device data on the screen in descending order of difference. .. As a result, it is possible to reduce the burden on the maintenance personnel who performs the abnormality analysis, and it is possible to shorten the time required for the maintenance personnel to analyze the factors.

  (C) The data matching control unit 215c according to the present embodiment is configured to extract the device data before and after the occurrence of the abnormality and display the device data on the screen in descending order of difference. This makes it possible to shorten the time taken to identify the cause of the abnormality even if there is a human error made by a maintenance worker (for example, an input error of the set value of the device data). In particular, even if there is an erroneous setting that is one of the factors that causes the film formation abnormality, the time required to identify the factor can be shortened.

  (D) The data matching control unit 215c according to the present embodiment is configured to display the result of matching the device data in time series from the time of execution of the recipe in which the abnormality has occurred, on the screen. As a result, the change over time of the device data can be confirmed by visually observing the change history of the matching rate until the occurrence of the abnormality, so that it becomes possible for the maintenance personnel to shorten the time taken to analyze the abnormality factor.

(Other embodiments)
Next, a file (data) matching function (tool matching function) at the time of device setup by the data matching control unit 215c will be described with reference to FIGS. Here, the file comparison target is the same as the file held in the repeat device and the file held in the master device, respectively, and is the same in that the data matching control unit 215c executes the flow shown in FIG.

  In the present embodiment, a method will be described in which the data matching control unit 215c of the repeat device directly communicates with the data matching control unit 215c of the master device to acquire necessary device data from the master device. Here, the data matching control unit 215c executes the program that realizes the tool matching function, so that the file used in the repeat device is already used in the master device without the intervention of the management device or the HOST computer which is a kind of higher-level computer. It can be matched with a proven file.

  As shown in FIG. 14, the name and IP address (Internet Protocol Address) of the master device 1 (0) can be set as initial information in the main controller storage unit 222 of the repeat device, for example, the repeat device 1 (2). ing. The name and IP address of the master device 1 (0) are set by the operator from the operation display unit 227 of the repeat device 1 (2), for example, from the master device 1 (0) to the repeat device 1 (2). It may be configured to be distributed. The reason for using the two pieces of information of the IP address and the name for the connection with the master device 1 (0) is that the device name is collated after the communication connection by the IP address is established with the master device 1 (0). Because there is. As a result, erroneous connection due to an IP address setting error can be prevented, and the worker can perform matching (data matching) work without being aware of the master device.

  In the data matching control shown in FIG. 14, the data matching control unit 215c of the device 1 including the repeat device 1 (2) reads the recipe file and the parameter file from the main controller storage unit 222 of the master device 1 (0), The data is stored in the main control memory unit 222 of No. 1 and collated. In this embodiment, the recipe file of the master device 1 (0) and the recipe file of the device 1 are compared and compared. Note that the recipe file received from the master device 1 (0) may be stored in the storage unit 215h of the device 1 instead of being stored in the main controller storage unit 222 to perform file matching.

FIG. 15 is a table defining a performance evaluation waveform. It is pre-registered in the master device 1 (0), and a maximum of 20 waveforms can be registered. This is because the user acquires optimum parameters and manages them as know-how while operating the device 1 after the first device 1 is delivered. In order to match the performances of the device 1 and the master device 1 (0) during the setup (startup) work, the waveform data to be collated (matching) related to the performance is defined in advance as shown in FIG. For example, specific waveform data such as a temperature rising waveform up to 1200 ° C. and a decompression waveform up to 2 Pa are targets, and temperature waveform data of pipe heating that is not related to performance (not defined in FIG. 15) is not a matching target. By using the table shown in FIG. 15, the setup (startup) work can be efficiently advanced.

FIG. 16 is an illustrative example of a history reference screen displayed when a button for referring to the history of data matching (tool matching) is pressed on a menu screen (not shown). FIG. 17 is a data matching detail confirmation screen displayed when the temperature (Temp) is selected in.

  As shown in FIG. 17, information on the number of steps of 80% or more and less than 80% of the total number of steps (20) of the process recipe is displayed, and each item (U, CU, C , CL, L) is displayed. Moreover, 84% of the matching rate (Matching Rate) described below indicates the matching rate of the apparatus data regarding the temperature (Temp) in the entire recipe. That is, it is the average value of the matching rate calculated for each item in steps, for the entire recipe.

  Color coding is displayed for 80% or more and less than 80% so that it is easy to understand which item has a lower matching rate at which step. Then, when the button (Trace) for displaying the raw waveform data is pressed, the raw waveform data shown in FIG. 18 is displayed.

  In FIG. 18, raw waveform data of each item (U, CU, C, CL, L) of the process file of the master device 1 (0) and each item (U, CU, C, CL,) of the process file of the device 1 are shown. The L) raw waveform data is configured to be displayed from preset steps.

  In this way, it is possible to compare raw waveform data for items having a poor matching rate.

  According to this embodiment, one or more of the following effects are exhibited.

  (A) The data matching control unit 215c according to the present embodiment calculates the matching rate for each step of the process recipe, and calculates each item of a plurality of types (temperature, gas, etc.) (for example, the actual temperature value of the U zone, etc.). ) Is used to easily extract device data with a small matching rate. As a result, since the information about the performance of the device is limited, downtime at the time of setup can be reduced.

