KR102182022B1 - Light emitting device package and light emitting module - Google Patents

Abstract

The light emitting device package of the embodiment includes a package body having a cavity, a light emitting device disposed within the cavity of the package, a lens disposed on the light emitting device within the cavity, and a molding member disposed between the lens and the bottom surface of the cavity to surround the light emitting device And an optical fiber disposed over the lens, wherein the optical fiber is embedded in the upper portion of the cavity and includes an upper side extending from a lower side and a lower side disposed on the exit surface of the lens to the outside of the cavity.

Description

Light emitting device package and light emitting module TECHNICAL FIELD

The embodiment relates to a light emitting device package and a light emitting module.

Light Emitting Diode (LED) is a kind of semiconductor device that converts electricity into infrared or light using the characteristics of a compound semiconductor to send and receive signals, or used as a light source.

Group III-V nitride semiconductors are in the spotlight as core materials for light emitting devices such as light emitting diodes (LEDs) or laser diodes (LDs) due to their physical and chemical properties.

These light-emitting diodes do not contain environmentally hazardous substances such as mercury (Hg), which are used in conventional lighting equipment such as incandescent and fluorescent lamps, so they have excellent eco-friendliness, and have advantages such as long lifespan and low power consumption. Are replacing them.

Various materials are used to protect the light emitting device package including the above light emitting device from an external environment, such as moisture or moisture. Even if the light-emitting device package is sealed using a metal, silicon-based material, or epoxy-based material, the light-emitting device package is an electrical device and therefore has an electrode structure exposed to the outside and is vulnerable to moisture or moisture. Even in the case of a light emitting module in which the light emitting device package is modular, it is vulnerable to moisture or moisture.

In particular, a light emitting device package used for sterilization emits light in a deep ultraviolet wavelength band. In this case, since bacteria, viruses, and molds to be sterilized mainly live in places with high moisture, the light emitting device package for sterilization is often used in places with high moisture. In consideration of this, there is a need for a light emitting device package for sterilization resistant to moisture or moisture.

The embodiment provides a light emitting device package and a light emitting module resistant to moisture or moisture.

The light emitting device package of the embodiment includes: a package body having a cavity; A light emitting device disposed in the cavity of the package; A lens disposed on the light emitting element within the cavity; A molding member disposed between the lens and the bottom surface of the cavity to surround the light emitting element; And an optical fiber disposed on the lens, wherein the optical fiber is buried in an upper portion of the cavity and disposed on an emission surface of the lens; And an upper side extending from the lower side to the outside of the cavity.

The lens may have a thickness of 200 μm to 3 mm.

The light emitting device may emit light in a deep ultraviolet wavelength band. The material of the optical fiber may include a quartz-based material. The package body may include at least one of aluminum, ceramic, copper, or gold.

The difference in refractive index between the molding member and the lens may be substantially the same as the difference in refractive index between the lens and the optical fiber.

The first refractive index of the molding member may be less than or equal to the second refractive index of the lens, and the second refractive index may be less than or equal to the third refractive index of the optical fiber.

The thickness (t) between the light emitting element and the lens of the molding member may be as follows.

Here, W represents the width of the cavity.

The thickness t of the lens may be as follows.

The molding member may be liquid.

The molding member may have a multilayer structure stacked in a thickness direction of the package body. At least one of the multilayers of the molding member may be liquid and the other may be solid.

The thickness of the lower side of the optical fiber buried in the upper portion of the cavity may be 1 mm or more.

The optical fiber and the lens may be bonded to each other with a silicone-based transparent adhesive.

The cavity may have a parabolic cross-sectional shape whose width increases from the bottom to the top.

An upper side of the optical fiber has a predetermined length, and an end of the upper side may emit light in water.

A light emitting module according to another embodiment includes a module substrate; And the light emitting device package disposed on the module substrate.

In the light emitting device package and the light emitting module according to the embodiment, since light is emitted from the end of the optical fiber, it is resistant to moisture or moisture and can emit light in water, so that it can be easily used for sterilization using deep ultraviolet light.

