KR20210024721A - Manufacturing method of plate type heat spreader having excellent formability and binding - Google Patents

Manufacturing method of plate type heat spreader having excellent formability and binding Download PDF

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Publication number
KR20210024721A
KR20210024721A KR1020190104193A KR20190104193A KR20210024721A KR 20210024721 A KR20210024721 A KR 20210024721A KR 1020190104193 A KR1020190104193 A KR 1020190104193A KR 20190104193 A KR20190104193 A KR 20190104193A KR 20210024721 A KR20210024721 A KR 20210024721A
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South Korea
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protruding
plate
spreader
side portion
channel
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KR1020190104193A
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Korean (ko)
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KR102264283B1 (en
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이삼일
서진국
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주식회사 쿨링스
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Abstract

The present invention provides a manufacturing method of a flat plate type heat spreader with improved processability and binding properties, comprising: a step of extruding a spreader plate (10) of a plate-type structure, in which a channel part (11) having a plurality of channels (12) is provided in the central portion, and first and second support parts (13, 15) having a predetermined width are provided on the left and right sides of the channel part (11); a step of cutting each of one side portion and the other side portion of a corner of each of the first and second support parts (13, 15) of the extruded spreader plate (10), to form a first protruding channel part (111) on one side portion of the spreader plate (10) and form a second protruding channel part (112) on the other side portion of the spreader plate (10); a step of cutting the second protruding channel part (112) protruding from the other side portion of the spreader plate (10) and sealing the other side portion of the spreader plate (10); a step of injecting a heating medium into each channel (12) of the first protruding channel part (112) protruding from one side portion of the spreader plate (10); and a step of cutting the first protruding channel part (111) protruding from one side portion of the spreader plate (10) and sealing one side portion of the spreader plate (10). Accordingly, it is possible to significantly enhance the binding power with electronic devices.

Description

가공성 및 결합성이 향상된 평판형 히트 스프레더 제조방법{Manufacturing method of plate type heat spreader having excellent formability and binding}Manufacturing method of plate type heat spreader having excellent formability and binding}

본 발명은 히트 스프레더 제조방법에 관한 것으로, 더욱 구체적으로는 열매체의 유동과 관련된 채널부 자체의 손상이나 훼손 없이 전자기기와의 조립에 필요한 관통공을 매우 용이하게 가공할 수 있음은 물론 전자기기와의 결합력을 상당부분 증진시키는 것이 가능한 평판형 히트 스프레더 제조방법에 관한 것이다.The present invention relates to a method of manufacturing a heat spreader, and more specifically, it is possible to very easily process a through hole required for assembly of an electronic device without damaging or damaging the channel part itself related to the flow of a heat medium. It relates to a method of manufacturing a plate-type heat spreader capable of significantly improving the bonding force of the.

히트 스프레더(heat spreader)는 소형의 이동통신단말기는 물론 대형 TV 등에 장착되어 전자기기들로부터 열을 흡수하고 방출하는 일종의 열 전달기구로서, 알루미늄 소재와 같이 가벼우면서 열 전도성이 뛰어난 금속을 압출 성형하여 내부에 복수 개의 채널을 형성한 다음, 각 채널에 열매체를 주입한 다음 밀봉하는 방식으로 제조된다.A heat spreader is a type of heat transfer device that is installed in small mobile communication terminals as well as large TVs to absorb and release heat from electronic devices. It is manufactured by forming a plurality of channels inside, injecting a heat medium into each channel, and then sealing it.

한편, 일정 형상으로 제조된 히트 스프레더를 특정 전자기기에 장착하기 위해서는 히트 스프레더의 특정 부위를 가공하여 절단하거나, 또는 히트 스프레더의 모서리 부위를 따라 다양한 모양의 관통공을 형성하게 되는데, 이러한 가공이나 관통 작업 중에 열매체가 주입되어 있는 히트 스프레더의 채널이 손상될 염려가 있다.Meanwhile, in order to mount a heat spreader manufactured in a certain shape to a specific electronic device, a specific part of the heat spreader is processed and cut, or through holes of various shapes are formed along the edge of the heat spreader. During operation, there is a risk of damage to the channel of the heat spreader in which the heat medium is injected.

