KR102176475B1 - Plating solution discharging device and plating solution discharging method using same - Google Patents

Abstract

The present invention includes a plating liquid discharge device including a plating bath in which a plating solution is accommodated, a block driving part disposed above the plating bath to raise and lower a block, a pump for sucking the plating liquid, and a pump driving part for raising and lowering the pump. to provide.

Description

Plating solution discharging device and plating solution discharging method using same}

The embodiment relates to a plating liquid discharge device and a plating liquid discharge method using the same. More specifically, the present invention relates to a plating solution discharging device for automatically discharging the plating solution in the plating bath in order to prevent a decrease in component reliability due to residual solution when the plating solution in the plating bath is replaced, and a plating solution discharging method using the same.

In general, plating of a steel sheet is an operation of coating the surface of a steel sheet with a material that maintains a stable state or a material that suppresses the surface reaction elements of the steel sheet in order to prevent the steel sheet from being oxidized and corroded.

Before carrying out such plating work, various plating tests are conducted and various tests are conducted.

The CGL (Continous Galvanaazing Line) Pilot Plant facility, which is a hot-dip galvanizing simulation device, is a device that continuously supplies rolled coils, performs heat treatment at a constant temperature, and then passes through a strip through a molten galvanized bath.

When the test is finished after plating the surface of the strip in the same way as above, the CGL Pilot Plant facility must pump out the plating solution contained in the zinc pot from the plating bath, unlike on-site CGL.

Currently, the pumping out of the CGL Pilot Plant facility is manually discharged by a person from the plating bath.

However, since such a work is performed manually and in a short distance, there is a problem that reliability is lowered in the next component experiment due to residual hot water when the plating solution is exchanged, and various disasters frequently occur due to high-risk manual work.

In addition, there is a risk of safety accidents when the work is performed in a short distance of the hot plating bath.

The embodiment provides a plating solution discharging device that increases the reliability of an experiment by minimizing the amount of plating solution remaining in a plating bath using a jig block, and a plating solution discharging method using the same.

In addition, there is provided a plating solution discharging device capable of increasing the life of a facility by gradually lowering a metal pump using a plurality of sensors, and a plating solution discharging method using the same.

The problem to be solved by the present invention is not limited to the problems mentioned above, and other problems that are not mentioned herein will be clearly understood by those skilled in the art from the following description.

In an embodiment of the present invention, a block driving unit disposed on an upper portion of a plating bath in which a plating solution is accommodated to lift a block; A pump for sucking the plating solution; And a pump driving unit for raising and lowering the pump.

Preferably, the block driving unit includes a jig to which the block is connected and a jig driving motor that lifts and lowers the jig, and the block may be fixed to the jig by at least four fixed points.

Preferably, the block may be characterized in that the plurality of chains are connected to both sides of the jig.

Preferably, it may include; a control unit for controlling the operation of the block driving unit and the pump driving unit.

Preferably, the pump driving unit includes a support frame, a connection unit connecting the pump and the support frame, and an elevating motor for raising and lowering the connection unit, and the connection unit may be characterized in that it moves up and down along the support frame. have.

Preferably, a plurality of first fixing grooves are formed in the support frame, a second fixing groove is formed in the connection part, and a fixing bar is inserted into the first fixing groove and the second fixing groove to fix the position. You can do it.

Preferably, the support frame is provided with a plurality of position sensing sensors, and the control unit may control the moving position of the connection unit according to a height sensed by the position sensing sensor.

Preferably, it may be characterized in that the preheating unit is connected to the pump.

Preferably, the block may be provided in plurality.

Preferably, a plurality of the blocks may be characterized in that the sequential input.

Preferably, the block may have a block body and a block protrusion.

Preferably, the block is provided in a'U' shape, and the pump may be disposed in a recess of the block.

Preferably, the block may be characterized in that it has a weight of 8 to 12% of the plating solution accommodated in the plating bath.

Another embodiment of the present invention is a plating solution discharging method for discharging a plating solution in a plating bath, the block insertion step of inserting a block into the plating bath; A pump lowering step of lowering a pump for discharging the plating solution; A discharge step of discharging the plating solution by operating the pump; And a height adjusting step of adjusting the height of the pump according to the discharge state of the plating solution.