  (B) The data matching control unit 215c according to the present embodiment calculates the matching rate for each step of the process recipe to calculate each item of a plurality of types (temperature, gas, etc.) (for example, the actual temperature value of the U zone, etc.). ) Is used to easily extract device data with a small matching rate. As a result, the burden on the operator who performs the setup work can be reduced, and the time required for the operator to perform the setup work can be shortened.

  The substrate processing apparatus 1 according to the embodiment of the present invention can be applied not only to a semiconductor manufacturing apparatus for manufacturing a semiconductor but also to an apparatus for processing a glass substrate such as an LCD device. Further, it is needless to say that the present invention can be applied to various substrate processing apparatuses such as an exposure apparatus, a lithographic apparatus, a coating apparatus and a processing apparatus using plasma.

1 ... Substrate processing device, 215 ... Device management controller, 215c ... Data matching control unit, 215e ... Device state monitoring control unit, 215h ... Storage unit, 227 ... Operation display unit.

Claims (14)

A storage unit that stores device data generated during execution of a recipe that has a plurality of steps and that processes a substrate;
A data matching control unit that respectively collates the plurality of device data stored in the storage unit;
In a substrate processing apparatus including
The data matching control unit,
A selection unit that selects a recipe executed under the same conditions as the recipe in which the abnormality has occurred from the storage unit, and an acquisition unit that acquires the device data from each of the recipe in which the abnormality has occurred and the recipe selected by the selection unit. A processing unit that calculates a ratio of the apparatus data in the steps executed at least at the same timing among the acquired apparatus data. Furthermore, it has a display device for displaying the result of the collation, the display device,
The substrate processing apparatus according to claim 1, wherein the apparatus data is displayed in descending order of the difference in the apparatus data between the recipe in which the abnormality has occurred and the recipe selected by the selection unit. In the step, in the step, the calculation unit calculates the absolute value of the data difference of the device data for each unit time, and the calculation unit that calculates the ratio in which the device data match, and the absolute value is set to a preset threshold value. And a comparison unit that determines whether or not the device data match,
The substrate processing apparatus according to claim 1, further comprising: Furthermore, it has a calculation unit for calculating the standard deviation of the data difference of the device data of the step,
The calculator calculates a threshold value using the standard deviation,
The substrate processing apparatus according to claim 3, wherein the arithmetic unit compares the absolute value with the calculated threshold value and determines whether the apparatus data match. The arithmetic unit is configured to calculate an absolute value of a data difference of the device data for each unit time, and calculate a standard deviation of the data difference of the device data in the step based on the absolute value. The substrate processing apparatus described. The data matching control unit,
Obtaining the abnormality analysis information from the storage unit,
Based on the data time information associated with the abnormality analysis information, while aligning the start time of the recipe, calculate the absolute value of the data difference of the device data for each unit time, the absolute value and a preset threshold value respectively. 2. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is configured to make a comparison for each unit time to determine whether the apparatus data match, and to calculate a rate of matching the apparatus data within a predetermined period. The data matching control unit searches the storage unit, reads a plurality of recipes executed under the same conditions as the searched recipe in which the abnormality has occurred, acquires the device data from each read recipe, The substrate processing apparatus according to claim 1, wherein a matching rate is calculated from a difference in the apparatus data between the apparatus data acquired from each recipe and the recipe in which the abnormality has occurred. Furthermore, it has a display device for displaying the result of the calculation, the display device,
8. The substrate processing apparatus according to claim 7, wherein the matching rate with the recipe in which the abnormality has occurred is displayed for each batch in which the recipe is executed. The data matching control unit,
9. The substrate processing apparatus according to claim 8, which is configured to display a matching rate with the recipe in which the abnormality has occurred for specific apparatus data among the apparatus data. The substrate processing apparatus according to claim 9, wherein the specific apparatus data is configured to be selected from the group consisting of temperature data, pressure data, gas flow rate data, heater power data, concentration data, and valve data. The data matching control unit,
When selecting a recipe executed under the same conditions as the recipe in which the abnormality has occurred from the storage unit, if there is no recipe executed under the same conditions in the storage unit, search in the storage unit of another device, The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is configured to acquire a recipe executed under the same condition as the recipe in which the abnormality has occurred. A storage unit that stores device data generated during execution of a recipe for processing a substrate having a plurality of steps,
A selection unit that selects a recipe executed under the same conditions as the recipe in which the abnormality has occurred from the storage unit, and an acquisition unit that acquires the device data from each of the recipe in which the abnormality has occurred and the recipe selected by the selection unit. A data matching control unit having a computing unit that computes a ratio of matching of the device data in the step executed at least at the same timing among the acquired device data,
A device management controller including. A substrate processing step of storing device data generated during execution of a recipe for processing a substrate having a plurality of steps in a storage unit;
Selecting a recipe executed under the same conditions as the recipe in which the abnormality occurred from the storage unit;
A step of acquiring the device data from each of the recipe in which the abnormality has occurred and the recipe selected by the selection unit;
Calculating a ratio of the device data in the step executed at least at the same timing among the acquired device data,
And a method for manufacturing a semiconductor device having. A storage unit that stores device data generated during execution of a recipe for processing a substrate having a plurality of steps,
A data matching control unit for collating each of the plurality of device data stored in the storage unit,
To the device management controller including
A procedure of selecting a recipe executed under the same conditions as the recipe in which the abnormality has occurred from the storage unit;
A procedure for acquiring the device data from each of the recipe in which the abnormality has occurred and the recipe selected by the selection unit,
A step of calculating a ratio of the device data in the step executed at least at the same timing among the acquired device data,
A program to execute.