KR102243473B1 - Substrate processing apparatus, apparatus management controller, program and method of manufacturing semiconductor device - Google Patents

Abstract

Provides a configuration that can reduce the time for analysis and investigation of abnormalities.
A storage unit for storing device data generated when executing a recipe including a plurality of steps; And the abnormal phenomenon occurs every unit time while matching the start time of the recipe in which the abnormal phenomenon has occurred and the recipe stored in the memory unit under the same conditions as the recipe in which the abnormal phenomenon has occurred based on the data time information related to the data abnormal analysis-related information. The absolute value of the data difference between the first device data acquired from the recipe and the second device data acquired from the recipe stored in the storage unit is calculated, and the absolute value is compared with a preset threshold value for each unit time, and the step There is provided a substrate processing apparatus including a data control unit that determines whether the first device data and the second device data match on a unit basis.

Description

Substrate processing device, device management controller, program, and manufacturing method of semiconductor device {SUBSTRATE PROCESSING APPARATUS, APPARATUS MANAGEMENT CONTROLLER, PROGRAM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE}

The present invention relates to a substrate processing apparatus, a device management controller, a program, and a method of manufacturing a semiconductor device.

In the field of semiconductor manufacturing, information of a device such as a substrate processing device is accumulated in a server in order to improve the device operation rate or production efficiency. The accumulated information can be used when analyzing device problems or monitoring device status. In the present specification, "trouble" refers to an abnormal situation such as an abnormal situation when a film is formed or an abnormal situation such as a stop of a device due to a failure of the device.

When a conventional method of specifying the cause of a problem is applied to a device in which a large amount of data is maintained during substrate processing, the efficiency is low, it takes a considerable time to specify the cause of the problem, and the amount of data used is large. Therefore, the method of specifying the cause of the problem in the related art may vary depending on the skill of the maintenance worker who interprets the problem. In addition, for reasons such as omission of confirmation of important data, there are cases in which the cause of the trouble cannot be specified when analyzing a conventional trouble. Therefore, various studies have been attempted in order to improve the operation rate of the device by quickly specifying the cause of the abnormality when analyzing the problem.

For example, Patent Document 1 describes a method of comparing files used in a substrate processing apparatus connected to a management apparatus collectively, and when a difference is extracted as a result of comparing the files, a method of correcting the difference is described. Further, in Patent Document 2, comparing files between conventional recipes, for example, comparing files of process recipe A and process recipe B is described. The ability to compare files like this has the advantage of being able to easily extract different data between files. According to analyzing the trouble by using the function of comparing files, it is expected to improve the efficiency of specifying the cause of the abnormality.

1. International Publication No. WO2014/189045 2. Japanese Patent No. 4577553

An object of the present invention is to provide a technique capable of shortening the time for analyzing an abnormality.

According to one aspect of the present invention, there is provided a storage unit for storing device data generated when a recipe including a plurality of steps is executed; And the abnormal phenomenon occurs every unit time while matching the start time of the recipe in which the abnormal phenomenon has occurred and the recipe stored in the memory unit under the same conditions as the recipe in which the abnormal phenomenon has occurred based on the data time information related to the data abnormal analysis-related information. The absolute value of the data difference between the first device data acquired from the recipe and the second device data acquired from the recipe stored in the storage unit is calculated, and the absolute value is compared with a preset threshold value for each unit time, and the step There is provided a technology including a substrate processing apparatus including a data control unit that determines whether the first device data and the second device data match on a unit basis.

According to the present invention, it is possible to shorten the time to analyze an abnormality of a device in which the abnormality has occurred, and to reduce the device stop time.

1 is a perspective view showing a substrate processing apparatus preferably used in an embodiment of the present invention.
2 is a side cross-sectional view showing a substrate processing apparatus preferably used in an embodiment of the present invention.
3 is a diagram showing a functional configuration of a control system preferably used in an embodiment of the present invention.
4 is a diagram showing a functional configuration of a main controller preferably used in an embodiment of the present invention.
5 is a diagram showing the configuration of a substrate processing system preferably used in an embodiment of the present invention.
6 is a diagram for explaining a functional configuration of a device management controller preferably used in an embodiment of the present invention.
7A is a diagram showing a functional configuration of a device state monitoring control unit according to an embodiment of the present invention, and 7B is a diagram showing a functional configuration of a data matching control unit according to an embodiment of the present invention.
8 is a diagram for explaining device data acquired by a device state monitoring control unit according to an embodiment of the present invention.
9 is a view for explaining device data to be compared to a file according to an embodiment of the present invention.
10 is a diagram showing an example of a processing flow executed by a data matching control unit according to an embodiment of the present invention.
11 is a diagram illustrating an example for explaining a matching rate according to an embodiment of the present invention.
12 is a diagram illustrating an example for explaining a method of calculating a threshold value used to calculate a matching rate according to an embodiment of the present invention.
13 is a diagram illustrating an example of a matching rate of device data in a lower order according to an embodiment of the present invention.
14 is a view for explaining a file comparison function according to another embodiment of the present invention.
15 is a diagram illustrating an exemplary performance evaluation waveform table according to another embodiment of the present invention.
16 is a view showing an example of a contrast history screen according to an embodiment of the present invention.
17 is a diagram illustrating a detailed data display screen according to an embodiment of the present invention.
18 is a diagram exemplarily showing raw waveform data according to an embodiment of the present invention.
19 is a diagram illustrating a recipe comparison result according to an embodiment of the present invention by way of example.

<Overview of substrate processing device>

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. First, with reference to Figs. 1 and 2, a description will be given of a substrate processing apparatus 1 (hereinafter simply referred to as "apparatus") in which the present invention is implemented.

The substrate processing apparatus 1 includes a housing 2. In the lower part of the front wall 3 of the housing 2, a maintenance opening 4 (front maintenance tool) is provided, and the opening 4 is opened and closed by a front maintenance door 5.

On the front wall 3 of the housing 2, a pod carrying-in/out port 6 is opened to communicate inside and outside the housing 2, and the pod carrying-in/out port 6 is opened and closed by the front shutter 7 to carry in a pod. A load port 8 is provided on the front front side of the carry-out port 6, and the load port 8 is configured to align the placed pod 9 in position.

The pod 9 is a sealed substrate transfer container, and is carried on the load port 8 by an in-process transfer device (not shown) and is carried out from the load port 8.

A rotary pod shelf 11 is installed at an upper portion of the housing 2 in an approximately central portion in the front-rear direction, and the rotary pod shelf 11 is configured to store a plurality of pods 9.

The rotary pod shelf 11 includes a post 12 vertically standing and intermittently rotated, and a plurality of shelf plates 13 radially supported at each position of the upper, middle and lower ends of the post 12, and the shelf plate Reference numeral 13 is configured to store the pods 9 in a state in which a plurality of pods 9 are mounted.

A pod opener 14 is installed below the rotary pod shelf 11, and the pod opener 14 includes a configuration in which the pod 9 is placed and the cover of the pod 9 can be opened and closed. do.

A pod transport mechanism 15 is provided between the load port 8 and the rotary pod shelf 11 and the pod opener 14, and the pod transport mechanism 15 holds the pod 9 and moves up and down. It is configured to be capable of advancing and retreating in the horizontal direction, and is configured to convey the pod 9 between the load port 8, the rotary pod shelf 11, and the pod opener 14.

