CN116493510B - Electronic component pin former - Google Patents
Electronic component pin former Download PDFInfo
- Publication number
- CN116493510B CN116493510B CN202310235880.XA CN202310235880A CN116493510B CN 116493510 B CN116493510 B CN 116493510B CN 202310235880 A CN202310235880 A CN 202310235880A CN 116493510 B CN116493510 B CN 116493510B
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- plate
- plates
- pressing die
- top pressing
- shaped connecting
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- 238000003825 pressing Methods 0.000 claims abstract description 89
- 230000007246 mechanism Effects 0.000 claims abstract description 66
- 238000005452 bending Methods 0.000 claims abstract description 25
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000013016 damping Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
- B21F1/004—Bending wire other than coiling; Straightening wire by means of press-type tooling
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention belongs to the technical field of electronic element processing, in particular to electronic element pin forming equipment, which enables bending equipment to simultaneously produce two different pin packages through a special structure of a top pressing die, and enables the number of the two pins to be adjustable through the combination of an adjusting mechanism and a limiting arc plate, so that the bending equipment can adapt to the actual production requirement.
Description
Technical Field
The invention belongs to the technical field of electronic element processing, and particularly relates to electronic element pin forming equipment.
Background
The electronic component is usually used for producing the circuit board after being packaged, the electronic component is divided into a shell package and a pin package, the pin package of the electronic component is usually selected into two packaging modes for adapting TO the structure of the circuit board, one is plug-in type, the other is paste-mounted type, for MOS (metal oxide semiconductor) tubes, the most common packaging mode is TO (metal oxide semiconductor) package, but the TO package is mostly plug-in type, the paste-mounted type package is also developed, in actual production, the MOS tubes with the same shell package are used for producing the paste-mounted type circuit board and the plug-in type circuit board, and the pin bending equipment of the traditional electronic component can only bend pins into one shape, and the pin package of the two MOS tubes can be completed only by configuring two bending equipment.
The invention mainly solves the problems that: how to use one device to package two pins and how to adapt to the actual production requirement, and according to the production quantity of two circuit boards, the MOS tubes with different numbers of two pins are bent.
Disclosure of Invention
Aiming at the situation, in order to overcome the defects of the prior art, the invention provides the electronic element pin forming equipment, the bending equipment can simultaneously produce two different pin packages through the special structure of the top pressing die, and the quantity of the two pins can be adjusted through the combination of the adjusting mechanism and the limiting arc plate, so that the bending equipment can adapt to the actual production requirement.
The invention provides electronic element pin forming equipment, which comprises a pressing mechanism, an adjusting mechanism, a bending mechanism and a supporting mechanism, and is characterized in that: the adjusting mechanism is arranged inside the pressing mechanism, the bending mechanism is arranged below the pressing mechanism, the supporting mechanisms are arranged on two sides below the bending mechanism, the pressing mechanism comprises a top pressing die and a pneumatic sliding rail, L-shaped connecting plates are arranged between two ends of the top pressing die and the pneumatic sliding rail, the top pressing die is connected with the pneumatic sliding rail through the L-shaped connecting plates, and a plurality of L-shaped connecting rods are arranged between the top pressing die and the bending mechanism.
Further, a sliding rod is arranged on one side of the top pressing die, the sliding rod is connected with the L-shaped connecting rod in a sliding mode, a transverse pressing plate is arranged on one section of the other side of the top pressing die, a vertical guide groove is arranged on the other section of the other side of the top pressing die, a transverse guide groove is arranged below the transverse pressing plate, and a plurality of sliding holes are formed in the upper portion of the top pressing die.
Further, adjustment mechanism includes slide and slide, be equipped with first guide arm on the slide, be equipped with the spring on the first guide arm between slide and top moulding-die, one side of slide is equipped with a plurality of interior locating holes, one side of slide is equipped with outer locating hole, the below of slide is equipped with the backing plate, be equipped with positioning bolt in the outer locating hole.
Further, the bending mechanism comprises an element frame and a lower lifting die, the element frame comprises a plurality of placing groove plates, and the placing groove plates are fixedly connected with the L-shaped connecting rods.
