KR102264283B1 - Manufacturing method of plate type heat spreader having excellent formability and binding - Google Patents

Manufacturing method of plate type heat spreader having excellent formability and binding Download PDF

Info

Publication number
KR102264283B1
KR102264283B1 KR1020190104193A KR20190104193A KR102264283B1 KR 102264283 B1 KR102264283 B1 KR 102264283B1 KR 1020190104193 A KR1020190104193 A KR 1020190104193A KR 20190104193 A KR20190104193 A KR 20190104193A KR 102264283 B1 KR102264283 B1 KR 102264283B1
Authority
KR
South Korea
Prior art keywords
protruding
spreader plate
channel
spreader
plate
Prior art date
Application number
KR1020190104193A
Other languages
Korean (ko)
Other versions
KR20210024721A (en
Inventor
이삼일
서진국
Original Assignee
주식회사 쿨링스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 쿨링스 filed Critical 주식회사 쿨링스
Priority to KR1020190104193A priority Critical patent/KR102264283B1/en
Publication of KR20210024721A publication Critical patent/KR20210024721A/en
Application granted granted Critical
Publication of KR102264283B1 publication Critical patent/KR102264283B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Abstract

본 발명은, 중앙부위에는 복수 개의 채널(12)이 형성된 채널부(11)가 마련되고, 채널부(11) 좌우에는 일정폭의 제1, 2지지부(13, 15)가 마련되는 판상 구조의 스프레더판(10)을 압출성형하는 단계; 압출된 스프레더판(10)의 제1, 2지지부(13, 15) 각각의 모서리 일측부위 및 타측부위 각각을 절단하여, 스프레더판(10) 일측부위에는 제1돌출채널부(111)를 형성하고 스프레더판(10) 타측부위에는 제2돌출채널부(112)를 형성하는 단계; 스프레더판(10)의 타측부위에 돌출된 제2돌출채널부(112)를 절단하며 스프레더판(10)의 타측부위를 밀봉하는 단계; 스프레더판(10)의 일측부위에 돌출된 제1돌출채널부(112) 각각의 채널(12)에 열매체를 주입하는 단계; 스프레더판(10)의 일측부위에 돌출된 제1돌출채널부(111)를 절단하며 스프레더판(10)의 일측부위를 밀봉하는 단계;를 포함하고, 상기 제1, 2지지부(13, 15)에는 절개부(133, 134) 및 관통공(153, 154)을 형성하는 단계;를 더 포함하는 가공성 및 결합성이 향상된 평판형 히트 스프레더 제조방법을 제공한다.In the present invention, a channel portion 11 having a plurality of channels 12 is provided in the central portion, and first and second support portions 13 and 15 of a certain width are provided on the left and right sides of the channel portion 11. Spreader of a plate-like structure extruding the plate 10; The first and second support parts 13 and 15 of the extruded spreader plate 10 are cut by cutting one side and the other side, respectively, to form a first protruding channel part 111 on one side of the spreader plate 10, and forming a second protruding channel part 112 on the other side of the spreader plate 10; cutting the second protruding channel part 112 protruding from the other side of the spreader plate 10 and sealing the other side of the spreader plate 10; injecting a heating medium into each channel 12 of the first protruding channel part 112 protruding from one side of the spreader plate 10; cutting the first protruding channel part 111 protruding from one side of the spreader plate 10 and sealing one side of the spreader plate 10; including, the first and second support parts 13 and 15 It provides a method of manufacturing a flat heat spreader with improved processability and bonding properties, further comprising; forming cutouts 133 and 134 and through holes 153 and 154.