A sub-conductor 16 is installed over the rear end in the lower part of the housing 2 in the substantially central portion in the front-rear direction. On the front wall 17 of the sub-conductor 16, a pair of wafer carry-in/out ports 19 for carrying in/out of the wafer 18 (hereinafter referred to as a substrate) into the sub-conductor 16 are vertically vertically arranged. It is arranged and opened in two stages, and pod openers 14 are respectively provided to the upper and lower wafer carry-in/out ports 19.

The pod opener 14 includes a mounting table 21 for placing the pod 9 and an opening/closing mechanism 22 for opening and closing the cover of the pod 9. The pod opener 14 is configured to open and close the wafer entrance of the pod 9 by opening and closing the lid of the pod 9 placed on the mounting table 21 by the opening/closing mechanism 22.

The sub body 16 constitutes a transfer chamber 23 that is airtight with a space (pod transport space) in which the pod transport mechanism 15 and the rotary pod shelf 11 are disposed. A wafer transfer mechanism 24 (substrate transfer mechanism) is installed in the front region of the transfer chamber 23, and the substrate transfer mechanism 24 requires the required number of sheets to place the substrate 18 (5 sheets in the illustration). The wafer mounting plate 25 is provided, and the wafer mounting plate 25 can be directly moved in a horizontal direction, can be rotated in a horizontal direction, and can be raised and lowered. The substrate transfer mechanism 24 includes a boat 26 (substrate holding plate). Sieve), the substrate 18 is loaded and ejected.

In the rear area of the transfer chamber 23, a waiting part 27 for accommodating and waiting for the boat 26 is configured, and a vertical processing furnace is provided above the waiting part 27. (28) is installed. The processing furnace 28 has a processing chamber 29 formed therein, the lower end of the processing chamber 29 becomes a furnace opening, and the furnace opening is opened and closed by a furnace opening shutter 31.

A boat elevator 32, which is an elevating mechanism for lifting the boat 26, is provided between the right end of the housing 2 and the right end of the waiting portion 27 of the sub housing 16. A seal cap 34, which is an individual, is horizontally attached to the arm 33 connected to the lifting platform of the boat elevator 32, and the seal cap 34 supports the boat 26 vertically. And, in a state in which the boat 26 is charged into the processing chamber 29, the furnace port is airtightly closed.

The boat 26 is configured to hold a plurality of (for example, about 50 to 125) of the substrates 18 in a multi-stage in a horizontal position, centered on the substrate 18.

A clean unit 35 is disposed at a position opposite to the boat elevator 32 side, and the clean unit 35 is a supply fan and dustproof to supply a clean atmosphere or clean air 36 which is an inert gas. It consists of a filter. A notch matching device (not shown) is provided between the substrate transfer mechanism 24 and the clean unit 35, which is a substrate matching device that matches the position of the substrate 18 in the circumferential direction.

The clean air 36 discharged from the clean unit 35 is sucked by a duct (not shown) after being circulated to the notch matching device (not shown) and the substrate transfer mechanism 24 and the boat 26, and It is configured to be exhausted to the outside or to be discharged into the transfer chamber 23 by the clean unit 35.

Next, the operation of the substrate processing apparatus 1 will be described.

When the pod 9 is supplied to the load port 8, the pod carrying-in/out port 6 is opened by the front shutter 7. The pod 9 on the load port 8 is carried into the interior of the housing 2 by the pod conveying device 15 through the pod carrying-in/out port 6, and the designated shelf plate 13 of the rotary pod shelf 11 ) Is wit. After the pod 9 is temporarily stored in the rotary pod shelf 11, it is conveyed from the shelf plate 13 to one of the pod openers 14 by the pod conveying device 15, and the mounting table 21 ) Or directly from the load port 8 to the mounting table 21.

At this time, the wafer carrying-in/out port 19 is closed by the opening/closing mechanism 22, and the transfer chamber 23 is filled with clean air 36 flowing therethrough. Since the transfer chamber 23 is filled with nitrogen gas as the clean air 36, the oxygen concentration in the transfer chamber 23 is lower than the oxygen concentration inside the housing 2.

The pod 9 placed on the mounting table 21 has a cross-section on the opening side of the pod 9 at the edge of the opening of the wafer loading/unloading port 19 at the front wall 17 of the sub body 16. ), the lid is removed by the opening/closing mechanism 22, and the wafer entrance is opened.

When the pod 9 is opened by the pod opener 14, the substrate 18 is taken out from the pod 9 by the substrate transfer mechanism 24 and transferred to a notch matching device (not shown), After matching the substrates 18 in the notch matching device, the substrate transfer mechanism 24 carries the substrate 18 into the standby portion 27 at the rear of the transfer chamber 23 and loads it into the boat 26.

The board|substrate transfer mechanism 24 which delivered the board|substrate 18 to the said boat 26 returns to the pod 9, and loads the next board|substrate 18 in the boat 26.

During the loading operation of the substrate 18 to the boat 26 by the substrate transfer mechanism 24 from the pod opener 14 of one (top or bottom), the pod opener 14 of the other (bottom or top) has a rotary pod. The other pod 9 is conveyed from the shelf 11 by the pod conveying device 15 and transferred, and the opening operation of the pod 9 by the other pod opener 14 proceeds at the same time.

When a predetermined number of substrates 18 are loaded in the boat 26, the furnace opening of the processing furnace 28 closed by the furnace opening shutter 31 is opened by the furnace opening shutter 31. Subsequently, the boat 26 is raised by the boat elevator 32 and carried in (loaded) into the processing chamber 29.

After loading, the furnace opening is hermetically closed by the seal cap 34. In addition, in the present embodiment, a purge process (pre-purge process) in which the internal atmosphere of the processing chamber 29 is replaced with an inert gas after loading is included.

The processing chamber 29 is evacuated by a gas exhaust mechanism (not shown) so that the desired pressure (vacuum degree) is reached. Further, the processing chamber 29 is heated to a predetermined temperature by a heater driving unit (not shown) so as to obtain a desired temperature distribution.

In addition, the processing gas controlled at a predetermined flow rate is supplied by a gas supply mechanism (not shown), and the processing gas is in contact with the surface of the substrate 18 in the process of circulating the processing chamber 29 so as to be in contact with the surface of the substrate 18. A predetermined process is carried out. Further, the processing gas after the reaction is exhausted from the processing chamber 29 by a gas exhaust mechanism.

When a predetermined processing time elapses, an inert gas is supplied from an inert gas supply source (not shown) by a gas supply mechanism, and the processing chamber 29 is replaced with the inert gas, and the pressure in the processing chamber 29 returns to normal pressure ( After purge process). Then, the boat 26 descends through the seal cap 34 by the boat elevator 32.

Regarding the carrying out of the substrate 18 after processing, the substrate 18 and the pod 9 are unloaded to the outside of the housing 2 in an order opposite to that described above. The unprocessed substrate 18 is also loaded in the boat 26 and the processing of the substrate 18 is repeated.

<Function configuration of the control system 200>

Next, the functional configuration of the control system 200 centering on the main controller 201 as an operation unit will be described with reference to FIG. 3. In the present specification, the main controller 201 may also be indicated as the operation unit 201. As shown in Fig. 3, the control system 200 includes a main controller 201, a transport controller 211 as a transport control unit, a process controller 212 as a processing control unit, and a device management controller 215 as a data monitoring unit. do. The device management controller 215 functions as a data collection controller, and collects device data inside and outside the device 1 to monitor the integrity of the device data in the device 1. In this embodiment, the control system 200 is housed in the device 1.

