CN206363985U - The plastic-sealing mould structure of semiconductor devices - Google Patents
The plastic-sealing mould structure of semiconductor devices Download PDFInfo
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- CN206363985U CN206363985U CN201621450549.1U CN201621450549U CN206363985U CN 206363985 U CN206363985 U CN 206363985U CN 201621450549 U CN201621450549 U CN 201621450549U CN 206363985 U CN206363985 U CN 206363985U
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- frame
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- frame portion
- semiconductor devices
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Abstract
The utility model provides a kind of plastic-sealing mould structure of semiconductor devices, the mould includes frame section and frame mouthful, there are the frame section two the first frame portions be arrangeding in parallel and two connections to be connected in the second frame portion between the both ends of 2 first frame portion, and first frame portion and second frame portion connect to form the frame mouthful；Wherein, between the stage casing of 2 first frame portion there is dowel to connect, the frame mouthful cuts to form multiple windows by the dowel, define to form sealing region jointly in the edge of the inner edge dowel of each window and its frame section of surrounding, separated between each sealing region by the dowel, thereby, reach the warping phenomenon for avoiding single sealing region long and being exaggerated after plastic packaging glue-line is set caused by material expand coefficient difference, angularity of the mould after plastic packaging black glue is greatly reduced to the paster flatness for meeting follow-up cutting operation, it is effectively improved manufacturing yield of products.
Description
Technical field
The utility model is related to the encapsulation technology field of semiconductor devices, relates in particular to a kind of modeling of semiconductor devices
Seal mould structure.
Background technology
QFN (quad flat Lead-free in Electronic Packaging) is a kind of title of the packing forms of miniature electric component.It is aobvious as shown in Figure 1
Show a kind of existing QFN plastic-sealing mould structures, the mould 10 is mainly formed with frame section 11 and enclosed by the frame section 11
If the window 12 formed, the inner peripheral 11 of the window 12 and the frame section 11 is collectively as the region for encapsulating black glue.
It is worth noting that, QFN products are in itself because metal frame part 11 is different and easy with the coefficient of expansion of plastic packaging material
Cause buckling deformation slightly；Therefore, when the amount of buckling deformation slightly occurs there was only an independent window 12 as shown in Figure 1
Or two windows 12 and during plastic package die with the suitable form of elongated window 12, the micro- buckling deformation amount can be because window 12
Length it is longer and exaggerated, cause frame section 11 to produce the abnormal situation of warpage and become apparent from.The out-of-flatness can further shadow
Ringing product can not develop in cutting, and cutting is unstable, therefore is further improved.
Utility model content
In view of the foregoing, the utility model provides a kind of plastic-sealing mould structure of semiconductor devices, by mould frame
Dowel is formed between the relative frame portion in frame portion, to separate the sealing region on mould, it is to avoid single sealing region it is long and
The warping phenomenon caused by material expand coefficient difference is exaggerated after setting plastic packaging glue-line, by warpage of the mould after plastic packaging black glue
The paster flatness for meeting follow-up cutting operation is greatly reduced in degree, is effectively improved manufacturing yield of products.
To achieve the above object, the utility model, which is adopted the technical scheme that, provides a kind of plastic package die of semiconductor devices
Structure, the mould includes frame section and frame mouthful, and there are the frame section two the first frame portions be arrangeding in parallel and two connections to connect
The second frame portion between the both ends of 2 first frame portion, first frame portion and second frame portion connect to form described
Frame mouthful；Wherein, between the stage casing of 2 first frame portion there is dowel to connect, the frame mouthful cuts shape by the dowel
Into multiple windows, the edge of the inner edge dowel of the frame section of each window and its surrounding defines to form sealing region jointly,
Separated between each sealing region by the dowel.
The utility model semiconductor devices plastic-sealing mould structure further improvement is that, the frame section is provided with the
One positioning hole.It is preferred that first positioning hole is configured to circular hole.
The utility model semiconductor devices plastic-sealing mould structure further improvement is that, the dowel is provided with the
Two positioning holes.It is preferred that second positioning hole is configured to bar hole.
The utility model semiconductor devices plastic-sealing mould structure further improvement is that, the sealing region is provided with
Plastic packaging glue-line.
The further improvement of the plastic-sealing mould structure of the utility model semiconductor devices is that the mould has four
The window.Wherein, width of each window along the first frame portion bearing of trend is 50mm.
Brief description of the drawings
Fig. 1 is the planar structure schematic diagram of existing mold.
Fig. 2 is the side structure schematic view of existing mold.
Fig. 3 is the planar structure schematic diagram of the utility model mould.
Fig. 4 is the side structure schematic view of the utility model mould.
The corresponding relation of reference and part is as follows：
Mould 10；Frame section 11；Window 12；Mould 20；Sealing region 201；Frame section 21；First frame portion 211；Second frame
Portion 212；Inner edge 213；Dowel 22；Edge 221；Window 23；Frame mouthful 230；First positioning hole 24；Second positioning hole 25；Plastic packaging
Glue-line 30.
Embodiment
For the benefit of understand of the present utility model, illustrated below in conjunction with drawings and Examples.
