KR102250672B1 - 광학 이미징 장치의 모델 기반 제어 - Google Patents
광학 이미징 장치의 모델 기반 제어 Download PDFInfo
- Publication number
- KR102250672B1 KR102250672B1 KR1020157026275A KR20157026275A KR102250672B1 KR 102250672 B1 KR102250672 B1 KR 102250672B1 KR 1020157026275 A KR1020157026275 A KR 1020157026275A KR 20157026275 A KR20157026275 A KR 20157026275A KR 102250672 B1 KR102250672 B1 KR 102250672B1
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- South Korea
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/008—Mountings, adjusting means, or light-tight connections, for optical elements with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/028—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361770400P | 2013-02-28 | 2013-02-28 | |
| US61/770,400 | 2013-02-28 | ||
| DE102013203338.9A DE102013203338A1 (de) | 2013-02-28 | 2013-02-28 | Modellbasierte Steuerung einer optischen Abbildungseinrichtung |
| DE102013203338.9 | 2013-02-28 | ||
| PCT/EP2014/053955 WO2014131889A1 (en) | 2013-02-28 | 2014-02-28 | Model-based control of an optical imaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20150122722A KR20150122722A (ko) | 2015-11-02 |
| KR102250672B1 true KR102250672B1 (ko) | 2021-05-12 |
Family
ID=51349494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020157026275A Active KR102250672B1 (ko) | 2013-02-28 | 2014-02-28 | 광학 이미징 장치의 모델 기반 제어 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9581912B2 (https=) |
| JP (1) | JP6530718B2 (https=) |
| KR (1) | KR102250672B1 (https=) |
| DE (1) | DE102013203338A1 (https=) |
| WO (1) | WO2014131889A1 (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014223750A1 (de) * | 2014-11-20 | 2016-05-25 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage mit mindestens einem Manipulator |
| DE102017219151A1 (de) * | 2017-10-25 | 2019-04-25 | Carl Zeiss Smt Gmbh | Verfahren zum Temperieren einer Komponente |
| WO2019081187A1 (en) | 2017-10-25 | 2019-05-02 | Carl Zeiss Smt Gmbh | METHOD FOR REGULATING THE TEMPERATURE OF A COMPONENT |
| KR102445886B1 (ko) * | 2017-12-20 | 2022-09-22 | 현대자동차주식회사 | 온도센서 고장 판단방법 및 판단시스템 |
| DE102018208653A1 (de) * | 2018-05-30 | 2019-12-05 | Carl Zeiss Smt Gmbh | Verfahren sowie Vorrichtung zum Bestimmen des Erwärmungszustandes eines Spiegels in einem optischen System |
| DE102019206865B4 (de) * | 2019-05-13 | 2024-09-12 | Carl Zeiss Smt Gmbh | Verfahren und vorrichtung zum erzeugen eines mathematischen modells zum positionieren von einzelspiegeln eines facettenspiegels in einem optischen system |
| DE102021100995A1 (de) | 2021-01-19 | 2022-07-21 | Carl Zeiss Smt Gmbh | Verfahren sowie Vorrichtung zum Bestimmen des Erwärmungszustandes eines optischen Elements in einem optischen System |
| KR20230131202A (ko) | 2021-01-28 | 2023-09-12 | 칼 짜이스 에스엠테 게엠베하 | 광학 시스템 및 광학 시스템을 동작시키는 방법 |
| DE102021207580A1 (de) * | 2021-07-16 | 2023-01-19 | Carl Zeiss Smt Gmbh | Optisches System, sowie Verfahren zum Betreiben eines optischen Systems |
| DE102021208488B4 (de) | 2021-08-05 | 2025-03-13 | Carl Zeiss Smt Gmbh | Verfahren zum Betreiben eines optischen Systems |
| DE102024200558A1 (de) | 2024-01-22 | 2024-12-19 | Carl Zeiss Smt Gmbh | Verfahren sowie Vorrichtung zum Charakterisieren des Erwärmungszustandes eines Spiegels hinsichtlich des zeitliches Abstandes von einem thermischen Gleichgewichtszustand |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030111458A1 (en) * | 2001-10-03 | 2003-06-19 | Canon Kabushiki Kaisha | Temperature adjusting system in exposure apparatus |
| JP2006024941A (ja) * | 2004-07-08 | 2006-01-26 | Asml Netherlands Bv | リソグラフィ投影装置及びそのリソグラフィ投影装置を使用するデバイス製造方法 |
| JP2010147469A (ja) | 2008-12-18 | 2010-07-01 | Asml Netherlands Bv | リソグラフィ装置およびデバイス製造方法 |