Description

가공성 및 결합성이 향상된 평판형 히트 스프레더 제조방법{Manufacturing method of plate type heat spreader having excellent formability and binding}Manufacturing method of plate type heat spreader having excellent formability and binding

본 발명은 히트 스프레더 제조방법에 관한 것으로, 더욱 구체적으로는 열매체의 유동과 관련된 채널부 자체의 손상이나 훼손 없이 전자기기와의 조립에 필요한 관통공을 매우 용이하게 가공할 수 있음은 물론 전자기기와의 결합력을 상당부분 증진시키는 것이 가능한 평판형 히트 스프레더 제조방법에 관한 것이다.The present invention relates to a method for manufacturing a heat spreader, and more particularly, it is possible to very easily process a through hole required for assembling an electronic device without damage or damage to the channel part itself related to the flow of a heating medium. It relates to a method for manufacturing a flat plate heat spreader capable of significantly enhancing the bonding force of the

히트 스프레더(heat spreader)는 소형의 이동통신단말기는 물론 대형 TV 등에 장착되어 전자기기들로부터 열을 흡수하고 방출하는 일종의 열 전달기구로서, 알루미늄 소재와 같이 가벼우면서 열 전도성이 뛰어난 금속을 압출 성형하여 내부에 복수 개의 채널을 형성한 다음, 각 채널에 열매체를 주입한 다음 밀봉하는 방식으로 제조된다.
한편, 일정 형상으로 제조된 히트 스프레더를 특정 전자기기에 장착하기 위해서는 히트 스프레더의 특정 부위를 가공하여 절단하거나, 또는 히트 스프레더의 모서리 부위를 따라 다양한 모양의 관통공을 형성하게 되는데, 이러한 가공이나 관통 작업 중에 열매체가 주입되어 있는 히트 스프레더의 채널이 손상될 염려가 있다.
이를 위해 관련업계에서는, 압출성형을 통해 복수 개의 채널이 형성되면, 형성된 채널 중에서 중앙부위 채널에만 열매체를 주입하고, 좌우 모서리 부위 채널은 비워둠으로써, 추후 가공이나 관통 작업 과정에서 열매체가 주입되어 있는 채널 자체가 손상되는 현상을 방지하고 있다.
하지만, 이러한 방식은 열매체의 주입 여부와 상관없이 압출성형시 소재 전체에 채널을 형성시켜야 한다는 점에서 공정 자체가 비효율적이며, 가공부위나 관통부위가 채널이 형성되어 있는 지점에 형성된다는 점에서 가공성이 좋지 못할 뿐 아니라 전자기기와의 결합성이 현저히 떨어지는 문제가 있었다.A heat spreader is a type of heat transfer mechanism that absorbs and radiates heat from electronic devices installed in small mobile communication terminals as well as large TVs. It is manufactured by forming a plurality of channels inside, and then injecting a heating medium into each channel and then sealing.
On the other hand, in order to mount a heat spreader manufactured in a certain shape to a specific electronic device, a specific part of the heat spreader is processed and cut, or through holes of various shapes are formed along the edge of the heat spreader. There is a risk that the channel of the heat spreader into which the heating medium is injected may be damaged during operation.
To this end, in the related industry, when a plurality of channels are formed through extrusion molding, the heating medium is injected only in the central channel among the formed channels, and the left and right corner channels are empty, so that the channel in which the heating medium is injected in the process of subsequent processing or penetration. It prevents itself from being damaged.
However, in this method, the process itself is inefficient in that a channel must be formed in the entire material during extrusion regardless of whether the heating medium is injected, and the processability is improved in that the processed or penetrating portion is formed at the point where the channel is formed. Not only was it not good, but there was a problem that the compatibility with electronic devices was significantly lowered.

대한민국 등록실용신안 제0411135호Republic of Korea Registered Utility Model No. 0411135

본 발명은 이러한 종래 기술의 문제점을 해결하기 위해 제안된 것으로서, 본 발명의 목적은 전자기기에의 장착을 위한 필요한 가공이 용이할 뿐 아니라 전자기기와의 결합성을 제고시킬 수 있는 히트 스프레더 제조방법을 제안함에 있다.The present invention has been proposed to solve the problems of the prior art, and an object of the present invention is a method for manufacturing a heat spreader that can improve the bondability with the electronic device as well as facilitate the processing required for mounting on the electronic device. is in proposing.