In this specification, "device data" refers to data (hereinafter also referred to as control parameters) related to substrate processing such as processing temperature, processing pressure, and flow rate of processing gas when the device 1 processes the substrate 18, for example formed Data on the quality of the manufactured product substrate, such as the thickness of the film and the cumulative value of the thickness, and data on the component parts of the device 1 such as a quartz reaction tube, a heater, a valve, and a mass flow controller (MFC) (e.g., a set value , Measured value), refers to data generated by operating each component when the substrate processing apparatus 1 processes the substrate 18.

In addition, data collected while executing a recipe may also be referred to as process data. The device data also includes process data such as live waveform data, which is data collected every specific interval (eg, 1 second) from the start to the end of the recipe, and statistical data of each step in the recipe. Statistical data includes data such as maximum, minimum, and average values. The device data may include event data representing various device events (eg, data representing a maintenance history) when a recipe is not executed (eg, idle when a substrate is not inserted into the device 1).

The main controller 201 is electrically connected to the carrier controller 211 and the process controller 212 via a LAN line such as 100BASE-T. Accordingly, the main controller 201 may transmit/receive device data or download and upload files between the carrier controller 211 and the process controller 212.

The operation unit 201 is provided with a port that is a mounting unit into which a recording medium (for example, a USB key), which is an external storage device, is inserted or detached. The operating unit 201 is installed with an OS corresponding to the port. Further, a host computer is connected to the operation unit 201 via, for example, a communication network. For this reason, even in the case where the substrate processing apparatus 1 is installed in a clean room, the upper-level computer can be arranged in an office outside the clean room or the like.

The device management controller 215 is connected to the operation unit 201 through a LAN line, collects device data from the operation unit 201, and is configured to quantify the operation state of the device and display it on a screen. In addition, the device management controller 215 will be described in detail later.

The transfer system controller 211 is mainly composed of a rotary pod shelf 11, a boat elevator 32, a pod transfer device 15, a substrate transfer mechanism 24, a boat 26, and a rotation mechanism (not shown). It is connected to the substrate transfer system 211A. The transfer system controller 211 performs transfer operations of the rotary pod lathe 11, the boat elevator 32, the pod transfer device 15, the substrate transfer mechanism 24, the boat 26, and the rotation mechanism (not shown), respectively. Is configured to control. In particular, the transfer system controller 211 is configured to control the transfer operation of the boat elevator 32, the pod transfer device 15, and the substrate transfer mechanism 24, respectively, via the motion controller 211a.

The process controller 212 includes a temperature controller 212a, a pressure controller 212b, a gas flow controller 212c, and a sequencer 212d. These temperature controller 212a, pressure controller 212b, gas flow controller 212c, and sequencer 212d are sub-controllers. The temperature controller 212a, the pressure controller 212b, the gas flow controller 212c, and the sequencer 212d are electrically connected to the process controller 212, and transmit/receive the process controller 212 and each device data or It is configured to be able to download and upload files. On the other hand, the process controller 212 and the sub controller are shown as separate configurations, but the process controller 212 and the sub controller may be integrally configured.

To the temperature controller 212a, a heating mechanism 212A mainly including a configuration such as a heater and a temperature sensor is connected. The temperature controller 212a is configured to regulate the temperature in the processing furnace 28 by controlling the temperature of the heater of the processing furnace 28. Further, the temperature controller 212a is configured to perform switching (on-off) control of a thyristor (not shown) and to control power supplied to a heater element wire (not shown).

A gas exhaust mechanism 212B mainly constituted by a pressure sensor, an APC valve as a pressure valve, and a vacuum pump (not shown) is connected to the pressure controller 212b. The pressure controller 212b controls the opening degree of the APC valve and switching (on-off) of the vacuum pump so that the pressure in the processing chamber 29 becomes the desired pressure at a desired timing based on the pressure value detected by the pressure sensor. Is configured to

The gas flow controller 212c is constituted by MFC. The sequencer 212d is configured to control supplying gas to the process gas supply pipe or the purge gas supply pipe or stopping the supply of gas by opening and closing the valve 212D. Further, the process controller 212 is configured to control the MFC 212c and the valve 212D so that the flow rate of the gas supplied into the processing chamber 29 becomes a desired flow rate at a desired timing.

In addition, the main controller 201, the carrier controller 211, the process controller 212, and the device management controller 215 according to the present embodiment can be implemented by a dedicated system, as well as a general computer system. It can also be implemented using For example, each controller that executes a predetermined process can be configured by installing the program in a general-purpose computer using a recording medium (eg, a USB key) storing a program for executing the above-described process.

And there are many ways to supply their programs. As described above, not only a method of supplying through a predetermined recording medium but also a method of supplying through a configuration such as a communication line, a communication network, and a communication system is also possible. In this case, for example, the program can be posted on a bulletin board of a communication network, and the program can be superimposed on a carrier wave through the network and provided. Then, a predetermined process can be executed by starting the program provided in this way and executing it in the same manner as other application programs under the control of the OS.

<Configuration of main controller 201>

Next, the configuration of the main controller 201 will be described with reference to FIG. 4.

The main controller 201 is an operation display unit 227 including a main controller control unit 220, a hard disk (HDD) 222 that is a main controller storage unit, a display unit displaying various types of information, and an input unit receiving various instructions from an operator. It is configured to include a transmission/reception module 228, which is a main controller communication unit that communicates with the inside and outside of the device 1. In addition, operators may include device operators, as well as device managers, device engineers, maintenance personnel, and operators. The main controller control unit 220 includes a CPU 224 (a central processing unit) serving as a processing unit and a memory 226 serving as a temporary storage unit such as RAM and ROM, and is configured as a computer having a clock function (not shown).

The hard disk 222 includes, for example, a recipe file such as a recipe in which processing conditions and processing order of the substrate are defined, a control program file for executing the recipe file, a parameter file in which parameters for executing the recipe are defined, and an error processing program file. And various screen files including input screens for inputting process parameters as well as error processing parameter files and files such as various icon files (all not shown) are stored.

In addition, on the operation screen of the operation display unit 227, an operation instruction to the substrate transfer system 211A or the substrate processing system (heating mechanism 212A, gas exhaust mechanism 212B, and gas supply system 212C) shown in FIG. 3 is displayed. It is also possible to install each operation button, which is an input part for input.

The operation display unit 227 is configured to display an operation screen for operating the device 1. The operation display unit 227 displays information based on the device data generated in the substrate processing apparatus 100 on the operation screen via the operation screen. The operation screen of the operation display unit 227 is, for example, a touch panel using liquid crystal. The operation display unit 227 receives the operator's input data (input instruction) through the operation screen and transmits the input data to the main controller 201. In addition, the operation display unit 227 is an instruction for executing a recipe stored in the memory 226 (RAM) or the like or an arbitrary substrate processing recipe (hereinafter also referred to as a process recipe) among a plurality of recipes stored in the main controller storage unit 222 ( Control instruction) is received and transmitted to the main controller control unit 220.

In addition, in this embodiment, the device management controller 215 reads each screen file and data table stored in advance by executing various programs, etc. at startup, and reads the device data to determine the operating state of the device. Each of the illustrated screens is configured to be displayed on the operation display unit 227.