| WO2011092020A2 (en) * | 2010-01-29 | 2011-08-04 | Carl Zeiss Smt Gmbh | Arrangement for use in a projection exposure tool for microlithography having a reflective optical element |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19820158A1 (de) | 1998-05-06 | 1999-11-11 | Convergenza Ag Vaduz | Verfahren und Vorrichtung zur Blutoxygenierung |
| JP2004363559A (ja) | 2003-05-14 | 2004-12-24 | Canon Inc | 光学部材保持装置 |
| EP1513021B1 (en) * | 2003-09-04 | 2007-10-03 | ASML Netherlands B.V. | Lithographic apparatus and a method of compensating for thermal deformation in a lithographic apparatus |
| JP4666908B2 (ja) * | 2003-12-12 | 2011-04-06 | キヤノン株式会社 | 露光装置、計測方法及びデバイス製造方法 |
| DE102006021797A1 (de) | 2006-05-09 | 2007-11-15 | Carl Zeiss Smt Ag | Optische Abbildungseinrichtung mit thermischer Dämpfung |
| WO2009039883A1 (en) * | 2007-09-26 | 2009-04-02 | Carl Zeiss Smt Ag | Optical imaging device with thermal stabilization |
| EP2136250A1 (en) * | 2008-06-18 | 2009-12-23 | ASML Netherlands B.V. | Lithographic apparatus and method |
| TWI498679B (zh) * | 2010-07-30 | 2015-09-01 | 卡爾蔡司Smt有限公司 | 超紫外線曝光裝置 |
| DE102010061950A1 (de) * | 2010-11-25 | 2012-05-31 | Carl Zeiss Smt Gmbh | Verfahren sowie Anordnung zum Bestimmen des Erwärmungszustandes eines Spiegels in einem optischen System |
-
2013
- 2013-02-28 DE DE102013203338.9A patent/DE102013203338A1/de not_active Withdrawn
-
2014
- 2014-02-28 JP JP2015559512A patent/JP6530718B2/ja not_active Expired - Fee Related
- 2014-02-28 KR KR1020157026275A patent/KR102250672B1/ko active Active
- 2014-02-28 WO PCT/EP2014/053955 patent/WO2014131889A1/en not_active Ceased
-
2015
- 2015-07-29 US US14/812,008 patent/US9581912B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030111458A1 (en) * | 2001-10-03 | 2003-06-19 | Canon Kabushiki Kaisha | Temperature adjusting system in exposure apparatus |
| JP2006024941A (ja) * | 2004-07-08 | 2006-01-26 | Asml Netherlands Bv | リソグラフィ投影装置及びそのリソグラフィ投影装置を使用するデバイス製造方法 |
| JP2010147469A (ja) | 2008-12-18 | 2010-07-01 | Asml Netherlands Bv | リソグラフィ装置およびデバイス製造方法 |
| WO2011092020A2 (en) * | 2010-01-29 | 2011-08-04 | Carl Zeiss Smt Gmbh | Arrangement for use in a projection exposure tool for microlithography having a reflective optical element |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016513292A (ja) | 2016-05-12 |
| KR20150122722A (ko) | 2015-11-02 |
| DE102013203338A1 (de) | 2014-08-28 |
| WO2014131889A1 (en) | 2014-09-04 |
| US9581912B2 (en) | 2017-02-28 |
| US20160026093A1 (en) | 2016-01-28 |
| JP6530718B2 (ja) | 2019-06-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
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| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
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| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
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| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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| T11-X000 | Administrative time limit extension requested |
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| T11-X000 | Administrative time limit extension requested |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
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| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
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| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
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| PG1601 | Publication of registration |
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| P22-X000 | Classification modified |
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| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
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