본 발명은 이러한 목적을 달성하기 위하여, 중앙부위에는 복수 개의 채널(12)이 형성된 채널부(11)가 마련되고, 채널부(11) 좌우에는 일정폭의 제1, 2지지부(13, 15)가 마련되는 판상 구조의 스프레더판(10)을 압출성형하는 단계; 압출된 스프레더판(10)의 제1, 2지지부(13, 15) 각각의 모서리 일측부위 및 타측부위 각각을 절단하여, 스프레더판(10) 일측부위에는 제1돌출채널부(111)를 형성하고 스프레더판(10) 타측부위에는 제2돌출채널부(112)를 형성하는 단계; 스프레더판(10)의 타측부위에 돌출된 제2돌출채널부(112)를 절단하며 스프레더판(10)의 타측부위를 밀봉하는 단계; 스프레더판(10)의 일측부위에 돌출된 제1돌출채널부(111) 각각의 채널(12)에 열매체를 주입하는 단계; 스프레더판(10)의 일측부위에 돌출된 제1돌출채널부(111)를 절단하며 스프레더판(10)의 일측부위를 밀봉하는 단계;를 포함하고, 상기 제1, 2지지부(13, 15)에는 절개부(133, 134) 및 관통공(153, 154)을 형성하는 단계;를 더 포함하는 것을 그 기술적 특징으로 한다.In the present invention, in order to achieve this object, a channel portion 11 having a plurality of channels 12 is provided in the central portion, and first and second support portions 13 and 15 having a predetermined width are provided on the left and right sides of the channel portion 11. Extruding the provided spreader plate 10 of the plate-like structure; The first and second support parts 13 and 15 of the extruded spreader plate 10 are cut by cutting one side and the other side, respectively, to form a first protruding channel part 111 on one side of the spreader plate 10, and forming a second protruding channel part 112 on the other side of the spreader plate 10; cutting the second protruding channel part 112 protruding from the other side of the spreader plate 10 and sealing the other side of the spreader plate 10; injecting a heating medium into each channel 12 of the first protruding channel part 111 protruding from one side of the spreader plate 10; cutting the first protruding channel part 111 protruding from one side of the spreader plate 10 and sealing one side of the spreader plate 10; including, the first and second support parts 13 and 15 It is characterized in that it further comprises; forming the cutouts (133, 134) and the through-holes (153, 154).

본 발명은 스프레더판을 압출 성형함에 있어 채널이 형성되는 채널부 좌우에 일정폭 및 일정두께를 가지는 지지부를 동시에 마련하여, 지지부에 대하여 전자기기와의 조립을 위해 필요한 관통공 등을 가공하는 방법을 제안함으로써, 열매체의 유동과 관련된 채널부 자체의 손상이나 훼손 없이 필요한 관통공을 매우 용이하게 가공할 수 있음은 물론 전자기기와의 결합력을 상당부분 증진시키는 것이 가능하다.The present invention provides a method of simultaneously providing a support part having a predetermined width and a predetermined thickness on the left and right sides of a channel portion where a channel is formed in extrusion molding a spreader plate, and processing a through hole required for assembly with an electronic device with respect to the support portion. By making the proposal, it is possible to process a required through hole very easily without damaging or damaging the channel part itself related to the flow of the heating medium, as well as significantly enhancing the bonding force with the electronic device.

도 1 내지 도 5 각각은 본 발명에 따른 히트 스프레더의 개략적인 제조 단계도.
도 6은 본 발명에 따라 제조된 히트 스프레더의 개략적인 일 구성도.
도 7은 복수 개의 채널이 형성된 종래 히트 스프레더의 개략적인 일 구성도.1 to 5 each is a schematic manufacturing step diagram of a heat spreader according to the present invention.
6 is a schematic configuration diagram of a heat spreader manufactured according to the present invention.
7 is a schematic configuration diagram of a conventional heat spreader in which a plurality of channels are formed.