1 is a plan view of a light emitting device package according to an embodiment.
FIG. 2 is a cross-sectional view of an exemplary embodiment taken along line A-A' shown in FIG. 1.
3 is an enlarged cross-sectional view of a portion'B' shown in FIG. 2.
4 is a graph showing the intensity of normalized ultraviolet light output according to the first thickness of the lens illustrated in FIG. 2.
5 is a cross-sectional view of another embodiment taken along line A-A' shown in FIG. 1.
6 shows a partial cross-sectional view of the molding member, the lens and the optical fiber shown in FIG. 2.
7 is a cross-sectional view of another embodiment taken along line A-A' shown in FIG. 1.
8 shows a state in which the light emitting device package sterilizes water contained in a water tank.
9 is a perspective view of a light emitting module according to an embodiment.
10 is a perspective view illustrating an application example of a light emitting module according to an embodiment.
11 is a perspective view for explaining another application example of the light emitting module according to the embodiment.
12 is a perspective view for explaining another application example of the light emitting module according to the embodiment.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings in order to explain the present invention by way of example, and to aid understanding of the invention. However, the embodiments according to the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the embodiments described below. Embodiments of the present invention are provided to more completely describe the present invention to those with average knowledge in the art.

In the description of the embodiment according to the present invention, in the case of being described as being formed in the "top (top)" or "bottom (on or under)" of each element, the top (top) or bottom (bottom) (on or under) includes both elements in direct contact with each other or in which one or more other elements are indirectly formed between the two elements. In addition, when expressed as “up (up)” or “on or under”, the meaning of not only an upward direction but also a downward direction based on one element may be included.

In addition, relational terms such as "first" and "second," "upper" and "lower" used below do not necessarily require or imply any physical or logical relationship or order between such entities or elements. Thus, it may be used only to distinguish one entity or element from another entity or element.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. Also, the size of each component does not fully reflect the actual size.

Hereinafter, a light emitting device package according to an embodiment will be described with reference to the accompanying drawings. The embodiment will be described using Cartesian coordinate systems (x, y, z), but it goes without saying that other coordinate systems may also be used.

1 is a plan view of a light emitting device package 100 according to the embodiment, and FIG. 2 is a cross-sectional view of an embodiment 100A taken along line A-A′ shown in FIG. 1.

1 and 2, the light emitting device packages 100 and 100A include a package body 110, an optical fiber 120, a lens 130, a molding member 140A, a light emitting device 150, and a wire 162. , 164).

The light emitting device 150 may be disposed within the cavity C1 of the package body 110. The light emitting device 150 may have a vertical bonding structure, a horizontal bonding structure, or a flip chip bonding structure, and the embodiment is not limited to the bonding structure.

The light-emitting device 150 includes an LED using a plurality of compound semiconductor layers, for example, a compound semiconductor layer of a group III-V element, and the LED is a colored LED emitting light such as blue, green, or red, and ultraviolet rays (UV). :UltraViolet) LED, deep ultraviolet LED or non-polarized LED can be. The light emitted from the LED may be implemented using various semiconductors, but is not limited thereto.

Hereinafter, for better understanding of the embodiment, the light emitting device 150 will be described as having a flip chip bonding structure, but the embodiment may also be applied to a light emitting device having a vertical bonding structure or a horizontal bonding structure.

3 is an enlarged cross-sectional view of a portion'B' shown in FIG. 2.

Referring to FIG. 3, the light emitting device 150 includes a sub mount 152, a light emitting structure 154, a substrate 170, a first electrode 182, a second electrode 184, and first and second bumps ( 186 and 188 and first and second metal pads 192 and 194 may be included.

The light emitting structure 154 may be disposed on the sub mount 152. The sub-mount 152 may be formed of a semiconductor substrate such as AlN, BN, silicon carbide (SiC), GaN, GaAs, or Si, but is not limited thereto and may be formed of a semiconductor material having thermal characteristics.

The light emitting structure 154 may be disposed under the substrate 170. The substrate 170 may have light transmittance so that light emitted from the active layer 133B can be emitted through the substrate 131. For example, the substrate 170 may be formed of at least one of sapphire (Al ₂ O ₃ ), SiC, GaAs, GaN, ZnO, Si, GaP, InP, and Ge, but is not limited thereto. In addition, the substrate 170 may have a mechanical strength sufficient for separating into separate chips through a scribing process and a breaking process without causing warpage to the entire nitride semiconductor.

