KR102178768B1 - 메모리를 구비한 집적 회로 디바이스 및 집적 회로 디바이스에서 메모리를 구현하는 방법 - Google Patents
메모리를 구비한 집적 회로 디바이스 및 집적 회로 디바이스에서 메모리를 구현하는 방법 Download PDFInfo
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- KR102178768B1 KR102178768B1 KR1020157027772A KR20157027772A KR102178768B1 KR 102178768 B1 KR102178768 B1 KR 102178768B1 KR 1020157027772 A KR1020157027772 A KR 1020157027772A KR 20157027772 A KR20157027772 A KR 20157027772A KR 102178768 B1 KR102178768 B1 KR 102178768B1
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- Prior art keywords
- memory
- integrated circuit
- programmable
- block
- data
- Prior art date
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
- H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
- H03K19/17748—Structural details of configuration resources
- H03K19/1776—Structural details of configuration resources for memories
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/41—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
- G11C11/413—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
- G11C5/063—Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
Landscapes
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Logic Circuits (AREA)
- Static Random-Access Memory (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/789,313 US9153292B2 (en) | 2013-03-07 | 2013-03-07 | Integrated circuit devices having memory and methods of implementing memory in an integrated circuit device |
| US13/789,313 | 2013-03-07 | ||
| PCT/US2014/021404 WO2014138479A1 (en) | 2013-03-07 | 2014-03-06 | Integrated circuit devices having memory and methods of implementing memory in an integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20150126400A KR20150126400A (ko) | 2015-11-11 |
| KR102178768B1 true KR102178768B1 (ko) | 2020-11-13 |
Family
ID=50442621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020157027772A Active KR102178768B1 (ko) | 2013-03-07 | 2014-03-06 | 메모리를 구비한 집적 회로 디바이스 및 집적 회로 디바이스에서 메모리를 구현하는 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9153292B2 (https=) |
| EP (1) | EP2965429B1 (https=) |
| JP (1) | JP6573834B2 (https=) |
| KR (1) | KR102178768B1 (https=) |
| CN (1) | CN105144585B (https=) |
| WO (1) | WO2014138479A1 (https=) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US9431095B1 (en) | 2014-12-10 | 2016-08-30 | Xilinx, Inc. | High-density integrated circuit memory |
| US9711194B2 (en) * | 2015-01-28 | 2017-07-18 | Xilinx, Inc. | Circuits for and methods of controlling the operation of a hybrid memory system |
| WO2017136289A2 (en) * | 2016-02-02 | 2017-08-10 | Xilinx, Inc. | Active-by-active programmable device |
| US10002100B2 (en) | 2016-02-02 | 2018-06-19 | Xilinx, Inc. | Active-by-active programmable device |
| US10331601B2 (en) * | 2016-04-15 | 2019-06-25 | Infinera Corporation | Systems, apparatus, and methods for efficient space to time conversion of OTU multiplexed signal |
| WO2018034787A1 (en) * | 2016-08-15 | 2018-02-22 | Xilinx, Inc. | Standalone interface for stacked silicon interconnect (ssi) technology integration |
| US11625523B2 (en) | 2016-12-14 | 2023-04-11 | iCometrue Company Ltd. | Logic drive based on standard commodity FPGA IC chips |
| TWI892242B (zh) | 2016-12-14 | 2025-08-01 | 成真股份有限公司 | 標準大宗商品化現場可編程邏輯閘陣列(fpga)積體電路晶片組成之邏輯驅動器 |
| US10447274B2 (en) | 2017-07-11 | 2019-10-15 | iCometrue Company Ltd. | Logic drive based on standard commodity FPGA IC chips using non-volatile memory cells |
