KR102250917B1 - 구리-세라믹 복합체 - Google Patents

구리-세라믹 복합체 Download PDF

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KR102250917B1
KR102250917B1 KR1020187025786A KR20187025786A KR102250917B1 KR 102250917 B1 KR102250917 B1 KR 102250917B1 KR 1020187025786 A KR1020187025786 A KR 1020187025786A KR 20187025786 A KR20187025786 A KR 20187025786A KR 102250917 B1 KR102250917 B1 KR 102250917B1
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copper
ceramic
ceramic substrate
aluminum oxide
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KR20180111938A (ko
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카이 헤르브슈트
크리슈티안 무쉘크나우츠
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헤레우스 도이칠란트 게엠베하 운트 코. 카게
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    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
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    • C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
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    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
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    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
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    • C04B41/5111—Ag, Au, Pd, Pt or Cu
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    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5127—Cu, e.g. Cu-CuO eutectic
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
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    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Products (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020187025786A 2016-02-26 2017-02-16 구리-세라믹 복합체 Active KR102250917B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP16157594.9 2016-02-26
EP16157594 2016-02-26
PCT/EP2017/053450 WO2017144332A1 (de) 2016-02-26 2017-02-16 Kupfer-keramik-verbund

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Publication Number Publication Date
KR20180111938A KR20180111938A (ko) 2018-10-11
KR102250917B1 true KR102250917B1 (ko) 2021-05-12

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US (1) US11584696B2 (https=)
EP (1) EP3419949B1 (https=)
JP (1) JP6858786B2 (https=)
KR (1) KR102250917B1 (https=)
CN (1) CN108698935B (https=)
HU (1) HUE053549T2 (https=)
WO (1) WO2017144332A1 (https=)

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Publication number Priority date Publication date Assignee Title
DE102016203112B4 (de) 2016-02-26 2019-08-29 Heraeus Deutschland GmbH & Co. KG Kupfer-Keramik-Verbund
DE102016203058B3 (de) * 2016-02-26 2017-05-18 Heraeus Deutschland GmbH & Co. KG Kupfer-Keramik-Verbund und Modul
CN113929486B (zh) * 2020-06-29 2022-12-09 比亚迪股份有限公司 一种陶瓷覆铜板及其制备方法

Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2010120801A (ja) * 2008-11-19 2010-06-03 Panasonic Corp セラミックス基板
WO2010114126A1 (ja) 2009-04-03 2010-10-07 株式会社住友金属エレクトロデバイス セラミックス焼結体およびそれを用いた半導体装置用基板

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US3744120A (en) 1972-04-20 1973-07-10 Gen Electric Direct bonding of metals with a metal-gas eutectic
US3766634A (en) 1972-04-20 1973-10-23 Gen Electric Method of direct bonding metals to non-metallic substrates
US3994430A (en) 1975-07-30 1976-11-30 General Electric Company Direct bonding of metals to ceramics and metals
DE3204167A1 (de) 1982-02-06 1983-08-11 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten verbinden von metallstuecken mit oxidkeramiksubstraten
DE4004844C1 (de) 1990-02-16 1991-01-03 Abb Ixys Semiconductor Gmbh Verfahren zur Herstellung einer strukturierten Kupfermetallisierung auf einem Keramiksubstrat
DE4318241C2 (de) 1993-06-02 1995-06-29 Schulz Harder Juergen Metallbeschichtetes Substrat mit verbesserter Widerstandsfähigkeit gegen Temperaturwechselbeanspruchung
DE4319944C2 (de) 1993-06-03 1998-07-23 Schulz Harder Juergen Mehrfach-Substrat sowie Verfahren zu seiner Herstellung
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