KR102218124B1 - 보호 소자 - Google Patents
보호 소자 Download PDFInfo
- Publication number
- KR102218124B1 KR102218124B1 KR1020197011763A KR20197011763A KR102218124B1 KR 102218124 B1 KR102218124 B1 KR 102218124B1 KR 1020197011763 A KR1020197011763 A KR 1020197011763A KR 20197011763 A KR20197011763 A KR 20197011763A KR 102218124 B1 KR102218124 B1 KR 102218124B1
- Authority
- KR
- South Korea
- Prior art keywords
- heating element
- side edge
- insulating substrate
- edge
- distance
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fuses (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016219891A JP6811590B2 (ja) | 2016-11-10 | 2016-11-10 | 保護素子 |
JPJP-P-2016-219891 | 2016-11-10 | ||
PCT/JP2017/039630 WO2018088308A1 (ja) | 2016-11-10 | 2017-11-01 | 保護素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20190050851A KR20190050851A (ko) | 2019-05-13 |
KR102218124B1 true KR102218124B1 (ko) | 2021-02-19 |
Family
ID=62110448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020197011763A KR102218124B1 (ko) | 2016-11-10 | 2017-11-01 | 보호 소자 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6811590B2 (ja) |
KR (1) | KR102218124B1 (ja) |
CN (1) | CN109891546B (ja) |
TW (1) | TWI741063B (ja) |
WO (1) | WO2018088308A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7089758B2 (ja) * | 2018-09-12 | 2022-06-23 | 内橋エステック株式会社 | 保護素子 |
JP7523890B2 (ja) * | 2019-04-10 | 2024-07-29 | デクセリアルズ株式会社 | 保護素子及びバッテリパック |
JP7340979B2 (ja) | 2019-07-22 | 2023-09-08 | デクセリアルズ株式会社 | 保護素子および保護回路 |
JP7443144B2 (ja) | 2020-04-17 | 2024-03-05 | デクセリアルズ株式会社 | 保護素子及びバッテリパック |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015035281A (ja) * | 2013-08-07 | 2015-02-19 | デクセリアルズ株式会社 | 保護素子、及びこれを用いた保護回路基板 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7582952B2 (en) * | 2006-02-21 | 2009-09-01 | Qualcomm Mems Technologies, Inc. | Method for providing and removing discharging interconnect for chip-on-glass output leads and structures thereof |
JP5489777B2 (ja) * | 2010-02-25 | 2014-05-14 | 京セラ株式会社 | 抵抗温度ヒューズパッケージ、並びに抵抗温度ヒューズ |
TWI594285B (zh) * | 2013-02-05 | 2017-08-01 | Dexerials Corp | Short circuit components and circuits using this |
JP6227276B2 (ja) * | 2013-05-02 | 2017-11-08 | デクセリアルズ株式会社 | 保護素子 |
JP6324684B2 (ja) * | 2013-08-21 | 2018-05-16 | デクセリアルズ株式会社 | 保護素子 |
CN105706210B (zh) * | 2014-01-15 | 2019-01-18 | 迪睿合株式会社 | 保护元件 |
JP6254859B2 (ja) * | 2014-01-24 | 2017-12-27 | デクセリアルズ株式会社 | 遮断素子、遮断素子回路、 |
JP6356470B2 (ja) * | 2014-04-15 | 2018-07-11 | デクセリアルズ株式会社 | 保護素子 |
JP6371118B2 (ja) * | 2014-05-30 | 2018-08-08 | デクセリアルズ株式会社 | 保護素子、及びバッテリパック |
JP2016018683A (ja) * | 2014-07-08 | 2016-02-01 | デクセリアルズ株式会社 | 保護素子 |
JP6437262B2 (ja) * | 2014-09-26 | 2018-12-12 | デクセリアルズ株式会社 | 実装体の製造方法、温度ヒューズ素子の実装方法及び温度ヒューズ素子 |
JP6436729B2 (ja) * | 2014-11-11 | 2018-12-12 | デクセリアルズ株式会社 | ヒューズエレメント、ヒューズ素子、保護素子、短絡素子、切替素子 |
-
2016
- 2016-11-10 JP JP2016219891A patent/JP6811590B2/ja active Active
-
2017
- 2017-11-01 KR KR1020197011763A patent/KR102218124B1/ko active IP Right Grant
- 2017-11-01 CN CN201780066827.4A patent/CN109891546B/zh active Active
- 2017-11-01 WO PCT/JP2017/039630 patent/WO2018088308A1/ja active Application Filing
- 2017-11-09 TW TW106138754A patent/TWI741063B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015035281A (ja) * | 2013-08-07 | 2015-02-19 | デクセリアルズ株式会社 | 保護素子、及びこれを用いた保護回路基板 |
Also Published As
Publication number | Publication date |
---|---|
KR20190050851A (ko) | 2019-05-13 |
JP6811590B2 (ja) | 2021-01-13 |
TWI741063B (zh) | 2021-10-01 |
CN109891546B (zh) | 2021-05-28 |
JP2018078046A (ja) | 2018-05-17 |
TW201830446A (zh) | 2018-08-16 |
WO2018088308A1 (ja) | 2018-05-17 |
CN109891546A (zh) | 2019-06-14 |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |