CN112935133A - Electronic component pin forming device with high production efficiency - Google Patents
Electronic component pin forming device with high production efficiency Download PDFInfo
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- CN112935133A CN112935133A CN201911278144.2A CN201911278144A CN112935133A CN 112935133 A CN112935133 A CN 112935133A CN 201911278144 A CN201911278144 A CN 201911278144A CN 112935133 A CN112935133 A CN 112935133A
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- electronic element
- pressing plate
- substrate
- electronic
- electronic component
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
- B21F1/004—Bending wire other than coiling; Straightening wire by means of press-type tooling
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention relates to an electronic element pin forming device with high production efficiency, which relates to the field of electronic elements and mainly comprises: the top part is provided with at least one accommodating part for accommodating an accommodating groove of the electronic component body; the pressing part comprises a driving mechanism, a substrate, an electronic element body pressing plate arranged at the bottom of the substrate and an electronic element pin forming pressing plate; the connecting rod of the driving mechanism is connected with the base plate, the driving mechanism controls the base plate to be pressed downwards to the first position, the electronic element body is fixed in the accommodating groove by the electronic element body pressing plate, the base plate is continuously pressed downwards to the second position, the electronic element pins are pressed downwards on the side face of the accommodating groove by the electronic element pin forming pressing plate, a plurality of vertical lightening holes 5 are uniformly formed in the base, and the bottom of the base is fixedly provided with a rubber pad through glue. The invention can fix the electronic element body when the pin is formed, thereby ensuring that the electronic element body is not damaged by stress when the pin is formed.
Description
Technical Field
The invention relates to the field of electronic elements, in particular to an electronic element pin forming device with high production efficiency.
Background
With the rapid development of data services and the continuous popularization of distributed power supply systems in recent years, the module power supply technology is widely applied to various fields such as switching equipment, access equipment and optical transmission.
The electronic components are components of electronic elements and small-sized electric machines and instruments, are usually composed of a plurality of parts and can be commonly used in similar products; it is a general name of some parts in the industries of electric appliances, radio, instruments and the like, such as capacitors, transistors, hairsprings, springs and other sub-devices. Diodes and the like are common. The electronic component includes: the electronic device comprises a resistor, a capacitor, a potentiometer, an electronic tube, a radiator, an electromechanical element, a connector, a semiconductor discrete device, an electroacoustic device, a laser device, an electronic display device, a photoelectric device, a sensor, a power supply, a switch, a micro special motor, an electronic transformer, a relay, a printed circuit board, an integrated circuit, various circuits, piezoelectricity, crystals, quartz, a ceramic magnetic material, a substrate for a printed circuit, a special material for an electronic functional process, an electronic adhesive (tape) product, an electronic chemical material, a component and the like.
At present, all electronic components such as welding electric capacity, resistance on all power module, and most electric capacity, electronic components such as resistance all need carry out the shaping to its pin before using, prior art is when carrying out electronic component pin shaping, mainly carry out the shaping to the electric capacity pin through workman manual operation, in the operation process, because manual force is different when manual operation, produce stress damage to the electronic component body when carrying out the pin and breaking off with fingers and thumb easily, make electronic component damage, use the electronic component who damages in the circuit then can cause the power module short circuit, burn out, cause unnecessary loss.
Disclosure of Invention
The invention mainly aims to provide an electronic element pin forming device with high production efficiency, and aims to solve the technical problem of reducing the damage to an electronic element body in the process of forming an electronic element pin, so that the electronic element pin forming device is more practical.
The purpose of the invention and the technical problem to be solved are realized by adopting the following technical scheme. According to the invention, the electronic element pin forming device with high production efficiency comprises:
the top of the accommodating part is provided with at least one accommodating groove for accommodating the electronic component body;
the pressing part comprises a driving mechanism, a substrate, an electronic element body pressing plate and an electronic element pin forming pressing plate, wherein the electronic element body pressing plate is elastically arranged at the bottom of the substrate;
the connecting rod of the driving mechanism is connected with the substrate, the driving end of the driving mechanism controls the connecting rod to press the substrate downwards to a first position, the electronic element body is fixed in the accommodating groove by the electronic element body pressing plate, the driving end controls the driving mechanism to continue to press the substrate downwards to a second position, the substrate is close to the electronic element body pressing plate through elastic acting force, and the electronic element pin forming pressing plate presses the electronic element pin downwards on the side face of the accommodating groove.
