KR102256408B1 - 솔더, 스퍼터링 타겟 물질, 및 스퍼터링 타겟 물질의 제조 방법 - Google Patents

솔더, 스퍼터링 타겟 물질, 및 스퍼터링 타겟 물질의 제조 방법 Download PDF

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Publication number
KR102256408B1
KR102256408B1 KR1020160016209A KR20160016209A KR102256408B1 KR 102256408 B1 KR102256408 B1 KR 102256408B1 KR 1020160016209 A KR1020160016209 A KR 1020160016209A KR 20160016209 A KR20160016209 A KR 20160016209A KR 102256408 B1 KR102256408 B1 KR 102256408B1
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KR
South Korea
Prior art keywords
target material
solder
backing plate
material layer
weight
Prior art date
Application number
KR1020160016209A
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English (en)
Korean (ko)
Other versions
KR20170129301A (ko
Inventor
칭-호 양
수완-쳉 선
치-웬 우
멩-펭 수
치-쉬앙 웽
Original Assignee
주식회사 스미카 테크놀로지
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Publication of KR20170129301A publication Critical patent/KR20170129301A/ko
Application granted granted Critical
Publication of KR102256408B1 publication Critical patent/KR102256408B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
KR1020160016209A 2015-09-23 2016-02-12 솔더, 스퍼터링 타겟 물질, 및 스퍼터링 타겟 물질의 제조 방법 KR102256408B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW104131380 2015-09-23
TW104131380A TWI612025B (zh) 2015-09-23 2015-09-23 製作濺鍍靶材的銲料及其應用方法

Publications (2)

Publication Number Publication Date
KR20170129301A KR20170129301A (ko) 2017-11-27
KR102256408B1 true KR102256408B1 (ko) 2021-05-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160016209A KR102256408B1 (ko) 2015-09-23 2016-02-12 솔더, 스퍼터링 타겟 물질, 및 스퍼터링 타겟 물질의 제조 방법

Country Status (4)

Country Link
JP (1) JP2017060990A (ja)
KR (1) KR102256408B1 (ja)
CN (1) CN106541220A (ja)
TW (1) TWI612025B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112077477A (zh) * 2020-09-10 2020-12-15 哈尔滨理工大学 一种高稳定低熔点纤料及其制备方法
CN112091343A (zh) * 2020-09-11 2020-12-18 宁波江丰电子材料股份有限公司 一种钼靶材与背板的钎焊方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102409300A (zh) * 2011-09-07 2012-04-11 三峡大学 氧化物陶瓷溅射靶及其制备方法和所用的钎焊合金

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Publication number Priority date Publication date Assignee Title
US5242658A (en) * 1992-07-07 1993-09-07 The Indium Corporation Of America Lead-free alloy containing tin, zinc and indium
TW251249B (ja) * 1993-04-30 1995-07-11 At & T Corp
JPH07227690A (ja) * 1994-02-21 1995-08-29 Asahi Glass Co Ltd はんだ合金及びターゲット構造体
JPH0994687A (ja) * 1995-09-29 1997-04-08 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
US20040072009A1 (en) * 1999-12-16 2004-04-15 Segal Vladimir M. Copper sputtering targets and methods of forming copper sputtering targets
WO2002077317A1 (fr) * 2001-03-16 2002-10-03 Ishifuku Metal Industry Co., Ltd. Materiau de cible de pulverisation
JP2004114124A (ja) * 2002-09-27 2004-04-15 Hitachi Metals Ltd 電子部品および電子部品の製造方法
JP2007021580A (ja) * 2005-06-15 2007-02-01 Mitsui Mining & Smelting Co Ltd スパッタリングターゲット製造用はんだ合金およびこれを用いたスパッタリングターゲット
KR100785208B1 (ko) * 2005-06-15 2007-12-11 미쓰이 긴조꾸 고교 가부시키가이샤 스퍼터링 타깃 제조용 땜납 합금 및 이것을 이용한스퍼터링 타깃
CN101543924A (zh) * 2009-03-12 2009-09-30 宁波江丰电子材料有限公司 靶材与背板的焊接方法
CN102133669A (zh) * 2011-01-26 2011-07-27 宁波江丰电子材料有限公司 靶材与背板的焊接方法
CN102409299B (zh) * 2011-09-07 2014-08-06 三峡大学 一种氧化物陶瓷溅射靶的制备方法
CN103567583B (zh) * 2012-07-30 2015-12-02 宁波江丰电子材料股份有限公司 铝靶材组件的焊接方法
CN103785911B (zh) * 2012-10-30 2016-03-09 宁波江丰电子材料股份有限公司 靶材组件的焊接方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102409300A (zh) * 2011-09-07 2012-04-11 三峡大学 氧化物陶瓷溅射靶及其制备方法和所用的钎焊合金

Also Published As

Publication number Publication date
CN106541220A (zh) 2017-03-29
JP2017060990A (ja) 2017-03-30
KR20170129301A (ko) 2017-11-27
TW201711983A (zh) 2017-04-01
TWI612025B (zh) 2018-01-21

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