A configuration such as a switching hub (not shown) is connected to the main controller communication unit 228, and the main controller 201 transmits and receives data to and from an external computer or other controller in the device 1 through a network. It is composed.

Further, the main controller 201 transmits device data such as the state of the device 1 to an external host computer, for example, a host computer via a network (not shown). Further, the substrate processing operation of the apparatus 1 is controlled by the control system 200 based on each recipe file, each parameter file, and the like stored in the main controller storage unit 222.

<Substrate treatment method>

Next, a substrate processing method including a predetermined processing step performed using the apparatus 1 according to the present embodiment will be described. Here, as an example, the predetermined processing step is a case where a substrate processing step (here, a film forming step), which is one step of the semiconductor device manufacturing step, is performed.

When performing the substrate processing process, a substrate processing recipe (process recipe) corresponding to the substrate processing to be performed is stored in, for example, a memory such as RAM in the process controller 212. And, if necessary, an operation instruction is given from the main controller 201 to the process controller 212 or the carrier controller 211. The substrate treatment process performed in this way includes at least a carry-in process, a film formation process, and a carry-out process.

<Transfer process>

From the main controller 201, an instruction to drive the substrate transfer mechanism 24 is issued to the transfer system controller 211. Then, in accordance with an instruction from the transfer system controller 211, the substrate transfer mechanism 24 starts transfer processing of the substrate 18 from the pod 9 on the receiving stage 21 as a mounting table to the boat 26. This transfer process is performed until all of the predetermined substrates 18 are loaded into the boat 26 (wafer charging).

<Import process>

When a predetermined number of substrates 18 are loaded in the boat 26, the boat 26 is raised by the boat elevator 32 operating according to the instruction from the transfer system controller 211 to be formed in the processing furnace 28. It is charged into the processing chamber 29 (boat load). When the boat 26 is fully loaded, the seal cap 34 of the boat elevator 32 hermetically closes the lower end of the manifold of the treatment furnace 28.

<Film formation process>

Next, the internal atmosphere of the processing chamber 29 is evacuated by the vacuum evacuation device so as to become a predetermined film forming pressure (vacuum degree) in accordance with an instruction from the pressure control unit 212b. Further, the interior of the processing chamber 29 is heated by a heater to a predetermined temperature according to an instruction from the temperature control unit 212a. Subsequently, rotation of the boat 26 and the substrate 18 by the rotation mechanism is started according to the instruction from the transfer system controller 211. Then, a predetermined gas (processing gas) is supplied to the plurality of substrates 18 held in the boat 26 while being maintained at a predetermined pressure and a predetermined temperature, and a predetermined process (e.g., film formation) is applied to the substrate 18. Processing) takes place. Further, the temperature may be lowered from the treatment temperature (a predetermined temperature) before the next carrying out step.

<Export process>

When the film forming process for the substrate 18 placed on the boat 26 is completed, in accordance with the instruction from the transfer system controller 211, the rotation of the boat 26 and the substrate 18 by the rotation mechanism is stopped, and the boat The seal cap 34 is lowered by the elevator 32 to open the lower end of the manifold, and the boat 26 holding the processed substrate 18 is carried out to the outside of the processing furnace 28 (boat unloading )do.

<Recovery process>

The boat 26 holding the processed substrate 18 is very effectively cooled by the clean air 36 ejected through the clean unit 35. Then, when cooled to, for example, 150° C. or lower, the processed substrate 18 is hermetically removed from the boat 26 and transferred to the pod 9, and thereafter, the boat 26 of the new unprocessed substrate 18 ) Is carried out.

<Configuration of substrate processing system>

5 is a diagram showing the configuration of a substrate processing system used in this embodiment. In this substrate processing system, the master device 1-M and the repeat devices 1-1 to 1-6 are connected through a network. In the example of Fig. 5, six repeat devices 1-1 to 1-6 are shown, but the number of repeat devices is not limited to six. Further, the master device 1-M and the repeat devices 1-1 to 1-6 are each configured as a substrate processing device, that is, the device 1. In this specification, the master device 1-M and the repeat devices 1-1 to 1-6 are referred to as a device 1, respectively, and the master device 1-M and the repeat devices 1-1 to 1 The -6) is collectively referred to as the device 1.

The master device 1-M is a device 1 containing standard device data. The master device 1-M includes the same hardware configuration as the substrate processing device 1, and also includes a device management controller 215. The master device 1-M is, for example, the first unit of the device 1 to which the device data has been properly adjusted. In this specification, the "first unit" is a device 1 initially delivered to the customer's factory, and the "repeat device" is, for example, a device 1 delivered to the customer's factory after the second unit after the first unit. The repeat devices 1-1 to 1-6 receive copies of various types of information contained in the master device 1-M from the master device 1-M via a network, and each repeat device 1-1 to 1-6 receives a copy of the various information included in the master device 1-M. Each of them is stored in the memory of 1-6).

As described above, in this embodiment, the device management controller 215 is installed in each device 1. In addition, by connecting the master device (1-M) and the device management controllers 215 installed in each of the repeat devices (1-1 to 1-6) through a network, each repeat device (1-1 to 1-6) is Various information of the master device 1-M can be shared. Specifically, each repeat device 1-1 to 1-6 copies the same file as the device data of the master device 1-M, or compares and contrasts with the file of the master device 1-M (described later). Tool matching). In addition, since the network is used, there is no need to use a recording medium for copying the device data, and the maintenance personnel of the device maker can easily edit files without having to move to the front of the device 1 installed in the clean room. There is.

<Function configuration of the device management controller 215>

The device management controller 215, which is a health check controller that checks the health state of the device 1 shown in FIG. 6, includes information related to various health states of the device 1, for example, the matching state with the master device 1-M. , While quantifying information such as the amount of change over time in the device data from the time of shipment or set-up of the device 1, the deterioration state of the components constituting the device 1, and the occurrence state of the failure information of the device 1, the device ( It is a controller with a configuration that monitors whether 1) can continue to operate normally. Here, "at the time of setup" is when the device 1 is first started up (powered on) after being delivered to the customer's factory.

As shown in FIG. 6, the device management controller 215 includes a data matching control unit 215c, a device status monitoring control unit 215e, a communication unit 215g for transmitting and receiving device data between the main controller 201, and various types of devices. A storage unit 215h for storing data is provided. Specifically, the device management controller 215 determines the validity of the device status monitoring control unit 215e that monitors the health of device data that can be obtained from the operating status of the constituent parts constituting the device, and the facility data provided from the factory facility. And at least a data matching control unit 215c. The device management controller 215 evaluates the operating state of the device 1 based on the device state monitoring result data acquired from the device state monitoring control unit 215e and the validity determination result data determined by the data matching control unit 215c. Is configured to derive.

In addition, the device management controller 215 monitors the health status based on the quantified value of the information that evaluates the operating status of the device 1, and when the health status deteriorates, for example, by outputting an alarm sound or displaying an alarm. Is configured to issue. Further, the device management controller 215 is configured to be able to operate functions useful for the stable operation of the device 1, such as data matching and device status monitoring, on the operation display unit 227 of the device 1.

The device management controller 215 includes, as a hardware configuration, a CPU (not shown) and a memory (not shown) for storing an operation program of the device management controller 215, for example. The CPU operates according to the above operation program. In the present embodiment, the device management controller 215 stores the device data generated during execution of a recipe for processing a substrate in the storage unit 215h by executing the operation program. And, on the basis of data indicating that the abnormality has occurred, at least a data matching control unit 215c configured to collate the device data obtained from the recipe before and after the occurrence of the abnormality is realized.

