KR102250672B1 - 광학 이미징 장치의 모델 기반 제어 - Google Patents
광학 이미징 장치의 모델 기반 제어 Download PDFInfo
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- KR102250672B1 KR102250672B1 KR1020157026275A KR20157026275A KR102250672B1 KR 102250672 B1 KR102250672 B1 KR 102250672B1 KR 1020157026275 A KR1020157026275 A KR 1020157026275A KR 20157026275 A KR20157026275 A KR 20157026275A KR 102250672 B1 KR102250672 B1 KR 102250672B1
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- 238000012634 optical imaging Methods 0.000 title abstract description 19
- 238000003384 imaging method Methods 0.000 claims abstract description 95
- 238000001514 detection method Methods 0.000 claims abstract description 84
- 238000000034 method Methods 0.000 claims abstract description 68
- 238000004364 calculation method Methods 0.000 claims abstract description 22
- 230000003287 optical effect Effects 0.000 claims description 131
- 238000009826 distribution Methods 0.000 claims description 47
- 230000002123 temporal effect Effects 0.000 claims description 21
- 238000012937 correction Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 13
- 238000013178 mathematical model Methods 0.000 claims description 12
- 230000001105 regulatory effect Effects 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 238000005286 illumination Methods 0.000 claims description 4
- 230000001276 controlling effect Effects 0.000 claims description 3
- 238000005457 optimization Methods 0.000 claims 10
- 238000001393 microlithography Methods 0.000 abstract description 11
- 238000011156 evaluation Methods 0.000 description 20
- 230000006978 adaptation Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 230000001419 dependent effect Effects 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- 239000013543 active substance Substances 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000008542 thermal sensitivity Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/008—Mountings, adjusting means, or light-tight connections, for optical elements with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/028—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361770400P | 2013-02-28 | 2013-02-28 | |
| US61/770,400 | 2013-02-28 | ||
| DE102013203338.9 | 2013-02-28 | ||
| DE102013203338.9A DE102013203338A1 (de) | 2013-02-28 | 2013-02-28 | Modellbasierte Steuerung einer optischen Abbildungseinrichtung |
| PCT/EP2014/053955 WO2014131889A1 (en) | 2013-02-28 | 2014-02-28 | Model-based control of an optical imaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20150122722A KR20150122722A (ko) | 2015-11-02 |
| KR102250672B1 true KR102250672B1 (ko) | 2021-05-12 |
Family
ID=51349494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020157026275A Active KR102250672B1 (ko) | 2013-02-28 | 2014-02-28 | 광학 이미징 장치의 모델 기반 제어 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9581912B2 (enExample) |
| JP (1) | JP6530718B2 (enExample) |
| KR (1) | KR102250672B1 (enExample) |
| DE (1) | DE102013203338A1 (enExample) |
| WO (1) | WO2014131889A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014223750A1 (de) * | 2014-11-20 | 2016-05-25 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage mit mindestens einem Manipulator |
| DE102017219151A1 (de) * | 2017-10-25 | 2019-04-25 | Carl Zeiss Smt Gmbh | Verfahren zum Temperieren einer Komponente |
| WO2019081187A1 (en) | 2017-10-25 | 2019-05-02 | Carl Zeiss Smt Gmbh | METHOD FOR REGULATING THE TEMPERATURE OF A COMPONENT |
| KR102445886B1 (ko) * | 2017-12-20 | 2022-09-22 | 현대자동차주식회사 | 온도센서 고장 판단방법 및 판단시스템 |
| DE102018208653A1 (de) * | 2018-05-30 | 2019-12-05 | Carl Zeiss Smt Gmbh | Verfahren sowie Vorrichtung zum Bestimmen des Erwärmungszustandes eines Spiegels in einem optischen System |
| DE102019206865B4 (de) | 2019-05-13 | 2024-09-12 | Carl Zeiss Smt Gmbh | Verfahren und vorrichtung zum erzeugen eines mathematischen modells zum positionieren von einzelspiegeln eines facettenspiegels in einem optischen system |
| DE102021100995A1 (de) | 2021-01-19 | 2022-07-21 | Carl Zeiss Smt Gmbh | Verfahren sowie Vorrichtung zum Bestimmen des Erwärmungszustandes eines optischen Elements in einem optischen System |
