KR102229303B1 - Manufacturing method for a conductive adhesive tape - Google Patents

Abstract

The present invention relates to a manufacturing method of a conductive adhesive tape and, more specifically, to a manufacturing method of a conductive adhesive tape, which performs lamination of a metal foils with excellent EMI conductivity or metal powder plating, after micro-face-to-face perforation of a polymer film, and is manufactured by coating a conductive adhesive on one side or both sides of a film.

Description

Conductive adhesive tape manufacturing method {MANUFACTURING METHOD FOR A CONDUCTIVE ADHESIVE TAPE}

The present invention relates to a method of manufacturing a conductive adhesive tape, and more particularly, after a micro-face-to-face perforation of a polymer film, lamination or metal powder plating of a metal foil having excellent EMI conductivity is performed, and a conductive adhesive is coated on one side or both sides of the film. It relates to a method of manufacturing a conductive adhesive tape manufactured by doing.

In electronic devices, malfunction of parts or destruction of materials may occur due to adverse effects of static electricity or electromagnetic waves. In order to prevent such an adverse effect, there is a method of using a conductive adhesive tape for parts inside the device.

Specifically, it is known that a conductive adhesive tape in which conductive particles are added to an adhesive layer using a metal foil as a base material is useful for electromagnetic shielding and grounding applications. In such a conductive adhesive tape, conductivity and adhesion are important performances, and various proposals have been made to improve the performance.

In recent years, electronic devices tend to become more compact and thinner. For example, information devices such as mobile phones, smart phones, and wearable terminals are becoming thinner and smaller.

The conventional conductive adhesive tape uses an adhesive tape in which conductive powder such as Ni is mixed with an acrylic adhesive, but has a disadvantage in that electrical conductivity and thermal conductivity are weak.

Korean Patent Registration No. 10-1753718

In order to solve the problems of the prior art as described above, thermal conductivity, adhesion, uniformity of thickness, electromagnetic wave shielding rate, etc. through lamination of metal foil or coating of conductive metal and conductive adhesive coating after micro-face-to-face drilling of a conductive polymer film. It is characterized by providing a method for manufacturing a conductive adhesive tape that is excellent in this, and particularly has very high conductivity of horizontal (surface) and vertical (up and down) resistance, and does not generate burrs on a cut surface.

The technical problems to be solved by the invention are not limited to the technical problems mentioned above, and other technical problems that are not mentioned will be clearly understood by those of ordinary skill in the technical field to which the present invention belongs from the following description. I will be able to.

The method of manufacturing a conductive adhesive tape of the present invention comprises: a first step of performing micro-face-to-face perforation using a perforated value on a polymer film; A-2 step of coating a conductive metal on one surface of the polymer film; A-3 step of coating a conductive metal on the other surface of the polymer film; And a step A-4 of coating a conductive adhesive on one side or both sides of the polymer film coated with the conductive metal.

In addition, the method of manufacturing a conductive adhesive tape of the present invention includes the step B-1 of laminating a metal foil on one side of a polymer film; Step B-2 of performing micro-face-to-face perforation on the polymer film laminated with the metal foil using a perforation tooth; Step B-3 of coating a conductive metal on the other surface of the polymer film; And a step B-4 of coating a conductive adhesive on one side or both sides of the polymer film coated with the conductive metal.

In addition, the method of manufacturing a conductive adhesive tape of the present invention comprises: a step C-1 of laminating a metal foil on both sides of a polymer film; Step C-2 of performing micro-face-to-face perforation on the polymer film laminated with the metal foil using a perforated tooth; C-3 step of coating a conductive metal on one surface of the polymer film; It characterized in that it comprises a; step C-4 of coating a conductive adhesive on one side or both sides of the polymer film coated with the conductive metal.

By means of solving the above problems, the conductive adhesive tape manufacturing method of the present invention can provide a conductive adhesive tape excellent in adhesive strength, electromagnetic wave shielding rate, horizontal and vertical resistance, and the like.