The storage unit 215h includes abnormal analysis information to be described later used in the data matching control unit 215c to be described later, or device data acquired from the master device 1-M to be described later used in the device state monitoring control unit 215e (to be described later). Standard data) is stored. Further, various programs such as a data matching program, a device state monitoring program, and a waveform matching program, which will be described later, are stored at least in the storage unit 215h. Further, the main controller storage unit 222 or the temporary storage unit 226 may be used instead of the storage unit 215h. Then, the device management controller 215 (and/or the data matching control unit 215c, the device status monitoring control unit 215e, and the communication unit 215g) each executes a screen display program to transfer the device data to the data for screen display. It is processed to create screen display data, and is controlled to display on the operation display unit 227.

<Data matching control unit 215c>

The data matching control unit 215c performs a copy or comparison between the file of the device 1 and the file of the master device 1-M received from the main controller 201 by executing a data matching program, which will be described later. Execute the tool matching function. In addition, in the present embodiment, the data matching control unit 215c is configured to compare a process recipe before and after an abnormality occurs by using the tool matching function. Thereby, the data matching control unit 215c is configured to compare the waveform data of each device data before and after the occurrence of the abnormality, and display the difference in the waveform data on the operation display unit 227 in the order of the greatest difference.

Next, as shown in FIG. 7B, the data matching control unit 215c selects a recipe executed under the same conditions as the recipe in which the abnormality occurred, from the storage unit 215h, the selection unit 321, and the recipe and the selection unit in which the abnormality occurred. It includes an acquisition unit 322 that acquires device data from each of the recipes selected in 321, and an operation unit 323 that calculates a difference between the acquired device data. In this embodiment, the data matching control unit 215c is configured to collate device data acquired from a recipe before and after the occurrence of the abnormality on the basis of data indicating that the abnormality has occurred.

In addition, as shown in FIG. 7B, the calculation unit 323 calculates the absolute value of the data difference between the device data and calculates the ratio of the device data to be matched, the absolute value and the preset threshold. It is configured to include a comparison unit 325 for comparing values and determining whether device data match, and a calculation unit 326 for calculating a standard deviation from the absolute value.

<Device status monitoring control unit 215e>

The device state monitoring control unit 215e includes a device state monitoring program, and executes a device state monitoring function. The device state monitoring control unit 215e receives the device data of the device 1 from the main controller 201, updates and accumulates the device data stored in the storage unit 215h, and The monitoring of the device data of the device 1 is performed on the basis of standard data obtained from ), i.e., the standard data that the device 1 should aim for, such as the elapsed waveform of the reaction chamber temperature, the upper and lower limits. That is, the device data of the device 1 is compared with standard data and monitored.

Further, in the present embodiment, the device management controller 215 is installed separately from the main controller 201 having a substrate processing function and a higher reporting function, but the present embodiment is not limited to this configuration. For example, from the device data collected by the main controller 201, data related to monitoring the device status (device status monitoring data), data evaluating device performance (evaluation item waveform data), data related to abnormal analysis (abnormal analysis data), and Needless to say, it may be possible to generate various data such as data related to alarm monitoring (failure information data).

<Device status monitoring function>

Next, a device state monitoring function of the present embodiment, that is, a device state monitoring program executed by the device state monitoring control unit 215e, will be described with reference to Fig. 7A. The device state monitoring program is stored in a memory (for example, the storage unit 215h) of the device management controller 215, and realizes the device state monitoring control unit 215e.

The device status monitoring control unit 215e includes a setting unit 311, a band generation unit 312, a FDC (Fault Detection & Classification) monitoring unit 313, a counting display unit 314, and a diagnosis unit ( 315).

In response to input from the operation display unit 227, such as input of an operation command, the setting unit 311 instructs the band generation unit 312, the FDC monitoring unit 313, and the diagnosis unit 315 to set the designated band management. do.

The band generation unit 312 generates a band based on the standard data set by the setting unit 311 and a designation value of an upper limit and a designation value of a lower limit. In this embodiment, "band" refers to a range determined to have a margin for a waveform by standard data (here, device data of the master device 1-M). Specifically, the band refers to a range determined by designating an upper limit value or a lower limit value, or an upper limit value and a lower limit value based on the values of each data point constituting standard data.

The FDC monitoring unit 313 includes a comparison unit 313a that compares the band generated by the band generation unit 312 with device data generated from the device 1 every moment, and a counting unit that counts the number of times the device data deviates from the band ( 313b) and a determination unit 313c that determines that the device data is abnormal if the device data deviates from the band by more than a predetermined number of times. Further, when the FDC monitoring unit 313 detects an abnormality, the FDC monitoring unit 313 is configured to, for example, display the detection of the abnormality on the operation display unit 227. In this way, the FDC monitoring unit 313 monitors the device data by comparing the device data received from the main controller 201 with the band generated with respect to the master data that is the criterion for determining the device data. In addition, the above-described band generation unit 312 may be configured to be included in the FDC monitoring unit 313,

The counting display unit 314 is configured to display the number of excluded points per batch process for the excluded points counted by the FDC monitoring unit 313 on the operation display unit 227. In this embodiment, a data point deviating from the band by comparing the band and device data is referred to as an exclusion point.

The diagnosis unit 315 diagnoses statistical data among device data constituted from the number of excluded points using an abnormal diagnosis rule. Further, when the diagnosis unit 315 is diagnosed as abnormal, the diagnosis unit 315 is configured to, for example, display the indication that the abnormality has been detected on the operation display unit 227.

In addition, the device data collected by the device state monitoring control unit 215e is stored in the storage unit 215h, but is not limited thereto. For example, the device data may be configured to be stored in the main controller storage unit 222.

As shown in Fig. 8, the device status monitoring control unit 215e accumulates the device data from the start to the end of the process recipe in the storage unit 215h at specific intervals by executing the above-described device status monitoring program. At the end of the step, the statistical data is calculated and stored in the storage unit 215h by calculating the statistic of the section (for example, the maximum value of the device data, the minimum value of the device data, and the average value of the device data). Further, the device state monitoring control unit 215e is configured to accumulate event data including maintenance information while the process recipe is not being executed. In addition, the device condition monitoring control unit 215e is configured to accumulate in the storage unit 215h the device data including the heating temperature waveform of the supply pipe or the exhaust pipe as well as the temperature rise waveform and the decompression waveform as raw waveform data. On the basis of the temperature waveform, for example, a cold spot may occur, and the possibility of a by-product deposition can be confirmed.

As shown in Fig. 9, in a recently used device 1 that holds a large amount (more than 500 types) of device data, data analysis when an abnormality occurs takes a considerable amount of time. In addition, since the amount of data is large, it takes time to specify the cause of the abnormality because important device data is missed by the skill of the maintenance person performing the data analysis. In addition, it is difficult to confirm changes over time only by visually comparing live waveform data, and since gradually changed data appears as a difference, it becomes difficult to identify the cause of the abnormality. As a result, downtime increases and equipment utilization decreases.

<Interpretation support processing>

Next, a processing flow of analysis support using a data matching function (tool matching function) executed by the data matching control unit 215c will be described with reference mainly to FIG. 10.