본 발명에 따른 바람직한 실시예를 첨부된 도면을 참조하여 상세하게 살펴보면 다음과 같은데, 본 발명의 실시예를 상술함에 있어 본 발명의 기술적 특징과 직접적인 관련성이 없거나, 또는 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에게 자명한 사항에 대해서는 그 상세한 설명을 생략하기로 한다.
본 발명은 스프레더판(10)의 압출성형단계, 제1, 2돌출채널부(111, 112) 형성단계, 제2돌출채널부(112) 절단단계, 열매체 주입단계, 제1돌출채널부(111) 절단단계를 포함하여 이루어지는 히트 스프레더의 제조방법을 제안함에 그 기술적 특징이 있다. 이하 이들 각 단계를 첨부된 도면을 참조하여 구체적으로 살펴본다.
먼저, 판상 구조로 이루어지는 스프레더판(10)을 준비한다. 스프레더판(10)은 알루미늄 소재로 이루어질 수 있으며 관련 업계에 널리 알려져 있는 압출 성형 방식으로 제조될 수 있다.
이때, 스프레더판(10)에 대한 압출 성형은 도 1과 같이, 그 중앙부위에는 복수 개의 채널(12)이 형성된 채널부(11)가 마련되고, 채널부(11)의 좌우에는 일정폭을 가지는 제1, 2지지부(13, 15)가 마련되는 구조로 이루어지는 것이 바람직하다.
즉, 중앙부위에는 열매체가 주입되어 유동할 수 있는 공간으로서의 채널들을 형성시키고, 채널의 좌우 각각에는 전자기기 등과의 결합을 위해 채널이 형성되지 않은 상태로 일정폭 및 일정두께를 가지는 지지부를 형성시키는 것이다.
스프레더판(10)이 압출 성형되면, 도 2와 같이 스프레더판(10)의 일측부위 및 타측부위 각각에 제1, 2돌출채널부(111, 112) 각각을 형성시킨다. 제1, 2돌출채널부(111, 112) 각각의 형성은 아래와 같이 형성될 수 있다.
먼저, 스프레더판(10)의 제1, 2지지부(13, 15) 각각에 있어 채널부(11)의 좌우 최외곽에 위치하는 채널(12)의 외벽이 일정 강도를 가질 수 있는 정도의 폭을 남겨두고, 도 2와 같이 제1, 2지지부(13, 15) 각각의 모서리 일측부위 및 타측부위 각각을 절단한다.
제1, 2지지부(13, 15) 각각의 모서리 일측부위 및 타측부위 각각이 절단되면, 스프레더판(10)의 제1지지부(13)의 일측부위 및 타측부위 각각의 모서리에는 제1, 2절단면(131, 132)이 형성되고, 스프레더판(10)의 제2지지부(15)의 일측부위 및 타측부위 각각의 모서리에는 제3, 4절단면(151, 152)이 형성된다.
이에 따라, 스프레더판(10) 일측부위에는 제1돌출채널부(111)가 돌출 형성되고, 스프레더판(10) 타측부위에는 제2돌출채널부(112)가 돌출 형성되는 것이다.
도면부호 133, 153 각각은 본 발명을 전자기기 등과 같은 기구와의 결합시 상대 기구의 돌출부나 장애물 등과의 간섭을 방지하기 위한 절개부이고, 도면부호 134, 154 각각은 스크류나 볼트 또는 리벳을 위한 관통공이다.
스프레더판(10)의 일측부위 및 타측부위 각각에 제1, 2돌출채널부(111, 112) 각각이 형성되면, 이 중에서 스프레더판(10)의 타측부위에 돌출된 제2돌출채널부(112)를 절단하며 스프레더판(10)의 타측부위를 밀봉한다.
제2돌출채널부(112)에 대한 절단은 도 3과 같이 임의 절단장치(1)에 의해 수행될 수 있다. 이때, 절단장치(1)는 일정 온도로 유지되는 열간 압착장치에 의해 수행되는 것이 바람직하다. 왜냐하면, 절단 단계에서 그 면이 용융되어 완전히 밀봉될 수 있기 때문이다.
이 단계가 완료되면, 제2돌출채널부(112)가 형성되어 있던 스프레더판(10)의 타측부위에는 제2밀봉면(114)이 형성된다. 제2밀봉면(114)은 도면과 같이 제2, 4절단면(132, 152) 각각과 평행하게 연결되는 구성으로 이루어지는 것이 바람직하다.
제2돌출채널부(112)가 절단되어 제2밀봉면(114)이 형성되면, 도 4와 같이 제1돌출채널부(111)에 마련되는 각 각 채널(12)로 일정 양의 열매체를 주입한다. 열매체는 액체-기체 상호간의 상변화에 의해 전자기기의 작동 과정에서 발생하는 열을 용이하게 흡수할 수 있는 물질 중의 어느 하나로 이루어질 수 있다.
열매체의 주입이 완료되면, 각 채널(12) 내부를 진공 상태를 만든다. 이러한 작업은 각 채널로의 열매체 주입 이전에 수행될 수도 있다. 즉, 작업의 용이성을 감안하여, 각 채널을 진공 상태로 만든 다음 열매체를 주입할 수도 있고 이와 달리 열매체를 주입한 다음 진공 상태를 형성할 수도 있다.
열매체가 주입되어 각 채널이 진공 상태를 이루면, 도 5와 같이 스프레더판(10)의 일측부위에 돌출되어 있는 제1돌출채널부(111)를 절단하며 스프레더판(10)의 일측부위를 밀봉한다.
제1돌출채널부(111)에 대한 절단 작업 역시 제2돌출채널부(112)와 동일하게 임의 절단장치(1)에 의해 수행될 수 있으며, 그 절단장치(1)는 일정 온도로 유지되는 열간 압착장치로 이루어지는 것이 바람직하다. 이 단계가 완료되면, 제1돌출채널부(111)가 형성되어 있던 스프레더판(10)의 일측부위에는 제1밀봉면(113)이 형성된다.
제2밀봉면(114)과 동일하게, 제1밀봉면(113) 역시 제1, 3절단면(131, 151) 각각과 평행하게 연결되는 구성으로 이루어지는 것이 바람직하다. 본 발명은 제2, 1돌출채널부(112, 111) 순서로 절단 작업이 이루어지는 경우를 상정하여 설명하였으나, 이와 달리 제1, 2돌출채널부(111, 112) 순서로 절단 작업이 이루어질수 있음은 물론이다.
도 6에는 본 발명에 따라 제조된 히트 스프레더(100)의 일례가 개시되어 있다. 도면에 개시된 것과 같이, 본 발명은 스프레더판을 압출 성형함에 있어 채널이 형성되는 채널부 좌우에 일정폭 및 일정두께를 가지는 지지부를 동시에 마련하는 특징이 있다.
이럴 경우, 전자기기와의 조립을 위해 필요한 관통공 등은 열매체의 유동과 관련된 채널부 자체의 손상이나 훼손 없이 지지부를 이용하여 매우 용이하게 가공할 수 있음은 물론, 지지부 자체가 일정두께를 가지고 있다는 점에서 전자기기와의 조립시 그 결합력을 상당부분 제고할 수 있게 된다.
상기에서는 본 발명의 바람직한 실시예들에 한정하여 설명하였으나 이는 단지 예시일 뿐이며, 본 발명은 이에 한정되지 않고 여러 다양한 방법으로 변경되어 실시될 수 있으며, 나아가 개시된 기술적 사상에 기초하여 별도의 기술적 특징이 부가되어 실시될 수 있음은 자명하다 할 것이다.A preferred embodiment according to the present invention will be described in detail with reference to the accompanying drawings as follows. In the description of the embodiments of the present invention, there is no direct relation to the technical features of the present invention, or it is common in the technical field to which the present invention pertains. For matters that are obvious to those with the knowledge of , the detailed description thereof will be omitted.