The object of the present invention and the technical problems solved thereby can be further achieved by the following technical measures.
Preferably, in the electronic component pin molding apparatus with high production efficiency, the electronic component body pressing plate includes a body fastening portion and a pin fastening portion, when the substrate is at the first position, the body fastening portion fixes the electronic component body in the accommodating recess, and the pin fastening portion fastens the electronic component pin portion in the notch of the accommodating recess.
Preferably, in the electronic component pin forming apparatus with high production efficiency, the pressing portion further includes a supporting plate, a first set of sliding bars, a second set of sliding bars, and an elastic member;
the first group of sliding rods are fixed on one side of the supporting plate;
the base plate is connected to the first group of sliding rods and the second group of sliding rods in a sliding mode;
the second group of sliding rods are connected with the substrate and the electronic element body pressing plate;
the elastic component is sleeved on the second group of sliding rods, and two ends of the elastic component are respectively abutted against the bottom surface of the substrate and the top surface of the electronic element body pressing plate.
Preferably, in the electronic component pin molding apparatus with high production efficiency, the electronic component pin molding press plate is located on one side of the electronic component body press plate.
Preferably, in the electronic component pin forming device with high production efficiency, the two sides of the accommodating portion are provided with the limiting blocks for limiting the pressing position of the electronic component body pressing plate, and the limiting blocks are U-shaped limiting blocks.
Preferably, in the electronic component pin forming apparatus with high production efficiency, a driving end of the driving mechanism is hinged to the connecting rod, and the driving end rotates from a first position to a second position to drive the connecting rod to move downward.
Preferably, in the electronic component pin forming apparatus with high production efficiency, one side of the connecting rod of the driving mechanism is fixed on the supporting plate.
Preferably, the electronic component pin forming device with high production efficiency further comprises a base, the accommodating part and the supporting plate are fixed on the base, a plurality of vertical lightening holes 5 are uniformly formed in the base, and a rubber pad is fixedly mounted at the bottom of the base through glue.
By the technical scheme, the electronic element pin forming device with high production efficiency at least has the following advantages:
in the technical scheme provided by the invention, the top of the accommodating part is provided with at least one accommodating groove for accommodating the electronic element body; the pressing part comprises a driving mechanism, a substrate, an electronic element body pressing plate and an electronic element pin forming pressing plate, wherein the electronic element body pressing plate is elastically arranged at the bottom of the substrate; the driving end of the driving mechanism is connected with the substrate, the driving end controls the driving mechanism to press the substrate downwards to the first position, the electronic element body is fixed in the accommodating groove by the electronic element body pressing plate, the driving end controls the driving mechanism to continue to press the substrate downwards to the second position, the substrate is close to the electronic element body pressing plate through elastic acting force, and the electronic element pin forming pressing plate presses the electronic element pin downwards on the side face of the accommodating groove. Compared with the prior art, the capacitor pins are mainly formed by manual operation of workers, in the operation process, due to different manual force during manual operation, stress damage is easily generated on the electronic element body when the pins are bent, and the electronic element is damaged, in the invention, the electronic element body is placed into the accommodating groove of the accommodating part, when the driving end controls the driving mechanism to continuously press the substrate to the first position, the electronic element body is fixed in the accommodating groove by the electronic element body pressing plate, then the electronic element pins are basically pressed, the electronic element pin forming pressing plate presses the electronic element pins on the side surface of the accommodating groove, when the pins are pressed, the electronic element body pressing plate can firmly fix the electronic element body in the accommodating groove, so that the electronic element body can be prevented from being damaged by stress when the pins are pressed, and meanwhile, in the technical scheme provided by the invention, the pin forming operation can be performed on a plurality of electronic elements at a time, and the production efficiency is improved.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
