TWI725244B - 用於程序控制之系統、方法及非暫時性電腦可讀儲存媒體 - Google Patents

用於程序控制之系統、方法及非暫時性電腦可讀儲存媒體 Download PDF

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TWI725244B
TWI725244B TW106136051A TW106136051A TWI725244B TW I725244 B TWI725244 B TW I725244B TW 106136051 A TW106136051 A TW 106136051A TW 106136051 A TW106136051 A TW 106136051A TW I725244 B TWI725244 B TW I725244B
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Taiwan
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tmu
measurement
tools
manufacturing
cli
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TW106136051A
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Chinese (zh)
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TW201827966A (zh
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凱倫 碧雅吉尼
布萊恩特 史丹福 曼緹萊
羅 拉維辰德 嘉延沙
蓋利 塔恩
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美商克萊譚克公司
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Publication of TW201827966A publication Critical patent/TW201827966A/zh
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4184—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by fault tolerance, reliability of production system
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4183—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37525—Mean, average values, statistical derived values
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Factory Administration (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW106136051A 2016-10-21 2017-10-20 用於程序控制之系統、方法及非暫時性電腦可讀儲存媒體 TWI725244B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/299,616 US10372114B2 (en) 2016-10-21 2016-10-21 Quantifying and reducing total measurement uncertainty
US15/299,616 2016-10-21

Publications (2)

Publication Number Publication Date
TW201827966A TW201827966A (zh) 2018-08-01
TWI725244B true TWI725244B (zh) 2021-04-21

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TW106136051A TWI725244B (zh) 2016-10-21 2017-10-20 用於程序控制之系統、方法及非暫時性電腦可讀儲存媒體

Country Status (7)

Country Link
US (1) US10372114B2 (enExample)
JP (1) JP6941169B2 (enExample)
KR (1) KR102248777B1 (enExample)
CN (1) CN109844664B (enExample)
DE (1) DE112017005308T5 (enExample)
TW (1) TWI725244B (enExample)
WO (1) WO2018075814A2 (enExample)

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US10360671B2 (en) 2017-07-11 2019-07-23 Kla-Tencor Corporation Tool health monitoring and matching
DE102018211099B4 (de) 2018-07-05 2020-06-18 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Bewerten eines statistisch verteilten Messwertes beim Untersuchen eines Elements eines Photolithographieprozesses
KR102441849B1 (ko) * 2020-09-04 2022-09-08 한국표준과학연구원 계측 센서 근접대응스팬교정에 의한 측정값의 불확도 정량화 방법 및 장치
US20240142948A1 (en) * 2022-11-01 2024-05-02 Kla Corporation Methods And Systems For Monitoring Metrology Fleet Productivity
CN116387208B (zh) * 2023-06-02 2023-08-18 合肥喆塔科技有限公司 基于阈值管控的腔室匹配分析方法、系统、设备及介质
CN117259466B (zh) * 2023-10-07 2024-04-09 河北华伦线缆有限公司 电缆导体用不确定度控制方法

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Also Published As

Publication number Publication date
US10372114B2 (en) 2019-08-06
CN109844664A (zh) 2019-06-04
WO2018075814A3 (en) 2018-07-26
WO2018075814A2 (en) 2018-04-26
TW201827966A (zh) 2018-08-01
JP2019537788A (ja) 2019-12-26
JP6941169B2 (ja) 2021-09-29
CN109844664B (zh) 2020-11-10
KR102248777B1 (ko) 2021-05-04
DE112017005308T5 (de) 2019-08-08
US20180113441A1 (en) 2018-04-26
KR20190059329A (ko) 2019-05-30

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