The present invention relates to the extrusion molding step of the spreader plate 10, the first and second projecting channel portions 111 and 112 forming step, the second projecting channel portion 112 cutting step, the heating medium injection step, the first projecting channel portion 111 ) There is a technical feature in proposing a method for manufacturing a heat spreader comprising a cutting step. Hereinafter, each of these steps will be described in detail with reference to the accompanying drawings.
First, a spreader plate 10 having a plate-like structure is prepared. The spreader plate 10 may be made of an aluminum material, and may be manufactured by extrusion molding well known in the related art.
At this time, in the extrusion molding of the spreader plate 10, as shown in FIG. 1, a channel portion 11 having a plurality of channels 12 is provided in the central portion thereof, and on the left and right sides of the channel portion 11, a product having a certain width It is preferable to have a structure in which 1 and 2 support parts 13 and 15 are provided.
That is, the central portion is to form channels as a space in which a heating medium can be injected and flow, and on each left and right of the channel, a support portion having a predetermined width and a predetermined thickness is formed in a state in which a channel is not formed for coupling with an electronic device, etc. .
When the spreader plate 10 is extrusion-molded, the first and second protruding channel portions 111 and 112 are respectively formed on one side and the other side of the spreader plate 10, respectively, as shown in FIG. 2 . Each of the first and second protruding channel portions 111 and 112 may be formed as follows.
First, in each of the first and second support parts 13 and 15 of the spreader plate 10, the outer wall of the channel 12 positioned at the left and right outermost sides of the channel part 11 was measured to have a certain strength. Left, as shown in Figure 2, each of the corners of the first and second support parts 13 and 15, one side and the other side are cut.
When one side portion and the other side portion of each of the first and second support portions 13 and 15 are cut, each of the first and second cut surfaces of the first and second portions of the first support portion 13 of the spreader plate 10 is at each corner. 131 and 132 are formed, and third and fourth cut surfaces 151 and 152 are formed at the corners of one side and the other side of the second support part 15 of the spreader plate 10, respectively.
Accordingly, the first protruding channel part 111 is protruded from one side of the spreader plate 10 , and the second protruding channel part 112 is protruded from the other side of the spreader plate 10 .
Reference numerals 133 and 153 are cutouts for preventing interference with protrusions or obstacles of the counterpart device when the present invention is combined with a device such as an electronic device, and reference numerals 134 and 154 are for screws, bolts or rivets, respectively. is a through hole.
When the first and second protruding channel parts 111 and 112 are respectively formed on one side and the other side of the spreader plate 10, the second protruding channel part 112 protrudes from the other side of the spreader plate 10 among them. ) is cut and the other side of the spreader plate 10 is sealed.
Cutting for the second protruding channel portion 112 may be performed by an arbitrary cutting device 1 as shown in FIG. 3 . At this time, the cutting device 1 is preferably performed by a hot pressing device maintained at a constant temperature. This is because, in the cutting step, the surface can be melted and completely sealed.