Need to first it illustrate, because the plastic package die of the utility model semiconductor devices is flake structure, the utility model
Accompanying drawing size be that the size in accompanying drawing bel not applied to limit this reality in order to which the signal of the clear explanation plastic-sealing mould structure is led to
With the concrete structure of novel die, size.
Fig. 3 to Fig. 4 is referred to, the utility model provides a kind of plastic-sealing mould structure of semiconductor devices, the mould 20
Including frame section 21 and frame mouthful 230, there are the frame section 21 two the first frame portions 211 be arrangeding in parallel and two connections to be connected in institute
The second frame portion 212 between the both ends of 2 first frame portions 211 is stated, first frame portion 211 and second frame portion 212 are connected
Form the frame mouthful 230.
Wherein, between the stage casing of 2 first frame portion 211 there is dowel 22 to connect, the frame mouthful 230 is by described
Dowel 22, which is cut, forms multiple windows 23, the dowel 22 of inner edge 213 of the frame section 21 of each window 23 and its surrounding
Edge 221 defines to form sealing region 201 jointly, is separated between each sealing region 201 by the dowel 22；The adhesive area
To set plastic packaging glue-line 30 on domain 201.Thereby, by the way that sealing region 201 is separated to shorten the length of single plastic packaging glue-line 30
Degree, reduces the warping phenomenon of mould 20 to disclosure satisfy that flatness of the mould 20 in paster.
Specifically, mould 20 of the present utility model is preferably provided with four windows 23, and the window 23 is along first frame portion
The width of 211 bearing of trends is 50mm.
Specifically, mould 20 of the present utility model is provided with the first positioning hole 24 in the first frame portion 211, and in dowel 22
The second positioning hole 25 is provided with, the mould 20 effectively to be positioned.Wherein, first positioning hole 24 preferably into
Shape is circular hole, and second positioning hole 25 is preferably configured to bar hole.It is to be understood that first positioning hole 24, second is fixed
The hole shape in position hole 25 is not limited to foregoing, can be adjusted according to specifically used demand.
The utility model is described in detail above in association with drawings and Examples, those skilled in the art can
Many variations example is made to the utility model according to the above description.Thus, some of embodiment details should not be constituted to this reality
With new restriction, the utility model regard the scope defined using appended claims as protection domain of the present utility model.
Claims (9)
1. a kind of plastic-sealing mould structure of semiconductor devices, the mould includes frame section and frame mouthful, the frame section has two
The first frame portion and 2 second frame portions be arrangeding in parallel, 2 second frame portion connect 2 first frame portion both ends it
Between, first frame portion and second frame portion connect to form the frame mouthful；It is characterized in that：
Between the stage casing of 2 first frame portion there is dowel to connect, the frame mouthful cuts to form multiple by the dowel
The edge of the inner edge dowel of the frame section of window, each window and its surrounding defines to form sealing region jointly, each sealing
Separated between region by the dowel.
2. the plastic-sealing mould structure of semiconductor devices according to claim 1, it is characterised in that：The frame section is provided with
First positioning hole.
3. the plastic-sealing mould structure of semiconductor devices according to claim 2, it is characterised in that：First positioning hole is set
In in first frame portion of the single side of the frame section.
4. the plastic-sealing mould structure of semiconductor devices according to claim 2, it is characterised in that：First positioning hole into
Shape is circular hole.
5. the plastic-sealing mould structure of semiconductor devices according to claim 1, it is characterised in that：The dowel is provided with
Second positioning hole.
6. the plastic-sealing mould structure of semiconductor devices according to claim 5, it is characterised in that：Second positioning hole into
Shape is bar hole.
7. the plastic-sealing mould structure of semiconductor devices according to any one of claim 1 to 6, it is characterised in that：
The sealing region is provided with plastic packaging glue-line.
8. the plastic-sealing mould structure of semiconductor devices according to claim 7, it is characterised in that：
The mould has four windows.
9. the plastic-sealing mould structure of semiconductor devices according to claim 8, it is characterised in that：The window is along described
The width of one frame portion bearing of trend is 50mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621450549.1U CN206363985U (en) | 2016-12-28 | 2016-12-28 | The plastic-sealing mould structure of semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621450549.1U CN206363985U (en) | 2016-12-28 | 2016-12-28 | The plastic-sealing mould structure of semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206363985U true CN206363985U (en) | 2017-07-28 |
Family
ID=59376775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621450549.1U Active CN206363985U (en) | 2016-12-28 | 2016-12-28 | The plastic-sealing mould structure of semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206363985U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115938703A (en) * | 2022-11-16 | 2023-04-07 | 业展电子(惠州市)有限公司 | Plastic package mold applied to alloy chip resistor and used for preventing frame deformation |
-
2016
- 2016-12-28 CN CN201621450549.1U patent/CN206363985U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115938703A (en) * | 2022-11-16 | 2023-04-07 | 业展电子(惠州市)有限公司 | Plastic package mold applied to alloy chip resistor and used for preventing frame deformation |
| CN115938703B (en) * | 2022-11-16 | 2023-06-30 | 业展电子(惠州市)有限公司 | Plastic packaging die applied to alloy chip resistor and capable of preventing frame from deforming |
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