KR102139787B1 - Cutting apparatus for pressuring substrate - Google Patents

Abstract

A pressing substrate cutting device is disclosed. In the pressing substrate cutting apparatus, a plurality of unit substrates are connected to each other by aligning rows and columns, and a first unit substrate array in which grooves are formed between the unit substrates is fixed, or column units or row units in the first unit substrate array. The second unit substrate array is separated from the first unit substrate array by pressing the second unit substrate array among the first unit substrate array and the fixing unit fixing the second unit substrate array separated by A pressing portion for pressing the unit substrate among the substrate arrays to separate the unit substrate from the second unit substrate array may be provided. The pressing unit presses the upper surface of the second unit substrate array or the unit substrate in a first mode in which the size of the second unit substrate array is greater than or equal to a first threshold or a size of the unit substrate is greater than or equal to a second threshold. Cut, and the upper and lower surfaces of the second unit substrate array or the unit substrate in a second mode in which the size of the second unit substrate array is less than the first threshold or the size of the unit substrate is less than the second threshold. It can be cut by pressing with the surface fixed.

Description

Cutting apparatus for pressuring substrate

The present invention relates to an apparatus for cutting a pressurized substrate, in particular, it is possible to precisely cut various sizes of substrates by pressing and cutting in different ways depending on the size of the substrate to be cut, and to automatically receive and transfer the cut substrates. It relates to a pressurized substrate cutting device.

As the demand for electric vehicles increases, HIC boards are being considered for control units that control electricity even for automotive electronics, and high-reliability substrates such as Si3N4 AMB, ZTA DCB, etc. are used for power units that generate electricity and convert AC and DC. Is being applied.

In particular, DCB (Direct Copper Bonding) is an automotive power semiconductor ceramic substrate that plays a role in helping semiconductor devices to operate efficiently for a long time even at high voltages and high currents where metal or plastic substrates are difficult to apply. In a DBC (Direct Bonded Copper) substrate, DBC is a process that refers to direct bonding copper, and as shown in the figure, it directly bonds copper and ceramic materials, and aluminum oxide (Al ₂ O ₃ ) and aluminum nitride ( AlN) and the like are used.

Power modules with DCB substrates with excellent heat dissipation characteristics and high reliability under high temperature and high pressure conditions compared to general PCB substrates are mainly applied to power industry, home appliances, industrial use, aerospace, and automobiles. It plays a role in helping semiconductor devices operate efficiently for a long time even at high voltages and high currents where metal or plastic substrates are difficult to apply.

Currently, semiconductor module manufacturers usually use hundreds of different types of unit boards cut from DCB boards (Master Cards) by attaching them to power modules, but most manufacturers around the world directly cut the DCB board cutting process. As a result, many problems and limitations are occurring in terms of defect rate and productivity.

The problem to be solved by the present invention is a pressurized substrate cutting device capable of precisely cutting substrates of various sizes and automatically receiving and transferring the cut substrates by pressing and cutting in different ways according to the size of the substrate portion to be cut. To provide.

Pressurized substrate cutting apparatus according to an embodiment of the present invention for achieving the above object is fixed to a first unit substrate array in which a plurality of unit substrates are connected in rows and columns and grooves are formed between the unit substrates or In the first unit substrate array, the fixing unit for fixing the second unit substrate array separated by column units or row units from the first unit substrate array and the second unit substrate array of the first unit substrate array are pressed, and the first unit substrate array is The second unit substrate array may be provided with a pressing unit separating the unit substrate from the second unit substrate array by separating the second unit substrate array or pressing the unit substrate among the second unit substrate arrays. The pressing unit presses the upper surface of the second unit substrate array or the unit substrate in a first mode in which the size of the second unit substrate array is greater than or equal to a first threshold or a size of the unit substrate is greater than or equal to a second threshold. Cut, and the upper and lower surfaces of the second unit substrate array or the unit substrate in a second mode in which the size of the second unit substrate array is less than the first threshold or the size of the unit substrate is less than the second threshold. It can be cut by pressing with the surface fixed.