When this step is completed, the second sealing surface 114 is formed on the other side of the spreader plate 10 on which the second protruding channel portion 112 is formed. It is preferable that the second sealing surface 114 is configured to be connected in parallel to each of the second and fourth cut surfaces 132 and 152 as shown in the drawing.
When the second protruding channel part 112 is cut to form the second sealing surface 114 , a predetermined amount of heat medium is injected into each channel 12 provided in the first protruding channel part 111 as shown in FIG. 4 . do. The heating medium may be made of any one of materials that can easily absorb heat generated in the operation process of the electronic device due to the phase change between liquid and gas.
When the injection of the heating medium is completed, a vacuum state is created inside each channel 12 . This operation may be performed prior to injection of the heating medium into each channel. That is, in consideration of the ease of operation, the heating medium may be injected after making each channel in a vacuum state, or alternatively, the heating medium may be injected and then the vacuum state may be formed.
When the heating medium is injected and each channel is in a vacuum state, the first protruding channel part 111 protruding from one side of the spreader plate 10 is cut as shown in FIG. 5 and one side of the spreader plate 10 is sealed. .
The cutting operation for the first protruding channel part 111 may also be performed by an arbitrary cutting device 1 in the same way as the second protruding channel part 112, and the cutting device 1 is hot maintained at a constant temperature. It is preferably made of a pressing device. When this step is completed, a first sealing surface 113 is formed on one side of the spreader plate 10 on which the first protruding channel portion 111 is formed.
Like the second sealing surface 114 , it is preferable that the first sealing surface 113 also be configured to be connected in parallel to the first and third cut surfaces 131 and 151 , respectively. The present invention has been described on the assumption that the cutting operation is performed in the order of the second and first protruding channel parts 112 and 111, but unlike this, the cutting operation can be performed in the order of the first and second protruding channel parts 111 and 112. Of course.
6 shows an example of a heat spreader 100 manufactured according to the present invention. As shown in the drawings, the present invention is characterized by simultaneously providing support portions having a predetermined width and a predetermined thickness on the left and right sides of the channel portion where the channels are formed in extrusion molding the spreader plate.
In this case, the through-holes required for assembly with the electronic device can be processed very easily using the support without damage or damage to the channel part itself related to the flow of the heating medium, and the support part itself has a certain thickness. In this regard, it is possible to significantly improve the bonding force when assembling with electronic devices.
In the above description, limited to preferred embodiments of the present invention, this is only an example, the present invention is not limited thereto and can be changed and implemented in various ways, and further, separate technical features are provided based on the disclosed technical idea. It will be obvious that it can be implemented in addition.