<Data receiving process (S110)>

First, when the data matching control unit 215c receives abnormal analysis information from the operation unit 201 via the communication unit 215g, it drives the waveform verification program. Further, the data matching control unit 215c includes a selection unit 321 that selects a recipe executed under the same conditions as the recipe in which the abnormality has occurred, and an acquisition unit 322 that obtains device data from each of the recipe in which the abnormality has occurred and the recipe selected by the selection unit. ) And an operation unit 323 that calculates a difference between the acquired device data.

In the present embodiment, the abnormal analysis information includes at least information specifying an abnormality and recipe specifying information specifying a recipe executed by the apparatus 1 in which the abnormality has occurred. Further, the data matching control unit 215c may be configured to receive abnormal analysis information via the communication unit 215g by condition input by an operator on the operation display unit 227. Further, the abnormal analysis information may be configured such that at least one of a group consisting of a threshold value, a step, a group, and an item described later can be set by a condition input by an operator on the operation display unit 227.

<File selection process (S120)>

The data matching control unit 215c acquires recipe specifying information based on the received abnormal analysis information. The data matching control unit 215c searches for the presence or absence of a recipe having the same conditions as the obtained recipe specific information by referring to production history information among the device data in the storage unit 215h. The search by the data matching control unit 215c is performed, for example, by retrieving a plurality of recipes recorded in the production history information from a recipe in which an abnormality occurred to a recipe in the past. When the data matching control unit 215c detects a recipe matching conditions in the production history information, it acquires the start time and end time of the recipe specified by the recipe specifying information, respectively. The data matching control unit 215c further acquires step information from the start time to the end time of the steps constituting the recipe. As described above, the data matching control unit 215c selects a recipe executed under the same conditions as the recipe in which the abnormality occurred.

<Data acquisition process (S130)>

Based on the acquired step information, the data matching control unit 215c reads from the storage unit 215h the device data related to the recipe specifying information that has occurred between the start time and the end time of the step. Specifically, the data matching control unit 215c stores the device data defined in Fig. 9 stored by the device state monitoring control unit 215e from the storage unit 215h for each of the recipe in which an abnormality has occurred and the recipe detected by the search. Is configured to acquire. Acquiring data for each step is repeated until the recipe is finished.

In recent recipes, the number of steps is large, and for example, there are cases in which the number of steps exceeds 100. In this case, since the combination of the item type of the device data shown in Fig. 9 and this step is 500 × 100 = 500,000, it is difficult to find out which waveform is bad. Therefore, it is desirable to set in advance which step data is to be acquired according to an abnormality by inputting a condition by an operator on the operation display unit 227. Similarly, it is also possible to pre-set groups and items.

<Data matching process (S140)>

Next, the data matching control unit 215c compares the device data acquired for each step for each of the recipe in which an abnormality has occurred and the recipe detected by the search and having the same conditions as the recipe. Specifically, the data matching control unit 215c calculates the absolute value of the data difference of the device data for each unit time while setting the start time of the recipe based on the data time information related to the abnormal analysis information, and sets the absolute value to a preset threshold. And each unit time is compared to determine whether the device data coincide, and the ratio (matching rate) of the device data coinciding in a predetermined period within the step is calculated. In the present embodiment, the "matching rate" refers to the percentage of periods in which there is a difference of more than a certain amount (eg, 3σ) after finding the standard deviation σ from the difference in data for each specific period. In addition, in this embodiment, a specific period is a period for collecting device data. However, even for recipes with the same conditions, since the time from the start to the end of the step may vary, it is preferable that the step time can be set to a predetermined period within the step.

As shown in Fig. 11, waveform data (e.g., temperature) every unit time (5 seconds in the example of Fig. 11) from two waveform data (e.g., the recipe in which an abnormality has occurred and device data read from each of the recipes executed before) The absolute value of the difference between is found, the case where the absolute value of the difference is greater than or equal to the threshold value (e.g. 30) is indicated by a dotted line (NG), and when the value is less than the threshold value is indicated by a solid line (OK), and the number of data in a predetermined period (Fig. In the example of 11, the ratio of the number of solid lines OK, that is, the ratio of the number determined to match through comparison (the difference is less than the threshold value) with 10 as the denominator is used as the matching rate. In FIG. 11, when comparing the recipe with an abnormality as line A and the recipe executed before the recipe as line B, the matching rate in a predetermined period (here, 00:00:00 to 00:50:00) becomes 90%. .

The threshold value 30 is configured to be set according to a condition input by an operator on the operation display unit 227. In addition, FIG. 11 shows only a part of the recipe separated and displayed to explain the calculation of the matching rate.

In this embodiment, the data matching control unit 215c is configured to include a calculation unit 326 that calculates an absolute value of a data difference between device data within a predetermined period, and calculates a standard deviation from this absolute value. Specifically, the calculation unit 326 calculates the absolute value of the data difference of the device data every unit time (for example, a time such as 0.1 second or 1 second), and the ratio of the device data match and the data difference of the device data in units of steps. Is configured to calculate the standard deviation of the absolute value of.

In addition, the calculation unit 326 is configured to update the threshold value by using the calculated standard deviation. Further, the calculating unit 323 is configured to compare the absolute value of the data difference of the device data with the calculated threshold value to determine whether the device data matches.

The threshold value of FIG. 11 is a fixed value by manual input. However, there are many types of process data, and the threshold value can be automatically calculated by presetting a threshold value suitable for each type. In addition, for example, the operator on the operation display unit 227 can set whether or not to automatically calculate the threshold value by inputting a condition.

In addition, waveform data of lines A and B of FIG. 12 are the same as those of FIG. 11. For example, as shown in Fig. 12, the standard deviation sigma (10.25) is found from the absolute value of the data difference (difference data) of the waveform data to be compared, 3 sigma (30.75), which is three times, is set as the threshold value, and the threshold value is set as the threshold value. A method of finding the waveform data matching rate by considering the excess difference data as a mismatch (NG) is shown. Thereby, since the threshold value is automatically set, the trouble of manually inputting the threshold value can be omitted. However, this method can be used for waveform data where the difference in waveforms intersect, but it is not suitable for waveform data along parallel lines. Therefore, it is preferable to first use a threshold value by automatic calculation in which the threshold value is automatically set, and to switch to a threshold value by manual input that requires adjustment. Further, the threshold value may be 2? (20.5), or may be set so as to change the value of this threshold value in accordance with steps. For example, the threshold value may be set to 3 sigma in the temperature increase step with large temperature fluctuation, and the threshold value may be set to 2 sigma in the film formation step where the temperature fluctuation is relatively stable.

When comparing the whole recipe, it is necessary to consider the delay of the step. For example, when a delay occurs in the heating step and the start of a subsequent step is delayed, a misalignment is made by comparing the shifted waveforms. In the present embodiment, the comparison is made in steps of each step, and thus, even if the step end condition is not satisfied and is set to HOLD, collation (matching) is possible regardless of the case.

In addition, the data matching process S140 may be configured to collate a recipe executed when an abnormality occurs with device data of all types and all items with a recipe before and after it. Further, if a type or item can be specified in response to an abnormality, the specific device data extracted for a specific type or specific item may be collated. For example, the specific device data is selected from the group consisting of temperature data, pressure data, gas flow data, heater power data, concentration data, and valve data.