Preferably, the height adjustment step may be characterized in that it descends step by step using a detection value of a position sensor that senses the position of the pump.

According to the embodiment, there is an effect of preventing the occurrence of a disaster by enabling a plating bath and a long distance operation.

In addition, there is an effect of improving the reliability of experimental data by minimizing the residual plating solution by using a jig block.

Various and beneficial advantages and effects of the present invention are not limited to the above-described contents, and may be more easily understood in the course of describing specific embodiments of the present invention.

1 is a view showing the structure of a plating solution discharge device according to an embodiment of the present invention,
2 is a diagram showing the structure of a block driving unit that is a component of FIG. 1,
3 is a view showing the structure of a pump driving unit that is a component of FIG. 1,
4 is a diagram showing the shape of a block that is a component of FIG. 1,
5 is a flowchart of a method of discharging a plating solution according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical idea of the present invention is not limited to some embodiments to be described, but may be implemented in various different forms, and within the scope of the technical idea of the present invention, one or more of the constituent elements may be selectively selected between the embodiments. It can be combined with and substituted for use.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention are generally understood by those of ordinary skill in the art, unless explicitly defined and described. It can be interpreted as a meaning, and terms generally used, such as terms defined in a dictionary, may be interpreted in consideration of the meaning in the context of the related technology.

In addition, terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention.

In the present specification, the singular form may include the plural form unless specifically stated in the phrase, and when described as “at least one (or more than one) of A and (and) B and C”, it is combined with A, B, and C. It may contain one or more of all possible combinations.

In addition, terms such as first, second, A, B, (a), and (b) may be used in describing the constituent elements of the embodiment of the present invention.

These terms are only for distinguishing the component from other components, and are not limited to the nature, order, or order of the component by the term.

And, when a component is described as being'connected','coupled' or'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also the component and It may also include the case of being'connected','coupled' or'connected' due to another component between the other components.

In addition, when it is described as being formed or disposed on the “top (top) or bottom (bottom)” of each component, the top (top) or bottom (bottom) is one as well as when the two components are in direct contact with each other. It also includes the case where the above other component is formed or arranged between the two components. In addition, when expressed as "upper (upper) or lower (lower)", the meaning of not only an upward direction but also a downward direction based on one component may be included.

Hereinafter, exemplary embodiments will be described in detail with reference to the accompanying drawings, but identical or corresponding components are denoted by the same reference numerals regardless of reference numerals, and redundant descriptions thereof will be omitted.

1 to 4, in order to clearly understand the present invention conceptually, only the main characteristic parts are clearly shown, and as a result, various modifications of the illustration are expected, and the scope of the present invention is limited by the specific shape shown in the drawings. It doesn't have to be.

1 is a view showing the structure of a plating liquid discharge device according to an embodiment of the present invention.

Referring to FIG. 1, an apparatus for discharging a plating solution 11 according to an exemplary embodiment of the present invention may include a plating bath 10, a block driving unit 200, a pump 300, and a pump 300 driving unit.

The plating bath 10 may accommodate the plating solution 11. The type of the plating solution 11 is not limited, and various materials for plating the steel sheet may be used. In one embodiment, the plating bath 10 may be provided in a water tank structure having a rectangular cross section.

The block driving unit 200 may be disposed above the plating bath 10 to move the block 100 up and down.

The block 100 is formed of a metal material and is disposed above the plating bath 10, and may be introduced into the plating solution 11 to discharge the plating solution 11. The block 100 is introduced into the plating bath 10 to raise the plating solution 11, and is made of a material having a melting point higher than the melting temperature of the plating solution 11 to prevent melting in the high temperature plating solution 11 have.

The block 100 may have a weight of 8 to 12% of the plating solution accommodated in the plating bath 10. Basically, the plating solution 11 in the plating bath 10 fills 80 to 85% of the storage capacity of the plating bath 10. When considering the capacity of the pump 300 injected for discharging the plating solution 11, the block 100 has a weight of 8 to 12% of the received plating solution 11, so that the pump 300 and the block 100 ) Is added to prevent the plating solution 11 from overflowing the plating bath 10.

In one embodiment, the block 100 may be provided in the shape of a square pillar with a wide bottom surface to maximize the elevation of the plating solution 11.

The block driving unit 200 may be disposed above the plating bath 10 to move the block 100 up and down. The block driving unit 200 may have a structure for seating the block 100 in a horizontal state.

The pump 300 is disposed above the plating bath 10 to have a structure capable of lifting and descending, and may descend stepwise according to the amount of suction. The pump 300 is made of a metal material so that it does not melt in the high-temperature plating solution 11, thereby increasing the reliability of the experiment. The shape of the pump 300 is not limited and can be modified in various shapes. The pump 300 may be connected to the storage tank 20 to move the plating solution 11 sucked into the storage tank 20.

The pump 300 is connected through the storage tank 20 and the connection pipe 30, and the connection pipe 30 is provided in a double pipe structure so as to resist high temperature so as to prepare for a safety accident.

In addition, the preheating unit 310 is connected to the pump 300 so that a problem that may occur due to a sudden temperature change may be checked in advance.

The preheating unit 310 is connected to the outer circumferential surface of the pump 300 and may test whether or not it operates normally when the temperature increases before the operation of the pump 300. In one embodiment, the preheating unit 310 may preheat the pump 300 to check whether a bearing or a motor, which is a component inside the pump 300, operates normally.

The pump driving unit 500 may drive the pump 300 so that the end of the pump 300 is immersed in the plating solution 11 by raising and lowering the pump 300 to absorb the plating solution 11. The pump driving unit 500 may gradually lower the height of the pump 300 to minimize damage to the pump 300 immersed in the high-temperature plating solution 11.

In one embodiment, the pump 300 may be made of a material capable of resisting the high-temperature plating solution 11 to a certain height, and the remaining height may be used as a general material. In this case, the pump driving unit 500 may lower the lifting height of the pump 300 to a height capable of resisting high temperatures.

The control unit 400 may control the operation of the block driving unit 200 and the pump driving unit 500. To discharge the plating solution 11 from the plating bath 10, the block driving unit 200 is operated to lower the block 100 into the plating bath 10, and then the pump driving unit 500 is operated to operate the pump 300. You can descend.

FIG. 2 is a diagram illustrating a structure of a block driving unit 200 that is a component of FIG. 1.

Referring to FIG. 2, the block driving unit 200 may include a block 100, a jig 210, and a jig driving motor 230.

The block 100 may have a plate-shaped rectangular column structure having a predetermined thickness. The rectangular plate-shaped block 100 may be put into the plating bath 10 having a rectangular cross section to raise the plating solution 11. Conventionally, the pump 300 was manually moved to suck the plating solution 11 to discharge the plating solution 11 in the plating bath 10. However, in this case, there was a limit to the amount of discharge of the plating solution 11 in the plating bath 10, many accidents occurred in the process of manually moving the pump 300, and the operator was exposed to danger. The block 100 is injected into one side of the plating bath 10 to raise the plating solution 11 toward the position of the pump 300 so that the plating solution 11 can be sucked without moving the pump 300, thereby reducing the risk. And, it is possible to increase the reliability of the test by increasing the discharge amount of the plating solution 11.

The jig 210 is connected to the block 100 at the top of the block 100 to support the block 100, and may stably support the block 100. The jig 210 may be provided in a beam structure, and may be provided wider than the width of the plating bath 10. The block 100 may be fixed to the jig 210 and at least four fixing points. This can stably support the block 100 having a square plate structure. In one embodiment, the block 100 may be connected to both sides of the jig 210 by a plurality of chains 211. A plurality of chains 211 are symmetrically connected to both sides of the jig 210 to stably support the block 100.

The jig driving motor 230 is connected to the jig 210 at the top of the jig 210 and may lift the jig 210 by receiving a command from the control unit 400.

3 is a view showing the structure of a pump driving unit 500 that is a component of FIG. 1.