In the first mode, a length of a short axis of the second unit substrate array is greater than or equal to the first threshold, or a length of a short axis of the unit substrate is greater than or equal to the second threshold, and the second mode is the second unit substrate. It is the case that the length of the short axis in the array is less than the first threshold or the length of the short axis in the unit substrate is less than the second threshold.

In the first unit substrate array, an edge is formed at an edge of a state in which the unit substrates are coupled, and the pressing unit presses the edge of the first unit substrate array to cover all the edges in the first unit substrate array. After separation, the second unit substrate array may be separated from the first unit substrate array.

The pressing unit, the second unit substrate array or the unit substrate in the second mode and the pressing means for pressing and cutting the upper surface of the second unit substrate array or the unit substrate in the first mode or the second mode The lower surface of the second unit is provided with a supporting means, and in the second mode, the pressing means and the supporting means are pressed while the upper and lower surfaces of the second unit substrate array or the unit substrate are fixed. The substrate array or the unit substrate may be cut.

In the first unit substrate array, an edge is formed on an edge of a state in which the unit substrates are coupled, and the pressing substrate cutting device is a central portion of the first unit substrate array when in the third mode of cutting the edge. A central fixing unit for fixing, the first unit substrate separated by the edge pressing unit and the edge pressing unit for pressing and cutting the edge in the first unit substrate array by pressing the edge of the first unit substrate array A substrate transfer unit for moving the array to a position fixed by the fixing unit and pressurized by the pressing unit may be further provided.

Pressurized substrate cutting apparatus according to another embodiment of the present invention for achieving the above object is fixed to the first unit substrate array is a plurality of unit substrates are connected in rows and columns and grooves are formed between the unit substrates Or a fixing unit for fixing the second unit substrate array separated in column units or row units from the first unit substrate array, and pressing the second unit substrate array among the first unit substrate array to press the second unit substrate array in the first unit substrate array. The pressing unit for separating the unit substrate from the second unit substrate array by separating the second unit substrate array or pressing the unit substrate among the second unit substrate array, and a lower portion of a position where the pressing unit presses the unit substrate. Located in the, it may be provided with a receiving portion is separated and the free-falling the unit substrate. The storage unit includes a plurality of storage spaces in which the unit substrate is accommodated, and when the unit substrate is accommodated in the storage space by separating the unit substrate from the pressing unit, the empty storage space adjacent to the unit moves horizontally. It may be located under the position of pressing the substrate.

In the first unit substrate array, an edge is formed at an edge of a state in which the unit substrates are coupled, and the pressing unit presses the edge of the first unit substrate array to cover all the edges in the first unit substrate array. After separation, the second unit substrate array may be separated from the first unit substrate array.

The pressing portion is cut by pressing the upper surface of the second unit substrate array or the unit substrate in a first mode in which the size of the second unit substrate array is greater than or equal to a first threshold or a size of the unit substrate is greater than or equal to a second threshold. And the upper and lower surfaces of the second unit substrate array or the unit substrate in a second mode in which the size of the second unit substrate array is less than the first threshold or the size of the unit substrate is less than the second threshold. It can be cut by pressing in a fixed state.

The pressing unit, the second unit substrate array or the unit substrate in the second mode and the pressing means for pressing and cutting the upper surface of the second unit substrate array or the unit substrate in the first mode or the second mode The lower surface of the second unit is provided with a supporting means, and in the second mode, the pressing means and the supporting means are pressed while the upper and lower surfaces of the second unit substrate array or the unit substrate are fixed. The substrate array or the unit substrate may be cut.

In the first unit substrate array, an edge is formed at an edge of a state in which the unit substrates are coupled, and the pressurized substrate cutting device displays a central portion of the first unit substrate array in the third mode of cutting the edge. A central fixing part for fixing, an edge pressing part for pressing and cutting the edge in the first unit substrate array by pressing the edge of the first unit substrate array, and the first unit substrate array separated by the edge pressing part It may be provided with a substrate transfer unit that is fixed by the fixing portion and moved to a position that can be pressed by the pressing portion.

The pressurized substrate cutting apparatus according to one embodiment according to the technical idea of the present invention can precisely cut various sized substrates and automatically receive the cut substrates by pressing and cutting in different ways according to the size of the substrate portion to be cut. As it can be transferred, it has the advantage of increasing productivity and cutting efficiency and minimizing the defect rate compared to the conventional method of cutting the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS In order to better understand the drawings cited in the detailed description of the present invention, a brief description of each drawing is provided.
1 is a view showing an example of a unit substrate array.
2 is a view for explaining that the pressing substrate cutting apparatus according to an embodiment of the present invention operates in a first mode.
3 is a view for explaining that the pressing substrate cutting apparatus according to the technical concept of the present invention operates in the second mode.
4 and 5 are views for explaining a case where the pressurized substrate cutting apparatus according to an embodiment of the present invention automatically receives and transfers the cut substrate.
6 is a view for explaining a case in which the pressing substrate cutting apparatus according to another embodiment of the present invention cuts the edge of the unit substrate array.
7 and 8 are views for explaining a process of separating the unit substrate from the unit substrate array by using the pressure substrate cutting device according to an embodiment of the present invention.

In order to fully understand the present invention and the operational advantages of the present invention and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the contents described in the drawings, which illustrate preferred embodiments of the present invention.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. The same reference numerals in each drawing denote the same members.

1 is a diagram illustrating an example of a unit substrate array 110.

Referring to FIG. 1, in the unit substrate array 110, a plurality of unit substrates 120 may be connected in rows and columns, and edges 150 and 160 may be formed at an edge. In addition, a groove is formed between the unit substrates 120 or between the unit substrate 120 and the edges 150 and 160, and the groove may have various shapes such as a U-shape or a V-shape. Hereinafter, for convenience of description, a unit substrate array in which a plurality of unit substrates 120 are aligned in rows and columns is referred to as a first unit substrate array 110, and a plurality of unit substrates are connected only in a row direction or in a column direction. The unit substrate arrays connected only to are referred to as second unit substrate arrays 130 and 140.

2 is a view for explaining that the pressurized substrate cutting apparatus 200 according to an embodiment of the present invention operates in the first mode, and FIG. 3 is a pressurized substrate cutting apparatus according to the technical spirit of the present invention A diagram for explaining that the 200 is operating in the second mode.

1 to 3, the pressing substrate cutting apparatus 200 may include a fixing part 210 and a pressing part. The pressing portion may include only the pressing means 230, or may include the pressing means 230 and the supporting means 310 together.

The fixing unit 210 may fix the first unit substrate array 110 or the second unit substrate arrays 130 and 140. The fixing unit 210 may be fixed by pressing the first unit substrate array 110 or the second unit substrate arrays 130 and 140 from the upper and lower portions as shown in FIGS. 2 and 3, but the present invention is used in this case. It is not limited, and various other methods may be used as long as the first unit substrate array 110 or the second unit substrate arrays 130 and 140 can be fixed.

The pressing unit presses the second unit substrate arrays 130 and 140 of the first unit substrate array 110 to separate the second unit substrate arrays 130 and 140 from the first unit substrate array 110 or the second unit. The unit substrate 120 may be separated from the second unit substrate arrays 130 and 140 by pressing the unit substrate 120 among the substrate arrays 130 and 140. Separating the substrate described below, by cutting the groove (H) formed between the unit substrate 120 by pressing the substrate to be separated by the pressing unit, the second unit substrate array (130, 140) or the unit substrate ( 120).

The pressing unit may include the second unit substrate arrays 130 and 140 in the first mode in which the size of the second unit substrate arrays 130 and 140 is greater than or equal to the first threshold or the size of the unit substrate 120 is greater than or equal to the second threshold. The upper surface of the unit substrate 120 may be pressed and cut. When pressing the upper surface, it can be pressed in the vertical direction. For example, in the first mode, the pressing part may include a pressing means 230. When the first unit substrate array 110 is in the first mode while being fixed by the fixing unit 210, the pressing unit 230, which is the pressing unit, is configured to remove the second unit substrate arrays 130 and 140 to be separated. By pressing, the second unit substrate arrays 130 and 140 may be separated from the first unit substrate array 110. In addition, when the second unit substrate arrays 130 and 140 are in the first mode while being fixed by the fixing unit 210, the pressing unit 230, which is the pressing unit, presses the unit substrate 120 to be separated. By doing so, the unit substrate 120 can be separated from the second unit substrate arrays 130 and 140.

The pressing unit is the second unit substrate arrays 130 and 140 in a second mode in which the size of the second unit substrate arrays 130 and 140 is less than the first threshold or the size of the unit substrate 120 is less than the second threshold. ) Alternatively, the upper and lower surfaces of the unit substrate 120 may be pressed and cut in a fixed state. For example, in the second mode, the pressing part may include a pressing means 230 and a supporting means 310. The pressing means 230 is a portion for pressing the substrate portion to be separated as described above, and the supporting means 310 is a portion for supporting the lower surface of the substrate to be separated. When the first unit substrate array 110 is fixed by the fixing unit 210, in the second mode, the pressing unit 230 and the supporting unit 310 which are the pressing units are the second unit substrate array 130, The second unit substrate arrays 130 and 140 may be separated from the first unit substrate array 110 by pressing the upper and lower surfaces of the 140 in a fixed state. In addition, in a state in which the second unit substrate arrays 130 and 140 are fixed by the fixing unit 210, in the second mode, the pressing unit 230 and the supporting unit 310 which are the pressing units are the unit substrate 120. ) Can be separated from the second unit substrate arrays 130 and 140 by pressing the upper and lower surfaces of the unit in a fixed state. In the above, when the pressing means 230 presses the substrate, the pressing means 230 and the supporting means 310 may move together in the direction in which the pressing means 230 presses while holding the substrate. For example, when the pressing means 230 presses in the vertical direction while the supporting means 310 supports the unit substrate 120, the supporting means 310 and the pressing means 230 press the unit substrate 120. The unit substrate 120 may be cut while moving in the vertical direction together in a fixed state. In addition, in the present invention, when the pressing means 230 and the supporting means 310 press the substrate in the vertical direction to separate the substrate, the pressing means 230 and the supporting means 310 hold the substrate to be separated and fixed. It may include any case that can cut the groove (H) portion formed between the unit substrate 120 while pressing while, for example, to separate the substrate by pressing while rotating.

The pressing unit may first cut and separate the edges 150 and 160 of the first unit substrate array 110 before cutting the second unit substrate array 130 and 140 in the first unit substrate array 110. have. For example, when the first unit substrate array 110 includes the edges 150 and 160 as shown in FIG. 1, the pressing unit is in the first unit substrate array 110 fixed by the fixing unit 210. First, the edges 150 and 160 are separated by pressing, and then the second unit substrate arrays 130 and 140 may be separated from the first unit substrate array from which the edges 150 and 160 are separated.

The first mode and the second mode may be determined based on the total area of the portion of the substrate to be cut, or may be determined based on the length of one axis of the substrate to be cut. For example, in the first mode, a length of a short axis of the second unit substrate arrays 130 and 140 is greater than or equal to the first threshold, or a length of a short axis of the unit substrate 120 is greater than or equal to the second threshold, The second mode may be when the length of the shorter axis of the second unit substrate arrays 130 and 140 is less than the first threshold or the length of the shorter axis of the unit substrate 120 is less than the second threshold.

4 and 5 are views for explaining a case where the pressurized substrate cutting apparatus 200 according to an embodiment of the present invention automatically receives and transfers the cut substrate.

1 to 5, as described with reference to FIGS. 2 and 3, the pressing substrate cutting apparatus 200 may include a fixing part 210, a pressing part 230, 310, and a receiving part 410. Can. The operation of the fixing part 210 and the pressing parts 230 and 310 is similar to that described with reference to FIGS. 2 and 3, and thus overlapping parts will be omitted. In the embodiment of FIGS. 4 and 5, the pressing units 230 and 310 may be divided into the first mode and the second mode and operated regardless of whether the first mode or the second mode is used. have. In the embodiment of FIG. 4, the pressing unit 230 presses the second unit substrate arrays 130 and 140 of the first unit substrate array 110 regardless of whether the first mode or the second mode is applied. The second unit substrate array 130. 140 is separated from the first unit substrate array 110 by pressing the unit substrate 120 out of the second unit substrate array 130. 140 or by separating the second unit substrate array 130. 140 from the second unit substrate array 130. In the unit substrate 120 can be separated. Similarly, in the embodiment of FIG. 5, the pressing units 230 and 310 may use the second unit substrate arrays 130 and 140 of the first unit substrate array 110 regardless of whether the first mode or the second mode is selected. The second unit substrate array 130 is separated from the first unit substrate array 110 by pressing, or the second unit substrate array 130 is pressed by pressing the unit substrate 120 out of the second unit substrate array 130. 140 In step 140), the unit substrate 120 can be separated. When operating according to whether the first mode or the second mode, since it has been described in detail with reference to FIGS. 2 and 3, the contents of FIGS. 2 and 3 are replaced.

The storage unit 410 may be located at a lower portion of a position where the pressing unit presses the unit substrate 120, and the unit substrate 120 that is separated and freely falling may be accommodated. In addition, the storage unit 410 includes a plurality of storage spaces 410_1, 410_2, and 410_3 in which the unit substrate 120 is accommodated, and the unit substrate 120 is separated from the pressurization unit to the storage space ( When 120) is accommodated, it can be moved in a horizontal direction so that the adjacent empty storage space is positioned below the position where the unit substrate 120 is pressed. For example, in FIG. 4, when the storage space 410_1 is positioned below the position where the pressing unit 230 presses the unit substrate 120, and the unit substrate 120 is received, the storage unit 410 is horizontal Moving in the direction (left to right in the case of FIG. 4), the adjacent empty storage space 410_2 may be positioned below the position where the pressing unit 230 presses the unit substrate 120. As another example, in FIG. 5, when the storage space 410_1 is positioned below the position where the pressing portions 230 and 310 press the unit substrate 120, and the unit substrate 120 is received, the storage portion 410 Moving in the horizontal direction (left to right in the case of FIG. 4), the adjacent empty storage space 410_2 may be positioned below the position where the pressing portions 230 and 310 press the unit substrate 120. The storage unit 410 may move in a horizontal direction when one unit substrate is stored in the storage space, or may move in a horizontal direction when a certain number of unit substrates are stored in the storage space.

6 is a view for explaining a case in which the pressing substrate cutting apparatus 600 according to another embodiment of the present invention cuts the edge of the unit substrate array 110.

1 to 6, the pressing substrate cutting device 600 may include a central fixing portion 610, an edge pressing portion 630, and a transfer portion (not shown). The central fixing unit 610 may fix the central portion of the first unit substrate array 110 in the third mode of cutting the edges 150 and 160 in the first unit substrate array 110. In addition, the edge pressing unit 630 may press the edges 150 and 160 of the first unit substrate array 110 to press and cut the edges 150 and 160 from the first unit substrate array 110. The edge pressing portion 630 may cut a pair of edges (a pair of 150 or a pair of 160) at both ends of the central fixing portion 610 at the same time or may cut only one edge. After cutting a pair of edges to cut all the edges 150 and 160, the first unit substrate array 110 may be rotated 90 degrees or the edge pressing portion 630 may be rotated to a position where there is an edge to be cut. have. In addition, the substrate transfer unit may transfer the first unit substrate array whose edges are cut by the edge pressing unit 630 to the pressing substrate cutting device 200 of FIGS. 2 to 4. For example, the substrate transfer unit may move the first unit substrate array whose edges are cut by the edge pressing unit 630 to a position fixed by the fixing unit 210 and pressurized by the pressing unit 230. Can. In addition, the pressurized substrate cutting device 600 may further include a collecting part 650 that can collect the cut edges 150 and 160 at the bottom.

