KR102248769B1 - 중첩 레이저 용접 장치 및 방법 - Google Patents

중첩 레이저 용접 장치 및 방법 Download PDF

Info

Publication number
KR102248769B1
KR102248769B1 KR1020177025371A KR20177025371A KR102248769B1 KR 102248769 B1 KR102248769 B1 KR 102248769B1 KR 1020177025371 A KR1020177025371 A KR 1020177025371A KR 20177025371 A KR20177025371 A KR 20177025371A KR 102248769 B1 KR102248769 B1 KR 102248769B1
Authority
KR
South Korea
Prior art keywords
laser
metal
metal part
pulse
weld
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020177025371A
Other languages
English (en)
Korean (ko)
Other versions
KR20170116118A (ko
Inventor
다니엘 앤써니 캐포스타그노
야체크 타데우스 가브즈딜
Original Assignee
에스피아이 레이저스 유케이 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에스피아이 레이저스 유케이 리미티드 filed Critical 에스피아이 레이저스 유케이 리미티드
Publication of KR20170116118A publication Critical patent/KR20170116118A/ko
Application granted granted Critical
Publication of KR102248769B1 publication Critical patent/KR102248769B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/22—Spot welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/244—Overlap seam welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B23K26/323—Bonding taking account of the properties of the material involved involving parts made of dissimilar metallic material

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
KR1020177025371A 2015-02-09 2016-02-08 중첩 레이저 용접 장치 및 방법 Active KR102248769B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB1502149.6A GB201502149D0 (en) 2015-02-09 2015-02-09 Apparatus and method for laser welding
GB1502149.6 2015-02-09
PCT/GB2016/000029 WO2016128705A1 (en) 2015-02-09 2016-02-08 Apparatus and method for overlap laser welding

Publications (2)

Publication Number Publication Date
KR20170116118A KR20170116118A (ko) 2017-10-18
KR102248769B1 true KR102248769B1 (ko) 2021-05-04

Family

ID=52746373

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177025371A Active KR102248769B1 (ko) 2015-02-09 2016-02-08 중첩 레이저 용접 장치 및 방법

Country Status (7)

