KR102158711B1 - 인쇄회로기판 - Google Patents

인쇄회로기판 Download PDF

Info

Publication number
KR102158711B1
KR102158711B1 KR1020180081253A KR20180081253A KR102158711B1 KR 102158711 B1 KR102158711 B1 KR 102158711B1 KR 1020180081253 A KR1020180081253 A KR 1020180081253A KR 20180081253 A KR20180081253 A KR 20180081253A KR 102158711 B1 KR102158711 B1 KR 102158711B1
Authority
KR
South Korea
Prior art keywords
resin layer
layer
circuit
via hole
plating
Prior art date
Application number
KR1020180081253A
Other languages
English (en)
Korean (ko)
Other versions
KR20200007308A (ko
Inventor
최정우
민태홍
장준형
송요한
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020180081253A priority Critical patent/KR102158711B1/ko
Priority to JP2019010618A priority patent/JP7238241B2/ja
Priority to TW108102666A priority patent/TWI714953B/zh
Publication of KR20200007308A publication Critical patent/KR20200007308A/ko
Application granted granted Critical
Publication of KR102158711B1 publication Critical patent/KR102158711B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020180081253A 2018-07-12 2018-07-12 인쇄회로기판 KR102158711B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020180081253A KR102158711B1 (ko) 2018-07-12 2018-07-12 인쇄회로기판
JP2019010618A JP7238241B2 (ja) 2018-07-12 2019-01-24 プリント回路基板
TW108102666A TWI714953B (zh) 2018-07-12 2019-01-24 印刷電路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180081253A KR102158711B1 (ko) 2018-07-12 2018-07-12 인쇄회로기판

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020200030203A Division KR102194703B1 (ko) 2020-03-11 2020-03-11 인쇄회로기판

Publications (2)

Publication Number Publication Date
KR20200007308A KR20200007308A (ko) 2020-01-22
KR102158711B1 true KR102158711B1 (ko) 2020-09-22

Family

ID=69170021

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180081253A KR102158711B1 (ko) 2018-07-12 2018-07-12 인쇄회로기판

Country Status (3)

Country Link
JP (1) JP7238241B2 (zh)
KR (1) KR102158711B1 (zh)
TW (1) TWI714953B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210110943A (ko) 2020-03-02 2021-09-10 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈
WO2022186037A1 (ja) * 2021-03-04 2022-09-09 Tdk株式会社 多層配線基板及びその製造方法
WO2023171351A1 (ja) * 2022-03-07 2023-09-14 株式会社村田製作所 回路基板及び回路基板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008103640A (ja) * 2006-10-20 2008-05-01 Ngk Spark Plug Co Ltd 多層配線基板
JP2013219204A (ja) * 2012-04-09 2013-10-24 Ngk Spark Plug Co Ltd 配線基板製造用コア基板、配線基板
JP2015195308A (ja) * 2014-03-31 2015-11-05 イビデン株式会社 プリント配線板およびその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1117345A (ja) * 1997-06-19 1999-01-22 Ibiden Co Ltd 多層プリント配線板
MY120077A (en) * 1998-06-26 2005-08-30 Ibiden Co Ltd Multilayer printed wiring board having a roughened inner conductor layer and production method thereof
JP2003258435A (ja) 2002-03-07 2003-09-12 Shinko Electric Ind Co Ltd 配線基板用シート材料及び多層配線基板
SG162619A1 (en) 2003-04-15 2010-07-29 Denki Kagaku Kogyo Kk Metal base circuit board and its production process
JP5066192B2 (ja) * 2007-11-28 2012-11-07 京セラ株式会社 配線基板及び実装構造体
JP5631281B2 (ja) * 2010-08-31 2014-11-26 京セラ株式会社 配線基板の製造方法及びその実装構造体の製造方法
CN104010815B (zh) * 2011-12-22 2016-08-17 太阳油墨制造株式会社 干膜及使用其的印刷电路板、印刷电路板的制造方法、以及倒装芯片安装基板
JP5952100B2 (ja) * 2012-06-15 2016-07-13 旭化成株式会社 硬化性樹脂組成物
KR101952864B1 (ko) * 2016-09-30 2019-02-27 삼성전기주식회사 팬-아웃 반도체 패키지

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008103640A (ja) * 2006-10-20 2008-05-01 Ngk Spark Plug Co Ltd 多層配線基板
JP2013219204A (ja) * 2012-04-09 2013-10-24 Ngk Spark Plug Co Ltd 配線基板製造用コア基板、配線基板
JP2015195308A (ja) * 2014-03-31 2015-11-05 イビデン株式会社 プリント配線板およびその製造方法

Also Published As

Publication number Publication date
JP2020013976A (ja) 2020-01-23
KR20200007308A (ko) 2020-01-22
JP7238241B2 (ja) 2023-03-14
TW202007238A (zh) 2020-02-01
TWI714953B (zh) 2021-01-01

Similar Documents

Publication Publication Date Title
US20140202740A1 (en) Method of Manufacturing Multilayer Wiring Substrate, and Multilayer Wiring Substrate
KR101215246B1 (ko) 다층 배선기판의 제조방법 및 다층 배선기판
KR102158711B1 (ko) 인쇄회로기판
KR20110095146A (ko) 다층 배선기판 및 그 제조방법
US11812556B2 (en) Printed circuit board and manufacturing method thereof
JP7480458B2 (ja) プリント回路基板
KR20190052486A (ko) 안테나 모듈
JP7188836B2 (ja) プリント回路基板
KR102163044B1 (ko) 인쇄회로기판
KR20110042977A (ko) 인쇄회로기판의 제조방법
KR102194703B1 (ko) 인쇄회로기판
KR102214641B1 (ko) 인쇄회로기판
JP2013219204A (ja) 配線基板製造用コア基板、配線基板
CN211828497U (zh) 树脂多层基板以及电子设备
CN111385971A (zh) 电路基板及其制造方法
KR102662860B1 (ko) 인쇄회로기판
CN118338526A (zh) 布线基板
CN117641698A (zh) 电路板及其制作方法
CN118338525A (zh) 布线基板
CN112533368A (zh) 软硬结合电路板及其制作方法
CN115988741A (zh) 电路板及其制作方法
CN117412469A (zh) 布线基板
CN113597084A (zh) 挠折线路板及其制作方法
KR20110099892A (ko) 인쇄회로기판 및 그 제조방법
JP2004214702A (ja) 多層配線基板の製造方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
X091 Application refused [patent]
A107 Divisional application of patent
AMND Amendment
E90F Notification of reason for final refusal
AMND Amendment
X701 Decision to grant (after re-examination)
GRNT Written decision to grant