10 : 스프레더판 11 : 채널부
12 : 채널 13, 15 : 제1, 2지지부
111, 112 : 제1, 2돌출채널부 113, 114 : 제1, 2밀봉면
131, 132, 151, 152 : 제1, 2, 3, 4절단면10: spreader plate 11: channel part
12: channels 13 and 15: first and second support parts
111, 112: first and second protruding channel parts 113, 114: first and second sealing surfaces
131, 132, 151, 152: 1st, 2nd, 3rd, 4th cut section

Claims (1)

중앙부위에는 복수 개의 채널(12)이 형성된 채널부(11)가 마련되고, 채널부(11) 좌우에는 일정폭의 제1, 2지지부(13, 15)가 마련되는 판상 구조의 스프레더판(10)을 압출성형하는 단계;
압출된 스프레더판(10)의 제1, 2지지부(13, 15) 각각의 모서리 일측부위 및 타측부위 각각을 절단하여, 스프레더판(10) 일측부위에는 제1돌출채널부(111)를 형성하고 스프레더판(10) 타측부위에는 제2돌출채널부(112)를 형성하는 단계;
상기 제1, 2지지부(13, 15)에 각각 절개부(133, 153) 및 관통공(134, 154)을 형성하는 단계;
스프레더판(10)의 타측부위에 돌출된 제2돌출채널부(112)를 절단하며 스프레더판(10)의 타측부위를 밀봉하는 단계;
스프레더판(10)의 일측부위에 돌출된 제1돌출채널부(111) 각각의 채널(12)에 열매체를 주입하는 단계;
스프레더판(10)의 일측부위에 돌출된 제1돌출채널부(111)를 절단하며 스프레더판(10)의 일측부위를 밀봉하는 단계;를 포함하는 가공성 및 결합성이 향상된 평판형 히트 스프레더 제조방법.
A spreader plate 10 having a plate-like structure in which a channel portion 11 having a plurality of channels 12 is formed in the central portion, and first and second support portions 13 and 15 having a predetermined width are provided on the left and right sides of the channel portion 11 extruding;
The first and second support parts 13 and 15 of the extruded spreader plate 10 are cut by cutting one side and the other side, respectively, to form a first protruding channel part 111 on one side of the spreader plate 10, and forming a second protruding channel part 112 on the other side of the spreader plate 10;
forming cutouts 133 and 153 and through holes 134 and 154 in the first and second support portions 13 and 15, respectively;
cutting the second protruding channel part 112 protruding from the other side of the spreader plate 10 and sealing the other side of the spreader plate 10;
injecting a heating medium into each channel 12 of the first protruding channel part 111 protruding from one side of the spreader plate 10;
Cutting the first protruding channel part 111 protruding from one side of the spreader plate 10 and sealing the one side of the spreader plate 10; A method for manufacturing a flat plate type heat spreader with improved workability and bondability, comprising the steps of: .
KR1020190104193A 2019-08-26 2019-08-26 Manufacturing method of plate type heat spreader having excellent formability and binding KR102264283B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020190104193A KR102264283B1 (en) 2019-08-26 2019-08-26 Manufacturing method of plate type heat spreader having excellent formability and binding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190104193A KR102264283B1 (en) 2019-08-26 2019-08-26 Manufacturing method of plate type heat spreader having excellent formability and binding