Fig. 1 is a schematic structural diagram of an electronic component pin forming apparatus with high production efficiency according to an embodiment of the present invention;
fig. 2 is a side view of an electronic component pin forming apparatus with high production efficiency according to an embodiment of the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention for achieving the predetermined objects, the following detailed description will be given of the embodiments, structures, features and effects of the electronic device pin forming apparatus with high production efficiency according to the present invention with reference to the accompanying drawings and the preferred embodiments. In the following description, different "one embodiment" or "an embodiment" refers to not necessarily the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
As shown in fig. 1 and fig. 2, an electronic component pin forming apparatus with high production efficiency according to an embodiment of the present invention includes a receiving portion, a top portion of the receiving portion 1 has at least one receiving groove for receiving a body of an electronic component; the pressing part 2 comprises a driving mechanism, a substrate 21, an electronic element body pressing plate 22 elastically arranged at the bottom of the substrate 21, and an electronic element pin forming pressing plate 23 arranged at the bottom of the substrate 21; the connecting rod 201 of the driving mechanism is connected with the substrate 21, the driving end 202 of the driving mechanism controls the connecting rod 201 to press the substrate 21 downwards to a first position, the electronic element body is fixed in the accommodating groove by the electronic element body pressing plate 22, the driving end 202 controls the driving mechanism to continue to press the substrate 21 downwards to a second position, the substrate 21 is close to the electronic element body pressing plate 22 through elastic acting force, and the electronic element pin forming pressing plate 23 presses the electronic element pins downwards on the side face of the accommodating groove.
Specifically, the accommodating part is a rectangular block, and accommodating grooves for accommodating the electronic element body are formed in the top of the accommodating part at the same interval; at the notch of each receiving recess there is a rim for fixing the pins of the electronic component. One end of the connecting rod of the driving mechanism is connected to the center of the base plate and can be connected in a welding mode, or one end of the connecting rod is fastened on the base plate through a bolt. The driving end controls the connecting rod to press the substrate downwards to a first position, the substrate drives the electronic element body pressing plate to fix the electronic element body in the accommodating groove, the electronic element pin forming pressing plate is fixed on the lower surface of the substrate through a screw, the bottom of the electronic element pin forming pressing plate is not contacted with the pins of the electronic element, the driving end controls the driving mechanism to continuously press the substrate downwards to a second position, in the pressing process, the substrate is close to the electronic element body pressing plate through elastic force, in the process, the position of the electronic element body pressing plate is kept still, the electronic element body is firmly fixed in the accommodating groove, the electronic element pin forming pressing plate presses the electronic element pins on the side face of the accommodating groove, the horizontal electronic element pins are formed to be in an angle bending state, the part, close to the electronic element body, of the electronic element pins is still horizontal, and the length of the part is consistent with the width of the edge of the accommodating groove.
According to the invention, the electronic element body is placed into the accommodating groove of the accommodating part, the driving end controls the driving mechanism to continuously press the substrate to the first position, the electronic element body pressing plate fixes the electronic element body in the accommodating groove, then the substrate is pressed, and the electronic element pin forming pressing plate presses the electronic element pin on the side surface of the accommodating groove.
As shown in fig. 1, in an electronic component pin forming apparatus with high production efficiency according to an embodiment of the present invention, an electronic component body pressing plate 22 includes a body fastening portion and a pin fastening portion, when a substrate 21 is at a first position, the body fastening portion fixes an electronic component body in a receiving groove, and the pin fastening portion fastens the electronic component pin portion on an edge of a notch of the receiving groove. Specifically, the body fastening portion and the pin fastening portion are rectangular, wherein a recess matched with the electronic element body is formed in the bottom surface of the body fastening portion, and the pin fastening portion and the body fastening portion are designed to be integrally formed.
