KR102211633B1 - 거울의 열적 작동을 위한 배열 - Google Patents
거울의 열적 작동을 위한 배열 Download PDFInfo
- Publication number
- KR102211633B1 KR102211633B1 KR1020157026654A KR20157026654A KR102211633B1 KR 102211633 B1 KR102211633 B1 KR 102211633B1 KR 1020157026654 A KR1020157026654 A KR 1020157026654A KR 20157026654 A KR20157026654 A KR 20157026654A KR 102211633 B1 KR102211633 B1 KR 102211633B1
- Authority
- KR
- South Korea
- Prior art keywords
- mirror
- optically effective
- effective surface
- cooling
- mirror substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 110
- 238000001816 cooling Methods 0.000 claims abstract description 79
- 238000010438 heat treatment Methods 0.000 claims abstract description 50
- 239000000463 material Substances 0.000 claims description 52
- 230000003287 optical effect Effects 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 18
- 230000005855 radiation Effects 0.000 claims description 17
- 230000008859 change Effects 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 230000004907 flux Effects 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 230000002745 absorbent Effects 0.000 claims 1
- 239000002250 absorbent Substances 0.000 claims 1
- 230000035945 sensitivity Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 230000006870 function Effects 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008542 thermal sensitivity Effects 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 210000001747 pupil Anatomy 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GNKTZDSRQHMHLZ-UHFFFAOYSA-N [Si].[Si].[Si].[Ti].[Ti].[Ti].[Ti].[Ti] Chemical compound [Si].[Si].[Si].[Ti].[Ti].[Ti].[Ti].[Ti] GNKTZDSRQHMHLZ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001393 microlithography Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000009304 pastoral farming Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
- G03F7/70266—Adaptive optics, e.g. deformable optical elements for wavefront control, e.g. for aberration adjustment or correction
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0825—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a flexible sheet or membrane, e.g. for varying the focus
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/181—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Environmental & Geological Engineering (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Optical Elements Other Than Lenses (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361781280P | 2013-03-14 | 2013-03-14 | |
| DE102013204427.5 | 2013-03-14 | ||
| US61/781,280 | 2013-03-14 | ||
| DE102013204427.5A DE102013204427A1 (de) | 2013-03-14 | 2013-03-14 | Anordnung zur thermischen Aktuierung eines Spiegels, insbesondere in einer mikrolithographischen Projektionsbelichtungsanlage |
| PCT/EP2014/054487 WO2014139896A2 (en) | 2013-03-14 | 2014-03-07 | Arrangement for the thermal actuation of a mirror, in particular in a microlithographic projection exposure apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20150132203A KR20150132203A (ko) | 2015-11-25 |
| KR102211633B1 true KR102211633B1 (ko) | 2021-02-04 |
Family
ID=51418762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020157026654A Active KR102211633B1 (ko) | 2013-03-14 | 2014-03-07 | 거울의 열적 작동을 위한 배열 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9798254B2 (enExample) |
| JP (1) | JP6483626B2 (enExample) |
| KR (1) | KR102211633B1 (enExample) |
| CN (1) | CN105190443B (enExample) |
| DE (1) | DE102013204427A1 (enExample) |
| WO (1) | WO2014139896A2 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013219808A1 (de) * | 2013-09-30 | 2015-04-02 | Heraeus Quarzglas Gmbh & Co. Kg | Spiegelblank für EUV Lithographie ohne Ausdehnung unter EUV-Bestrahlung |