<Data display process (S150)>

The data matching control unit 215c is configured to sequentially display on the operation display unit 227 from device data having a small matching rate from matching rates calculated for device data of all types and all items. For example, 10 pieces of data with poor matching rates (that is, 10 pieces of data in the order of lower matching rates) are displayed in FIG. 13 for a recipe executed when an abnormality occurs and a recipe executed before that. However, not according to this mode, for example, it may be displayed on the operation display unit 227 in order from device data having a small matching rate for each group, item, or step. In this embodiment, "group" is a data type such as temperature, pressure, and gas flow rate, and "item" is, for example, in the case of temperature data, the measured temperature value of the U zone, the measured temperature value of the CU zone, the measured temperature value of the C zone, It is the same temperature data as the temperature measured value of the CL zone and the temperature measured value of the L zone. Also the "gas flow" is, for example, the channel number of the MFC. In addition, the data matching control unit 215c may be differentiated and displayed according to the matching rate. The data matching control unit 215c may, for example, display the matching rate in red for device data having a matching rate of less than 80% and display the matching rate in blue for device data having a matching rate of 80% or more. Further, in the present embodiment, 10 device data are displayed in the order of poor matching rate, but the number is not limited thereto.

As described above, the data matching control unit 215c is configured to display on the operation display unit 227 in the order of device data having a small calculated matching rate, in other words, in the order of device data having a large data difference. As a result, it is possible to immediately determine which device data in a certain step caused the problem to occur, thereby contributing to shortening the problem analysis time and reducing analysis errors due to non-uniformity in the skill of the maintenance personnel.

Further, as shown in Fig. 19, the result of the data matching step (S140) may be displayed on the operation display unit 227 as a detailed data confirmation screen. This data detail confirmation screen is configured to display the matching rate of the total recipe (TOTAL) on the upper side. This is the average of the matching rates calculated from all categories and all items. In addition, it is preferable that the matching rate of the whole recipe is 80% or more.

In addition, the matching rate is displayed in units of type under the matching rate of the total recipe (TOTAL). Further, as shown in Fig. 19, a detailed data confirmation screen may be displayed for each type. In addition, FIG. 19 may be displayed as a data detail confirmation screen when a recipe is selected on a history reference screen to be described later.

As shown in FIG. 19, it is possible to predict which type (a type such as temperature and pressure) caused an abnormality in the detailed data confirmation screen. In addition, in the present embodiment, the matching rate is configured to be displayed by changing colors for each item (item) of less than 50%.

In the present embodiment, the result of collating two recipes of the recipe executed at the time of abnormal occurrence and the recipe executed before it through the data display process S150 is displayed, but the present embodiment is not limited to this form. For example, a recipe executed at the time of abnormal occurrence and a plurality of recipes may be collated, and the result of calculating the matching rate may be displayed in a time series. For example, the matching rate of the entire recipe TOTAL, the matching rate of the entire specific step, and the matching rate of the specific device data may be collectively displayed. Accordingly, it is possible to check the history of change in the matching rate until an abnormality occurs.

According to the present embodiment described above, when a recipe having the same condition as the recipe in which the abnormality occurred in the file selection step (S120) exists in the storage unit 215h, a recipe with the same condition is found as a result of the search. The case where it does not exist will be described below.

When the data matching control unit 215c searches the storage unit 215h of the device management controller 215 of the master device 1-M and detects a recipe with the same condition, the corresponding recipe file and the file related to the recipe file are stored. All are received from the master device 1-M, and stored in the storage unit 215h of the device 1 in which an abnormality has occurred. After the next step, it is omitted because it is the same. Further, even if the storage unit 215h in the master device is searched, if there is no recipe with the same condition, the storage unit 215h of the device management controller 215 of the other device 1 is searched. As a result, if a recipe with the same conditions is not searched, there is a clear misconfiguration, and the parameter setting becomes abnormal.

According to this embodiment, there are one or more effects described below.

(a) The data matching control unit 215c according to the present embodiment extracts device data before and after an abnormality occurs by referring to the abnormal analysis information, and displays the device data in the order of the lowest matching rate (in the order of the largest difference). Is configured to appear on. Accordingly, even if a maintenance person with low skill performs an abnormal analysis that takes a lot of time and a large amount of time, the data can be efficiently analyzed, and downtime when an abnormality occurs can be reduced.

(b) The data matching control unit 215c according to the present embodiment is configured to extract device data before and after an abnormality occurs with reference to the abnormal analysis information, and display the device data on the screen in the order of the largest difference. Thereby, the burden on the maintenance person who performs the abnormal analysis can be reduced, and it becomes possible to shorten the time it takes for the maintenance person to analyze the factors.

(c) The data matching control unit 215c according to the present embodiment is configured to extract device data before and after an abnormality occurs, and display the device data on the screen in the order of the largest difference. This makes it possible to shorten the time required for specifying an abnormal factor even when there is an artificial error (for example, an input error of the set value of the device data) by the maintenance person. In particular, even when there is an erroneous setting, which is one of the factors causing abnormal film formation, the time required for factor specification can be shortened.

(d) The data matching control unit 215c according to the present embodiment is configured to display a result of matching device data in time series from the execution of the recipe in which an abnormality has occurred on the screen. Accordingly, by viewing the history of change in the matching rate until the occurrence of an abnormality is observed, changes in the device data can be confirmed over time, so that the time taken for the maintenance personnel to analyze the abnormality factor can be shortened.

<Other Examples>

Next, a file (data) matching function (tool matching function) at the time of device setup by the data matching control unit 215c will be described with reference to FIGS. 14 to 19. In the present embodiment, the only difference is that the object of file comparison is a file held by each of the repeat devices 1-1 to 1-6 and the master device 1-M, and the flow shown in FIG. 215c) does the same.

In this embodiment, each of the data matching control units 215c of the repeat devices 1-1 to 1-6 directly communicates with the data matching control unit 215c of the master device 1-M, and A method of acquiring necessary device data from) will be described. In the present embodiment, the data matching control unit 215c executes a program that realizes the tool matching function, so that the repeating devices 1-1 to 1-6 are not interposed by a management device or a HOST computer, which is a kind of a host computer. ), it is possible to collate the files used in the master device (1-M) with files that have already been used and have a track record.

14, the name of the master device 1-M as initial information in the main controller storage unit 222 of the repeat devices 1-1 to 1-6, for example, the repeat device 1-2, and This is done so that you can set an IP address (Internet Protocol Address). The name and IP address of this master device 1-M are set by the operator from the operation display unit 227 of the repeat device 1-2, for example, but the repeat device 1-2 is from the master device 1-M. You may configure it to be sent to. The reason for using two pieces of information, an IP address and a name, for connection with the master device (1-M) is that after establishing a communication connection with the master device (1-M) by IP address, the device name is collated. This is because it is made into a structure. In this way, it is possible to prevent incorrect connection due to a misconfiguration of an IP address, and the worker can perform a matching (data matching) operation without being aware of the master device 1-M.

In the data matching control shown in Fig. 14, the data matching control unit 215c of the device 1 including the repeat device 1-2 is a recipe file from the main controller storage unit 222 of the master device 1-M. Alternatively, the parameter file is read, stored in the main controller storage unit 222 of the device 1, and checked (matched). In this embodiment, the recipe file of the master device 1-M and the recipe file of the device 1 are compared and compared. Further, the recipe file received from the master device 1-M may not be stored in the main controller storage unit 222, but may be stored in the storage unit 215h of the device 1 to perform file matching.

