KR102251891B1 - 기판 지지 장치 및 이를 이용한 기판 반출 방법 - Google Patents

기판 지지 장치 및 이를 이용한 기판 반출 방법 Download PDF

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Publication number
KR102251891B1
KR102251891B1 KR1020200170315A KR20200170315A KR102251891B1 KR 102251891 B1 KR102251891 B1 KR 102251891B1 KR 1020200170315 A KR1020200170315 A KR 1020200170315A KR 20200170315 A KR20200170315 A KR 20200170315A KR 102251891 B1 KR102251891 B1 KR 102251891B1
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KR
South Korea
Prior art keywords
substrate
electrostatic chuck
focus ring
driving
unit
Prior art date
Application number
KR1020200170315A
Other languages
English (en)
Korean (ko)
Inventor
이윤성
박재영
정희석
Original Assignee
주식회사 기가레인
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 기가레인 filed Critical 주식회사 기가레인
Priority to KR1020200170315A priority Critical patent/KR102251891B1/ko
Application granted granted Critical
Publication of KR102251891B1 publication Critical patent/KR102251891B1/ko
Priority to CN202110811072.4A priority patent/CN114613718B/zh
Priority to TW110126880A priority patent/TWI781695B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32788—Means for moving the material to be treated for extracting the material from the process chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020200170315A 2020-12-08 2020-12-08 기판 지지 장치 및 이를 이용한 기판 반출 방법 KR102251891B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020200170315A KR102251891B1 (ko) 2020-12-08 2020-12-08 기판 지지 장치 및 이를 이용한 기판 반출 방법
CN202110811072.4A CN114613718B (zh) 2020-12-08 2021-07-19 基板支承装置以及利用其的基板搬出方法
TW110126880A TWI781695B (zh) 2020-12-08 2021-07-21 基板支承裝置以及利用其的基板搬出方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020200170315A KR102251891B1 (ko) 2020-12-08 2020-12-08 기판 지지 장치 및 이를 이용한 기판 반출 방법

Publications (1)

Publication Number Publication Date
KR102251891B1 true KR102251891B1 (ko) 2021-05-13

Family

ID=75913547

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200170315A KR102251891B1 (ko) 2020-12-08 2020-12-08 기판 지지 장치 및 이를 이용한 기판 반출 방법

Country Status (3)

Country Link
KR (1) KR102251891B1 (zh)
CN (1) CN114613718B (zh)
TW (1) TWI781695B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102639129B1 (ko) * 2023-07-19 2024-02-21 주식회사 기가레인 웨이퍼 디척킹 장치 및 방법
WO2024123649A1 (en) * 2022-12-06 2024-06-13 Kla Corporation Lifter assembly with bellows for optical inspection system

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07130824A (ja) * 1993-11-04 1995-05-19 Anelva Corp 基板処理装置
JP2000100787A (ja) * 1998-09-18 2000-04-07 Matsushita Electric Ind Co Ltd 真空処理装置
JP2001230239A (ja) * 2000-02-15 2001-08-24 Tokyo Electron Ltd 処理装置及び処理方法
KR100899078B1 (ko) 2008-07-31 2009-05-25 김준규 램리서치 티시피/레인보우 장치의 정전 척 디척킹 장치
KR20120134368A (ko) * 2011-06-02 2012-12-12 엘아이지에이디피 주식회사 기판 척킹 디척킹 장치
KR20180065932A (ko) * 2016-12-08 2018-06-18 도쿄엘렉트론가부시키가이샤 배치대 및 플라즈마 처리 장치

Family Cites Families (13)

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JP3005461B2 (ja) * 1995-11-24 2000-01-31 日本電気株式会社 静電チャック
JP4489904B2 (ja) * 2000-04-14 2010-06-23 株式会社アルバック 真空処理装置及び基板保持方法
JP2004047513A (ja) * 2002-07-08 2004-02-12 Tokyo Electron Ltd 静電吸着構造および静電吸着方法ならびにプラズマ処理装置およびプラズマ処理方法
KR20080023569A (ko) * 2006-09-11 2008-03-14 주식회사 하이닉스반도체 식각프로파일 변형을 방지하는 플라즈마식각장치
JP5504980B2 (ja) * 2010-03-04 2014-05-28 日新イオン機器株式会社 ウエハリフト回転機構、ステージ装置及びイオン注入装置
US8840754B2 (en) * 2010-09-17 2014-09-23 Lam Research Corporation Polar regions for electrostatic de-chucking with lift pins
JP2014075372A (ja) * 2010-12-27 2014-04-24 Canon Anelva Corp 静電吸着装置
JP5907681B2 (ja) * 2011-08-02 2016-04-26 東京エレクトロン株式会社 基板受け渡し方法
KR101234020B1 (ko) * 2012-01-25 2013-02-18 주식회사 에스에프에이 정전척 캐리어를 이용한 기판의 진공처리장치
CN105575863B (zh) * 2014-11-10 2019-02-22 中微半导体设备(上海)有限公司 等离子体处理装置、基片卸载装置及方法
KR101909479B1 (ko) * 2016-10-06 2018-10-19 세메스 주식회사 기판 지지 유닛, 그를 포함하는 기판 처리 장치, 그리고 그 제어 방법
KR102063108B1 (ko) * 2017-10-30 2020-01-08 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
CN112701027B (zh) * 2019-10-22 2024-09-17 夏泰鑫半导体(青岛)有限公司 等离子体处理装置及边缘环的更换方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07130824A (ja) * 1993-11-04 1995-05-19 Anelva Corp 基板処理装置
JP2000100787A (ja) * 1998-09-18 2000-04-07 Matsushita Electric Ind Co Ltd 真空処理装置
JP2001230239A (ja) * 2000-02-15 2001-08-24 Tokyo Electron Ltd 処理装置及び処理方法
KR100899078B1 (ko) 2008-07-31 2009-05-25 김준규 램리서치 티시피/레인보우 장치의 정전 척 디척킹 장치
KR20120134368A (ko) * 2011-06-02 2012-12-12 엘아이지에이디피 주식회사 기판 척킹 디척킹 장치
KR20180065932A (ko) * 2016-12-08 2018-06-18 도쿄엘렉트론가부시키가이샤 배치대 및 플라즈마 처리 장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024123649A1 (en) * 2022-12-06 2024-06-13 Kla Corporation Lifter assembly with bellows for optical inspection system
KR102639129B1 (ko) * 2023-07-19 2024-02-21 주식회사 기가레인 웨이퍼 디척킹 장치 및 방법

Also Published As

Publication number Publication date
CN114613718A (zh) 2022-06-10
TW202223969A (zh) 2022-06-16
CN114613718B (zh) 2023-03-24
TWI781695B (zh) 2022-10-21

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