As shown in fig. 1, in an electronic component pin forming apparatus with high production efficiency according to an embodiment of the present invention, the pressing portion 2 further includes a supporting plate 24, a first set of sliding bars 25, a second set of sliding bars 26, and an elastic member 27; the first group of sliding rods 25 is fixed on one side of the supporting plate 24; the base plate 21 is slidably connected to the first set of slide bars 25 and the second set of slide bars 26; the second set of sliding bars 26 connects the base plate 21 and the electronic component body pressing plate 22; the elastic member 27 is sleeved on the second set of sliding bars 26, and two ends of the elastic member respectively abut against the bottom surface of the substrate 21 and the top surface of the electronic component body pressing plate 22. Specifically, the first group of sliding rods 25 and the second group of sliding rods 26 are both crankshafts, a fixing block 240 protruding outward from the plates is arranged on the support plate 24, the upper ends of the first group of sliding rods 25 penetrate through the fixing block 240, a first group of through holes and a second group of through holes are formed in the base plate 21, the first group of sliding rods 25 penetrate through the group of through holes and are fixed through the fixing block 240, the second group of sliding rods 26 penetrate through the second group of through holes, the lower ends of the second group of sliding rods 26 are connected with the electronic element body pressing plate 22, the elastic part 27 is sleeved on the second group of sliding rods 26, and two ends of the elastic part 27 are respectively abutted against the bottom surface. When the substrate 21 is pressed down from the first position to the second position, the elastic member 27 is compressed to press and mold the leads of the electronic component, and after the molding is completed, the elastic member 27 is restored to push the substrate 21 back to the first position. Bearings are arranged between the through holes of the base plate 21 and the slide bars, and the base plate 21 can slide up and down on the first group of slide bars 25 and the second group of slide bars 26 through the bearings. Specifically, the elastic member is a spring.
As shown in fig. 1 and fig. 2, in an electronic component pin molding apparatus with high production efficiency according to an embodiment of the present invention, an electronic component pin molding pressing plate 23 is located on a side of an electronic component body pressing plate 22 close to a supporting plate 24.
As shown in fig. 1, in an electronic component pin forming apparatus with high production efficiency provided by an embodiment of the present invention, two sides of an accommodating portion 1 are provided with a limiting block 3 for limiting a pressing position of a pressing plate of an electronic component body, and the limiting block 3 is a U-shaped limiting block. The limiting blocks 3 are fixed on two sides of the accommodating part 1 through bolts, and when the driving mechanism presses down the substrate 21, the electronic component body pressing plate 22 can be inserted into the limiting grooves of the limiting blocks 3.
As shown in fig. 1 and fig. 2, in an electronic component pin forming apparatus with high production efficiency according to an embodiment of the present invention, a driving end 202 of a driving mechanism is connected to a substrate 21 through a connecting rod 201, the driving end 202 is hinged to the connecting rod 201, and the driving end 202 rotates from a first position to a second position to drive the connecting rod 201 to move downward. When the electronic element pin forming device with high production efficiency is in a non-use state, the driving end 202 of the driving mechanism and the connecting rod 201 form an angle of 80-90 degrees, when the electronic element pin is formed, the driving end 202 of the driving mechanism is pressed downwards, the driving end 202 drives the connecting rod 201 to move downwards, the substrate 21 connected with the connecting rod 201 moves downwards, and therefore the electronic element body pressing plate 22 and the electronic element pin forming pressing plate 23 connected with the substrate 21 are pushed to move downwards, and the forming operation of the electronic element pin is completed. In the embodiment, the driving mechanism adopts a quick clamping tool, and the tool has high flexibility and low cost.
As shown in fig. 1, in an embodiment of the present invention, a pin forming apparatus for electronic components with high production efficiency is provided, in which one side of a connecting rod 201 of a driving mechanism is fixed on a supporting plate 24. Electronic component pin forming device that production efficiency is high still is provided with base 4, portion of accommodating 1 and backup pad 3 are fixed on base 4, a plurality of vertical lightening holes 5 have evenly been seted up on base 4, reduce the weight of base 4 through lightening holes 5, thereby make forming device be convenient for remove, glue fixed mounting has rubber pad 6 is passed through to the bottom of base 4, protect base 4's bottom through rubber pad 6, provide certain shock attenuation effect for base 4 on the one hand, on the other hand has also avoided base 4 direct and ground contact, thereby in the course of the work, send huge noise owing to collide with ground.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and any simple modification, equivalent change and modification made to the above embodiment according to the technical spirit of the present invention are still within the scope of the technical solution of the present invention.
