KR102276520B1 - 발열체용 지지 시스템 - Google Patents

발열체용 지지 시스템 Download PDF

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Publication number
KR102276520B1
KR102276520B1 KR1020167026884A KR20167026884A KR102276520B1 KR 102276520 B1 KR102276520 B1 KR 102276520B1 KR 1020167026884 A KR1020167026884 A KR 1020167026884A KR 20167026884 A KR20167026884 A KR 20167026884A KR 102276520 B1 KR102276520 B1 KR 102276520B1
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KR
South Korea
Prior art keywords
heating element
support
support member
heating
support system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
KR1020167026884A
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English (en)
Korean (ko)
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KR20160141722A (ko
Inventor
바딤 보구스라프스키
아르노 플란켄슈타이너
Original Assignee
플란제 에스이
플란제 유에스에이 엘엘씨
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Publication of KR20160141722A publication Critical patent/KR20160141722A/ko
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Publication of KR102276520B1 publication Critical patent/KR102276520B1/ko
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    • H01L21/67103—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
    • F16M13/00—Other supports for positioning apparatus or articles; Means for steadying hand-held apparatus or articles
    • F16M13/02—Other supports for positioning apparatus or articles; Means for steadying hand-held apparatus or articles for supporting on, or attaching to, an object, e.g. tree, gate, window-frame, cycle
    • H01L21/6835—
    • H01L21/68764—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/06—Control, e.g. of temperature, of power
    • H05B6/08—Control, e.g. of temperature, of power using compensating or balancing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020167026884A 2014-04-08 2015-01-27 발열체용 지지 시스템 Active KR102276520B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/247,427 2014-04-08
US14/247,427 US9719629B2 (en) 2014-04-08 2014-04-08 Supporting system for a heating element and heating system
PCT/EP2015/000144 WO2015154835A1 (en) 2014-04-08 2015-01-27 Supporting system for a heating element

Publications (2)

Publication Number Publication Date
KR20160141722A KR20160141722A (ko) 2016-12-09
KR102276520B1 true KR102276520B1 (ko) 2021-07-13

Family

ID=52473857

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167026884A Active KR102276520B1 (ko) 2014-04-08 2015-01-27 발열체용 지지 시스템

Country Status (8)

Country Link
US (1) US9719629B2 (https=)
EP (1) EP3130003B1 (https=)
JP (1) JP6423893B2 (https=)
KR (1) KR102276520B1 (https=)
CN (1) CN106165080B (https=)
SG (1) SG11201607804TA (https=)
TW (1) TWI623965B (https=)
WO (1) WO2015154835A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101749116B1 (ko) * 2015-05-08 2017-06-20 엘지전자 주식회사 조리기기
JP1581406S (https=) * 2016-10-14 2017-07-18
USD921431S1 (en) * 2019-04-01 2021-06-08 Veeco Instruments, Inc. Multi-filament heater assembly
JP1684469S (ja) * 2020-09-24 2021-05-10 基板処理装置用天井ヒータ
CN116356292B (zh) * 2021-12-27 2025-07-08 南昌中微半导体设备有限公司 一种加热器组件及气相沉积设备

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11354260A (ja) 1998-06-11 1999-12-24 Shin Etsu Chem Co Ltd 複層セラミックスヒータ
JP4398064B2 (ja) * 2000-05-12 2010-01-13 日本発條株式会社 加熱装置
US6506252B2 (en) * 2001-02-07 2003-01-14 Emcore Corporation Susceptorless reactor for growing epitaxial layers on wafers by chemical vapor deposition
US7645342B2 (en) * 2004-11-15 2010-01-12 Cree, Inc. Restricted radiated heating assembly for high temperature processing
US7573004B1 (en) * 2006-02-21 2009-08-11 Structured Materials Inc. Filament support arrangement for substrate heating apparatus
DK2071987T3 (da) * 2007-12-18 2010-08-09 Nestec Sa Indretning til fremstilling af en drikkevare omfattende en justerbar lukkemekanisme
DE102009023472B4 (de) * 2009-06-02 2014-10-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Beschichtungsanlage und Beschichtungsverfahren
JP5902085B2 (ja) * 2009-08-07 2016-04-13 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 処理チャンバ内で基板を位置決めするための装置及び処理チャンバ内で基板をセンタリングするための方法
JP5480723B2 (ja) * 2010-06-02 2014-04-23 助川電気工業株式会社 熱電子放出用フィラメントサポート
TWI565367B (zh) * 2010-06-25 2017-01-01 山特維克熱傳動公司 用於加熱元件線圈之支撐結構
US9594724B2 (en) * 2012-08-09 2017-03-14 International Business Machines Corporation Vector register file

Also Published As

Publication number Publication date
EP3130003A1 (en) 2017-02-15
SG11201607804TA (en) 2016-10-28
TWI623965B (zh) 2018-05-11
CN106165080A (zh) 2016-11-23
TW201539530A (zh) 2015-10-16
WO2015154835A1 (en) 2015-10-15
US20150289319A1 (en) 2015-10-08
KR20160141722A (ko) 2016-12-09
JP6423893B2 (ja) 2018-11-14
JP2017516297A (ja) 2017-06-15
US9719629B2 (en) 2017-08-01
EP3130003B1 (en) 2018-05-02
CN106165080B (zh) 2019-04-23

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