KR102141978B1 - Shielding device for a rotatable cathode, rotatable cathode and method for shielding a dark space in a deposition apparatus - Google Patents

Abstract

According to the present disclosure, a shielding device 20 for a rotatable cathode having a rotatable target 10 for sputtering material on a substrate, and a method for shielding a dark space region in a deposition apparatus, are provided. The shielding device 20 includes a shield 21 configured to cover a portion of the rotatable target 10, and a fixture 80 for connecting the shield 21 to the rotatable target 10. The fixture is configured to engage with the shield so that the shield extends essentially away from the center of the rotatable target in the axial direction of the rotatable target.

Description

A shielding device for a rotatable cathode, a rotatable cathode, and a method for shielding a dark space in a deposition apparatus {SHIELDING DEVICE FOR A ROTATABLE CATHODE, ROTATABLE CATHODE AND METHOD FOR SHIELDING A DARK SPACE IN A DEPOSITION APPARATUS}

[001] The present disclosure provides a device for shielding a rotatable cathode, in particular a shielding device having a shield and a fixture for connecting the shield to the rotatable cathode and a dark space region in the deposition apparatus. It relates to a method for shielding.

[002] In many applications it is desirable to deposit thin layers on a substrate. Known techniques for depositing thin layers are, in particular, evaporation, chemical vapor deposition and sputtering deposition. For example, sputtering can be used to deposit thin layers, such as thin layers of metal, eg, aluminum or ceramics. During the sputtering process, the coating material is transferred from the sputtering target of the material to be coated by bombarding the surface of the target with ions of the inert processing gas, typically at low pressure. The ions are generated by electron impact ionization of the processing gas and are accelerated by the voltage difference between the target and the anode acting as a sputtering cathode. This bombardment of the target results in the release of atoms or molecules of the coating material that accumulate as a film deposited on the substrate arranged under the sputtering cathode, for example, against the sputtering cathode.

The rotary cathode is typically supported by a cathode drive unit of a sputtering facility. Due to the geometry and design of the cathodes, rotatable targets typically have higher utilization and increased operating time than planar targets. Thus, the use of rotatable targets typically extends the service life and reduces costs. During sputtering, the cathode drive unit transmits rotationally to the rotary cathode. For example, given the lengthwise extension of rotary cathodes of up to about 4 m and the typical continuous operating time of a sputtering facility over several days, the bearing of the cathode drive unit is typically reliably supporting heavy mechanical loads over long periods of time desirable.

[004] To protect the cathode body from gas discharge and resulting ion bombardment, dark room shields can be provided at both the driven and free ends of the cathode. The shield around the drive end of the cathode body should prevent processing gas exhaust from contacting the drive end. Dark room shields may be mounted on the chamber wall or drive unit, and may be electrically insulated from the mounting surface.

The material sputtered from the edges of the target can contribute to non-uniform depositions. In order to promote uniform deposition, it is often preferred to place the dark space shield(s) adjacent to the edges of the target. The dark space shield reduces sputtering of the target edges by shielding the target edges from the plasma.

During sputtering, a film of deposited material grows on the surface of the dark shield, ie on the area of the dark shield surface facing the substrate. Eventually, the formed film usually begins to break up into chips or fragments in thicker areas. If the resulting material debris falls on the substrate, the debris hinders deposition on the substrate areas where the debris falls, resulting in a defective product. Therefore, such dark room shields often have to be replaced, thus increasing the maintenance cost of the sputtering unit.

Also, during repetitive thermal cycling, the darkroom or darkspace shield(s) often undergo thermal expansion. Thus, the darkroom or darkspace shield(s) are arranged to allow longitudinal and lateral tolerances of thermal expansion, for example, by providing gaps or voids between the darkspace shield and other features of the deposition apparatus.

Due to the change in the size of the dark space shield during thermal expansion, gaps or voids can be formed in undesirable locations, which is used on the target for sputtering material from the target onto the substrate, for example. Possible space can be reduced.

[009] Accordingly, there is a continuing need for improved devices and methods for shielding the dark space of deposition apparatus.

In view of the above, according to one aspect, a shielding device for a rotatable cathode having a rotatable target for sputtering material on a substrate is provided. The shielding device includes: a shield configured to cover a portion of the rotatable target; And a fixture for connecting the shield to the rotatable target. The fixture is configured to engage with the shield so that the shield extends essentially away from the center of the rotatable target in the axial direction of the rotatable target.

In addition, according to another aspect, a shielding device for a rotatable cathode having a rotatable target for sputtering material on a substrate is provided. The shielding device includes: a shield configured to cover a portion of the rotatable target; And a fixture for connecting the shield to the rotatable target. The fixture is configured to engage with the shield so that the shield extends essentially away from the center of the rotatable target in the axial direction of the rotatable target.

[0012] Also provided is a method for shielding a dark space region within a deposition apparatus during operation of the deposition apparatus. The method includes providing a fixture for connecting a shield to a rotatable target of a deposition apparatus, and assembling a plurality of parts together, the rotatable target to shield a dark space region within the deposition apparatus. To form a shield that covers a part of. The shield is assembled to engage the rotatable target such that during operation of the deposition apparatus, the shield extends essentially away from the center of the rotatable target in the axial direction of the rotatable target.