Country Link
US (1) US10668565B2 (https=)
EP (1) EP3256284B1 (https=)
JP (1) JP6993879B2 (https=)
KR (1) KR102248769B1 (https=)
CN (2) CN209754269U (https=)
GB (1) GB201502149D0 (https=)
WO (1) WO2016128705A1 (https=)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016212057A1 (de) * 2016-07-01 2018-01-04 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Verschweißen von Bauteilen
CN106346135A (zh) * 2016-11-04 2017-01-25 广东国玉科技有限公司 异性材料激光焊接方法
KR102404336B1 (ko) * 2017-01-31 2022-05-31 누부루 인크. 청색 레이저를 사용한 구리 용접 방법 및 시스템
JP6484272B2 (ja) * 2017-03-17 2019-03-13 株式会社フジクラ レーザ加工装置およびレーザ加工方法
US11597038B2 (en) 2017-12-28 2023-03-07 Fujikura Ltd. Welding structure, wiring board with metal piece, and welding method
DE102018102523B4 (de) 2018-02-05 2019-10-10 Scansonic Mi Gmbh Schweißverfahren und Laserschweißvorrichtung zum Verbinden von folienartigen Werkstücken
US11504801B2 (en) * 2018-08-24 2022-11-22 Phoenix Laser Solutions Bimetallic joining with powdered metal fillers
DE102018215069A1 (de) * 2018-09-05 2020-03-05 Robert Bosch Gmbh Verfahren zum Verbinden einzelner filmförmiger Folien eines Batteriefolienstapels
JP7192363B2 (ja) * 2018-09-28 2022-12-20 マツダ株式会社 レーザ溶接方法及びレーザ溶接装置
JP7110907B2 (ja) * 2018-10-26 2022-08-02 トヨタ自動車株式会社 異種金属部材の重ね溶接方法
JP6989549B2 (ja) * 2019-03-13 2022-01-05 フタバ産業株式会社 接合体の製造方法
US10926347B2 (en) * 2019-03-25 2021-02-23 Packless Industries Autogenous submerged liquid diffusion welding of titanium
DE102019211581A1 (de) * 2019-08-01 2021-02-04 Trumpf Laser Gmbh Verfahren zum Schweißen einer Kupfer-Aluminium-Verbindung
JP7305502B2 (ja) * 2019-09-26 2023-07-10 株式会社ダイヘン レーザ・アークハイブリッド溶接装置
CN111230298B (zh) * 2020-01-21 2023-03-21 中国科学院物理研究所 纳秒激光的应用以及非晶合金材料的焊接方法
KR102872013B1 (ko) * 2020-06-04 2025-10-17 후루카와 덴키 고교 가부시키가이샤 용접 방법, 용접 장치, 금속 적층체, 전기 부품, 및 전기 제품
DE102020214505A1 (de) 2020-11-18 2022-05-19 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung und Verfahren zum Verbinden von Bauteilen
CN113199147A (zh) * 2021-04-21 2021-08-03 上海工程技术大学 一种用于铝/钢异种金属的激光深熔点焊工艺
CN113290315A (zh) * 2021-05-12 2021-08-24 深圳市艾雷激光科技有限公司 电池电极的焊接方法、设备、控制器及可读存储介质
TWI834045B (zh) * 2021-06-25 2024-03-01 台達電子工業股份有限公司 採用動態光斑的雷射焊接系統及其方法
CN114054957B (zh) * 2021-07-06 2025-03-11 武汉帝尔激光科技股份有限公司 一种异种金属薄膜的激光焊接方法及系统
KR20230058754A (ko) * 2021-10-25 2023-05-03 주식회사 엘지에너지솔루션 나선형 용접부가 형성된 원통형 전지셀 및 이를 포함하는 전지모듈
CN114346429A (zh) * 2021-12-27 2022-04-15 深圳泰德激光技术股份有限公司 薄材激光焊接方法
CN114406469B (zh) * 2022-03-03 2024-09-24 吉林大学 采用镍基高熵合金中间层的钢-铝合金激光焊接方法
CN114985924A (zh) * 2022-05-19 2022-09-02 深圳泰德激光技术股份有限公司 一种薄材件激光焊接方法及构件
JP2024013085A (ja) * 2022-07-19 2024-01-31 矢崎総業株式会社 金属板の接合方法、バスバモジュールの製造方法、及び電池モジュールの製造方法
CN115476056B (zh) * 2022-10-14 2026-02-10 北京慧骨医学科技有限公司 激光光束的光斑确定方法、装置、电子设备及存储介质
CN116275521A (zh) * 2023-04-03 2023-06-23 合肥国轩高科动力能源有限公司 一种电池激流盘的焊接方法
GB202312217D0 (en) * 2023-08-09 2023-09-20 Trumpf Laser Uk Ltd A weld
CN117182367A (zh) * 2023-09-26 2023-12-08 北京星航机电装备有限公司 一种船舶铝铜复合层流板的制作方法
CN117182277A (zh) * 2023-09-26 2023-12-08 北京星航机电装备有限公司 一种异种金属结构件的焊接结构和方法
CN117182368A (zh) * 2023-09-26 2023-12-08 北京星航机电装备有限公司 一种防止异种金属结构件复合焊接裂纹的方法
CN117564468B (zh) * 2023-11-13 2024-07-05 东北电力大学 靶向协同预热的金属材料薄板脉冲激光焊接方法
DE102023004942A1 (de) * 2023-11-30 2025-06-05 Mercedes-Benz Group AG Verfahren zum Laserstrahlschweißen von Bauteilen
JP2025179428A (ja) * 2024-05-28 2025-12-10 リョービ株式会社 異種金属のレーザ溶接方法及び異種金属接合体
CN119897596B (zh) * 2025-04-01 2025-08-05 浙江摩克激光智能装备有限公司 一种异种金属焊接方法、焊接系统及铜基材

