KR102218124B1 - 보호 소자 - Google Patents

보호 소자 Download PDF

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Publication number
KR102218124B1
KR102218124B1 KR1020197011763A KR20197011763A KR102218124B1 KR 102218124 B1 KR102218124 B1 KR 102218124B1 KR 1020197011763 A KR1020197011763 A KR 1020197011763A KR 20197011763 A KR20197011763 A KR 20197011763A KR 102218124 B1 KR102218124 B1 KR 102218124B1
Authority
KR
South Korea
Prior art keywords
heating element
side edge
insulating substrate
edge
distance
Prior art date
Application number
KR1020197011763A
Other languages
English (en)
Korean (ko)
Other versions
KR20190050851A (ko
Inventor
유우지 기무라
마사미 가와즈
Original Assignee
데쿠세리아루즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 데쿠세리아루즈 가부시키가이샤 filed Critical 데쿠세리아루즈 가부시키가이샤
Publication of KR20190050851A publication Critical patent/KR20190050851A/ko
Application granted granted Critical
Publication of KR102218124B1 publication Critical patent/KR102218124B1/ko

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00Thermally-actuated switches
    • H01H37/74Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02Details
    • H01H85/04Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05Component parts thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fuses (AREA)
  • Structure Of Printed Boards (AREA)
KR1020197011763A 2016-11-10 2017-11-01 보호 소자 KR102218124B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016219891A JP6811590B2 (ja) 2016-11-10 2016-11-10 保護素子
JPJP-P-2016-219891 2016-11-10
PCT/JP2017/039630 WO2018088308A1 (ja) 2016-11-10 2017-11-01 保護素子

Publications (2)

Publication Number Publication Date
KR20190050851A KR20190050851A (ko) 2019-05-13
KR102218124B1 true KR102218124B1 (ko) 2021-02-19

Family

ID=62110448

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197011763A KR102218124B1 (ko) 2016-11-10 2017-11-01 보호 소자

Country Status (5)

Country Link
JP (1) JP6811590B2 (ja)
KR (1) KR102218124B1 (ja)
CN (1) CN109891546B (ja)
TW (1) TWI741063B (ja)
WO (1) WO2018088308A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7089758B2 (ja) * 2018-09-12 2022-06-23 内橋エステック株式会社 保護素子
JP7523890B2 (ja) * 2019-04-10 2024-07-29 デクセリアルズ株式会社 保護素子及びバッテリパック
JP7340979B2 (ja) 2019-07-22 2023-09-08 デクセリアルズ株式会社 保護素子および保護回路
JP7443144B2 (ja) 2020-04-17 2024-03-05 デクセリアルズ株式会社 保護素子及びバッテリパック

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015035281A (ja) * 2013-08-07 2015-02-19 デクセリアルズ株式会社 保護素子、及びこれを用いた保護回路基板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7582952B2 (en) * 2006-02-21 2009-09-01 Qualcomm Mems Technologies, Inc. Method for providing and removing discharging interconnect for chip-on-glass output leads and structures thereof
JP5489777B2 (ja) * 2010-02-25 2014-05-14 京セラ株式会社 抵抗温度ヒューズパッケージ、並びに抵抗温度ヒューズ
TWI594285B (zh) * 2013-02-05 2017-08-01 Dexerials Corp Short circuit components and circuits using this
JP6227276B2 (ja) * 2013-05-02 2017-11-08 デクセリアルズ株式会社 保護素子
JP6324684B2 (ja) * 2013-08-21 2018-05-16 デクセリアルズ株式会社 保護素子
CN105706210B (zh) * 2014-01-15 2019-01-18 迪睿合株式会社 保护元件
JP6254859B2 (ja) * 2014-01-24 2017-12-27 デクセリアルズ株式会社 遮断素子、遮断素子回路、
JP6356470B2 (ja) * 2014-04-15 2018-07-11 デクセリアルズ株式会社 保護素子
JP6371118B2 (ja) * 2014-05-30 2018-08-08 デクセリアルズ株式会社 保護素子、及びバッテリパック
JP2016018683A (ja) * 2014-07-08 2016-02-01 デクセリアルズ株式会社 保護素子
JP6437262B2 (ja) * 2014-09-26 2018-12-12 デクセリアルズ株式会社 実装体の製造方法、温度ヒューズ素子の実装方法及び温度ヒューズ素子
JP6436729B2 (ja) * 2014-11-11 2018-12-12 デクセリアルズ株式会社 ヒューズエレメント、ヒューズ素子、保護素子、短絡素子、切替素子

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015035281A (ja) * 2013-08-07 2015-02-19 デクセリアルズ株式会社 保護素子、及びこれを用いた保護回路基板

Also Published As

Publication number Publication date
KR20190050851A (ko) 2019-05-13
JP6811590B2 (ja) 2021-01-13
TWI741063B (zh) 2021-10-01
CN109891546B (zh) 2021-05-28
JP2018078046A (ja) 2018-05-17
TW201830446A (zh) 2018-08-16
WO2018088308A1 (ja) 2018-05-17
CN109891546A (zh) 2019-06-14

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