Publications (2)

Publication Number Publication Date
KR20210024721A KR20210024721A (en) 2021-03-08
KR102264283B1 true KR102264283B1 (en) 2021-06-14

Family

ID=75184841

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190104193A KR102264283B1 (en) 2019-08-26 2019-08-26 Manufacturing method of plate type heat spreader having excellent formability and binding

Country Status (1)

Country Link
KR (1) KR102264283B1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007093032A (en) * 2005-09-27 2007-04-12 Matsushita Electric Ind Co Ltd Sheet-shaped heat pipe and its manufacturing method
JP2016517950A (en) 2013-05-10 2016-06-20 コミッサリア タ レネルジー アトミク エ オ エネルジー オルタネイティヴ Method of making a heat exchanger module having at least two fluid flow circuits
KR101792759B1 (en) * 2017-04-04 2017-11-02 주식회사 세기하이텍 Method of filling heating medium into flat type heat spreader and sealing that of it

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100411135B1 (en) 2000-10-24 2003-12-18 이택현 automatic drawing-in device for warp knitting machine
KR100693920B1 (en) * 2005-07-07 2007-03-12 삼성전자주식회사 Heat spreader, semiconductor package module and memory module having the heat spreader

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007093032A (en) * 2005-09-27 2007-04-12 Matsushita Electric Ind Co Ltd Sheet-shaped heat pipe and its manufacturing method
JP2016517950A (en) 2013-05-10 2016-06-20 コミッサリア タ レネルジー アトミク エ オ エネルジー オルタネイティヴ Method of making a heat exchanger module having at least two fluid flow circuits
KR101792759B1 (en) * 2017-04-04 2017-11-02 주식회사 세기하이텍 Method of filling heating medium into flat type heat spreader and sealing that of it

Also Published As

Publication number Publication date
KR20210024721A (en) 2021-03-08

Similar Documents

Publication Publication Date Title
US20090178784A1 (en) Manufacturing Method of Isothermal Vapor Chamber And Product Thereof
US8876193B2 (en) Inner wall liner for a refrigerated trailer wall panel
CN105691821B (en) Splicing construction and splicing casing
CN101689650B (en) Gas diffusion unit for a fuel cell
KR102264283B1 (en) Manufacturing method of plate type heat spreader having excellent formability and binding
CN103978871A (en) Method for forming corner window and injection molding component, guide rail, corner window, automobile door and automobile
US20110192576A1 (en) Vapor chamber and edge-sealing structure thereof
CN111688111A (en) Method for manufacturing composite insert
US8505183B2 (en) Method for sealing edges of vapor chamber
US20110027605A1 (en) Metal sheet member having high plastic bonding strength
KR101638747B1 (en) Support bar and the process of manufacture for glass load cassette
US6699348B2 (en) Method for filter fabrication
CN207731047U (en) A kind of display module
CN206363985U (en) The plastic-sealing mould structure of semiconductor devices
US20220190434A1 (en) Composite battery cover
JP2014151558A (en) Method for producing fiber-reinforced thermoplastic resin-integrated structure
JP5184626B2 (en) Vacuum insulation panel
CN111555731B (en) Broadband surface acoustic wave filter for transmitting
KR101852654B1 (en) Battery cell and method of producing the same
US8689438B2 (en) Seal apparatus and method of manufacturing the same
KR100458538B1 (en) plastic corrugated cardboard with sealed lattice and its manufacturing method
CN220621615U (en) Corner glass doubling tool
CN110323567A (en) A kind of active antenna element and antenna element for base station
CN220078967U (en) Laser hot-melt edge banding
CN219864728U (en) Reinforcing assembly and guide plate

Legal Events

Date Code Title Description
N231 Notification of change of applicant
E701 Decision to grant or registration of patent right
GRNT Written decision to grant