이를 위해 관련업계에서는, 압출성형을 통해 복수 개의 채널이 형성되면, 형성된 채널 중에서 중앙부위 채널에만 열매체를 주입하고, 좌우 모서리 부위 채널은 비워둠으로써, 추후 가공이나 관통 작업 과정에서 열매체가 주입되어 있는 채널 자체가 손상되는 현상을 방지하고 있다.To this end, in the related industry, when a plurality of channels are formed through extrusion molding, the heat medium is injected only in the central channel among the formed channels, and the channels in the left and right corners are emptied. It prevents itself from being damaged.

하지만, 이러한 방식은 열매체의 주입 여부와 상관없이 압출성형시 소재 전체에 채널을 형성시켜야 한다는 점에서 공정 자체가 비효율적이며, 가공부위나 관통부위가 채널이 형성되어 있는 지점에 형성된다는 점에서 가공성이 좋지 못할 뿐 아니라 전자기기와의 결합성이 현저히 떨어지는 문제가 있었다.However, this method is inefficient in that a channel must be formed throughout the material during extrusion regardless of whether or not a heat medium is injected, and the processability is inefficient in that the processed part or the penetrating part is formed at the point where the channel is formed. Not only is it not good, but there is also a problem that the coupling with electronic devices is significantly deteriorated.

대한민국 등록실용신안 제0411135호Republic of Korea Utility Model Registration No. 0411135

본 발명은 이러한 종래 기술의 문제점을 해결하기 위해 제안된 것으로서, 본 발명의 목적은 전자기기에의 장착을 위한 필요한 가공이 용이할 뿐 아니라 전자기기와의 결합성을 제고시킬 수 있는 히트 스프레더 제조방법을 제안함에 있다.The present invention has been proposed in order to solve the problems of the prior art, and an object of the present invention is a method of manufacturing a heat spreader capable of not only facilitating necessary processing for mounting to an electronic device, but also improving the coupling property with the electronic device. In the proposal.

본 발명은 이러한 목적을 달성하기 위하여, 중앙부위에는 복수 개의 채널(12)이 형성된 채널부(11)가 마련되고, 채널부(11) 좌우에는 일정폭의 제1, 2지지부(13, 15)가 마련되는 판상 구조의 스프레더판(10)을 압출성형하는 단계; 압출된 스프레드판(10)의 제1, 2지지부(13, 15) 각각의 모서리 일측부위 및 타측부위 각각을 절단하여, 스프레드판(10) 일측부위에는 제1돌출채널부(111)를 형성하고 스프레드판(10) 타측부위에는 제2돌출채널부(112)를 형성하는 단계; 스프레드판(10)의 타측부위에 돌출된 제2돌출채널부(112)를 절단하며 스프레더판(10)의 타측부위를 밀봉하는 단계; 스프레드판(10)의 일측부위에 돌출된 제1돌출채널부(112) 각각의 채널(12)에 열매체를 주입하는 단계; 스프레드판(10)의 일측부위에 돌출된 제1돌출채널부(111)를 절단하며 스프레더판(10)의 일측부위를 밀봉하는 단계;를 포함하여 이루어지는 것을 그 기술적 특징으로 한다.In order to achieve this object, the present invention is provided with a channel portion 11 having a plurality of channels 12 formed at the center portion, and first and second support portions 13 and 15 having a predetermined width on the left and right sides of the channel portion 11 Extruding the spreader plate 10 having a plate-like structure to be provided; The first and second support portions 13 and 15 of the extruded spread plate 10 are cut at one side of each corner and the other side, respectively, to form a first protruding channel portion 111 on one side of the spread plate 10. Forming a second protruding channel portion 112 on the other side of the spread plate 10; Cutting the second protruding channel portion 112 protruding from the other side of the spreader plate 10 and sealing the other side of the spreader plate 10; Injecting a heat medium into the channels 12 of the first protruding channel portions 112 protruding from one side of the spread plate 10; It characterized in that it comprises a; cutting the first protruding channel portion 111 protruding from one side of the spreader plate 10 and sealing one side of the spreader plate 10.