In addition, there is no occurrence of burr, which is a conventional disadvantage, and the problem of tensile and tear strength of the metal foil is solved, and the oxidized layer is treated to prevent oxidation, so that corrosion and poor conductivity of the surface can be prevented.

In addition, with electrical characteristics, it is efficient in the occurrence rate of electrical shorts or unnecessary electromagnetic waves generated in the printed circuit board (PCB) of all electronic devices such as electronic devices, semiconductors, industrial equipment, and ship communication equipment. Can be shielded.

In addition, it can be used as a component for preventing static electricity generated from PCBs, connectors, cables of electronic devices, and equipment for defense equipment, shielding electromagnetic waves, and preventing grounding and heat dissipation.

1 is a flow chart showing a method of manufacturing a conductive adhesive tape according to a first embodiment of the present invention.
2 is a view showing a cross-sectional view of a conductive adhesive tape according to a first embodiment of the present invention.
3 is a view showing a perspective view of a polymer film perforated face-to-face of a conductive adhesive tape according to a first embodiment of the present invention.
4 is a view showing a cross-sectional view of a polymer film having a face-to-face perforation of a conductive adhesive tape according to a first embodiment of the present invention.
5 is a view showing the entire structure of a perforation device for face-to-face perforation in the method of manufacturing a conductive adhesive tape of the present invention.
6 is a view showing a structure of a perforation part of a perforation device for face-to-face perforation in the method of manufacturing a conductive adhesive tape of the present invention.
7 is a view showing a structure of a control plate of a drilling device for face-to-face drilling in the method of manufacturing a conductive adhesive tape of the present invention.
8 is a view showing the structure of a hole processing tool of a drilling device for face-to-face drilling in the method of manufacturing a conductive adhesive tape of the present invention.
9 is a flow chart showing a method of manufacturing a conductive adhesive tape according to a second embodiment of the present invention.
10 is a flow chart showing a method of manufacturing a conductive adhesive tape according to a third embodiment of the present invention.
11 is a view showing a hole and a metal column formed in a conductive adhesive tape according to an embodiment of the present invention.

Specific matters, including the problems to be solved, means for solving the problems, and effects of the invention as described above, are included in the following examples and drawings. Advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings.

Hereinafter, a method of manufacturing the conductive adhesive tape will be described with reference to drawings and examples.

1 is a flowchart showing a method of manufacturing a conductive adhesive tape according to a first embodiment of the present invention, and FIG. 2 is a view showing a cross-sectional view of a conductive adhesive tape according to a first embodiment of the present invention.

First, in step A-1 (SA1), micro-face-to-face perforation is performed on the polymer film using a perforation value.

Specifically, holes at regular intervals are created by performing micro-face-to-face perforations on the polymer film.

At least one of polyester (PET), polypropylene (PP), polyethylene (PE), polycarbonate (PC), polystyrene (PS), and polyimide (PI) may be used as the polymer film.

In addition, the polymer film may be prepared by interfacial treatment of a non-conductive polymer film by corona discharge etching as a pretreatment.

In the corona discharge etching, a high voltage is applied to the electrode to discharge the corona, thereby impinging accelerated electrons on the film to introduce a hydrophilic group to the surface of the hydrophobic plastic.

Through the pretreatment process, phenomena such as peeling, isolation, cracking, and color imbalance of the surface can be prevented by performing the following operations on the surface of the interfacial-treated film.

Chemical interface treatment may be substituted or additionally performed, and the chemical interface treatment may include caustic soda etching, ultrasonic cleaning, water washing, acid treatment (neutralization), water washing, palladium catalyzed treatment (palladium ion adsorption) water washing, sulfuric acid. The process of activation and washing may be involved.

As mentioned above, a hole may be provided in the polymer film to increase horizontal and vertical resistance. For this purpose, a configuration of forming a hole using a perforation value according to an embodiment of the present invention will be described in more detail below. .