| JP2019033327A (ja) | 2017-08-04 | 2019-02-28 | 株式会社東芝 | 半導体集積回路 |
| US10957679B2 (en) | 2017-08-08 | 2021-03-23 | iCometrue Company Ltd. | Logic drive based on standardized commodity programmable logic semiconductor IC chips |
| US10630296B2 (en) * | 2017-09-12 | 2020-04-21 | iCometrue Company Ltd. | Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells |
| US10079211B1 (en) * | 2017-09-28 | 2018-09-18 | Intel Corporation | Modular interconnection repair of multi-die package |
| US10608642B2 (en) | 2018-02-01 | 2020-03-31 | iCometrue Company Ltd. | Logic drive using standard commodity programmable logic IC chips comprising non-volatile radom access memory cells |
| US10623000B2 (en) | 2018-02-14 | 2020-04-14 | iCometrue Company Ltd. | Logic drive using standard commodity programmable logic IC chips |
| US12476637B2 (en) | 2018-05-24 | 2025-11-18 | iCometrue Company Ltd. | Logic drive using standard commodity programmable logic IC chips |
| US10608638B2 (en) | 2018-05-24 | 2020-03-31 | iCometrue Company Ltd. | Logic drive using standard commodity programmable logic IC chips |
| US11309334B2 (en) | 2018-09-11 | 2022-04-19 | iCometrue Company Ltd. | Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells |
| US10892011B2 (en) | 2018-09-11 | 2021-01-12 | iCometrue Company Ltd. | Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells |
| US10937762B2 (en) | 2018-10-04 | 2021-03-02 | iCometrue Company Ltd. | Logic drive based on multichip package using interconnection bridge |
| US11616046B2 (en) | 2018-11-02 | 2023-03-28 | iCometrue Company Ltd. | Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chip |
| US11211334B2 (en) | 2018-11-18 | 2021-12-28 | iCometrue Company Ltd. | Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chip |
| US10642946B2 (en) * | 2018-12-28 | 2020-05-05 | Intel Corporation | Modular periphery tile for integrated circuit device |
| US11169822B2 (en) * | 2019-02-14 | 2021-11-09 | Xilinx, Inc. | Configuring programmable logic region via programmable network |
| US10804255B1 (en) * | 2019-05-10 | 2020-10-13 | Xilinx, Inc. | Circuit for and method of transmitting a signal in an integrated circuit device |
| US10985154B2 (en) | 2019-07-02 | 2021-04-20 | iCometrue Company Ltd. | Logic drive based on multichip package comprising standard commodity FPGA IC chip with cryptography circuits |
| US11227838B2 (en) | 2019-07-02 | 2022-01-18 | iCometrue Company Ltd. | Logic drive based on multichip package comprising standard commodity FPGA IC chip with cooperating or supporting circuits |
| US10797037B1 (en) | 2019-07-15 | 2020-10-06 | Xilinx, Inc. | Integrated circuit device having a plurality of stacked dies |
| US11887930B2 (en) | 2019-08-05 | 2024-01-30 | iCometrue Company Ltd. | Vertical interconnect elevator based on through silicon vias |
| US11637056B2 (en) | 2019-09-20 | 2023-04-25 | iCometrue Company Ltd. | 3D chip package based on through-silicon-via interconnection elevator |
| US11600526B2 (en) | 2020-01-22 | 2023-03-07 | iCometrue Company Ltd. | Chip package based on through-silicon-via connector and silicon interconnection bridge |
| TW202240808A (zh) | 2021-01-08 | 2022-10-16 | 成真股份有限公司 | 使用於積體電路晶片封裝結構中的微型熱導管 |
| US12176278B2 (en) | 2021-05-30 | 2024-12-24 | iCometrue Company Ltd. | 3D chip package based on vertical-through-via connector |