15 is a table defining a performance evaluation waveform. It is registered in advance in the master device (1-M), and up to 20 waveforms can be registered. This is because after the first unit of the device 1, that is, the master device 1-M, is delivered, the user acquires the optimum parameters while operating the device 1 and manages them as know-how. In order to match the performance of the device 1 and the master device 1-M at the time of the set-up (winning) operation, waveform data of the object to be matched (matched) related to the performance is defined as shown in FIG. 15 in advance. For example, specific waveform data such as a temperature rising waveform up to 1200°C or a decompression waveform up to 2 Pa are targeted, and the temperature waveform data of pipe heating that is not related to performance (not defined in FIG. 15) is not a matching object. By using the table shown in Fig. 15, the set-up operation can be carried out efficiently.

Fig. 16 shows an example of a history reference screen displayed when a button for referring to a history of data matching (tool matching) is pressed on a menu screen (not shown). 17 illustrates a detailed confirmation screen for data matching displayed when a temperature is selected.

As shown in Fig. 17, information on the number of steps of 80% or more and less than 80% of all the number of steps (for example, 20) of the process recipe is displayed, and each item (U, CU, It is configured to display the matching rates for C, CL, L). In addition, 84% of the matching rate described below indicates the matching rate of the device data regarding the temperature in the entire recipe. That is, it is the average value of the whole recipe of the matching rate calculated for each item in steps.

In addition, identification marks are made at more than 80% and less than 80%, making it easier to know which item and at which step the matching rate decreases. And when the button (Trace) for displaying the live waveform data is pressed, the live waveform data shown in FIG. 18 is displayed.

Fig. 18 shows the raw waveform data of each item (U, CU, C, CL, L) of the process file of the master device 1-M and each item (U, CU, C, CL) of the process file of the device 1 , L) is configured to be displayed from a preset step.

Items with poor matching rates can be compared in live waveform data as described above.

According to this embodiment, there are one or more effects described below.

(a) The data matching control unit 215c according to the present embodiment calculates the matching rate in steps of the process recipe and matches each item of a plurality of types (temperature, gas, etc.) (e.g., measured temperature values in the U zone). It is configured to easily extract device data with a low rate. As a result, it is possible to display only information on the performance of the device, so that downtime during setup can be reduced.

(b) The data matching control unit 215c according to the present embodiment calculates the matching rate in steps of the process recipe and matches each item of a plurality of types (temperature, gas, etc.) (e.g., measured temperature values in the U zone). It is configured to easily extract device data with a low rate. Thereby, it is possible to reduce the burden of the operator performing the set-up operation, and it becomes possible to shorten the time required for the operator to perform the set-up operation.

Further, the substrate processing apparatus 1 in the embodiment of the present invention can be applied not only to a semiconductor manufacturing apparatus for manufacturing a semiconductor, but also an apparatus for processing a glass substrate such as an LCD device. It goes without saying that it is also applicable to various substrate processing apparatuses such as exposure apparatuses, lithographic apparatuses, coating apparatuses, and processing apparatuses using plasma.

1: substrate processing device 215: device management controller
215c: data matching control unit 215e: device state monitoring control unit
215h: storage unit 227: operation display unit

Claims (13)

A storage unit for storing device data generated when executing a recipe including a plurality of steps; And
The recipe in which the abnormal phenomenon occurred every unit time while matching the start time of the recipe in which the abnormal phenomenon occurred and the recipe stored in the memory unit under the same conditions as the recipe in which the abnormal phenomenon occurred based on data time information related to data abnormal analysis related information The absolute value of the data difference between the first device data acquired from and the second device data acquired from the recipe stored in the storage unit is calculated, and the absolute value is compared with a preset threshold value for each unit time, and the step unit A data control unit that determines whether the first device data and the second device data match.
A substrate processing apparatus comprising a. The method of claim 1,
The data control unit is configured to display on the display device a ratio in which the first device data and the second device data match within a predetermined period as a result of the determination. The method of claim 1,
The data control unit,
A calculation unit that calculates a ratio in which the first device data and the second device data match; And
A comparison unit that determines whether the first device data and the second device data match
Operation unit equipped with
The substrate processing apparatus further comprising a. The method of claim 3,
Further comprising a calculation unit for calculating a standard deviation using the absolute value of the data difference between the first device data and the second device data,
The operation unit compares the absolute value and a threshold value calculated using the standard deviation to determine whether the first device data and the second device data match. delete The method of claim 4,
The data control unit is configured to calculate a matching rate based on a difference between the first device data and the second device data. The method of claim 6,
Further comprising a display device for displaying the matching rate,
The display device is configured to display a matching rate with a recipe in which the abnormal phenomenon has occurred for each batch in which the recipe has been executed. The method of claim 6,
Further comprising a display device for displaying the matching rate,
The display device is configured to display a matching rate of a recipe in which the abnormal phenomenon has occurred with respect to specific device data among the device data. The method of claim 8,
The specific device data is configured to be selected from a group consisting of temperature data, pressure data, gas flow data, heater power data, concentration data, and valve data. The method of claim 1,
When the data control unit selects a recipe executed under the same conditions as the recipe in which the abnormal phenomenon occurs from the storage unit, when there is no recipe executed under the same condition in the storage unit, the recipe in which the abnormal phenomenon occurs from an external device A substrate processing apparatus configured to retrieve and receive a recipe executed under the same conditions as. A storage unit for storing device data generated when executing a recipe including a plurality of steps; And
The recipe in which the abnormal phenomenon occurred every unit time while matching the start time of the recipe in which the abnormal phenomenon occurred and the recipe stored in the memory unit under the same conditions as the recipe in which the abnormal phenomenon occurred based on data time information related to data abnormal analysis related information The absolute value of the data difference between the first device data acquired from and the second device data acquired from the recipe stored in the storage unit is calculated, and the absolute value is compared with a preset threshold value for each unit time, and the step unit A data control unit configured to determine whether the first device data and the second device data match
Device management controller comprising a. In a device management controller including a storage unit for storing device data generated when executing a recipe including a plurality of steps for processing a substrate,
The recipe in which the abnormal phenomenon occurred every unit time while matching the start time of the recipe in which the abnormal phenomenon occurred and the recipe stored in the memory unit under the same conditions as the recipe in which the abnormal phenomenon occurred based on data time information related to data abnormal analysis related information A procedure of calculating an absolute value of a data difference between the first device data acquired from and the second device data acquired from the recipe stored in the storage unit; And
The order of comparing the absolute value with a preset threshold value for each unit time and determining whether the first device data and the second device data coincide with each other in the step unit
A computer program recorded on a recording medium that executes. A method for manufacturing a semiconductor device including a substrate processing step of processing a substrate by executing a recipe including a plurality of steps,
In the substrate processing step, the device data generated when executing the recipe is stored in a storage unit;
The recipe in which the abnormal phenomenon occurred every unit time while matching the start time of the recipe in which the abnormal phenomenon occurred and the recipe stored in the memory unit under the same conditions as the recipe in which the abnormal phenomenon occurred based on data time information related to data abnormal analysis related information Calculating an absolute value of a data difference between the first device data acquired from and the second device data acquired from the recipe stored in the storage unit; And
Comparing the absolute value with a preset threshold value for each unit time, and determining whether the first device data and the second device data coincide with each other in the step unit
A method of manufacturing a semiconductor device comprising a.

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