본 발명은 스프레더판을 압출 성형함에 있어 채널이 형성되는 채널부 좌우에 일정폭 및 일정두께를 가지는 지지부를 동시에 마련하여, 지지부에 대하여 전자기기와의 조립을 위해 필요한 관통공 등을 가공하는 방법을 제안함으로써, 열매체의 유동과 관련된 채널부 자체의 손상이나 훼손 없이 필요한 관통공을 매우 용이하게 가공할 수 있음은 물론 전자기기와의 결합력을 상당부분 증진시키는 것이 가능하다.The present invention provides a method of simultaneously providing a support part having a certain width and a certain thickness on the left and right sides of a channel part in which a channel is formed in extrusion molding a spreader plate, and processing a through hole necessary for assembling an electronic device with respect to the support part. By the proposal, it is possible to very easily process the necessary through-holes without damaging or damaging the channel part itself related to the flow of the heat medium, as well as enhancing the coupling force with the electronic device to a considerable extent.

도 1 내지 도 5 각각은 본 발명에 따른 히트 스프레더의 개략적인 제조 단계도.
도 6은 본 발명에 따라 제조된 히트 스프레더의 개략적인 일 구성도.
도 7은 복수 개의 채널이 형성된 종래 히트 스프레더의 개략적인 일 구성도.Each of Figures 1 to 5 is a schematic manufacturing step diagram of a heat spreader according to the present invention.
6 is a schematic configuration diagram of a heat spreader manufactured according to the present invention.
7 is a schematic configuration diagram of a conventional heat spreader in which a plurality of channels are formed.

본 발명에 따른 바람직한 실시예를 첨부된 도면을 참조하여 상세하게 살펴보면 다음과 같은데, 본 발명의 실시예를 상술함에 있어 본 발명의 기술적 특징과 직접적인 관련성이 없거나, 또는 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에게 자명한 사항에 대해서는 그 상세한 설명을 생략하기로 한다. A detailed look at the preferred embodiments according to the present invention with reference to the accompanying drawings is as follows. In the above description of the embodiments of the present invention, there is no direct relationship to the technical features of the present invention, or in the technical field to which the present invention pertains. For matters that are self-evident to those with knowledge of, detailed explanations will be omitted.

본 발명은 스프레더판(10)의 압출성형단계, 제1, 2돌출채널부(111, 112) 형성단계, 제2돌출채널부(112) 절단단계, 열매체 주입단계, 제1돌출채널부(111) 절단단계를 포함하여 이루어지는 히트 스프레더의 제조방법을 제안함에 그 기술적 특징이 있다. 이하 이들 각 단계를 첨부된 도면을 참조하여 구체적으로 살펴본다.The present invention is an extrusion molding step of the spreader plate 10, a step of forming the first and second protruding channel parts 111 and 112, a step of cutting the second protruding channel part 112, a heat medium injection step, and a first protruding channel part 111 ) There is a technical feature in proposing a method of manufacturing a heat spreader including a cutting step. Hereinafter, each of these steps will be described in detail with reference to the accompanying drawings.

먼저, 판상 구조로 이루어지는 스프레더판(10)을 준비한다. 스프레더판(10)은 알루미늄 소재로 이루어질 수 있으며 관련 업계에 널리 알려져 있는 압출 성형 방식으로 제조될 수 있다.First, a spreader plate 10 made of a plate-like structure is prepared. The spreader plate 10 may be made of an aluminum material and may be manufactured by extrusion molding, which is widely known in the related industry.