Referring to FIG. 3, the pump driving unit 500 may include a support frame 510, a connection unit 530, and an elevating motor 550.

The support frame 510 is installed vertically and may be provided in a rail structure to guide the lifting of the pump 300. The support frame 510 is provided with a plurality of position sensing sensors 511, and the control unit 400 can control the movement of the pump 300 by sensing the position of the pump 300 through the position sensing sensor 511. have.

In one embodiment, the pump 300 and the support frame 510 may be connected through the connection unit 530, and the control unit 400 senses the height of the pump 300 detected by the position sensor 511 The position of 300 can be gradually lowered. This can minimize the extent to which the pump 300 is damaged when immersed in the high-temperature plating solution 11. The pump 300 can descend step by step according to the suction speed of the plating solution 11, and descends to the bottom of the plating bath 10 by repeatedly sucking the plating solution 11 and descending again after descending to a certain height. Thus, the plating solution 11 can be discharged.

The connection part 530 connects the pump 300 and the support frame 510 to move the pump 300 up and down along the support frame 510.

A plurality of first fixing grooves 513 are formed in the support frame 510, a second fixing groove 531 is formed in the connection part 530, and the first fixing groove 513 and the second fixing groove 531 A fixing bar 560 may be inserted in to fix the position of the pump 300 connected to the connection part 530.

When a problem occurs when the plating solution 11 is discharged, the movement of the pump 300 may be controlled using the fixing bar 560 to control the movement of the pump 300 or fix the position.

The lifting motor 550 may be connected to the connection part 530 to lift the connection part 530 up and down.

FIG. 4 is a diagram showing the shape of a block 100 that is a component of FIG. 1.

Referring to FIG. 4, a plurality of blocks 100 may be provided. The purpose of the block 100 is to minimize the amount of the plating solution 11 remaining in the plating bath 10 when the plating solution 11 in the plating bath 10 is discharged.

Accordingly, the plurality of blocks 100 may be introduced into an area within the plating bath 10 except for a location where the pump 300 is disposed. When a plurality of blocks 100 are injected, the plating solution may be prevented from overflowing by sequentially inputting the blocks 100 while a certain amount of the plating solution 11 is sucked, and the efficiency of removing residual metal may be increased.

In one embodiment, the block 100 may include a block body 110 and a block protrusion 120.

The block protrusion 120 may be disposed to protrude horizontally from one side of the block body 110. In this case, it is preferable that the block protrusion 120 protrudes into a region where the pump 300 is not disposed.

In one embodiment, the block protrusion 120 and the block body 110 are arranged in a'c' shape, and a pump 300 is disposed in the recess of the block 100 to pump the residual plating solution 11 as much as possible. 300) can be moved.

Meanwhile, in the following, a method of discharging a plating solution according to another embodiment of the present invention will be described with reference to the accompanying drawings. However, the description of the same as described in the apparatus for discharging the plating solution 11 according to an embodiment of the present invention will be omitted.

5 is a flow chart of a method for discharging a plating solution according to another embodiment of the present invention. In the description of FIG. 5, the same reference numerals as those of FIGS. 1 to 4 denote the same members, and detailed descriptions will be omitted.

Referring to Figure 5, the plating solution discharge method for discharging the plating solution 11 in the plating bath 10 according to another embodiment of the present invention is a block insertion step (S100), the pump lowering step (S200), the discharge step ( S300) and a height adjustment step (S400) may be included.

In the block inserting step (S100), the plating solution 11 may be raised by driving the block driving unit 200 to insert the block 100 into the plating bath 10. The block insertion step (S100) is a preparatory step for pumping out the plating solution 11 after the plating experiment is conventional.

The block insertion step S100 may have an effect of collecting the plating solution 11 spreading in the plating bath 10 to one side by inserting the block 100. Through this, the trouble of moving the pump 300 for sucking the plating solution 11 can be reduced, and the risk generated through this can be reduced. In addition, it is possible to reduce the amount of residual hot water by collecting the plating solution 11 to one side and discharging it, thereby increasing the reliability of the components in the plating bath 10 during a later experiment.