Figure 3 is a view showing a perspective view of a polymer film perforated face of the conductive adhesive tape according to the first embodiment of the present invention, Figure 4 is a view of the polymer film perforated face of the conductive adhesive tape according to the first embodiment of the present invention. It is a view showing a cross-sectional view, Figure 5 is a view showing the entire structure of the perforation device for face-to-face drilling in the conductive adhesive tape manufacturing method of the present invention, Figure 6 is a view for the face-to-face drilling in the conductive adhesive tape manufacturing method of the present invention. It is a view showing the structure of the perforation part of the perforation device, Figure 7 is a view showing the structure of the control plate of the perforation device for face-to-face perforation in the conductive adhesive tape manufacturing method of the present invention, Figure 8 is a conductive adhesive tape manufacturing method of the present invention It is a drawing showing the structure of the hole processing tool of the drilling device for face-to-face drilling of.

As shown in Figure 5, in the hole is formed in the polymer film, a perforation device (A) according to an embodiment of the present invention can be used, the perforation device (A) is an unwinder part (100), A perforation part 200, a rewinder part 300, and a tension control part 400 may be included.

The unwinder part 100 is provided with a polymer film in the form of a roll before processing in which holes are not formed, so that the polymer film is released. The perforation part 200 receives the polymer film released by the unwinder part 100 and moves upward and downward from the upper side of the polymer film to form a plurality of holes, and the rewinder part 300 is formed by the perforation part 200. Holes are formed to receive the processed polymer film, and the polymer film is rolled into a roll.

In this way, the perforation device (A) automatically unwinds the polymer film in the form of a roll, micro-perforates it to form a hole, and then rolls it into a roll form again, so that a polymer film having a plurality of holes can be easily manufactured. The subsequent process can be smoothly performed by using a polymer film.

And, the tension control unit 400 is to be able to maintain a taut state when transferred to the perforation unit 200 or / and rewinder unit 300, and between the unwinder unit 100 and the perforation unit 200, and It may be provided between the study 200 and the rewinder 300.

On the other hand, the perforation 200 is specifically provided in the form of a bar (bar) and a worktable 210 on which the polymer film is positioned on the upper side as shown in FIG. 6 and horizontally provided on the upper side of the worktable 210 in the vertical direction. Includes a support 220 that moves to and a hole processing tool 230 that is coupled to the support 220 to form a hole in the polymer film when it comes into contact with the polymer film located below while moving in the vertical direction together with the support 220 can do. That is, the polymer film before processing is positioned on the upper side of the work table 210, and then as the support 220 moves downward, a hole is formed by the abutting hole processing tool 230, and then moved out of the work table 210.

The hole processing tool 230 includes a micro-perforation needle 232 to form a hole when it comes into contact with the polymer film, and may be provided to adjust the length of a portion of the micro-perforation needle 232 penetrating the polymer film. To this end, the hole processing tool 230 may be configured to include a control plate 231, a micro-perforated needle 232, and a cover plate 233.

More specifically, a plurality of control plates 231 are provided, and the plurality of control plates 231 have through holes 231a having different sizes as shown in FIGS. 7 and 8, and the through holes 231a are formed. As they communicate with each other, the through-holes 231a having a smaller diameter are stacked and bonded toward the lower side. As shown in FIG. 8, the micro-perforated needle 232 forms a sharp cone shape downward and is forcibly fitted into the through-holes 231a of the plurality of control plates 231 so that a part of the micro-perforated needle 232 protrudes downward, and is located at the top. It is provided so as not to protrude upward of the control plate 231. The cover plate 233 is combined with the control plate 231 to cover the control plate 231 located at the top as shown in FIG. 8, so that when the microperforated needle 232 contacts the polymer film, the control plate 231 It plays a role to prevent it from falling out to the upper side of ).

At this time, the plurality of control plates 231 is a method of sequentially removing the control plate 231 located at the lowermost side, as shown in FIG. 8B, by adjusting the number of the micro-perforated needles 232 protruding from the control plate 231 It is possible to change the degree to which it becomes, and accordingly, the size of the hole formed in the polymer film can be adjusted. As an example, the diameter of the hole formed in the polymer film through the hole processing tool 230 as shown in FIG. 8A is 0.005mm, and as shown in FIG. 8B, the hole processing tool 230 from which one control plate 231 is removed. Through the hole formed in the polymer film may have a diameter of 0.008 mm.

On the other hand, the drilling device (A) forms a hole while forming a certain pattern by forming the hole at regular intervals. The horizontal and vertical resistance values may be adjusted together by adjusting the size of the hole and the interval between the hole and the hole.

To this end, the size of the hole according to the exemplary embodiment of the present invention may be formed by adjusting the size of 20 to 300 μm, and the spacing of the pattern is 1 to 5 mm.

In addition, by adjusting the size of the hole and the spacing of the pattern, it is possible to prevent the durability (such as tearing) of the conductive adhesive tape from deteriorating.

As a polymer film applied to a conductive adhesive tape is manufactured using such a perforation device (A), it is not necessary to prepare a manufacturing device for each conductive adhesive tape that requires different horizontal and vertical resistance values. A suitable conductive adhesive tape can be produced easily.

Next, in step A-2 (SA2), a conductive metal is coated on one surface of the polymer film.

Specifically, metal having excellent conductivity is coated on one surface of the perforated polymer film on the inside and the surface of the hole, so that horizontal and vertical resistance is excellent.

The coating of the conductive metal is a metal comprising at least one of Ni, Cu, Ag, and Co having excellent conductivity, and is performed by performing at least one of electrolytic plating, electroless plating, vacuum deposition, and sputtering deposition.

Next, in step A-3 (SA3), a conductive metal is coated on the other surface of the polymer film.

Specifically, a conductive metal is coated on the other surface of the polymer film on which one surface is coated.

Next, in step A-4 (SA4), a conductive adhesive is coated on one side or both sides of the polymer film coated with the conductive metal.

Specifically, a conductive adhesive obtained by mixing a conductive metal powder and a pressure sensitive adhesive is coated on one side or both sides of the polymer film coated with the conductive metal.

The conductive metal powder may be composed of nickel or the like, and the conductive adhesive may be composed of an acrylic adhesive.

The coating of the conductive adhesive may be coated on one side or both sides according to the purpose of the conductive adhesive tape, as presented above.

In addition, the conductive adhesive tape of the present invention may include a configuration in which a polymer film and a metal foil are laminated as in the second embodiment below.

9 is a flow chart showing a method of manufacturing a conductive adhesive tape according to a second embodiment of the present invention.

First, in step B-1 (SB1), a metal foil is laminated on one surface of the polymer film.

Specifically, a metal foil is laminated on one side of the polymer film with a heat curable adhesive.

The polymer film may be subjected to a pretreatment process like the polymer film of the first embodiment.

The metal foil may be made of a material such as copper, aluminum, tin, nickel, stainless steel, etc., and an alloy thereof, and various designs may be changed according to the purpose of use of the conductive adhesive tape.

The heat curable adhesive may be a polyurethane-based adhesive.

Next, in step B-2 (SB2), micro-face-to-face perforation is performed on the polymer film laminated with the metal foil using a perforation value.

Specifically, micro-face-to-face perforation is performed on the polymer film laminated with the metal foil using a perforation value to form holes at regular intervals, and the micro-face-to-face perforation is performed in step A-1 (SA1) of the first embodiment. It is performed in the same way as micro face-to-face drilling

Next, in step B-3 (SB3), a conductive metal is coated on the other surface of the polymer film.