7 and 8 are views for explaining a process of separating the unit substrate from the unit substrate array 110 using the pressurized substrate cutting device 200 according to an embodiment of the present invention. Hereinafter, it is assumed that the edges 150 and 160 are removed from the first unit substrate array 110, and the unit substrate 120 is separated from the first unit substrate array 170 from which the edges 150 and 160 are removed. The case will be described.

1 to 8, first, as shown in FIG. 7, when the first unit substrate array 170 is transferred to the pressurized substrate cutting device 200, the fixing unit 210 may open the first unit substrate array 170. The fixing unit 230 may press the first unit substrate array 170 to separate the second unit substrate array 130 or 140 from the first unit substrate array 170. The separated second unit substrate array 130 or 140 is transferred to the pressurized substrate cutting device 200 as shown in FIG. 8, and the fixing unit 210 fixes the second unit substrate array 130 or 140 and , The pressing unit 230 may press the second unit substrate array 130 or 140 to separate the unit substrate 120 from the second unit substrate array 130 or 140. For example, FIG. 7 may be the first mode and FIG. 8 may be the second mode. However, the present invention is not limited to this case, and both FIGS. 7 and 8 may be the first mode or the second mode. In addition, it is not necessary to proceed in the order of FIGS. 7 and 8, and after separating the second unit substrate array 130 or 140 from the first unit substrate array 110 using the pressurized substrate cutting device of FIG. 7. The unit substrate 120 may be separated from the separated second unit substrate array 130 or 140 using the pressurized substrate cutting device of FIG. 7. Alternatively, after separating the second unit substrate array 130 or 140 from the first unit substrate array 110 using the pressing substrate cutting device of FIG. 8, the second unit separated using the pressing substrate cutting device of FIG. 8. The unit substrate 120 may be separated from the substrate array 130 or 140. Alternatively, after separating the second unit substrate array 130 or 140 from the first unit substrate array 110 using the pressing substrate cutting device of FIG. 8, the second unit substrate array using the pressing substrate cutting device of FIG. 7 The unit substrate 120 may be separated at 130 or 140. The pressurized substrate cutting apparatus 200 of FIG. 7 and the pressurized substrate cutting apparatus 200 of FIG. 8 may cut the substrate while moving only the support means 310 in the same position, and while transferring the transfer means to each other while being in separate positions. It is also possible to transfer the cut substrate.

As described above, optimal embodiments have been disclosed in the drawings and specifications. Although specific terms have been used herein, they are only used for the purpose of describing the present invention and are not used to limit the scope of the present invention as defined in the claims or claims. Therefore, those skilled in the art will understand that various modifications and other equivalent embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

Claims (10)