이때, 스프레더판(10)에 대한 압출 성형은 도 1과 같이, 그 중앙부위에는 복수 개의 채널(12)이 형성된 채널부(11)가 마련되고, 채널부(11)의 좌우에는 일정폭을 가지는 제1, 2지지부(13, 15)가 마련되는 구조로 이루어지는 것이 바람직하다.At this time, the extrusion molding of the spreader plate 10 is provided with a channel portion 11 having a plurality of channels 12 formed at the center portion thereof, as shown in FIG. It is preferable to have a structure in which 1 and 2 support portions 13 and 15 are provided.

즉, 중앙부위에는 열매체가 주입되어 유동할 수 있는 공간으로서의 채널들을 형성시키고, 채널의 좌우 각각에는 전자기기 등과의 결합을 위해 채널이 형성되지 않은 상태로 일정폭 및 일정두께를 가지는 지지부를 형성시키는 것이다. In other words, channels are formed in the center as a space through which a heat medium can be injected and flow, and a support part having a certain width and a certain thickness is formed on the left and right sides of the channel in a state where no channels are formed for coupling with electronic devices. .

스프레드판(10)이 압출 성형되면, 도 2와 같이 스프레드판(10)의 일측부위 및 타측부위 각각에 제1, 2돌출채널부(111, 112) 각각을 형성시킨다. 제1, 2돌출채널부(111, 112) 각각의 형성은 아래와 같이 형성될 수 있다.When the spread plate 10 is extruded, first and second protruding channel portions 111 and 112 are formed respectively on one side and the other side of the spread plate 10 as shown in FIG. 2. Each of the first and second protruding channel portions 111 and 112 may be formed as follows.

먼저, 스프레드판(10)의 제1, 2지지부(13, 15) 각각에 있어 채널부(11)의 좌우 최외곽에 위치하는 채널(12)의 외벽이 일정 강도를 가질 수 있는 정도의 폭을 남겨두고, 도 2와 같이 제1, 2지지부(13, 15) 각각의 모서리 일측부위 및 타측부위 각각을 절단한다.First, in each of the first and second support portions 13 and 15 of the spread plate 10, the outer wall of the channel 12 located at the left and right outermost portions of the channel portion 11 is set to have a width such that the outer wall of the channel 12 can have a certain strength. As shown in FIG. 2, the first and second support portions 13 and 15 are cut off at one side and the other at each of the corners.

제1, 2지지부(13, 15) 각각의 모서리 일측부위 및 타측부위 각각이 절단되면, 스프레드판(10)의 제1지지부(13)의 일측부위 및 타측부위 각각의 모서리에는 제1, 2절단면(131, 132)이 형성되고, 스프레드판(10)의 제2지지부(15)의 일측부위 및 타측부위 각각의 모서리에는 제3, 4절단면(151, 152)이 형성된다. When each of the first and second support portions 13 and 15 is cut at one side and the other side, each of the first and second support portions 13 of the spread plate 10 has the first and second cutouts at the corners of each of the first and second support portions 13 and 15. (131, 132) are formed, and third and fourth cut-off surfaces 151 and 152 are formed at respective corners of one side and the other side of the second support 15 of the spread plate 10.

이에 따라, 스프레드판(10) 일측부위에는 제1돌출채널부(111)가 돌출 형성되고, 스프레드판(10) 타측부위에는 제2돌출채널부(112)가 돌출 형성되는 것이다. Accordingly, the first protruding channel part 111 is protruded from one side of the spread plate 10 and the second protruding channel part 112 protrudes from the other side of the spread plate 10.

도면부호 133, 153 각각은 본 발명을 전자기기 등과 같은 기구와의 결합시 상대 기구의 돌출부나 장애물 등과의 간섭을 방지하기 위한 절개부이고, 도면부호 134, 154 각각은 스크류나 볼트 또는 리벳을 위한 관통공이다.Reference numerals 133 and 153 each are cutouts for preventing interference with protrusions or obstacles of the counterpart device when the present invention is combined with an electronic device, etc., and each of the reference numerals 134 and 154 is for screws, bolts, or rivets. It is a through hole.

