KR102240759B9 - 전자 장치 및 그 제조 방법 - Google Patents

전자 장치 및 그 제조 방법

Info

Publication number
KR102240759B9
KR102240759B9 KR1020190063362A KR20190063362A KR102240759B9 KR 102240759 B9 KR102240759 B9 KR 102240759B9 KR 1020190063362 A KR1020190063362 A KR 1020190063362A KR 20190063362 A KR20190063362 A KR 20190063362A KR 102240759 B9 KR102240759 B9 KR 102240759B9
Authority
KR
South Korea
Prior art keywords
fabricating
methods
same
electronic device
electronic
Prior art date
Application number
KR1020190063362A
Other languages
English (en)
Other versions
KR20200137281A (ko
KR102240759B1 (ko
Inventor
정세영
주기수
이승재
Original Assignee
엔트리움 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엔트리움 주식회사 filed Critical 엔트리움 주식회사
Priority to KR1020190063362A priority Critical patent/KR102240759B1/ko
Publication of KR20200137281A publication Critical patent/KR20200137281A/ko
Application granted granted Critical
Publication of KR102240759B1 publication Critical patent/KR102240759B1/ko
Publication of KR102240759B9 publication Critical patent/KR102240759B9/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/80—Constructional details

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020190063362A 2019-05-29 2019-05-29 전자 장치 및 그 제조 방법 KR102240759B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020190063362A KR102240759B1 (ko) 2019-05-29 2019-05-29 전자 장치 및 그 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190063362A KR102240759B1 (ko) 2019-05-29 2019-05-29 전자 장치 및 그 제조 방법

Publications (3)

Publication Number Publication Date
KR20200137281A KR20200137281A (ko) 2020-12-09
KR102240759B1 KR102240759B1 (ko) 2021-04-16
KR102240759B9 true KR102240759B9 (ko) 2022-04-11

Family

ID=73786848

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190063362A KR102240759B1 (ko) 2019-05-29 2019-05-29 전자 장치 및 그 제조 방법

Country Status (1)

Country Link
KR (1) KR102240759B1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102339363B1 (ko) * 2021-03-09 2021-12-16 엔트리움 주식회사 반도체 디바이스와 그 제조 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101800500B1 (ko) 2014-12-04 2017-11-22 주식회사 엘지화학 전자파 차폐 및 방열 복합재 조성물
JP6407186B2 (ja) * 2016-03-23 2018-10-17 Tdk株式会社 電子回路パッケージ
KR20170119421A (ko) 2016-04-19 2017-10-27 전자부품연구원 전자파 차폐필름 및 그의 제조방법
KR102419046B1 (ko) * 2016-06-14 2022-07-12 삼성전자주식회사 반도체 패키지 및 그 제조 방법
US10388611B2 (en) * 2017-03-13 2019-08-20 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming magnetic field shielding with ferromagnetic material

Also Published As

Publication number Publication date
KR20200137281A (ko) 2020-12-09
KR102240759B1 (ko) 2021-04-16

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Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
G170 Re-publication after modification of scope of protection [patent]