| DE102021208488B4 (de) | 2021-08-05 | 2025-03-13 | Carl Zeiss Smt Gmbh | Verfahren zum Betreiben eines optischen Systems |
| DE102024200558A1 (de) | 2024-01-22 | 2024-12-19 | Carl Zeiss Smt Gmbh | Verfahren sowie Vorrichtung zum Charakterisieren des Erwärmungszustandes eines Spiegels hinsichtlich des zeitliches Abstandes von einem thermischen Gleichgewichtszustand |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030111458A1 (en) * | 2001-10-03 | 2003-06-19 | Canon Kabushiki Kaisha | Temperature adjusting system in exposure apparatus |
| JP2006024941A (ja) * | 2004-07-08 | 2006-01-26 | Asml Netherlands Bv | リソグラフィ投影装置及びそのリソグラフィ投影装置を使用するデバイス製造方法 |
| JP2010147469A (ja) | 2008-12-18 | 2010-07-01 | Asml Netherlands Bv | リソグラフィ装置およびデバイス製造方法 |
| WO2011092020A2 (en) * | 2010-01-29 | 2011-08-04 | Carl Zeiss Smt Gmbh | Arrangement for use in a projection exposure tool for microlithography having a reflective optical element |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19820158A1 (de) | 1998-05-06 | 1999-11-11 | Convergenza Ag Vaduz | Verfahren und Vorrichtung zur Blutoxygenierung |
| JP2004363559A (ja) | 2003-05-14 | 2004-12-24 | Canon Inc | 光学部材保持装置 |
| EP1513021B1 (en) * | 2003-09-04 | 2007-10-03 | ASML Netherlands B.V. | Lithographic apparatus and a method of compensating for thermal deformation in a lithographic apparatus |
| JP4666908B2 (ja) * | 2003-12-12 | 2011-04-06 | キヤノン株式会社 | 露光装置、計測方法及びデバイス製造方法 |
| DE102006021797A1 (de) | 2006-05-09 | 2007-11-15 | Carl Zeiss Smt Ag | Optische Abbildungseinrichtung mit thermischer Dämpfung |
| WO2009039883A1 (en) * | 2007-09-26 | 2009-04-02 | Carl Zeiss Smt Ag | Optical imaging device with thermal stabilization |
| EP2136250A1 (en) * | 2008-06-18 | 2009-12-23 | ASML Netherlands B.V. | Lithographic apparatus and method |
| TWI475330B (zh) * | 2010-07-30 | 2015-03-01 | 卡爾蔡司Smt有限公司 | 超紫外線曝光裝置 |
| DE102010061950A1 (de) * | 2010-11-25 | 2012-05-31 | Carl Zeiss Smt Gmbh | Verfahren sowie Anordnung zum Bestimmen des Erwärmungszustandes eines Spiegels in einem optischen System |
-
2013
- 2013-02-28 DE DE102013203338.9A patent/DE102013203338A1/de not_active Withdrawn
-
2014
- 2014-02-28 WO PCT/EP2014/053955 patent/WO2014131889A1/en not_active Ceased
- 2014-02-28 KR KR1020157026275A patent/KR102250672B1/ko active Active
- 2014-02-28 JP JP2015559512A patent/JP6530718B2/ja active Active
-
2015
- 2015-07-29 US US14/812,008 patent/US9581912B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030111458A1 (en) * | 2001-10-03 | 2003-06-19 | Canon Kabushiki Kaisha | Temperature adjusting system in exposure apparatus |
| JP2006024941A (ja) * | 2004-07-08 | 2006-01-26 | Asml Netherlands Bv | リソグラフィ投影装置及びそのリソグラフィ投影装置を使用するデバイス製造方法 |
| JP2010147469A (ja) | 2008-12-18 | 2010-07-01 | Asml Netherlands Bv | リソグラフィ装置およびデバイス製造方法 |
| WO2011092020A2 (en) * | 2010-01-29 | 2011-08-04 | Carl Zeiss Smt Gmbh | Arrangement for use in a projection exposure tool for microlithography having a reflective optical element |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150122722A (ko) | 2015-11-02 |
| JP2016513292A (ja) | 2016-05-12 |
| US20160026093A1 (en) | 2016-01-28 |
| US9581912B2 (en) | 2017-02-28 |
| DE102013203338A1 (de) | 2014-08-28 |
| JP6530718B2 (ja) | 2019-06-12 |
| WO2014131889A1 (en) | 2014-09-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20150923 Patent event code: PA01051R01D Comment text: International Patent Application |
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| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20190226 Comment text: Request for Examination of Application |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20200811 Patent event code: PE09021S01D |
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| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20210309 |
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| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20210504 Patent event code: PR07011E01D |
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| PR1002 | Payment of registration fee |
Payment date: 20210506 End annual number: 3 Start annual number: 1 |
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| PG1601 | Publication of registration |