KR102248777B1 - 총 측정 불확도의 정량화 및 감소 - Google Patents

총 측정 불확도의 정량화 및 감소 Download PDF

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KR102248777B1
KR102248777B1 KR1020197014620A KR20197014620A KR102248777B1 KR 102248777 B1 KR102248777 B1 KR 102248777B1 KR 1020197014620 A KR1020197014620 A KR 1020197014620A KR 20197014620 A KR20197014620 A KR 20197014620A KR 102248777 B1 KR102248777 B1 KR 102248777B1
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South Korea
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tmu
tools
manufacturing
cli
measurement
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Korean (ko)
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KR20190059329A (ko
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카렌 비아지니
브라이언트 맨티플리
라오 라비찬데르 자얀다
개리 탄
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케이엘에이 코포레이션
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4184—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by fault tolerance, reliability of production system
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4183—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37525—Mean, average values, statistical derived values
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Factory Administration (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020197014620A 2016-10-21 2017-10-19 총 측정 불확도의 정량화 및 감소 Active KR102248777B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/299,616 US10372114B2 (en) 2016-10-21 2016-10-21 Quantifying and reducing total measurement uncertainty
US15/299,616 2016-10-21
PCT/US2017/057467 WO2018075814A2 (en) 2016-10-21 2017-10-19 Quantifying and reducing total measurement uncertainty

Publications (2)

Publication Number Publication Date
KR20190059329A KR20190059329A (ko) 2019-05-30
KR102248777B1 true KR102248777B1 (ko) 2021-05-04

Family

ID=61970306

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197014620A Active KR102248777B1 (ko) 2016-10-21 2017-10-19 총 측정 불확도의 정량화 및 감소

Country Status (7)

Country Link
US (1) US10372114B2 (enExample)
JP (1) JP6941169B2 (enExample)
KR (1) KR102248777B1 (enExample)
CN (1) CN109844664B (enExample)
DE (1) DE112017005308T5 (enExample)
TW (1) TWI725244B (enExample)
WO (1) WO2018075814A2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
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US10360671B2 (en) 2017-07-11 2019-07-23 Kla-Tencor Corporation Tool health monitoring and matching
DE102018211099B4 (de) 2018-07-05 2020-06-18 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Bewerten eines statistisch verteilten Messwertes beim Untersuchen eines Elements eines Photolithographieprozesses
KR102441849B1 (ko) * 2020-09-04 2022-09-08 한국표준과학연구원 계측 센서 근접대응스팬교정에 의한 측정값의 불확도 정량화 방법 및 장치
US20240142948A1 (en) * 2022-11-01 2024-05-02 Kla Corporation Methods And Systems For Monitoring Metrology Fleet Productivity
CN116387208B (zh) * 2023-06-02 2023-08-18 合肥喆塔科技有限公司 基于阈值管控的腔室匹配分析方法、系统、设备及介质
CN117259466B (zh) * 2023-10-07 2024-04-09 河北华伦线缆有限公司 电缆导体用不确定度控制方法

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US6430456B1 (en) 1999-07-26 2002-08-06 Advanced Micro Devices, Inc. Efficient process tool utilization in semiconductor manufacturing using an additional process tool state
US6738682B1 (en) 2001-09-13 2004-05-18 Advances Micro Devices, Inc. Method and apparatus for scheduling based on state estimation uncertainties
US20030079121A1 (en) 2001-10-19 2003-04-24 Applied Materials, Inc. Secure end-to-end communication over a public network from a computer inside a first private network to a server at a second private network
US7143288B2 (en) * 2002-10-16 2006-11-28 Vormetric, Inc. Secure file system server architecture and methods
US7352478B2 (en) * 2002-12-20 2008-04-01 International Business Machines Corporation Assessment and optimization for metrology instrument
WO2004059247A1 (en) * 2002-12-20 2004-07-15 International Business Machines Corporation Assessment and optimization for metrology instrument
WO2004072668A1 (en) * 2003-02-13 2004-08-26 Mcgill Iniversity Mixed-signal-device testing
US7848911B2 (en) 2004-02-20 2010-12-07 Agilent Technologies, Inc. Method of determining measurement uncertainties using circuit simulation
US7107177B2 (en) 2005-02-14 2006-09-12 International Business Machines Corporation Combining multiple reference measurement collections into a weighted reference measurement collection
TWI276932B (en) 2005-02-17 2007-03-21 Powerchip Semiconductor Corp Methods for determining tool assignment sequence and manufacturing systems using the same
US7340374B2 (en) * 2005-02-25 2008-03-04 International Business Machines Corporation Determining fleet matching problem and root cause issue for measurement system
KR100613821B1 (ko) * 2005-05-19 2006-08-22 인터내셔널 비지네스 머신즈 코포레이션 계측 기구에 대한 평가 및 최적화
US7065425B1 (en) * 2005-06-22 2006-06-20 Internaitonal Business Machines Corporation Metrology tool error log analysis methodology and system
DE102005030586A1 (de) 2005-06-30 2007-01-11 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System für eine fortschrittliche Prozesssteuerung unter Anwendung der Messunsicherheit als Steuerungseingang
US8335670B2 (en) 2006-03-17 2012-12-18 Canberra Industries, Inc. Probabilistic uncertainty estimator
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JP5209012B2 (ja) 2010-09-22 2013-06-12 株式会社東芝 位置合わせ測定方法及び位置合わせ測定装置
US8193007B1 (en) * 2011-02-17 2012-06-05 Tokyo Electron Limited Etch process control using optical metrology and sensor devices
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JP2016076010A (ja) * 2014-10-03 2016-05-12 株式会社日立製作所 生産方式評価システムおよび生産方式評価方法

Also Published As

Publication number Publication date
US10372114B2 (en) 2019-08-06
CN109844664A (zh) 2019-06-04
WO2018075814A3 (en) 2018-07-26
WO2018075814A2 (en) 2018-04-26
TWI725244B (zh) 2021-04-21
TW201827966A (zh) 2018-08-01
JP2019537788A (ja) 2019-12-26
JP6941169B2 (ja) 2021-09-29
CN109844664B (zh) 2020-11-10
DE112017005308T5 (de) 2019-08-08
US20180113441A1 (en) 2018-04-26
KR20190059329A (ko) 2019-05-30

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