The light emitting structure 154 may have a structure in which a first conductivity type semiconductor layer 154-1, an active layer 154-2, and a second conductivity type semiconductor layer 154-3 are sequentially stacked.

The first conductivity type semiconductor layer 154-1 may be formed of a semiconductor compound. It may be implemented with a compound semiconductor such as Group III-V or Group II-VI, and may be doped with a first conductivity type dopant. For example, the first conductivity-type semiconductor layer 154-1 has a composition formula of Al _x In _y Ga _(1-xy) N (0≤x≤1, 0≤y≤1, 0≤x+y≤1) It may be formed of any one or more of a semiconductor material having, InAlGaN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP. When the first conductivity-type semiconductor layer 154-1 is an n-type semiconductor layer, the first conductivity-type dopant may include an n-type dopant such as Si, Ge, Sn, Se, and Te. The first conductivity type semiconductor layer 154-1 may be formed as a single layer or multiple layers, but is not limited thereto. If the light emitting device 150 is an ultraviolet (UV), deep UV, or non-polarized light emitting device, the first conductivity type semiconductor layer 154-1 may include at least one of InAlGaN and AlGaN. . When the first conductivity type semiconductor layer 154-1 is made of AlGaN, the content of Al may be 50%.

The active layer 154-2 is disposed between the first conductivity type semiconductor layer 154-1 and the second conductivity type semiconductor layer 154-3, and is a single well structure, a multiple well structure, a single quantum well structure, and multiple quantum It may include any one of a multi-quantum well (MQW) structure, a quantum dot structure, or a quantum wire structure. The active layer 154-2 is a well layer and a barrier layer, such as InGaN/GaN, InGaN/InGaN, GaN/AlGaN, InAlGaN/GaN, GaAs(InGaAs),/ AlGaAs, GaP (InGaP) / AlGaP may be formed in any one or more pair structure, but is not limited thereto. The well layer may be formed of a material having an energy band gap smaller than that of the barrier layer. In particular, the active layer 154-2 according to the embodiment may generate light of ultraviolet or deep ultraviolet wavelength. For example, the wavelength band of light emitted from the active layer 154-2 may be 200 nm to 405 nm.

The second conductivity type semiconductor layer 154-3 may be disposed under the active layer 154-2. The second conductivity type semiconductor layer 154-3 may be formed of a semiconductor compound. The second conductivity type semiconductor layer 154-3 may be implemented as a compound semiconductor such as Group III-V or Group II-VI, and may be doped with a second conductivity type dopant. For example, a semiconductor material having a composition formula of In _x Al _y Ga _1-xy N (0≤x≤1, 0≤y≤1, 0≤x+y≤1) or AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP It may be formed of any one or more of. When the second conductivity-type semiconductor layer 154-3 is a p-type semiconductor layer, the second conductivity-type dopant may be a p-type dopant such as Mg, Zn, Ca, Sr, Ba, or the like. The second conductivity type semiconductor layer 154-3 may be formed as a single layer or multiple layers, but is not limited thereto. If the light emitting device 150 is an ultraviolet (UV), deep UV, or non-polarized light emitting device, the second conductivity-type semiconductor layer 154-3 may include at least one of InAlGaN and AlGaN. .

The first electrode 182 is in contact with the first conductivity type semiconductor layer 154-1 and may be formed of a metal. For example, the first electrode 182 may be formed of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf, and selective combinations thereof.

The first electrode 182 may be a transparent conductive oxide (TCO) film. For example, the first electrode 182 includes the above-described metal material, indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IAZO), and indium gallium (IGZO). zinc oxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), GZO (gallium zinc oxide), IrOx, RuOx, RuOx/ITO, Ni/IrOx/Au, and Ni/ It may include at least one of IrOx/Au/ITO, but is not limited to these materials. The first electrode 182 may include a material in ohmic contact with the first conductivity type semiconductor layer 154-1. In addition, the first electrode 182 may be formed of a single layer or multiple layers of a reflective electrode material having ohmic characteristics. If the first electrode 182 performs an ohmic role, a separate ohmic layer (not shown) may not be formed.

The second electrode 184 extends parallel to the active layer 154-2 and is disposed under the second conductivity type semiconductor layer 154-3. The second electrode 184 has an energy band gap larger than the energy band gap of the active layer 154-2. Because, when the energy band gap of the second electrode 184 is not larger than the energy band gap of the active layer 154-2, the light emitted from the active layer 154-2 does not transmit or reflect the second electrode 184. Because it can be absorbed without.

The second electrode 184 may include, for example, at least one of AlN and BN, but is not limited thereto. That is, any material that can reflect or transmit light emitted from the active layer 154-2 without absorbing it and that can be grown on the second conductivity-type semiconductor layer 154-3 with good quality is the second electrode ( 184).

The first electrode 182 is connected to the first metal pad 192 of the sub mount 152 using the first bump 186, and the second electrode 184 is used as the second bump 188. It may be connected to the second metal pad 194 of the mount 152.

The first metal pad 192 is connected to the first body portion 110A by the first wire 162, and the second metal pad 194 is the second body portion 110B by the second wire 164 Can be connected to

The package body 110 may include first and second body portions 110A and 110B. If the first and second body parts 110A and 110B are made of a material having electrical conductivity, the insulating material 172 electrically separates the first body part 110A and the second body part 110B from each other. It plays a role to let.

The package body 110 has a cavity C1, and the above-described light emitting device 150 may be mounted in the cavity C1. For example, the package body 110 may include at least one of aluminum, ceramic, copper, or gold.

The lens 130 may be disposed on the light emitting device 150 within the cavity C1 of the package body 110. Here, the lens 130 may play a role of condensing light emitted from the light-emitting element 150 and transmitting it to the optical fiber 120.

4 is a graph showing the intensity of normalized UV power according to the first thickness t1 of the lens 130 illustrated in FIG. 2, where the horizontal axis represents the first thickness t1 and the vertical axis Indicates the intensity of light.

In FIG. 4, reference numerals '162', '164', and '166' denote when the distance between the measuring device for measuring the light output intensity of the light emitting device package and the light emitting device package is 5 cm, 6 cm, and 7 cm, respectively. Show.

When the light emitting device 150 emits light in the deep ultraviolet wavelength band, as illustrated in FIG. 4, as the first thickness t1 of the lens 130 increases, the light output of the light emitting device packages 100 and 100A is Can increase. For example, the lens 130 may have a first thickness t1 of 200 μm to 3 mm, but the embodiment is not limited to a specific value of the first thickness t1.

When the thickness of the lens 130 is formed to be thick as described above, the light emitted from the light emitting element 150 through the molding member 140A can be efficiently totally reflected and directed to the optical fiber 120.

Meanwhile, the molding member 140A may be disposed between the lens 130 and the bottom surface CB of the cavity C1 to surround the light emitting element 150. In addition, the molding member 140A may include a phosphor to change the wavelength of light emitted from the light emitting device chip 150.

According to an embodiment, the molding member 140A may be liquid or solid.

In addition, the molding member 140A may have a multilayer structure stacked in the z-axis direction, which is the thickness direction of the package body 110.

5 is a cross-sectional view of another embodiment 100B taken along line A-A' shown in FIG. 1.

The molding member 140A illustrated in FIG. 2 has a single layer structure, while the molding member 140B illustrated in FIG. 5 has a multilayer structure. Except for this, since the light-emitting device 100B illustrated in FIG. 5 is the same as the light-emitting device 100A illustrated in FIG. 2, descriptions of the same parts are omitted and only differences are described.

The molding member 140B illustrated in FIG. 5 may include first and second molding members 140B-1 and 140B-2. The molding member 140A illustrated in FIG. 2 may be liquid or solid. Alternatively, at least one of the multilayers 140B-1 and 140B-2 of the molding member 140B illustrated in FIG. 5 may be in a liquid state and the other layer may be in a solid state. For example, the first molding member 140B-1 may be in a solid state, and the second molding member 140B-2 may be in a liquid state. Conversely, the first molding member 140B-1 may be in a liquid state, and the second molding member 140B-1 may be in a liquid state. The member 140B-2 may be solid. Alternatively, both of the first and second molding members 140B-1 and 140B-2 may be liquid or solid.

In addition, although the first molding member 140B-1 is shown to have a hemispherical cross-sectional shape, the embodiment is not limited to the cross-sectional shape of each of the first and second molding members 140B-1 and 140B-2.

In addition, as the number of stacking of the molding members 140A, 140B-1, and 140B-2 is increased, more light emitted from the light emitting device 150 may travel to the lens 130.

Meanwhile, the optical fiber 120 may be disposed on the lens 130.

Referring to FIG. 1, the optical fiber 120 is illustrated as having a circular planar shape, but the embodiment is not limited thereto. That is, according to another embodiment, the optical fiber 120 may have an oval shape or a polygonal planar shape.

The optical fiber 120 may include a lower side 120A and an upper side 120B.

The lower side 120A of the optical fiber 120 may be buried in the upper portion of the cavity C1 and disposed on the exit surface 130A of the lens 130.

The optical fiber 120 and the lens 130 may be adhered to each other with a silicone-based transparent adhesive (not shown), but the embodiment is not limited to the form or method of bonding these 120 and 130. As an example, after heating the ends (120A-1, 120A-2) of the lower side (120A) of the optical fiber 120 to 200 ℃ to 300 ℃, the package body 110 and FIG. It can be physically and chemically bonded as illustrated.

At this time, when the lower side (120A) is embedded in the upper portion of the cavity (C1) to be thinner than 1 mm, the adhesive force between the optical fiber 120 and the upper portion of the package body 110 is weak, so that the lower side (120A) of the cavity (C1) It can also be easily separated from the top side. Accordingly, the second thickness t2 of the lower side 120A of the optical fiber 120 may be 1 mm or more. If the optical fiber 120 is bonded to the lens 130 by a silicone-based transparent adhesive, the second thickness t2 of the lower side 120A may be 3 mm or more.

The upper side 120B may extend to the outside of the cavity 110 from the lower side 120A.

If light in the ultraviolet wavelength band is emitted from the light emitting device 150, the material of the optical fiber 120 may include a quartz-based material having less absorption of light in the ultraviolet wavelength band.

The light emitting device packages 100A and 100B due to the difference in refractive index between the molding members 140A and 140B, the lens 130 and the optical fiber 120 included in the light emitting device packages 100A and 100B illustrated in FIGS. 2 and 5 ), the light extraction efficiency may vary.

If, the difference in refractive index between the first refractive index of the molding members 140A and 140B and the second refractive index of the lens 130 (hereinafter,'the first refractive index difference') is the difference between the second refractive index and the third refractive index of the optical fiber 120 (Hereinafter,'second refractive index difference') may be substantially the same. Here, "substantially the same" may mean that there is no difference between the first refractive index difference and the second refractive index difference such that there is no difference in the light escape angle according to Snell's law.

Also, the first refractive index of the molding members 140A and 140B may be less than or equal to the second refractive index of the lens 130, and the second refractive index of the lens 130 may be less than or equal to the third refractive index of the optical fiber 120. When these conditions are satisfied, light extraction efficiency of the light emitting device packages 100A and 100B may be improved.

For example, the molding members 140A and 140B may be implemented with silicon having a first refractive index of 1.4 to 1.5, and the lens 130 may be implemented with quartz glass having a refractive index of 1.5.

6 shows a partial cross-sectional view of the molding member 140A, the lens 130, and the optical fiber 120 shown in FIG. 2.

For example, when the first refractive index of the molding member 140A is 1.4, the second refractive index of the lens 130 is 1.45, and the third refractive index of the optical fiber 120 is 1.5, as illustrated in FIG. 6 , More light may escape the optical fiber 120 as indicated by the arrow direction.

In addition, so that more light can escape, the molding member 140A may be implemented so as not to include an air layer, so that the first refractive index may be constant.

In addition, the light extraction efficiency of the light emitting device packages 100A and 100B may vary according to the first thickness t1 of the lens 130 and the third thickness t3 of the molding members 140A and 140B.

In order to improve the light extraction efficiency of the light-emitting device packages 100A and 100B, the third thickness t3 between the light-emitting device 150 and the lens 130 of the molding members 140A and 140B is shown in Equation 1 below. Can be the same

Here, W represents the width of the cavities C1 and C2.

In addition, in order to further improve the light extraction efficiency of the light emitting device packages 100A and 100B, the first thickness t1 of the lens 130 may be as Equation 2 below.

In Equations 1 and 2, the beam angle of light emitted from the light emitting device 150 is assumed to be 120°.

7 is a cross-sectional view of another embodiment 100C taken along line A-A' shown in FIG. 1.

The cross-sectional shapes of the cavities C1 and C2 in the light emitting device packages 100A and 100B illustrated in FIGS. 2 and 5 are rectangular. That is, the upper width W and the lower width W of the cavities C1 and C2 may be the same. In contrast, in the light emitting device package 100C illustrated in FIG. 7, the cavity C3 may have a parabolic cross-sectional shape whose width increases from bottom to top. Except for this, since the light-emitting device package 100C illustrated in FIG. 7 is the same as the light-emitting device package 100A illustrated in FIG. 2, redundant descriptions of the same portions will be omitted.

Compared to the case where the cross-sectional shape of the cavities C1 and C2 is square, when the shape of the cavity C3 is parabolic as illustrated in FIG. 7, the light LD emitted from the light emitting element 150 is at the highest It can go straight to and reach the optical fiber 120, so it can be emitted from the light emitting device package 100C without loss of light.

8 shows a state in which the light emitting device package 10 sterilizes the water 5 contained in the water tank 20.

Referring to FIG. 8, in general, the light emitting device package 10 is disposed to be spaced apart from the water tank 20 by a predetermined distance in order to sterilize the water 5 contained in the water tank 20. This is because the conventional light emitting device package 10 is vulnerable to moisture or water due to the limitation of sealing and thus has low or no waterproof effect. As illustrated in FIG. 8, when the light emitting device package 10 is disposed, the light emitting device is diffusely reflected from the surface of the water 5 due to the difference in refractive index between the water 5 and the air 3, as illustrated by arrows. A significant portion of the light emitted from the package 10 cannot be incident on the water 5 in the water tank 20 and is reflected or escaped from the water tank 20 itself, so that a desired sterilization effect cannot be expected.

Hereinafter, a light emitting module 200 according to an embodiment including the light emitting device packages 100, 100A, 100B, and 100C will be described as follows with reference to the accompanying drawings.

9 shows a perspective view of the light emitting module 200 according to the embodiment.

The light emitting module 200 illustrated in FIG. 9 includes a module substrate 210 and first to Nth light emitting device packages 100-1, 100-2, ..., 100-N. Here, N is a positive integer of 1 or more.

Each 100-n of the first to Nth light emitting device packages 100-1, 100-2, ... 100-N disposed on the module substrate 210 is shown in FIGS. 1, 2, 5, or 7 It may correspond to the light emitting device packages 100, 100A, 100B, and 100C illustrated in FIG. Here, 1 ≤ n ≤ N. Accordingly, the n-th light emitting device package 100-n illustrated in FIG. 9 may include an n-th package body 110-n and an n-th optical fiber 120-n. . In addition, although not visible in FIG. 9, the inside of the n-th package body 110-n includes a light emitting device 150 having a structure as illustrated in FIGS. 2, 5, and 7, and molding members 140A, 140B, and 140C. ), of course, that the lens 130 is disposed.

The module substrate 210 may include not only a general printed circuit board (PCB), but also a metal core PCB (MCPCB), a flexible PCB, and the like, and embodiments are not limited thereto. .

The upper side of each of the first to Nth optical fibers 120-1, 120-2, ..., 120-N may have a predetermined length, and the end 124 of the upper side is contained in water to emit light. I can.

Hereinafter, examples of application to the above-described light emitting module 200 will be described with reference to the accompanying drawings.

10 to 12 are perspective views for explaining an application example of the light emitting module 200 according to the embodiment.