스프레드판(10)의 일측부위 및 타측부위 각각에 제1, 2돌출채널부(111, 112) 각각이 형성되면, 이 중에서 스프레드판(10)의 타측부위에 돌출된 제2돌출채널부(112)를 절단하며 스프레더판(10)의 타측부위를 밀봉한다.When the first and second protruding channel portions 111 and 112 are respectively formed on one side and the other side of the spread plate 10, among them, the second protruding channel portion 112 protruding from the other side of the spread plate 10 ) Is cut and the other side of the spreader plate 10 is sealed.

제2돌출채널부(112)에 대한 절단은 도 3과 같이 임의 절단장치(1)에 의해 수행될 수 있다. 이때, 절단장치(1)는 일정 온도로 유지되는 열간 압착장치에 의해 수행되는 것이 바람직하다. 왜냐하면, 절단 단계에서 그 면이 용융되어 완전히 밀봉될 수 있기 때문이다. Cutting of the second protruding channel part 112 may be performed by an arbitrary cutting device 1 as shown in FIG. 3. At this time, the cutting device 1 is preferably performed by a hot pressing device maintained at a constant temperature. This is because in the cutting step, the face is melted and can be completely sealed.

이 단계가 완료되면, 제2돌출채널부(112)가 형성되어 있던 스프레드판(10)의 타측부위에는 제2밀봉면(114)이 형성된다. 제2밀봉면(114)은 도면과 같이 제2, 4절단면(132, 152) 각각과 평행하게 연결되는 구성으로 이루어지는 것이 바람직하다. When this step is completed, a second sealing surface 114 is formed on the other side of the spread plate 10 on which the second protruding channel portion 112 was formed. It is preferable that the second sealing surface 114 is configured to be connected in parallel with the second and fourth cutting surfaces 132 and 152, respectively, as shown in the drawing.

제2돌출채널부(112)가 절단되어 제2밀봉면(114)이 형성되면, 도 4와 같이 제1돌출채널부(111)에 마련되는 각 각 채널(12)로 일정 양의 열매체를 주입한다. 열매체는 액체-기체 상호간의 상변화에 의해 전자기기의 작동 과정에서 발생하는 열을 용이하게 흡수할 수 있는 물질 중의 어느 하나로 이루어질 수 있다.When the second protruding channel part 112 is cut to form the second sealing surface 114, a certain amount of heat medium is injected into each channel 12 provided in the first protruding channel part 111 as shown in FIG. 4. do. The heat medium may be made of any one of materials capable of easily absorbing heat generated during an operation of an electronic device due to a phase change between liquid and gas.

열매체의 주입이 완료되면, 각 채널(12) 내부를 진공 상태를 만든다. 이러한 작업은 각 채널로의 열매체 주입 이전에 수행될 수도 있다. 즉, 작업의 용이성을 감안하여, 각 채널을 진공 상태로 만든 다음 열매체를 주입할 수도 있고 이와 달리 열매체를 주입한 다음 진공 상태를 형성할 수도 있다.When the injection of the heating medium is completed, the inside of each channel 12 is made in a vacuum state. This operation may be performed prior to injection of the heating medium into each channel. That is, in consideration of the ease of operation, each channel may be made into a vacuum state and then the heat medium may be injected, or alternatively, the heat medium may be injected and then a vacuum state may be formed.

열매체가 주입되어 각 채널이 진공 상태를 이루면, 도 5와 같이 스프레드판(10)의 일측부위에 돌출되어 있는 제1돌출채널부(111)를 절단하며 스프레더판(10)의 일측부위를 밀봉한다. When the heat medium is injected and each channel is in a vacuum state, the first protruding channel part 111 protruding from one side of the spread plate 10 is cut as shown in FIG. 5 to seal one side of the spreader plate 10. .