The pump lowering step (S200) is a step of lowering the pump 300 into the plating bath 10 in order to discharge the plating solution 11. In the block insertion step (S100), when the block 100 is inserted and the plating solution 11 rises, the pump 300 descends and the end portion is immersed in the plating solution 11. In the lowering step of the pump 300, it is possible to check whether the pump 300 operates normally through the preheating unit 310, and if there is no abnormality after the test, the pump driving unit 500 may lower the pump 300.

The discharge step S300 is a step of discharging the plating solution 11 to the storage tank 20 while the pump 300 descends and is inserted into the plating solution 11 in the pump descending step S200. The pump driving unit 500 operates the pump 300 to discharge the plating solution 11 to the storage tank 20 through the connection pipe 30.

The height adjustment step (S400) is a step of adjusting the height of the pump 300 according to the discharge state of the plating solution 11. The control unit 400 may extend the life of the pump 300 by gradually lowering the position of the pump 300 by using a detection value of the position sensor 511 that detects the position of the pump 300.

The control unit 400 may determine whether the pump 300 descends by comparing the amount of the plating solution 11 moving through the pump 300 and the amount of the plating solution 11 according to the descending height. The pump 300 may descend step by step without being exposed to the outside of the plating solution 11.

According to embodiments of the present invention, there is an effect of preventing the occurrence of a disaster by enabling a plating bath and a long distance operation.

In addition, there is an effect of improving the reliability of experimental data by minimizing the residual plating solution by using a jig block.

As described above, with reference to the accompanying drawings with respect to an embodiment of the present invention was looked at in detail.

The above description is merely illustrative of the technical idea of the present invention, and those of ordinary skill in the technical field to which the present invention belongs can make various modifications, changes, and substitutions within the scope not departing from the essential characteristics of the present invention. will be. Accordingly, the embodiments disclosed in the present invention and the accompanying drawings are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments and the accompanying drawings. . The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present invention.

10: plating bath 11: plating solution
20: reservoir 30: connector
100: block 110: block body
120: block protrusion
200: block driving unit 210: jig
211: chain 230: jig driving motor
300: pump 310: preheating unit
400: control unit 500: pump driving unit
510: support frame 511: position sensor
513: first fixing groove 530: connection
531: second fixing groove 550: elevating motor
560: fixed bar

Claims (15)

A block driving unit disposed above the plating bath in which the plating solution is accommodated to move the block up and down into the plating bath;
A pump for sucking the plating solution;
A pump driving unit for raising and lowering the pump; And
A control unit for controlling the operation of the block driving unit and the pump driving unit;
Including,
The pump driving part
A support frame, a connection part connecting the pump and the support frame, and an elevating motor for raising and lowering the connection part,
The plating liquid discharge device, characterized in that the connection part elevates and descends along the support frame. The method of claim 1,
The block driving part
It includes a jig to which the block is connected and a jig driving motor to lift the jig,
The plating solution discharging device, wherein the block is fixed to the jig by at least four fixing points. The method of claim 2,
The block is a plating solution discharging device, characterized in that connected to both sides of the jig by a plurality of chains. delete delete The method of claim 1,
A plurality of first fixing grooves are formed in the support frame,
A second fixing groove is formed in the connection part,
A plating solution discharging device, characterized in that a fixing bar is inserted into the first fixing groove and the second fixing groove to fix the position. The method of claim 1,
The support frame is provided with a plurality of position detection sensors,
Wherein the control unit controls the moving position of the connection unit according to the height sensed by the position sensor. The method of claim 1,
Plating liquid discharge device, characterized in that the preheating unit is connected to the pump. The method of claim 1,
A plating solution discharging device having a plurality of blocks. The method of claim 9,
Plating solution discharging device, characterized in that the plurality of blocks are sequentially introduced. The method of claim 1,
The block is
A plating liquid discharge device having a block body and a block protrusion. The method of claim 11,
A plating solution discharging device in which the block body and the block protrusion are arranged in a'U' shape, and the pump is disposed in a depression of the block. The method of claim 1,
The plating liquid discharge device, characterized in that the block has a weight of 8 to 12% of the plating liquid accommodated in the plating bath. delete delete

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