According to an application example, as illustrated in FIG. 10, the ends 128 of each optical fiber 120 of the light emitting module 200 may be immersed in the water tank 20. In this way, instead of immersing the entire light emitting module 200 in the water tank 20, only the end 128 of the optical fiber 120 is immersed in the water tank 20, so that the light emitting module 200 may be resistant to moisture or water. . In this way, in a state in which the optical fiber 120 is immersed in the water tank 20, since the light in the deep ultraviolet wavelength band for sterilization is emitted through the end 124 of the optical fiber 120, it is contained in the water tank 20. The sterilizing effect of the water 5 can be maximized. In comparison with FIG. 8, it can be seen that a large portion of the light emitted from the light emitting module 200 can be used for sterilization of the water 5 contained in the water tank 20.

According to another application example, as illustrated in FIG. 11, when the water 5 moves in the arrow direction 224 through the pipeline 220, the optical fiber 120 of the light emitting module 200 according to the embodiment Is disposed in a direction opposite to the movement direction 224 of the water 5, and may sterilize the water 5. This shows that, for example, the light emitting module 200 according to the embodiment may be disposed in a portion where water 5 flows out of a water purifier (not shown).

According to another application example, as illustrated in FIG. 12, when the through hole 222 is disposed in the pipeline 220 and the optical fiber 120 is inserted into the through hole 222, the arrow direction 224 ) Can sterilize the flowing water (5). This shows that the light-emitting module 200 is disposed differently from that illustrated in FIG. 11 to sterilize the water 5.

As described above, in the light emitting device packages 100, 100A, 100B, 100C and the light emitting module 200 according to the embodiment, the portion vulnerable to water is not immersed in water, and the end of the optical fiber 120 resistant to water or moisture Since only 128 is immersed in the water 5, it can be seen that the light emitting device packages 100, 100A, 100B, 100C or the light emitting module 200 according to the embodiment are resistant to water or moisture. Accordingly, the light emitting device packages 100, 100A, 100B, and 100C and the light emitting module 200 according to the embodiment may be easily used in an environment with a lot of water or moisture.

The embodiments have been described above, but these are only examples and do not limit the present invention, and those of ordinary skill in the field to which the present invention belongs are not illustrated above within the scope not departing from the essential characteristics of the present embodiment. It will be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified and implemented. And differences related to these modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

100, 100A, 100B, 100C, 100-1, 100-2, 100-N: light emitting device package
110, 110-1, 110-2, 110-N: Package body
120, 120-1, 120-2, 120-N: optical fiber
130: lens 140A, 140B, 140C: molding member
150: light-emitting element 152: sub mount
154: light-emitting structure 162, 164: wire
170: substrate 182, 184: electrode
186, 188: bump 192, 194: metal pad
200: light-emitting module 210: module substrate

Claims (17)

A package body having a cavity;
A light emitting device disposed in the cavity of the package and emitting light in a deep ultraviolet wavelength band;
A lens disposed on the light emitting element within the cavity;
A molding member disposed between the lens and the bottom surface of the cavity to surround the light emitting element; And
Including an optical fiber disposed on the lens,
The optical fiber
A lower side buried in the upper portion of the cavity, disposed on an emission surface of the lens, and having an end through which the light is emitted; And
Including an upper side extending from the lower side to the outside of the cavity,
The molding member has a multilayer structure stacked in the thickness direction of the package body,
At least one of the multilayers of the molding member is a liquid state and the other is a solid state. The method of claim 1, wherein the lens has a thickness of 200 μm to 3 mm,
The material of the optical fiber includes a quartz-based material,
The package body is a light emitting device package comprising at least one of aluminum, ceramic, copper, or gold. delete delete delete delete delete The method of claim 1, wherein a thickness (t3) between the light emitting element and the lens of the molding member is as follows,

(Wherein, W represents the width of the cavity.)
The thickness t1 of the lens is a light emitting device package as follows.

delete delete delete delete The method of claim 1, wherein the thickness of the lower side of the optical fiber embedded in the upper portion of the cavity is 1 mm or more,
The optical fiber and the lens are adhered to each other with a silicone-based transparent adhesive,
The light emitting device package having a parabolic cross-sectional shape in which the width of the cavity increases from bottom to top. delete delete delete Module substrate; And
A light emitting module disposed on the module substrate and comprising the light emitting device package according to any one of claims 1, 2, 8, and 13.

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