| US12555628B2 (en) | 2021-09-24 | 2026-02-17 | iCometrue Company Ltd. | Multi-output look-up table (LUT) for use in coarse-grained field-programmable-gate-array (FPGA) integrated-circuit (IC) chip |
| US12268012B2 (en) | 2021-09-24 | 2025-04-01 | iCometrue Company Ltd. | Multi-output look-up table (LUT) for use in coarse-grained field-programmable-gate-array (FPGA) integrated-circuit (IC) chip |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004529581A (ja) | 2001-05-18 | 2004-09-24 | ザイリンクス インコーポレイテッド | プログラマブルインターフェイスコアおよび中央処理装置を含むプログラマブルロジックデバイス |
| JP2008097735A (ja) * | 2006-10-12 | 2008-04-24 | Elpida Memory Inc | メモリ回路及び半導体装置 |
| US20090072856A1 (en) * | 2007-09-14 | 2009-03-19 | Cswitch Corporation | Memory controller for heterogeneous configurable integrated circuits |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH07321640A (ja) * | 1994-05-30 | 1995-12-08 | Nippon Telegr & Teleph Corp <Ntt> | プログラマブル論理回路 |
| US6072741A (en) * | 1997-04-01 | 2000-06-06 | Ramtron International Corporation | First-in, first-out integrated circuit memory device incorporating a retransmit function |
| US6181159B1 (en) | 1997-05-06 | 2001-01-30 | Altera Corporation | Integrated circuit incorporating a programmable cross-bar switch |
| US6467017B1 (en) | 1998-06-23 | 2002-10-15 | Altera Corporation | Programmable logic device having embedded dual-port random access memory configurable as single-port memory |
| US6350653B1 (en) | 2000-10-12 | 2002-02-26 | International Business Machines Corporation | Embedded DRAM on silicon-on-insulator substrate |
| JP3553519B2 (ja) * | 2001-04-16 | 2004-08-11 | 三菱電機株式会社 | プログラマブル論理回路装置 |
| US6781407B2 (en) * | 2002-01-09 | 2004-08-24 | Xilinx, Inc. | FPGA and embedded circuitry initialization and processing |
| US7461234B2 (en) * | 2002-07-01 | 2008-12-02 | Panasonic Corporation | Loosely-biased heterogeneous reconfigurable arrays |
| JP5163306B2 (ja) * | 2008-06-19 | 2013-03-13 | 富士通セミコンダクター株式会社 | 動的再構成回路およびデータ送信制御方法 |
| US8058897B1 (en) * | 2010-06-28 | 2011-11-15 | Xilinx, Inc. | Configuration of a multi-die integrated circuit |
| US8693235B2 (en) * | 2011-12-06 | 2014-04-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and apparatus for finFET SRAM arrays in integrated circuits |
-
2013
- 2013-03-07 US US13/789,313 patent/US9153292B2/en active Active
-
2014
- 2014-03-06 KR KR1020157027772A patent/KR102178768B1/ko active Active
- 2014-03-06 EP EP14716076.6A patent/EP2965429B1/en active Active
- 2014-03-06 WO PCT/US2014/021404 patent/WO2014138479A1/en not_active Ceased
- 2014-03-06 JP JP2015561680A patent/JP6573834B2/ja active Active
- 2014-03-06 CN CN201480012875.1A patent/CN105144585B/zh active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004529581A (ja) | 2001-05-18 | 2004-09-24 | ザイリンクス インコーポレイテッド | プログラマブルインターフェイスコアおよび中央処理装置を含むプログラマブルロジックデバイス |
| JP2008097735A (ja) * | 2006-10-12 | 2008-04-24 | Elpida Memory Inc | メモリ回路及び半導体装置 |
| US20090072856A1 (en) * | 2007-09-14 | 2009-03-19 | Cswitch Corporation | Memory controller for heterogeneous configurable integrated circuits |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014138479A1 (en) | 2014-09-12 |
| US9153292B2 (en) | 2015-10-06 |
| EP2965429B1 (en) | 2018-12-26 |
| JP2016516331A (ja) | 2016-06-02 |
| CN105144585B (zh) | 2018-08-17 |
| EP2965429A1 (en) | 2016-01-13 |
| CN105144585A (zh) | 2015-12-09 |
| KR20150126400A (ko) | 2015-11-11 |
| US20140254232A1 (en) | 2014-09-11 |
| JP6573834B2 (ja) | 2019-09-11 |
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