A second unit substrate in which a plurality of unit substrates are connected to each other in rows and columns and grooves are formed between the unit substrates to fix a first unit substrate array or to be separated in units of columns or rows from the first unit substrate array. Fixing unit for fixing the array; And
Pressing the second unit substrate array among the first unit substrate array to separate the second unit substrate array from the first unit substrate array or pressing the unit substrate from the second unit substrate array to press the second unit substrate It has a pressing portion for separating the unit substrate from the array,
The pressing portion,
In the first mode in which the size of the second unit substrate array is greater than or equal to the first threshold or the size of the unit substrate is greater than or equal to the second threshold, the second unit substrate array or the upper surface of the unit substrate is pressed and cut,
Fixing the upper and lower surfaces of the second unit substrate array or the unit substrate in a second mode in which the size of the second unit substrate array is less than the first threshold or the size of the unit substrate is less than the second threshold. A pressurized substrate cutting device characterized in that it is pressurized in a state and cut. The method of claim 1, wherein the first mode,
When the length of the short axis of the second unit substrate array is greater than or equal to the first threshold, or the length of the short axis of the unit substrate is greater than or equal to the second threshold,
The second mode,
And a short axis length of the second unit substrate array is less than the first threshold, or a short axis length of the unit substrate is less than the second threshold. The method of claim 1, wherein the first unit substrate array,
Edges are formed on the edge of the unit substrates in a coupled state,
The pressing portion,
Pressing the edge of the first unit substrate array to separate all the edges from the first unit substrate array and then separating the second unit substrate array from the first unit substrate array . According to claim 1, The pressing portion,
Pressing means for pressing and cutting the upper surface of the second unit substrate array or the unit substrate in the first mode or the second mode; And
In the second mode, the second unit substrate array or support means for supporting a lower surface of the unit substrate is provided.
In the second mode, the pressing means and the supporting means cut the second unit substrate array or the unit substrate by pressing while fixing the upper and lower surfaces of the second unit substrate array or the unit substrate. Pressed substrate cutting device characterized in that. The method of claim 1, wherein the first unit substrate array,
Edges are formed on the edge of the unit substrates in a coupled state,
The pressing substrate cutting device,
A central fixing part fixing a central portion of the first unit substrate array in the third mode of cutting the edge;
An edge pressing unit which presses the edge of the first unit substrate array to press and cut the edge in the first unit substrate array; And
And a substrate transfer unit for moving the first unit substrate array separated by the edge pressing unit to a position fixed by the fixing unit and pressurized by the pressing unit. . A second unit substrate in which a plurality of unit substrates are connected to each other in rows and columns and grooves are formed between the unit substrates to fix a first unit substrate array or to be separated in units of columns or rows from the first unit substrate array. Fixing unit for fixing the array;
Pressing the second unit substrate array among the first unit substrate array to separate the second unit substrate array from the first unit substrate array or pressing the unit substrate from the second unit substrate array to press the second unit substrate A pressing unit separating the unit substrate from the array; And
The pressing portion is located at a lower portion of the position to press the unit substrate, and is provided with a receiving portion for receiving the unit substrate is separated and free fall,
The storage unit,
When the unit substrate is received in the storage space by separating the unit substrate from the pressing portion, the adjacent empty storage space presses the unit substrate. Is located at the bottom of the location,
The pressing portion,
In the first mode in which the size of the second unit substrate array is greater than or equal to the first threshold or the size of the unit substrate is greater than or equal to the second threshold, the second unit substrate array or the upper surface of the unit substrate is pressed and cut,
Fixing the upper and lower surfaces of the second unit substrate array or the unit substrate in a second mode in which the size of the second unit substrate array is less than the first threshold or the size of the unit substrate is less than the second threshold. A pressurized substrate cutting device, characterized in that it is pressurized in a state to cut. The method of claim 6, wherein the first unit substrate array,
Edges are formed on the edge of the unit substrates in a coupled state,
The pressing portion,
Pressing the edge of the first unit substrate array to separate all the edges from the first unit substrate array and then separating the second unit substrate array from the first unit substrate array . delete The method of claim 6, wherein the pressing portion,
Pressing means for pressing and cutting the upper surface of the second unit substrate array or the unit substrate in the first mode or the second mode; And
In the second mode, the second unit substrate array or support means for supporting a lower surface of the unit substrate is provided.
In the second mode, the pressing means and the supporting means cut the second unit substrate array or the unit substrate by pressing while fixing the upper and lower surfaces of the second unit substrate array or the unit substrate. Pressed substrate cutting device characterized in that. The method of claim 6, wherein the first unit substrate array,
Edges are formed on the edge of the unit substrates in a coupled state,
The pressing substrate cutting device,
A central fixing part fixing a central portion of the first unit substrate array in the third mode of cutting the edge;
An edge pressing unit which presses the edge of the first unit substrate array to press and cut the edge in the first unit substrate array; And
And a substrate transfer unit for moving the first unit substrate array separated by the edge pressing unit to a position fixed by the fixing unit and pressurized by the pressing unit. .

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