Specifically, a conductive metal is coated on the other surface of the polymer film (the surface opposite to the surface on which the metal foil is laminated), and the coating of the conductive metal is the same as the conductive metal coating in step A-3 (SA3) of the first embodiment. Is performed.

Next, in step B-4 (SB4), a conductive adhesive is coated on one side or both sides of the polymer film coated with the conductive metal.

Specifically, a conductive adhesive is coated on one side or both sides of the polymer film coated with the conductive metal (the side where the metal foil is laminated and the side coated with the conductive metal), and the coating of the conductive pressure sensitive adhesive is A of the first embodiment. -It is carried out in the same manner as the conductive adhesive coating of step 4 (SA4).

In addition, the conductive adhesive tape of the present invention may include a configuration in which a polymer film and a metal foil are laminated (double-sided lamination) as in the following third embodiment.

10 is a flow chart showing a method of manufacturing a conductive adhesive tape according to a third embodiment of the present invention.

First, in the C-1 step (SC1), metal foils are laminated on both sides of the polymer film.

Specifically, metal foils are laminated on both sides of the polymer film with a heat curable adhesive.

The polymer film may be subjected to a pretreatment process like the polymer film of the first embodiment.

The heat curable adhesive may be a polyurethane-based adhesive.

Next, in step C-2 (SB2), micro-face-to-face perforation is performed on the polymer film laminated with the metal foil using a perforation value.

Specifically, micro-face-to-face perforation is performed on the polymer film laminated with the metal foil using a perforation value to form holes at regular intervals, and the micro-face-to-face perforation is performed in step A-1 (SA1) of the first embodiment. It is performed in the same way as micro face-to-face drilling.

Next, in step C-3 (SC3), a conductive metal is coated on one surface of the polymer film.

Specifically, a conductive metal is coated on one surface of the polymer film, and the coating of the conductive metal is performed in the same manner as the conductive metal coating of step A-3 (SA3) of the first embodiment.

Next, in step C-4 (SC4), a conductive adhesive is coated on one side or both sides of the polymer film coated with the conductive metal.

Specifically, a conductive adhesive is coated on one side or both sides of the polymer film coated with the conductive metal (a side coated with a conductive metal and a side opposite to the side coated with the conductive metal), and the coating of the conductive adhesive is the first It is carried out in the same manner as the conductive adhesive coating of step A-4 (SA4) of the embodiment.

The conductive adhesive tape of the present invention may be provided with a metal pillar by means of a hole created by performing micro-face-to-face drilling through the perforation teeth.

11 is a view showing a hole and a metal column formed in a conductive adhesive tape according to an embodiment of the present invention.

As shown in FIG. 11, when a hole is generated by the perforation device presented in the present invention, a protrusion in the shape of a column may be formed on the opposite surface (downward direction) of the perforation needle.

These protrusions may replace the embossing treatment performed in the conventional conductive adhesive tape manufacturing method, thereby increasing the efficiency of work and exhibiting a high vertical conduction effect.

Specifically, adjustment of the micro-perforation needle provided to adjust the size of the hole to be adjusted during drilling and the length of the portion penetrating the polymer film (preparing to enable current by setting the radius of the hole larger than the upper and lower height for current) Thus, it is possible to enable high up and down current of the protrusion to become a metal column.

As described above, it will be understood that the technical configuration of the present invention described above can be implemented in other specific forms without changing the technical spirit or essential features of the present invention by those skilled in the art.

Therefore, the above-described embodiments are to be understood as illustrative and non-limiting in all respects, and the scope of the present invention is indicated by the claims to be described later rather than the detailed description, and the meaning and scope of the claims and the All changes or modifications derived from the equivalent concept should be construed as being included in the scope of the present invention.