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006525659A (ja) * 2003-04-29 2006-11-09 エスピーアイ レーザーズ ユーケー リミテッド 材料加工用のレーザ装置
JP2014140890A (ja) * 2012-12-27 2014-08-07 Amada Miyachi Co Ltd 金属箔の重ね接合方法及び接合構造体

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4873415A (en) * 1988-02-02 1989-10-10 Raycon Corporation Method for welding galvanized material
US5502292A (en) * 1994-08-04 1996-03-26 Midwest Research Institute Method for laser welding ultra-thin metal foils
US6285002B1 (en) 1999-05-10 2001-09-04 Bryan Kok Ann Ngoi Three dimensional micro machining with a modulated ultra-short laser pulse
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
TW516981B (en) * 2000-12-22 2003-01-11 Koninkl Philips Electronics Nv Method of laser welding
JP2002316282A (ja) 2001-04-18 2002-10-29 Matsushita Electric Ind Co Ltd レーザ加工方法及び装置
AU2002253572A1 (en) * 2001-04-27 2002-11-11 Honda Giken Kogyo Kabushiki Kaisha Method and appratus for laser beam welding of overlapping sheets
FR2830477B1 (fr) * 2001-10-09 2004-02-06 Usinor Procede et dispositif de soudage par recouvrement a l'aide d'un faisceau a haute densite d'energie de deux toles revetues
US20050155956A1 (en) 2002-08-30 2005-07-21 Sumitomo Heavy Industries, Ltd. Laser processing method and processing device
JP2004255435A (ja) 2003-02-27 2004-09-16 Suzuki Motor Corp レーザ溶接装置及び方法
US6906281B2 (en) * 2003-03-03 2005-06-14 Dana Corporation Method for laser welding of metal
US7154064B2 (en) * 2003-12-08 2006-12-26 General Motors Corporation Method of improving weld quality
EP1547719A3 (en) 2003-12-26 2009-01-28 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus, laser irradiation method, and method for manufacturing crystalline semiconductor film
DE102004005358B4 (de) * 2004-02-03 2007-03-22 Daimlerchrysler Ag Verfahren zur Laserbearbeitung beschichteter Bleche und beschichtetes Blech
US8604383B2 (en) * 2004-08-06 2013-12-10 Hamamatsu Photonics K.K. Laser processing method
WO2006016441A1 (ja) 2004-08-09 2006-02-16 Nec Corporation 異金属薄板の溶接方法、異金属薄板接合体、電気デバイスおよび電気デバイス集合体
US20090283505A1 (en) * 2005-07-13 2009-11-19 Dr Industries Interface suspension for alloy based laser welding
US9138913B2 (en) 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
DE102006042280A1 (de) * 2005-09-08 2007-06-06 IMRA America, Inc., Ann Arbor Bearbeitung von transparentem Material mit einem Ultrakurzpuls-Laser
CA2688771A1 (en) * 2007-05-18 2008-11-27 Gsi Group Corporation Laser processing of conductive links
US8116341B2 (en) * 2007-05-31 2012-02-14 Electro Scientific Industries, Inc. Multiple laser wavelength and pulse width process drilling
KR101587941B1 (ko) * 2007-11-19 2016-01-22 가부시키가이샤 아마다미야치 레이저 빔조사 장치
EP2394775B1 (en) * 2009-02-09 2019-04-03 Hamamatsu Photonics K.K. Workpiece cutting method
WO2010139841A1 (en) * 2009-06-04 2010-12-09 Corelase Oy Method and apparatus for processing substrates
WO2011018989A1 (ja) * 2009-08-11 2011-02-17 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
JP2013505837A (ja) * 2009-09-24 2013-02-21 イ−エスアイ−パイロフォトニクス レーザーズ インコーポレイテッド 有益なパルス形状を有するレーザパルスのバーストを使用して薄膜材料にラインをスクライブする方法及び装置