| DE102014223750A1 (de) * | 2014-11-20 | 2016-05-25 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage mit mindestens einem Manipulator |
| CN106324792B (zh) * | 2015-06-19 | 2020-11-03 | 中国科学院大连化学物理研究所 | 一种适用高功率激光使用的相变冷却反射镜 |
| DE102015225509A1 (de) | 2015-12-16 | 2017-06-22 | Carl Zeiss Smt Gmbh | Reflektives optisches Element |
| CN106125298A (zh) * | 2016-08-31 | 2016-11-16 | 中国科学院长春光学精密机械与物理研究所 | 非接触式空间光学遥感器反射镜面形控制系统 |
| US11720034B2 (en) | 2017-04-11 | 2023-08-08 | Asml Netherlands B.V. | Lithographic apparatus and cooling method |
| CN107390346A (zh) * | 2017-09-19 | 2017-11-24 | 北京仿真中心 | 一种低辐射红外场镜装置 |
| DE102019219231A1 (de) | 2019-12-10 | 2020-01-23 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage für die Halbleiterlithographie |
| DE102019219289A1 (de) | 2019-12-11 | 2021-06-17 | Carl Zeiss Smt Gmbh | Optisches System, sowie Heizanordnung und Verfahren zum Heizen eines optischen Elements in einem optischen System |
| DE102020201724A1 (de) * | 2020-02-12 | 2021-08-12 | Carl Zeiss Smt Gmbh | Optisches system und lithographieanlage |
| CN116324621A (zh) * | 2020-08-07 | 2023-06-23 | 卡尔蔡司Smt有限责任公司 | 光学系统与操作光学系统的方法 |
| EP4002009A1 (en) * | 2020-11-11 | 2022-05-25 | ASML Netherlands B.V. | A method and apparatus for thermally deforming an optical surface of an optical element |
| CN116368436A (zh) * | 2020-11-11 | 2023-06-30 | Asml荷兰有限公司 | 用于使光学元件热变形的方法和设备 |
| DE102021201258A1 (de) | 2021-02-10 | 2022-08-11 | Carl Zeiss Smt Gmbh | Verfahren zum Heizen eines optischen Elements in einer mikrolithographischen Projektionsbelichtungsanlage, sowie optisches System |
| DE102021213458A1 (de) | 2021-11-30 | 2022-08-18 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage für die Halbleiterlithografie |
| DE102021214366A1 (de) * | 2021-12-15 | 2023-06-15 | Carl Zeiss Smt Gmbh | Vorrichtung und Verfahren zur Vermeidung einer Degradation einer optischen Nutzoberfläche eines Spiegelmoduls, Projektionssystem, Beleuchtungssystem sowie Projektionsbelichtungsanlage |
| CN114924378B (zh) * | 2022-05-30 | 2023-10-27 | 深圳综合粒子设施研究院 | 一种反射镜面形控制结构及光束线装置 |
| DE102022211636A1 (de) | 2022-11-04 | 2024-05-08 | Carl Zeiss Smt Gmbh | Optisches System, sowie Verfahren zum Betreiben eines optischen Systems |
| CN116203722A (zh) * | 2023-01-04 | 2023-06-02 | 深圳综合粒子设施研究院 | 反射镜的面形优化方法及装置 |
| WO2024145826A1 (zh) * | 2023-01-04 | 2024-07-11 | 深圳综合粒子设施研究院 | 反射镜的面形优化方法及装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005117048A (ja) * | 2003-10-09 | 2005-04-28 | Asml Netherlands Bv | リトグラフ装置、および、デバイスの製造方法 |
| JP2011512018A (ja) * | 2007-10-09 | 2011-04-14 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 光学素子の温度制御装置 |
| US20110249245A1 (en) * | 2010-04-07 | 2011-10-13 | Asml Netherlands B.V. | Method of cooling an optical element, lithographic apparatus and method for manufacturing a device |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0868898A (ja) * | 1994-08-29 | 1996-03-12 | Nikon Corp | 反射鏡およびその製造方法 |
| JP2004056125A (ja) * | 2002-06-20 | 2004-02-19 | Nikon Corp | 個別アクチュエータを有する反射投影光学系 |
| US6880942B2 (en) * | 2002-06-20 | 2005-04-19 | Nikon Corporation | Adaptive optic with discrete actuators for continuous deformation of a deformable mirror system |
| US20040051984A1 (en) | 2002-06-25 | 2004-03-18 | Nikon Corporation | Devices and methods for cooling optical elements in optical systems, including optical systems used in vacuum environments |
| JP2005019628A (ja) * | 2003-06-25 | 2005-01-20 | Nikon Corp | 光学装置、露光装置、並びにデバイス製造方法 |
| JP4537087B2 (ja) * | 2004-02-12 | 2010-09-01 | キヤノン株式会社 | 露光装置、デバイスの製造方法 |