제1돌출채널부(111)에 대한 절단 작업 역시 제1돌출채널부(112)와 동일하게 임의 절단장치(1)에 의해 수행될 수 있으며, 그 절단장치(1)는 일정 온도로 유지되는 열간 압착장치로 이루어지는 것이 바람직하다. 이 단계가 완료되면, 제1돌출채널부(111)가 형성되어 있던 스프레드판(10)의 일측부위에는 제1밀봉면(112)이 형성된다.The cutting work for the first protruding channel part 111 can also be performed by an arbitrary cutting device 1 in the same way as the first protruding channel part 112, and the cutting device 1 is hot maintained at a constant temperature. It is preferably made of a pressing device. When this step is completed, a first sealing surface 112 is formed on one side of the spread plate 10 on which the first protruding channel portion 111 was formed.

제2밀봉면(114)과 동일하게, 제1밀봉면(112) 역시 제1, 3절단면(131, 151) 각각과 평행하게 연결되는 구성으로 이루어지는 것이 바람직하다. 본 발명은 제2, 1돌출채널부(112, 111) 순서로 절단 작업이 이루어지는 경우를 상정하여 설명하였으나, 이와 달리 제1, 2돌출채널부(111, 111) 순서로 절단 작업이 이루어질수 있음은 물론이다.Like the second sealing surface 114, the first sealing surface 112 is also preferably made of a configuration that is connected in parallel with the first and third cutting surfaces 131 and 151, respectively. The present invention has been described on the assumption that the cutting operation is performed in the order of the second and first protruding channel portions 112 and 111, but unlike this, the cutting operation may be performed in the order of the first and second protruding channel portions 111 and 111. Of course.

도 6에는 본 발명에 따라 제조된 히트 스프레더(100)의 일례가 개시되어 있다. 도면에 개시된 것과 같이, 본 발명은 스프레더판을 압출 성형함에 있어 채널이 형성되는 채널부 좌우에 일정폭 및 일정두께를 가지는 지지부를 동시에 마련하는 특징이 있다.6 shows an example of a heat spreader 100 manufactured according to the present invention. As disclosed in the drawings, the present invention is characterized in that, in extrusion molding a spreader plate, support portions having a predetermined width and a predetermined thickness are simultaneously provided on the left and right sides of a channel portion in which a channel is formed.

이럴 경우, 전자기기와의 조립을 위해 필요한 관통공 등은 열매체의 유동과 관련된 채널부 자체의 손상이나 훼손 없이 지지부를 이용하여 매우 용이하게 가공할 수 있음은 물론, 지지부 자체가 일정두께를 가지고 있다는 점에서 전자기기와의 조립시 그 결합력을 상당부분 제고할 수 있게 된다.In this case, the through hole required for assembly of the electronic device can be processed very easily using the support part without damage or damage to the channel part itself related to the flow of the heat medium, as well as that the support part itself has a certain thickness. In this regard, when assembling with electronic devices, the coupling force can be significantly improved.

상기에서는 본 발명의 바람직한 실시예들에 한정하여 설명하였으나 이는 단지 예시일 뿐이며, 본 발명은 이에 한정되지 않고 여러 다양한 방법으로 변경되어 실시될 수 있으며, 나아가 개시된 기술적 사상에 기초하여 별도의 기술적 특징이 부가되어 실시될 수 있음은 자명하다 할 것이다.In the above, the description has been limited to the preferred embodiments of the present invention, but this is only an example, and the present invention is not limited thereto and may be changed and implemented in various ways, and further, a separate technical feature is provided based on the disclosed technical idea. It will be obvious that it can be added and implemented.