[0013] Also provided is a method for shielding a dark space region within a deposition apparatus during operation of the deposition apparatus. The method includes providing a fixture for connecting a shield to a rotatable target of a deposition apparatus, and assembling a plurality of parts together, the rotatable target to shield a dark space region within the deposition apparatus. To form a shield that covers a part of. The shield is assembled to hang on the rotatable target such that during operation of the deposition apparatus, the shield extends essentially away from the center of the rotatable target in the axial direction of the rotatable target.

Additional aspects, advantages and features of the present disclosure are apparent from the dependent claims, detailed description and accompanying drawings.

Some of the above-described embodiments will be described in more detail in the following description of typical embodiments with reference to the following drawings:
1 schematically illustrates a side view of a shielding device, rotatable target, and cathode driver of a deposition apparatus for sputtering material on a substrate according to embodiments.
FIG. 2 shows an enlarged view of section 60 of the embodiment shown in FIG. 1 according to embodiments.
3 schematically shows an exploded view of the shielding of the shielding device according to the embodiments.
4 schematically shows a portion of a shielding device for connecting an armspace shield according to embodiments to a rotatable target.
5 schematically shows an additional part of a shielding device for connecting an armspace shield according to embodiments to a rotatable target.
6 schematically illustrates a top view of a darkroom shield according to embodiments.
7 schematically illustrates a shield portion according to embodiments in a three-dimensional view.
8 schematically shows a cross-sectional view of a sputtering facility according to embodiments.
9 schematically shows a cross-sectional view of a sputtering installation according to embodiments.

Various embodiments will now be referenced in detail, one or more examples of which are illustrated in each drawing. Each example is provided for illustrative purposes and not for limitation. For example, features illustrated or described as part of an embodiment may be used in other embodiments or in combination with other embodiments to yield other embodiments. This disclosure is intended to cover such modifications and variations.

Embodiments of the present disclosure relate to nanofabrication technology solutions that include equipment, processes, and materials used for the deposition of thin films and coatings, and representative examples include applications that encompass (but are not limited to) the following: But not limited): semiconductor and dielectric materials and devices, silicon based wafers, flat panel displays (such as TFTs), masks and filters, energy conversion and storage (photocells, fuel cells and batteries) Same), solid state lighting (such as LEDs), magnetic and optical storage, micro-electromechanical systems (MEMS) and nano-electro-mechanical systems (NEMS), micro-optics And optoelectronic devices, architectural and automotive glasses, metal and polymer foils and metallization systems for packaging, micro molding and nano molding.

Sputtering (Sputtering) is a process in which atoms are released from a solid target material due to bombardment of the target by energetic particles. The process of coating the substrate is typically associated with thin film applications. The terms "coating" and the term "deposition" are used interchangeably herein. The terms "sputtering equipment" and "deposition device" are used interchangeably herein, and are typically targeted as thin films on a substrate. It will refer to a device that uses sputtering to deposit.

Typical target materials include pure metals such as aluminum (Al), copper (Cu), silver (Ag) and gold (Au); Metal alloys such as aluminum-niobium (AlNb) alloys or aluminum-nickel (AlNi) alloys; Semiconductor materials such as silicon (Si); And nitrides, carbides, titanates, silicates, aluminates and oxides, such as Sn doped In2O3 (ITO) and F doped SnO2, as well as impurity doped ZnO, such as ZnO:Al, AlZnO , Dielectric materials such as, but not limited to, transparent conductive oxides (TCO) such as In2O3, SnO2 and CdO. Oxides, nitrides, oxynitrides, etc. can also be deposited by reactive sputtering, where the target material reacts with the reactive gas in the processing gas.

[0029] As used herein, the term "substrate" will refer to all non-flexible substrates, such as wafer or glass plates, and flexible substrates such as webs and foils.

The term "dark space shield" as used herein will generally refer to shields that prevent sputtering of unwanted portions of the cathode. The terms "dark space shield" and "dark space shield" are used interchangeably herein.

1 shows a section 100 of a deposition apparatus for sputtering material on a substrate in a conventional cross-section along a direction parallel to the axis of rotation 50 defined by the rotatable target 10. The section 100 includes a driving unit 30 for rotating the rotatable target 10 and a shielding device 20 connected to the rotatable target 10 to cover at least a portion of the rotatable target 10. . During operation of the deposition apparatus, the rotatable target can rotate around the axis of rotation 50.

According to embodiments herein, the shield 21 of the shielding device 20 may be part of a rotatable target 10 such as, for example, the bottom end 15 of the rotatable target 10. I can cover it. The bottom end 15 of the rotatable target 10 can be defined as the end of the rotatable target 10 connected to the drive unit 30. The middle section 16 of the rotatable target 10 can be used to deposit material on the substrate during operation of the sputtering device. The terms “middle section” and “uncovered section” are used interchangeably herein. The upper end 17 of the rotatable target 10 is, for example, to prevent gas emissions caused by electric field accumulation. It may be covered by a shielding device (not shown in the drawings).