A: Drilling device
100: unwinder part 200: perforation part
210: work table 220: support
230: hole tool 231: control plate
231a: through hole 232: micro-perforated needle
233: cover plate 300: rewinder part
400: tension control unit

Claims (7)

Step A-1 of performing micro-face-to-face perforation on the polymer film using a perforation value;
A-2 step of coating a conductive metal on one surface of the polymer film;
A-3 step of coating a conductive metal on the other surface of the polymer film;
Characterized in that it comprises a; step A-4 of coating a conductive adhesive on one side or both sides of the polymer film coated with the conductive metal,
The coating of the conductive metal,
It is carried out by performing at least one of electrolytic plating, electroless plating, vacuum deposition, and sputtering deposition,
A metal column is provided by a hole created by performing the micro face-to-face drilling,
The cloth factory value,
An unwinder part 100 in which a polymer film in which a hole is not formed before processing is provided in a roll form to release the polymer film;
A perforation part 200 for receiving the polymer film unwound by the unwinder and moving in a vertical direction from the upper side of the polymer film to form a plurality of holes;
A rewinder part 300 for winding the polymer film in a roll shape by receiving the processed polymer film by forming a hole by the perforation part; And
A tension control unit provided between the unwinder part and the perforated part 200 and between the perforated part and the rewinder part to maintain a taut state when transferring the polymer film to the perforated part or the rewinder part 300 ( 400),
The perforation part,
A worktable 210 on which the polymer film is seated on the upper side;
A support 220 formed in the form of a bar and horizontally provided on the upper side of the worktable to move in the vertical direction; And
Includes; a hole processing tool 230 coupled to the support 220 to form a hole in the polymer film when it comes into contact with the polymer film located below while moving in the vertical direction together with the support,
The hole machining tool,
A plurality of control plates 231 stacked and coupled to each other through holes 231a of different sizes are formed, and the through holes 231a having a smaller diameter are positioned as the through holes 231a communicate with each other,
It forms a sharp cone shape downward and is forcibly fitted into the through-holes 231a of the plurality of control plates 231 so that a part of the control plate 231 protrudes downward, and is configured not to protrude upward from the control plate 231 located at the top Perforation needle 232; And
A cover plate 233 coupled to the control plate 231 so as to cover the control plate 231 positioned at the uppermost side so as not to fall out of the control plate 231 when the micro-perforated needle 232 contacts the polymer film; Including,
The plurality of control plates,
It is configured to adjust the degree of protrusion of the micro-perforated needles 232 from the control plate 231 and the size of the holes formed in the polymer film by sequentially removing the control plate 231 located at the lowermost side and adjusting the number,
The polymer film before processing is located on the upper side of the work table 210, and as the support 220 moves downward, a hole is formed by the abutting hole processing tool 230, and then moves out of the work table 210. Conductive adhesive tape manufacturing method B-1 step of laminating a metal foil on one side of the polymer film;
Step B-2 of performing micro-face-to-face perforation on the polymer film laminated with the metal foil using a perforation tooth;
Step B-3 of coating a conductive metal on the other surface of the polymer film;
Characterized in that it comprises a; but characterized in that it comprises a; step B-4 of coating a conductive adhesive on one side or both sides of the polymer film coated with the conductive metal,
The coating of the conductive metal,
It is carried out by performing at least one of electrolytic plating, electroless plating, vacuum deposition, and sputtering deposition,
A metal column is provided by a hole created by performing the micro face-to-face drilling,
The cloth factory value,
An unwinder part 100 in which a polymer film in which a hole is not formed before processing is provided in a roll form to release the polymer film;
A perforation part 200 for receiving the polymer film unwound by the unwinder and moving in a vertical direction from the upper side of the polymer film to form a plurality of holes;
A rewinder part 300 for winding the polymer film in a roll shape by receiving the processed polymer film by forming a hole by the perforation part; And
A tension control unit provided between the unwinder part and the perforated part 200 and between the perforated part and the rewinder part to maintain a taut state when transferring the polymer film to the perforated part or the rewinder part 300 ( 400),