KR101116638B1 (ko) * 2009-12-15 2012-03-07 주식회사 성우하이텍 강판의 레이저 용접방법
FI123860B (fi) * 2010-05-18 2013-11-29 Corelase Oy Menetelmä substraattien tiivistämiseksi ja kontaktoimiseksi laservalon avulla ja elektroniikkamoduli
JP5578935B2 (ja) * 2010-05-20 2014-08-27 株式会社アマダミヤチ ファイバレーザ加工装置
US9737960B2 (en) * 2010-07-01 2017-08-22 Magna International Inc. Laser-based lap welding of sheet metal components using laser induced protuberances to control gap
DE102010039893A1 (de) 2010-08-27 2012-03-01 Robert Bosch Gmbh Fügekörper und Verfahren zur Herstellung eines Fügekörpers
KR101240980B1 (ko) * 2010-11-18 2013-03-11 기아자동차주식회사 레이저 용접 품질 검사 방법 및 장치
WO2012106326A1 (en) * 2011-01-31 2012-08-09 The Regents Of The University Of California Using millisecond pulsed laser welding in mems packaging
JP2012170989A (ja) * 2011-02-22 2012-09-10 Suzuki Motor Corp レーザ重ね溶接方法
JP5902400B2 (ja) * 2011-04-26 2016-04-13 トヨタ自動車株式会社 レーザ溶接装置、レーザ溶接方法、鋼板積層体の製造方法及び積層体のレーザ溶接による溶接構造
US9821408B2 (en) * 2011-09-16 2017-11-21 Hamamatsu Photonics K.K. Laser machining method and laser machining device
KR101272050B1 (ko) * 2011-11-11 2013-06-07 주식회사 성우하이텍 레이저 용접방법
DE102012008940B4 (de) 2012-05-08 2022-03-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Fügen von mindestens zwei Werkstücken
JP2014041927A (ja) * 2012-08-22 2014-03-06 Hamamatsu Photonics Kk 加工対象物切断方法
US9757817B2 (en) * 2013-03-13 2017-09-12 Queen's University At Kingston Methods and systems for characterizing laser machining properties by measuring keyhole dynamics using interferometry
US9067278B2 (en) * 2013-03-29 2015-06-30 Photon Automation, Inc. Pulse spread laser
US20160016261A1 (en) * 2013-03-29 2016-01-21 Photon Automation, Inc. Laser welding system and method
DE102013104548B3 (de) 2013-05-03 2014-03-20 Scansonic Mi Gmbh Fügevorrichtung und Fügeverfahren zum thermischen Fügen
DE102013015710A1 (de) * 2013-09-20 2014-07-24 Daimler Ag Verfahren zur Herstellung einer flächigen Schweißverbindung und Anordnung mit einer flächigen Schweißverbindung
US9463992B2 (en) * 2013-11-06 2016-10-11 Advalue Photonics, Inc. Laser processing system using broad band pulsed lasers
US10442719B2 (en) * 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9815730B2 (en) * 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US9850160B2 (en) * 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9701563B2 (en) * 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
JP5982652B2 (ja) 2014-04-15 2016-08-31 パナソニックＩｐマネジメント株式会社 異材金属接合体
CN108406112B (zh) * 2015-02-09 2021-07-27 通快激光英国有限公司 激光焊缝
JP6643263B2 (ja) * 2015-02-13 2020-02-12 日本板硝子株式会社 レーザ加工用ガラス及びそれを用いた孔付きガラスの製造方法
US9889526B2 (en) * 2015-07-03 2018-02-13 Sungwoo Hitech Co., Ltd. Laser welding method for welding dissimilar metal plates
CN107849687B (zh) * 2015-07-09 2020-01-14 奥博泰克有限公司 对激光诱导正向转移喷射角度的控制
CN107949454B (zh) * 2015-09-15 2020-04-28 松下知识产权经营株式会社 金属构件的焊接构造以及焊接方法
JP6605277B2 (ja) * 2015-09-29 2019-11-13 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006525659A (ja) * 2003-04-29 2006-11-09 エスピーアイ レーザーズ ユーケー リミテッド 材料加工用のレーザ装置
JP2014140890A (ja) * 2012-12-27 2014-08-07 Amada Miyachi Co Ltd 金属箔の重ね接合方法及び接合構造体