| DE102006045075A1 (de) | 2006-09-21 | 2008-04-03 | Carl Zeiss Smt Ag | Steuerbares optisches Element |
| EP1950594A1 (de) | 2007-01-17 | 2008-07-30 | Carl Zeiss SMT AG | Abbildende Optik, Projektionsbelichtunsanlage für die Mikrolithographie mit einer derartigen abbildenden Optik, Verfahren zur Herstellung eines mikrostrukturierten Bauteils mit einer derartigen Projektionsbelichtungsanlage, durch das Herstellungsverfahren gefertigtes mikrostrukturiertes Bauelement sowie Verwendung einer derartigen abbildenden Optik |
| US7894038B2 (en) * | 2007-03-14 | 2011-02-22 | Asml Netherlands B.V. | Device manufacturing method, lithographic apparatus, and a computer program |
| WO2009026970A1 (en) * | 2007-08-24 | 2009-03-05 | Carl Zeiss Smt Ag | Controllable optical element and method for operating an optical element with thermal actuators and projection exposure apparatus for semiconductor lithography |
| US7740362B1 (en) * | 2008-02-19 | 2010-06-22 | Jefferson Science Associates | Mirror with thermally controlled radius of curvature |
| WO2009152959A1 (en) | 2008-06-17 | 2009-12-23 | Carl Zeiss Smt Ag | Projection exposure apparatus for semiconductor lithography comprising a device for the thermal manipulation of an optical element |
| US20100033704A1 (en) * | 2008-08-11 | 2010-02-11 | Masayuki Shiraishi | Deformable mirror, mirror apparatus, and exposure apparatus |
| DE102009039400A1 (de) | 2009-08-31 | 2011-03-03 | Carl Zeiss Laser Optics Gmbh | Reflektives optisches Element zur Verwendung in einem EUV-System |
| JP5732257B2 (ja) * | 2010-01-15 | 2015-06-10 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置、デバイス製造方法およびコンピュータ読取可能媒体 |
| EP2598947B1 (en) * | 2010-07-30 | 2020-04-29 | Carl Zeiss SMT GmbH | Euv exposure apparatus |
| DE102011081259A1 (de) * | 2010-09-28 | 2012-03-29 | Carl Zeiss Smt Gmbh | Anordnung zur Spiegeltemperaturmessung und/oder zur thermischen Aktuierung eines Spiegels in einer mikrolithographischen Projektionsbelichtungsanlage |
| DE102011005778A1 (de) * | 2011-03-18 | 2012-09-20 | Carl Zeiss Smt Gmbh | Optisches Element |
| DE102011005840A1 (de) * | 2011-03-21 | 2012-09-27 | Carl Zeiss Smt Gmbh | Steuerbare Mehrfachspiegelanordnung, optisches System mit einer steuerbaren Mehrfachspiegelanordnung sowie Verfahren zum Betreiben einer steuerbaren Mehrfachspiegelanordnung |
-
2013
- 2013-03-14 DE DE102013204427.5A patent/DE102013204427A1/de not_active Withdrawn
-
2014
- 2014-03-07 WO PCT/EP2014/054487 patent/WO2014139896A2/en not_active Ceased
- 2014-03-07 CN CN201480014966.9A patent/CN105190443B/zh active Active
- 2014-03-07 JP JP2015562046A patent/JP6483626B2/ja active Active
- 2014-03-07 KR KR1020157026654A patent/KR102211633B1/ko active Active
-
2015
- 2015-09-09 US US14/848,593 patent/US9798254B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005117048A (ja) * | 2003-10-09 | 2005-04-28 | Asml Netherlands Bv | リトグラフ装置、および、デバイスの製造方法 |
| JP2011512018A (ja) * | 2007-10-09 | 2011-04-14 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 光学素子の温度制御装置 |
| US20110249245A1 (en) * | 2010-04-07 | 2011-10-13 | Asml Netherlands B.V. | Method of cooling an optical element, lithographic apparatus and method for manufacturing a device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105190443A (zh) | 2015-12-23 |
| WO2014139896A3 (en) | 2014-11-06 |
| CN105190443B (zh) | 2019-04-23 |
| US20160041480A1 (en) | 2016-02-11 |
| DE102013204427A1 (de) | 2014-09-18 |
| KR20150132203A (ko) | 2015-11-25 |
| JP6483626B2 (ja) | 2019-03-13 |
| WO2014139896A2 (en) | 2014-09-18 |
| US9798254B2 (en) | 2017-10-24 |
| JP2016517028A (ja) | 2016-06-09 |
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