The perforation part,
A worktable 210 on which the polymer film is seated on the upper side;
A support 220 formed in the form of a bar and horizontally provided on the upper side of the worktable to move in the vertical direction; And
Includes; a hole processing tool 230 coupled to the support 220 to form a hole in the polymer film when it comes into contact with the polymer film located below while moving in the vertical direction together with the support,
The hole machining tool,
A plurality of control plates 231 stacked and coupled to each other through holes 231a of different sizes are formed, and the through holes 231a having a smaller diameter are positioned as the through holes 231a communicate with each other,
It forms a sharp cone shape downward and is forcibly fitted into the through-holes 231a of the plurality of control plates 231 so that a part of the control plate 231 protrudes downward, and is configured not to protrude upward from the control plate 231 located at the top Perforation needle 232; And
A cover plate 233 that is coupled to the control plate 231 so as to cover the control plate 231 positioned at the uppermost side so as not to fall out of the control plate 231 when the micro-perforated needle 232 contacts the polymer film; Including,
The plurality of control plates,
It is configured to adjust the degree of protrusion of the micro-perforated needles 232 from the control plate 231 and the size of the holes formed in the polymer film by sequentially removing the control plate 231 located at the lowermost side and adjusting the number,
The polymer film before processing is located on the upper side of the work table 210, and as the support 220 moves downward, a hole is formed by the abutting hole processing tool 230, and then moves out of the work table 210. Conductive adhesive tape manufacturing method C-1 step of laminating the metal foil on both sides of the polymer film;
Step C-2 of performing micro-face-to-face perforation on the polymer film laminated with the metal foil using a perforated tooth;
C-3 step of coating a conductive metal on one surface of the polymer film;
Characterized in that it comprises a; but characterized in that it comprises a; step C-4 of coating a conductive adhesive on one side or both sides of the polymer film coated with the conductive metal,
The coating of the conductive metal,
It is carried out by performing at least one of electrolytic plating, electroless plating, vacuum deposition, and sputtering deposition,
A metal column is provided by a hole created by performing the micro face-to-face drilling,
The cloth factory value,
An unwinder part 100 in which a polymer film in which a hole is not formed before processing is provided in a roll form to release the polymer film;
A perforation part 200 for receiving the polymer film unwound by the unwinder and moving in a vertical direction from the upper side of the polymer film to form a plurality of holes;
A rewinder part 300 for winding the polymer film in a roll shape by receiving the processed polymer film by forming a hole by the perforation part; And
A tension control unit provided between the unwinder part and the perforated part 200 and between the perforated part and the rewinder part to maintain a taut state when transferring the polymer film to the perforated part or the rewinder part 300 ( 400),
The perforation part,
A worktable 210 on which the polymer film is seated on the upper side;
A support 220 formed in the form of a bar and horizontally provided on the upper side of the worktable to move in the vertical direction; And
Includes; a hole processing tool 230 coupled to the support 220 to form a hole in the polymer film when it comes into contact with the polymer film located below while moving in the vertical direction together with the support,
The hole machining tool,
A plurality of control plates 231 stacked and coupled to each other through holes 231a of different sizes are formed, and the through holes 231a having a smaller diameter are positioned as the through holes 231a communicate with each other,
It forms a sharp cone shape downward and is forcibly fitted into the through-holes 231a of the plurality of control plates 231 so that a part of the control plate 231 protrudes downward, and is configured not to protrude upward from the control plate 231 located at the top Perforation needle 232; And
A cover plate 233 that is coupled to the control plate 231 so as to cover the control plate 231 positioned at the uppermost side so as not to fall out of the control plate 231 when the micro-perforated needle 232 contacts the polymer film; Including,
The plurality of control plates,
It is configured to adjust the degree of protrusion of the micro-perforated needles 232 from the control plate 231 and the size of the holes formed in the polymer film by sequentially removing the control plate 231 located at the lowermost side and adjusting the number,
The polymer film before processing is located on the upper side of the work table 210, and as the support 220 moves downward, a hole is formed by the abutting hole processing tool 230, and then moves out of the work table 210. Conductive adhesive tape manufacturing method In the method of manufacturing a conductive adhesive tape using a perforated value including an unwinder part, a perforation part, and a rewinder part,
Performing micro-face-to-face perforation on the pretreated polymer film using a perforation tooth;
Forming a hole of a predetermined pattern in the polymer film, and forming the hole by adjusting the size of the hole and the spacing of the pattern; And
Including; coating a conductive metal on one side and the other side of the polymer film in which the holes are formed, and then coating a conductive adhesive on one side or both sides of the polymer film coated with the conductive metal,
The step of forming by adjusting the size of the hole and the spacing of the pattern,
An unwinding step in which the polymer film before processing is provided in a roll form by the unwinder to unwind the polymer film;
A work table on which the polymer film is located on the upper side, a support provided horizontally on the upper side of the work table and moving in an up-down direction, and a hole that forms a hole in the polymer film when contacting the polymer film located below while being bonded to the support Using a perforation including a tool, it moves from the top of the polymer film unwound by the unwinder to form a hole, but by adjusting the number of control plates to change the degree of protrusion of the micro-perforated needle, it is formed in the polymer film. Adjusting the size of the hole to be formed; And
A rewinding step of drying the polymer film processed by forming a hole by the perforation in a roll form by the rewinder,
The size of the hole and the spacing of the pattern,
The size of the hole is formed by controlling the size of 20 to 300㎛, the spacing of the pattern is 1 to 5mm,
The coating of the conductive metal,
It is carried out by performing at least one of electrolytic plating, electroless plating, vacuum deposition, and sputtering deposition,
A metal column is provided by a hole created by performing the micro face-to-face drilling,
The cloth factory value,
An unwinder part 100 in which a polymer film in which a hole is not formed before processing is provided in a roll form to release the polymer film;
A perforation part 200 for receiving the polymer film unwound by the unwinder and moving in a vertical direction from the upper side of the polymer film to form a plurality of holes;
A rewinder part 300 for winding the polymer film in a roll shape by receiving the processed polymer film by forming a hole by the perforation part; And
A tension control unit provided between the unwinder part and the perforated part 200 and between the perforated part and the rewinder part to maintain a taut state when transferring the polymer film to the perforated part or the rewinder part 300 ( 400),
The perforation part,
A worktable 210 on which the polymer film is seated on the upper side;
A support 220 formed in the form of a bar and horizontally provided on the upper side of the worktable to move in the vertical direction; And
Includes; a hole processing tool 230 coupled to the support 220 to form a hole in the polymer film when it comes into contact with the polymer film located below while moving in the vertical direction together with the support,
The hole machining tool,
A plurality of control plates 231 stacked and coupled to each other through holes 231a of different sizes are formed, and the through holes 231a having a smaller diameter are positioned as the through holes 231a communicate with each other,
It forms a sharp cone shape downward and is forcibly fitted into the through-holes 231a of the plurality of control plates 231 so that a part of the control plate 231 protrudes downward, and is configured not to protrude upward from the control plate 231 located at the top Perforation needle 232; And
A cover plate 233 that is coupled to the control plate 231 so as to cover the control plate 231 positioned at the uppermost side so as not to fall out of the control plate 231 when the micro-perforated needle 232 contacts the polymer film; Including,
The plurality of control plates,
It is configured to adjust the degree of protrusion of the micro-perforated needles 232 from the control plate 231 and the size of the holes formed in the polymer film by sequentially removing the control plate 231 located at the lowermost side and adjusting the number,
The polymer film before processing is located on the upper side of the work table 210, and as the support 220 moves downward, a hole is formed by the abutting hole processing tool 230, and then moves out of the work table 210. Conductive adhesive tape manufacturing method delete delete delete

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