Also Published As

Publication number Publication date
CN208342006U (zh) 2019-01-08
EP3256284B1 (en) 2025-04-02
JP2018505059A (ja) 2018-02-22
EP3256284A1 (en) 2017-12-20
CN209754269U (zh) 2019-12-10
JP6993879B2 (ja) 2022-01-14
US20180029163A1 (en) 2018-02-01
KR20170116118A (ko) 2017-10-18
EP3256284C0 (en) 2025-04-02
GB201502149D0 (en) 2015-03-25
WO2016128705A1 (en) 2016-08-18
US10668565B2 (en) 2020-06-02

Similar Documents

Publication Publication Date Title
KR102248769B1 (ko) 중첩 레이저 용접 장치 및 방법
JP7095039B2 (ja) 溶接部
US9956646B2 (en) Multiple-beam laser processing using multiple laser beams with distinct wavelengths and/or pulse durations
JP5551792B2 (ja) ２つの金属構成部材の溶接方法、および２つの金属構成部材を有する接合構成体
CN105916627B (zh) 激光焊接方法以及焊接接头
US9149885B2 (en) Method and apparatus for the production of a welding seam or a three-dimensional structure on a surface of a metallic work piece
JP2010264494A (ja) レーザ加工装置及びレーザ加工方法
JP2002028795A (ja) レーザ溶接方法及び装置
JP2002316282A (ja) レーザ加工方法及び装置
CN113967787A (zh) 一种激光焊接方法
JP4352143B2 (ja) レーザスポット溶接における穴欠陥の防止または修復方法および装置
Kelkar Pulsed laser welding
Naeem et al. Microwelding performance comparison between a low power (125W) pulsed Nd: YAG laser and a low power (100-200W) single mode fiber laser
JP2020015052A (ja) 溶接方法、溶接装置、および溶接鋼板
JPH09300086A (ja) レーザ溶接方法
Parker et al. A study of high-speed remote micro-processing with a galvanometer based fiber laser

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20170908

Patent event code: PA01051R01D

Comment text: International Patent Application

AMND Amendment
PG1501 Laying open of application
A201 Request for examination
AMND Amendment
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20190208

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20200617

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20201216

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20200617

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

X091 Application refused [patent]
AMND Amendment
PX0901 Re-examination

Patent event code: PX09011S01I

Patent event date: 20201216

Comment text: Decision to Refuse Application

Patent event code: PX09012R01I

Patent event date: 20200818

Comment text: Amendment to Specification, etc.

Patent event code: PX09012R01I

Patent event date: 20190208

Comment text: Amendment to Specification, etc.

Patent event code: PX09012R01I

Patent event date: 20170914

Comment text: Amendment to Specification, etc.

PX0701 Decision of registration after re-examination

Patent event date: 20210201

Comment text: Decision to Grant Registration

Patent event code: PX07013S01D

Patent event date: 20210108

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

Patent event date: 20201216

Comment text: Decision to Refuse Application

Patent event code: PX07011S01I

Patent event date: 20200818

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

Patent event date: 20190208

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

Patent event date: 20170914

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

X701 Decision to grant (after re-examination)
GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20210429

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20210429

End annual number: 3

Start annual number: 1

PG1601 Publication of registration