In this regard, directional terms such as “top”, “bottom”, “top”, “bottom”, “top”, “bottom”, “~top”, etc. are related to the orientation of the rotation axis 50 The term "axial direction" as used herein is intended to describe a direction parallel to the rotation axis 50. Similarly, the term "radial direction" as used herein is orthogonal to the rotation axis 50 and the rotation axis It is intended to describe the direction away from 50. Similarly, the term "axial distance" as used herein is intended to describe the distance in the direction of the rotation axis 50. The term "axial direction" as used herein "Extension" is intended to describe the extension in the direction of the rotating shaft 50.

2 schematically shows an excerpt 60 of a section 100 of a deposition apparatus for sputtering a material on the substrate shown in FIG. 1. In particular, the shielding device 20 according to embodiments herein is shown assembled around the drive end of the rotatable target 10.

The shield 21 of the shielding device 20 includes a first section 26 and a second section 27. The first section can be described as a section of the shield that covers a portion of the rotatable target in the axial direction of the target above the point of attachment of the rotatable target to the drive. The second section can be described as a section of the shield that covers a portion of the rotatable target in the axial direction of the target at the point of attachment of the rotatable target to the drive, optionally the second section attaching the rotatable target to the drive It may extend axially below the point.

According to this embodiment, the diameter of the first section 26 of the shield 21 may be smaller than the diameter of the second section 27 of the shield 21. The diameter of the first section 26 of the shield 21 may be essentially the same as the diameter of the rotatable target 10. According to this embodiment, the diameter of the rotatable target 10 may be defined as the diameter of a portion of the rotatable target 10 directly above the shield 21 of the shielding device 20. A portion of the axially rotatable target 10 parallel to the axis of rotation 50 directly above the shield 21 can be used to deposit material on the substrate during operation of the deposition apparatus.

2, according to embodiments of the present specification, the fixture 80 for connecting the shield 21 to the rotatable target 10 is a first section 26 of the shield 21 ) Can be connected to the shield 21. In particular, the fixture 80 that meshes with the shield 21 may be connected to the shield 21 around the inside of the shield 21. According to some embodiments that may be combined with other embodiments described herein, the fixture may be engaged with the shield by a fastening element, such as one or more screws, and/or the fixture may be as described herein. It can be configured to suspend the shield in the same fixture.

According to embodiments of the present specification, a guiding device 90 for stabilizing and/or guiding the shield may be attached to the driving unit of the deposition apparatus. The guiding device 90 can be covered by the second section 27 of the shield 21. The guiding device can center the shield radially.

3 schematically shows an enlarged view of an excerpt 60 of a section 100 of a deposition apparatus for sputtering material on the substrate shown in FIG. 1. According to embodiments that may be combined with other embodiments described herein, the shield includes one or more notches, trenches, channels or hollows formed along the radially inner perimeter of the darkroom shield 21. can do. The notch 22 can be located at an axial position of the shield within 50% or less of the top of the shield 21, particularly within 20% or less. According to embodiments of the present specification, the notch 22 may include an overhang or an overhang 23 for firmly fixing the fixture 80 and the shield 21 to each other.

According to embodiments herein, the notch 22 is dimensioned to accommodate at least a portion of the fixture 80 such that the shield 21 can be connected to the rotatable target 10 through the fixture 80. Can be set. In embodiments herein, the fixture 80, for example a PEEK ring, can be clamped to the rotatable target 10.

According to embodiments herein, the rotatable target 10 is formed with one or more notches, trenches, channels formed along the outer periphery of the rotatable target 10 adapted to receive the fixture 80 Or cavities. The notch 11 may hereinafter be referred to as the first notch 11. The first notch 11 can be located at the drive end of the rotatable target 10 to be covered by the shield 21 of the shielding device 20 during operation of the deposition apparatus.

According to embodiments of the present specification, the rotatable target 10 may include a recessed portion or a notch. Recesses or notches, also referred to hereinafter as second notches 12, when the shielding device 20 is mounted to the rotatable target 10, the outer surface and shield of the rotatable target 10 involved in the deposition process It can be adapted to accommodate the shielding device 20 so that the outer surface of the top of 21 is in the same plane (see plane 70 shown in FIG. 2 ).

According to the embodiments described herein, the first notch 11 adapted to receive the fixture to connect the shield to the rotatable target may be located within the second notch 12. The fixture itself can be covered by a shield during operation of the deposition apparatus.

According to embodiments herein, a shielding device is provided that can cover a portion of a target, such as, for example, a portion of a rotatable target. The shielding device may include a shield and a fixture for connecting the shield to the target. The fixture can be configured to cause the shield to extend essentially away from the center of the target in the axial direction of the target (see arrow 25 in FIG. 2). The term “essentially” as used herein to describe the axial expansion of the shield means that most of the shield can expand as it moves away from the center of the target in the axial direction of the target (see reference numeral 13 in FIG. 1 ). It should be understood as meaning. For example, 50% or more of the shield, in particular 70% or more, can be extended to move away from the center of the target in the axial direction of the target.

The shield may be connectable to the fixture at an axial position of the shield within 50% or less of the top of the shield, particularly within 20% or less. The top of the shield can be defined as the end of the shield closest to the center of the rotatable target. Alternatively, the top of the shield can be defined as the end of the shield opposite the end of the shield facing the drive unit in the axial direction of the shield. According to embodiments herein, the center of gravity of the shield may be below the point where the shield is attached to the rotatable target. For example, when the shield is arranged around a portion of the target, the center of gravity of the shield may be below the fixture for connecting the shield to the target.

To connect the fixture and the shield to each other, the shield may include a special attachment site located within 50% or less, particularly 20% or less of the top of the shield. For example, the shield may include a notch. The notch can be positioned around the interior of the shield, such that the notch faces the target when the shield is installed around the target. According to embodiments herein, the notch may extend partially or completely along the inner perimeter of the shield.

The terms “notch” and the term “channel” are used interchangeably herein, at least a portion of a notch of a shield or a notch may include a bottom area surrounded by both side walls. In fields, at least one of the sidewalls may include an overhang structure or protrusion extending along at least a portion of the sidewall to maintain the fixture at a predetermined location.

The fixture of the shielding device according to embodiments herein may be adapted to suspend or suspend the shield from a target, such as a rotary target. The terms “hanging” or “suspending” may be used interchangeably herein. Suspension or suspension of a shield as described herein generally refers to a shield of a rotatable target. When connected to a rotatable target to cover a part, it means that the shield is essentially unsupported under the fixture During thermal cycling, this allows the shield to extend downward from the point of attachment to the fixture (eg 2) The shield can extend axially from the center of the target toward the drive end of the target, so the expansion of the shield can be controlled and oriented in a predetermined direction. In the embodiments described in, the shield may extend essentially in a single direction towards the surface of the earth According to some embodiments that may be combined with other embodiments described herein, fixtures and/or guys The ding device may include an insulating material, the insulating material may optionally include a heat-resistant plastic, the heat-resistant plastic may improve use in a sputtering deposition chamber.

The shielding device according to the embodiments may further include a guiding device for guiding and stabilizing the shield in a right angle or radial direction with respect to the axial direction of the shield. The guiding device can stabilize the shield against movements in a direction away from the rotation axis of the shield. According to embodiments of the present specification, the guiding device may be adapted to be connected to the driving portion of the deposition apparatus.

[0050] The guiding device may include one or more friction reducing sections at the point of contact to the shield. One or more friction reducing sections may be movable with the shield. According to embodiments herein, the friction reducing sections may be movable independently from the remaining guiding device. For example, the friction reducing section can be one or more rollers. Alternatively or in addition, according to embodiments herein, the shield may include a friction reduction section at the point of contact with the guiding device.

[0051] The shield is typically electrically insulated from the rotatable target. For example, at least the contact surfaces of the shield and the guiding device and the fixture can be made of an insulating material. The insulating material can be, for example, a heat-resistant plastic such as poly ether ether ketone (PEEK).

According to embodiments of the present specification, the rotatable target may include a special attachment site for connecting the shield to the rotatable target through a fixture. For example, the attachment site can be a first notch extending along the outer perimeter of the target. The first notch may extend partially or completely along the outer perimeter of the target. The fixture can be attached, for example, in form-fit or snap-fit with a rotatable target comprising positioning and locking features (constraining features).

[0053] The rotatable target may include a recess or a second notch. The recess or notch of the rotatable target can be adapted to provide a space or gap for receiving the shielding device. This space or gap is adapted such that the surface and shield of the rotatable target used for the deposition of the material on the substrate are essentially in a common plane.

According to embodiments herein, the junction between the shield and the rotatable target may form a transition region that is essentially flat or of the same height. The section of the rotatable target immediately above the top of the shield of the shielding device and the top of the shield of the shielding device may be on the same plane. This ensures uniform deposition of material on the substrate during operation of the deposition apparatus.

According to embodiments herein, the first notch of the rotatable target for connecting the fixture of the shielding device may be located in the second notch or recess of the rotatable target.

The shielding device 20 as shown in the figures may include a segmented armspace shield 21 adapted to rotate with the rotatable target 10. For example, the divided dark space shield may be divided into two segments (also referred to herein as "parts"). The term “divided” as used herein is intended to describe the dark space shield as consisting of many parts assembled together. The terms "divided", "multipart" and "in multiple parts" are used simultaneously in this specification. Typically, the shield has an uneven surface with typical roughness between RZ 25 and RZ 70.

[0057] The dark space shield can be divided into a plurality of segments that can be assembled together. The at least two parts can be secured together when the shield is mounted to the target using, for example, a fastening device such as a fastener. The segments can be separate pieces, or alternatively, the segments can be linked together, for example by hinges or joints. In particular, the hinge or joint can be located on the inside of the segments relative to the radial direction.

Given the fact that the dark space shield comprises several parts, the dark space shield can be easily arranged on and mounted on at least a portion of the rotatable target. The integral shield will have to be disposed over the target so as to be arranged over at least a portion of the target. Since the targets can have a significant length of several meters and the targets can be easily affected by contact with the shield, maintenance efforts are essentially reduced by the use of a multi-part shield as described herein. Can. According to embodiments, the shield or at least a portion thereof may be assembled concentrically on the rotatable target.

[0059] The term "rotatable target" as used herein will refer to any cathode assembly adapted to be rotatably mounted to a sputtering facility. Typically, the rotatable target includes a target structure adapted to be sputtered. As used herein, the term “rotatable target” will specifically refer to magnetically enhanced cathode assemblies, where the assemblies are further enhanced with internal magnetic units for improved sputtering, eg permanent magnets.

Rotatable targets, also referred to as rotatable sputtering cathodes or rotary cathodes, may subsequently be made of a hollow cylindrical body of target material. These rotating targets are also referred to as monolithic targets and can be produced by casting or sintering these targets from a target material.

Non-monolithic rotatable targets typically include a cylindrical rotatable tube, for example a backing tube, with a layer of target material applied to its outer surface. In the manufacture of such rotatable sputtering cathodes, the target material can be applied, for example, by spraying or casting of powder on the outer surface of the backing tube or by isostatic pressing. Alternatively, a hollow cylinder of target material, which may also be referred to as a target tube to form a rotary cathode, can be arranged on the backing tube and combined with indium, for example. According to another alternative, uncoupled target cylinders can be provided radially outward from the backing tube.

[0062] To obtain an increased deposition rate, the use of magnetically strengthened cathodes has been proposed. This can also be referred to as magnetron sputtering. Magnetic units, which may include an array of magnets, are disposed inside the sputtering cathode, for example inside a backing tube or inside a monolithic target, and can provide a magnetic field for magnetically enhanced sputtering. have. The cathode is typically rotatable about its longitudinal axis, so that the cathode can be rotated relative to magnetic units. The term “end” or “edge” as used herein in the context of a rotatable target or cathode will refer to an axial end or edge of the cathode or target, typically the outer cross-section of the target or cathode having a diameter For example, it may be 8 cm to 30 cm circular, while the length of the target or cathode may be several meters, for example up to 0.3 m or even up to 4 m.

During operation, electrically non-screened cathodes may experience gas release (arching) at the cathode edges due to electric field accumulation. This release is undesirable. The area of gas discharge next to the cathode end is called the “darkroom”. According to the embodiments described herein, darkroom shields may be arranged to cover one or both ends of the cathode.

According to embodiments herein, a shield is provided to shield the dark area of the target, to avoid gas release on the drive end of the cathode. The shield is usually made of an insulator. Targets shielded by non-rotating shields can undergo material deposition only on one side of the darkroom shield during the sputtering process. The resulting film formed on the darkroom shield surface can fragment after several deposition cycles, and material particles can be deposited on the surface of the substrate, masking the deposition of sputtered material, causing defects in products. have. The material particles described above can generally accumulate and contaminate the deposition apparatus.

[0065] As described herein, by the dark shield rotating with the target, the surface of the dark shield is exposed to material deposition. The layer of material is deposited in a uniform manner, forming a film across the surface of the darkroom shield. This means that the film can be deposited for a longer period of time before fragmentation, which reduces the likelihood of fragments of the film falling onto the substrate. The risk of contamination, maintenance time and cost of the substrate and deposition apparatus can thus be reduced compared to providing a non-rotating darkroom shield.

According to embodiments, the plurality of segments may be cylindrical segments forming a cylindrical shield when assembled together. Typically, two segments are provided, each covering 180° around the cylinder. According to other embodiments, for example, as shown in FIG. 6, the shield 21 can be assembled into three segments 24, each segment covering 120° of the cylinder.

The shield may be rotationally symmetrical for each section. At least two parts of the shield are, for example, cylinder section parts covering 180° or 120° of the circumference. When assembled together, the parts form a cylinder that can achieve rotational symmetry independently of the intersection between the parts. According to the present disclosure, if the part is said to be “rotatively symmetrical”, the surface is the same after rotating the part. In the case of cylinder sections, rotation is performed about the center of rotation, which is the center of the cylinder. The cylinder section covering 360°/n (eg, n=2 or n=3) can rotate at any angle up to 360°/n degrees, and the surface is the same. The term surface specifically includes surfaces on radially outer perimeters. Without being limited to any particular embodiment herein, the shield may include more than 3, eg, 4, 6, or more portions covering together 360° of the cylinder.

A cross-sectional view of a rotationally symmetric cylinder section is shown in FIG. 7. The shield portion or segment 24 covering 180° of the cylinder has a center 28. The arrow 25 illustrated by way of example will illustrate that the part can be rotated 180°, and the surface, in particular the radial outer surface, is the same.

In particular, according to the embodiments described herein, the shield segments may not have a hole for receiving screws or pins, for example. The hole will make the shield parts rotationally asymmetric. In known shields, holes were provided for assembling the shields with other elements. However, any rotational asymmetry in the shield results in disturbance of the electric field during sputtering. This eventually leads to reduced homogeneity of the layer on the coated substrate.

In addition, holes were provided to allow screws or the like to be inserted. Thus, it is necessary to loosen the screws to disassemble or remove the shield for maintenance, for example. This is particularly time consuming because the screw head is coated during sputtering, and it is necessary to first remove the coating from the screw head and secondly unscrew it in order to disassemble or separate the shield.

Thus, providing a rotationally symmetrical shield without any rotational asymmetry elements such as holes not only improves coating quality, but also reduces maintenance effort and cost.

According to certain embodiments that may be combined with other embodiments described herein, the rotatable target may include a top shield. The top shield is located on top of the rotatable target. The term "top" will be understood as the end of the target opposite the end connected to the drive in the axial direction of the target (herein referred to as the "driving end" of the rotatable target). The top shield is adapted to rotate with the rotatable target. Similar to the drive end shield, the top shield or at least a portion of it may be concentrically assembled to the rotatable target.

During repeated thermal cycling of the deposition chamber, the darkroom or darkspace shield(s) often undergo thermal expansion. Thus, the fixtures or elements connecting the shield to the rotary target can be adapted to facilitate such repeated thermal expansion without damaging the rotary target.

In the art, the shield may be attached to the cathode drive to cover the drive end of the rotatable target. The drive unit supports the shield and rotary target. In such cases, the shield extends from the support driver in the axial direction of the target toward the center of the rotary target. Thus, large spaces or gaps may be provided between the shield at the drive end and the rotary target to allow thermal expansion of the shield. These spaces can reduce the surface area of the target used to deposit the material on the substrate.

4 schematically illustrates a portion of a shielding device for connecting an armspace shield according to embodiments to a rotatable target. In particular, FIG. 4 shows an enlarged view of the excerpt 61 of the embodiment shown in FIG. 2. The fixture 80 can be connected to the first notch 11 of the rotatable target 10. According to the embodiments herein, the first notch 11 may be milled into a rotatable target, for example.

According to embodiments of the present specification, the fixture 80 may include a hook-shaped portion inserted into the notch 22 of the shield 21. The shield 21 may be suspended or suspended from the hook-shaped portion.

In embodiments herein, the overhang structure or protrusion 23 can have a fixture 80 located inside the notch 22. For example, the overhang structure or protrusion 23 may extend in the axial direction of the shield 21 toward the bottom end of the shield 21. According to embodiments herein, the overhang structure or protrusion 23 may be located at the edge of the notch 22, particularly the edge of the notch 22 closest to the top of the shield 21.

According to embodiments of the present specification, the fixture 80 may be configured such that the shield is spaced at a distance of 1.5 mm to 4.5 mm, for example, about 3 mm ± 0.5 mm from the rotatable target. Since the shield 21 can be suspended or suspended from the fixture 80, the gap or distance 40, 41 between the shield and the rotatable target can essentially remain constant during thermal cycling operations. In particular, the axial gap or distance 40 between the top of the shield 21 and the rotatable target 10 due to the special fixture 80 adapted to hang the shield 21 will remain constant during thermal cycling. This allows the shield 21 to extend essentially downward from the center of the rotatable target during thermal cycling. Preferably, the extension of the surface of the rotatable target used during operation of the deposition apparatus for depositing the material on the substrate remains essentially constant, which can ensure the homogeneity of the layer of material deposited on the substrate. .

5 schematically illustrates a portion of a shielding device for connecting an armspace shield according to embodiments to a rotatable target. In particular, FIG. 5 shows an enlarged view of the excerpt 62 of the embodiment shown in FIG. 2. In particular, FIG. 5 shows the bottom section of the shielding device 20. According to embodiments of the present specification, during operation of the deposition apparatus, the bottom portion of the shield 21 of the shielding device 20 may be adapted to cover the bottom end of the rotatable target 10. The bottom end of the rotatable target 10 may include a portion of the rotatable target connected to the drive portion of the deposition apparatus.

In embodiments herein, the shield 21 of the shielding device 20 may be spaced apart from the rotatable target at a distance 41 in a direction perpendicular to the axial direction of the rotatable target, which is a deposition apparatus Can be kept essentially constant during the thermal cycling operation of the. According to embodiments, the distance 41 or gap between the rotatable target and the shield 21 may be between 1.5 mm and 4.5 mm, for example about 3 mm ± 0.5 mm.

According to embodiments of the present specification, the shielding device 20 may include a guiding device 90 for stabilizing the bottom end of the shield 21 of the shielding device 20. The guiding device can stabilize the shield 21 in a direction perpendicular to the axial direction of the shield or radially from the rotatable target.

The guiding device can be adapted to be connected to the driving portion of the deposition apparatus. In embodiments herein, the guiding device may include a friction reducing section at the point of contact of the shielding device 20 with the shield 21. For example, the friction reducing section can be a movable section. The movable section of the friction reducing section can be adapted to be movable with the shield 21 during operation of the deposition apparatus.

The shield 21 and the guiding device 90 of the shielding device 20 have an axial gap 42 or space between the shield 21 and the guiding device 90 of the shielding device 20 It can be configured to be formed. The gap 42 can be adapted to allow the shield 21 to expand freely downward from the center of the rotatable target during thermal cycling operations of the deposition apparatus. According to the embodiments of the present specification, the gap 42 may be smaller in size when the shield 21 is in the expanded state as opposed to when the shield 21 is in the unexpanded state.

8 schematically illustrates a cross-sectional view of a sputtering facility 200 along a rotation axis 50 according to embodiments. The sputtering facility 200 typically includes a process chamber 220 formed by walls 231 and 232. According to conventional embodiments, the axis of rotation 50 of the cathode, target or backing tube is essentially parallel to the wall 231, where a drop-in configuration of the cathode is realized.

According to embodiments, at least one end-block 101, which may include a drive for rotating the rotatable target, is mounted in the process chamber 220. The base body 110 is typically secured through the insulating plate 116 and to the flap or door 230 of the process chamber 220. During sputtering, flap or door 230 is closed. Thus, the base body 110 is typically fixed during sputtering and cannot at least rotate. Alternatively, the outer housing 125 can be secured directly to the wall 231 of the process chamber 220.

According to embodiments, the rotary drive 150, which is typically an electric drive, is arranged outside the process chamber 220 through the mounting support 152. However, the rotation driving unit 150 may be disposed in the outer housing 125. Typically, the rotation drive 150 rotates around the rotatable target 10, a pinion 153 connected to the rotation drive, and a pinion 153 during sputtering through the motor shaft 154 of the rotation drive. Around a chain or toothed belt (not shown) and the gear wheel 151 attached to the bearing housing 123 of the rotor 122 are driven.

Typically, the coolant support tubes 134 and/or the electrical support line are from the coolant supply and discharge unit 130 and/or the electrical support unit to the outside of the process chamber 220 through the outer housing 125. Is supplied.

[0088] The rotatable target 10 is typically supported by an end block 101. Also, the rotatable target 10 can be further supported at its upper end. According to the embodiments of the present specification, the shielding device 20 as described in more detail with respect to the previous drawings may cover at least a portion of the rotatable target 10. The shielding device may extend in the axial direction of the rotational axis 50 of the rotatable target 10 and cover at least a portion of the junction between the rotatable target 10 and the end block 101.

According to embodiments of the present specification, the rotatable target 10 may be mounted to the target flange 121 of the end block along the rotation axis 50. According to embodiments, the target flange 121 and the rotatable target 10 are coaxial with each other. The shielding device 20 may extend axially with respect to the rotation axis 50 of the target to cover at least a portion of the target flange 121.

The rotatable target 10 can be fitted on top of the target flange 121 using an annular clamp that presses the rotatable target 10 onto the target flange 121. O-ring seals may be arranged between the target flange 121 and the adjacent portion of the backing tube and the rotatable target 10, respectively. Thus, the rotatable target 10 can be mounted airtightly on the target flange 121.

According to embodiments, the rotatable target 10 may be vacuum tightly mounted to the upper portion of the target flange 121, for example, to prevent fluid leakage into the low pressure process chamber. This is usually achieved by annular sealing (not shown).

To operate the rotatable target 10 as a cathode during sputtering, at least one electric ball (not shown) for the rotatable target 10 can also be provided through the target flange 121.

According to embodiments that can be combined with other embodiments disclosed herein, both the target flange and the bearing housing can be made of a conductive material, such as steel. In these embodiments, current can flow from the current collector plate to the rotatable target through the bearing housing and target flange.

According to embodiments that may be combined with other embodiments disclosed herein, the target flange may be adapted to mechanically support the rotatable target. In addition, coolant and electrical supply to the target tube can be provided through the target flange.

9 illustrates a sputtering facility 200 as shown in FIG. 8. The schematic cross section of FIG. 9 is orthogonal to the cross section of FIG. 8. According to an embodiment, the sputtering facility 200 has a vacuum process chamber 220 that includes a gas inlet 201 for providing processing gas, eg argon, to the vacuum process chamber 220. The vacuum process chamber 220 further includes a substrate support 202 and a substrate 203 arranged on the substrate support 202. In addition, the vacuum process chamber 220 includes a rotatable target 10.

A high voltage difference can be applied between the rotatable target 10 acting as a cathode and the substrate support 202 acting as an anode. Plasma is typically formed by, for example, impact ionization of electrons accelerated with argon atoms. The formed argon ions are accelerated in the direction of the rotatable target 10, so that particles of the rotatable target 10, typically atoms, are sputtered and subsequently deposited on the substrate 203.

[0097] In embodiments, other suitable gases, such as other inert gases such as krypton or reactive gas such as oxygen or nitrogen, can be used to generate the plasma. According to typical embodiments that can be combined with other embodiments described herein, the pressure in the plasma region may be from about 10 ^-4 mbar to about 10 ^-2 mbar, typically about 10 ^-3 mbar. In another embodiment, vacuum process chamber 220 may include one or more openings and/or valves for introducing or recovering substrate 203 into and out of vacuum process chamber 220.

[0098] Magnetron sputtering is particularly advantageous in that its deposition rate is rather high. By arranging one or more magnets 14 inside the rotatable target 10, free electrons in the generated magnetic field just below the target surface can be captured. This typically improves the probability of ionizing gas molecules by several orders of magnitude. Consequently, the deposition rate can be significantly increased. Depending on the application and the material to be sputtered, static or time-varying magnetic fields can be used. In addition, cooling fluid may be circulated within the rotatable target 10 to cool the magnet 14 and/or the rotatable target 10.

[0099] The rotatable target 10 is not visible in the illustrated cross section and can thus be supported by the end block 101 shown as a dashed circle. The end block 101 cannot be seen in the illustrated cross section and can therefore be mounted non-rotatably on the wall 231 or door 230 or flap of the process chamber 220 shown as a dotted rectangle.

According to embodiments of the present specification, a method for shielding a dark space region in a deposition apparatus during operation of the deposition apparatus is provided. The method includes providing a fixture for connecting the shield to the rotatable target of the deposition apparatus, and providing the fixture can include connecting the fixture to the rotatable target. The method may further include assembling the plurality of parts together, forming a shield to cover a portion of the rotatable target to shield the dark space region in the deposition apparatus, the shield being shielded during operation of the deposition apparatus. It is assembled to suspend and/or engage the rotatable target to extend essentially away from the center of the rotatable target in the axial direction of the rotatable target. Assembling the plurality of parts can include, for example, assembling two or more shield parts to form a shield.

According to embodiments of the present specification, a method for shielding a dark space region in a deposition apparatus during operation of the deposition apparatus, further comprising assembling the shield such that the shield hangs on the rotatable target at the point of attachment. The center of gravity of the shield is below the attachment point. The method may further include stabilizing the shield in a direction perpendicular to the axial direction of the shield.

[00102] Certain features of various embodiments of the disclosure are shown in some drawings and not in other drawings, but this is for convenience only. Any feature in the figures may be referenced and/or claimed in combination with any feature in any other figure.

This described description discloses the disclosure including the best mode, and also includes those skilled in the art of making and using any devices or systems and performing any integrated methods. Enable them to practice the topic. While various specific embodiments have been disclosed above, those skilled in the art will recognize that the spirit and scope of the claims enable equally effective modifications. In particular, mutually exclusive features of the above-described embodiments can be combined with each other. The patentable scope is defined by the claims, and may include such modifications and other examples as possible to those skilled in the art. These other examples are within the scope of the claims, if such examples have structural elements that are not different from the literal language of the claims, or if such examples include equivalent structural elements that have no substantial difference from the literal language of the claims. Is intended.

Claims (15)

A shielding device (20) for a rotatable cathode having a rotatable target (10) for sputtering material on a substrate,
A shield 21 configured to cover a part of the rotatable target 10; And
Fixture (80) for connecting the shield (21) to the rotatable target (10)
It includes,
The fixture is configured to engage with the shield 21 so that the shield extends essentially away from the center 13 of the rotatable target 10 in the axial direction of the rotatable target,
Shielding device for a rotatable cathode. According to claim 1,
The shield 21 is connectable to the fixture 80 at an axial position of the shield 21 within 50% or less of the top of the shield,
Shielding device for a rotatable cathode. According to claim 1,
The fixture 80 is configured to hold the shield 21 at a certain distance from the rotatable target 10 in a direction perpendicular to the axial direction of the rotatable target,
Shielding device for a rotatable cathode. The method of claim 3,
The fixture 80 is configured to hold the shield 21 at the constant distance 41 from 1.5 mm to 4.5 mm from the rotatable target 10 in the direction perpendicular to the axial direction of the rotatable target. ,
Shielding device for a rotatable cathode. According to claim 1,
The center of gravity of the shield 21 is below the fixture 80 for connecting the shield to the rotatable target,
Shielding device for a rotatable cathode. According to claim 1,
Further comprising a guiding device (90) for stabilizing the shield 21 in a direction perpendicular to the axial direction of the shield,
Shielding device for a rotatable cathode. The method of claim 6,
The guiding device 90 includes a friction reducing section at the point of contact with the shield 21,
Shielding device for a rotatable cathode. The method of claim 7,
The friction reducing section is movable with the shield 21,
Shielding device for a rotatable cathode. The method of claim 6,
The fixture 80 and/or the guiding device 90 include an insulating material, the insulating material optionally comprising a heat-resistant plastic,
Shielding device for a rotatable cathode. According to claim 1,
The fixture 80 includes a peak ring for hanging the shield 21,
Shielding device for a rotatable cathode. As a rotatable target (10) having a material sputtered on a substrate of a deposition apparatus,
The rotatable target comprises a first notch 11 along the perimeter of the rotatable target to connect the shielding device according to claim 1,
Rotatable target. The method of claim 11,
The rotatable target comprises a second notch 12 along the perimeter of the rotatable target to accommodate at least a portion of the shield 21 such that the shield and the rotatable target are essentially flush with each other. ,
Rotatable target. The method of claim 12,
The first notch 11 is located in the second notch 12,
Rotatable target. A method for shielding a dark space region in the deposition apparatus during operation of the deposition apparatus, comprising:
Providing a fixture 80 for connecting a shield 21 to a rotatable target 10 of the deposition apparatus; And
Assembling a plurality of parts together to form a shield 21 covering a portion of the rotatable target 10 to shield the dark space region in the deposition apparatus
It includes,
The shield 21 is assembled to engage with the rotatable target such that during operation of the deposition apparatus, the shield extends essentially away from the center of the rotatable target 10 in the axial direction of the rotatable target. ,
A method for shielding a dark space region in a deposition apparatus. A shielding device (20) for a rotatable cathode having a rotatable target (10) for sputtering material on a substrate,
A shield 21 configured to cover a part of the rotatable target 10; And
Fixture 80 for connecting the shield 21 to the rotatable target 10
It includes,
The fixture 80 is configured to engage the shield 21 to allow the shield to extend essentially away from the center 13 of the rotatable target 10 in the axial direction of the rotatable target, The fixture 80 is configured to hold the shield 21 at a certain distance from the rotatable target 10 in a direction perpendicular to the axial direction of the rotatable target,
The shielding device is:
Guiding device 90 for stabilizing the shield in a direction perpendicular to the axial direction of the shield
Further comprising,
The rotatable target 10 includes a first notch 11 along the circumference of the rotatable target to connect the shielding device 20,
Shielding device for a rotatable cathode.

Images