10 : 스프레더판 11 : 채널부
12 : 채널 13, 15 : 제1, 2지지부
111, 112 : 제1, 2돌출채널부 113, 114 : 제1, 2밀봉면
131, 132, 151, 152 : 제1, 2, 3, 4절단면10: spreader plate 11: channel part
12: channel 13, 15: first, second support
111, 112: 1st, 2nd protruding channel part 113, 114: 1st, 2nd sealing surface
131, 132, 151, 152: 1st, 2nd, 3rd, 4th section

Claims (1)

중앙부위에는 복수 개의 채널(12)이 형성된 채널부(11)가 마련되고, 채널부(11) 좌우에는 일정폭의 제1, 2지지부(13, 15)가 마련되는 판상 구조의 스프레더판(10)을 압출성형하는 단계;
압출된 스프레드판(10)의 제1, 2지지부(13, 15) 각각의 모서리 일측부위 및 타측부위 각각을 절단하여, 스프레드판(10) 일측부위에는 제1돌출채널부(111)를 형성하고 스프레드판(10) 타측부위에는 제2돌출채널부(112)를 형성하는 단계;
스프레드판(10)의 타측부위에 돌출된 제2돌출채널부(112)를 절단하며 스프레더판(10)의 타측부위를 밀봉하는 단계;
스프레드판(10)의 일측부위에 돌출된 제1돌출채널부(112) 각각의 채널(12)에 열매체를 주입하는 단계;
스프레드판(10)의 일측부위에 돌출된 제1돌출채널부(111)를 절단하며 스프레더판(10)의 일측부위를 밀봉하는 단계;를
포함하는 가공성 및 결합성이 향상된 평판형 히트 스프레더 제조방법.A spreader plate 10 having a plate-like structure in which a channel portion 11 having a plurality of channels 12 formed at the center portion is provided, and first and second support portions 13 and 15 having a predetermined width are provided on the left and right sides of the channel portion 11 Extruding;
The first and second support portions 13 and 15 of the extruded spread plate 10 are cut at one side of each corner and the other side, respectively, to form a first protruding channel portion 111 on one side of the spread plate 10. Forming a second protruding channel portion 112 on the other side of the spread plate 10;
Cutting the second protruding channel portion 112 protruding from the other side of the spreader plate 10 and sealing the other side of the spreader plate 10;
Injecting a heat medium into the channels 12 of the first protruding channel portions 112 protruding from one side of the spread plate 10;
Cutting the first protruding channel portion 111 protruding from one side portion of the spread plate 10 and sealing one side portion of the spreader plate 10;
A method of manufacturing a flat heat spreader with improved processability and bonding including.
KR1020190104193A 2019-08-26 2019-08-26 Manufacturing method of plate type heat spreader having excellent formability and binding KR102264283B1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100411135B1 (en) 2000-10-24 2003-12-18 이택현 automatic drawing-in device for warp knitting machine
KR20070006199A (en) * 2005-07-07 2007-01-11 삼성전자주식회사 Heat spreader, semiconductor package module and memory module having the heat spreader
JP2007093032A (en) * 2005-09-27 2007-04-12 Matsushita Electric Ind Co Ltd Sheet-shaped heat pipe and its manufacturing method
JP2016517950A (en) * 2013-05-10 2016-06-20 コミッサリア タ レネルジー アトミク エ オ エネルジー オルタネイティヴ Method of making a heat exchanger module having at least two fluid flow circuits
KR101792759B1 (en) * 2017-04-04 2017-11-02 주식회사 세기하이텍 Method of filling heating medium into flat type heat spreader and sealing that of it

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100411135B1 (en) 2000-10-24 2003-12-18 이택현 automatic drawing-in device for warp knitting machine
KR20070006199A (en) * 2005-07-07 2007-01-11 삼성전자주식회사 Heat spreader, semiconductor package module and memory module having the heat spreader
JP2007093032A (en) * 2005-09-27 2007-04-12 Matsushita Electric Ind Co Ltd Sheet-shaped heat pipe and its manufacturing method
JP2016517950A (en) * 2013-05-10 2016-06-20 コミッサリア タ レネルジー アトミク エ オ エネルジー オルタネイティヴ Method of making a heat exchanger module having at least two fluid flow circuits
KR101792759B1 (en) * 2017-04-04 2017-11-02 주식회사 세기하이텍 Method of filling heating medium into flat type heat spreader and sealing that of it

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