Claims (6)
1. The electronic component pin forming device is characterized by comprising an accommodating part, wherein the top of the accommodating part is provided with at least one accommodating groove for accommodating an electronic component body, a pressing plate of the electronic component body comprises a body fastening part and a pin fastening part, when the substrate is at a first position, the body fastening part fixes the electronic component body in the accommodating groove, and the pin fastening part fastens the pin part of the electronic component in a notch of the accommodating groove;
the pressing part comprises a driving mechanism, a substrate, an electronic element body pressing plate and an electronic element pin forming pressing plate, wherein the electronic element body pressing plate is elastically arranged at the bottom of the substrate, the electronic element pin forming pressing plate is arranged at the bottom of the substrate, and the pressing part further comprises a supporting plate, a first group of sliding rods, a second group of sliding rods and an elastic component; the first group of sliding rods are fixed on one side of the supporting plate; the base plate is connected to the first group of sliding rods and the second group of sliding rods in a sliding mode; the second group of sliding rods are connected with the substrate and the electronic element body pressing plate; the elastic component is sleeved on the second group of sliding rods, and two ends of the elastic component are respectively abutted against the bottom surface of the substrate and the top surface of the electronic element body pressing plate;
the connecting rod of the driving mechanism is connected with the substrate, the driving end of the driving mechanism controls the connecting rod to press the substrate downwards to a first position, the electronic element body pressing plate fixes the electronic element body in the accommodating groove, the driving end controls the driving mechanism to continue to press the substrate downwards to a second position, the substrate is close to the electronic element body pressing plate through elastic acting force, and the electronic element pin forming pressing plate presses the electronic element pins downwards on the side face of the accommodating groove.
2. The apparatus as claimed in claim 1, wherein the pressing plate is located on one side of the pressing plate.
3. The electronic component pin forming device with high production efficiency according to claim 1, wherein limiting blocks for limiting the pressing position of the electronic component body pressing plate are arranged on two sides of the accommodating portion, and the limiting blocks are U-shaped limiting blocks.
4. The apparatus of claim 1, wherein the driving end of the driving mechanism is hinged to the connecting rod, and the driving end rotates from a first position to a second position to move the connecting rod downward.
5. The pin forming apparatus for electronic components of claim 3, wherein the driving mechanism is fixed to the supporting plate on one side of the connecting rod.
6. The apparatus as claimed in claim 3, wherein the apparatus further comprises a base, the receiving portion and the supporting plate are fixed on the base, the base is uniformly formed with a plurality of vertical lightening holes 5, and a rubber pad is fixed on the bottom of the base by glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911278144.2A CN112935133A (en) | 2019-12-11 | 2019-12-11 | Electronic component pin forming device with high production efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911278144.2A CN112935133A (en) | 2019-12-11 | 2019-12-11 | Electronic component pin forming device with high production efficiency |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112935133A true CN112935133A (en) | 2021-06-11 |
Family
ID=76234366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911278144.2A Withdrawn CN112935133A (en) | 2019-12-11 | 2019-12-11 | Electronic component pin forming device with high production efficiency |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112935133A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116493510A (en) * | 2023-03-13 | 2023-07-28 | 江苏上达半导体有限公司 | Electronic component pin former |
-
2019
- 2019-12-11 CN CN201911278144.2A patent/CN112935133A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116493510A (en) * | 2023-03-13 | 2023-07-28 | 江苏上达半导体有限公司 | Electronic component pin former |
| CN116493510B (en) * | 2023-03-13 | 2023-09-29 | 江苏上达半导体有限公司 | Electronic component pin former |
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Legal Events
| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210611 |
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| WW01 | Invention patent application withdrawn after publication |