Further, the lower part lift mould includes a plurality of perpendicular clamp plate and a rotation lift board, perpendicular clamp plate sets up in the below of placing the frid, it sets up the below at perpendicular clamp plate to rotate the lift board, be equipped with the spacing arch of arc on the rotation lift board, the both sides that the arc is spacing protruding all are equipped with rotation branch, be connected between rotation branch and the supporting mechanism, it is equipped with short clamp plate to be located the spacing protruding one side of arc on the lift board to rotate, short clamp plate sets up the below at perpendicular clamp plate.
Further, the vertical pressing plate is tangent to the arc-shaped limiting protrusions, the number of the vertical pressing plates is the same as that of the element frames, limiting arc plates are arranged below the element frames on the vertical pressing plate, the limiting arc plates are fixedly connected with the L-shaped connecting rods, the upper surfaces of the limiting arc plates are planes, and the lower surfaces of the limiting arc plates are cambered surfaces.
Further, a plurality of total guide grooves are formed in the rotating lifting plate.
Further, the supporting mechanism comprises a bottom supporting plate and a rotating plate support, wherein the rotating plate support is arranged on the bottom supporting plate, and the rotating support rod is rotationally connected with the rotating plate support.
Further, the pneumatic slide rail is arranged on the bottom supporting plate and comprises a sliding table and a sliding block, and the sliding block is fixedly connected with the top pressing die through an L-shaped connecting plate.
Further, a plurality of MOS tubes are arranged on the element frame.
The invention provides electronic element pin forming equipment, which has the following beneficial effects:
(1) Two different pins are bent by a special top pressing die, and packaging of the two pins can be performed by using one device;
(2) The adjusting mechanism is combined with the limiting arc plate, so that the position of the top pressing die can be adjusted within a certain range, and two pins are bent according to the proportion;
(3) The guide grooves are arranged on the top pressing die and the bending mechanism, so that the left and right deflection of the pins can be prevented.
Drawings
Fig. 1 is an isometric view of an electronic component pin forming apparatus according to the present invention;
fig. 2 is an exploded view of an electronic component pin molding apparatus according to the present invention;
fig. 3 is a left side view of an electronic component pin forming apparatus according to the present invention;
fig. 4 is a right side view of an electronic component pin forming apparatus according to the present invention;
FIG. 5 is a schematic view of the rear structure of the hold-down mechanism;
FIG. 6 is a schematic view of a bending mechanism;
FIG. 7 is a schematic diagram of a top stamper structure;
FIG. 8 is a schematic view of an adjustment mechanism;
FIG. 9 is a schematic view of a limiting arc plate structure;
fig. 10 is a schematic view of a rotating lift plate structure.
1, a pressing mechanism; 2. an adjusting mechanism; 3. a bending mechanism; 4. a support mechanism; 5. a top stamper; 6. a pneumatic slide rail; 7. an L-shaped connecting plate; 8. an L-shaped connecting rod; 9. a slide bar; 10. a transverse pressing plate; 11. a vertical guide groove; 12. a transverse guide groove; 13. a slide hole; 14. a slideway; 15. a slide plate; 16. a first guide bar; 17. a spring; 18. an inner positioning hole; 19. an outer locating hole; 20. positioning bolts; 21. a component frame; 22. a lower lifting die; 23. placing a groove plate; 24. a vertical pressing plate; 25. rotating the lifting plate; 26. arc limit projection; 27. rotating the support rod; 28. a short pressing plate; 29. limiting arc plates; 30. a total guide groove; 31. a bottom support plate; 32. a rotating plate support; 33. a sliding table; 34. a slide block; 35. a MOS tube; 36. a backing plate.
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention.
Description of the embodiments
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention; all other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate orientation or positional relationships based on those shown in the drawings, merely to facilitate description of the invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
As shown in fig. 1, 2, 3 and 4, the present invention provides an electronic component pin forming apparatus, which includes a pressing mechanism 1, an adjusting mechanism 2, a bending mechanism 3 and a supporting mechanism 4, and is characterized in that: the adjusting mechanism 2 is arranged inside the pressing mechanism 1, the bending mechanism 3 is arranged below the pressing mechanism 1, the supporting mechanisms 4 are arranged on two sides below the bending mechanism 3, the pressing mechanism 1 comprises a top pressing die 5 and a pneumatic sliding rail 6, L-shaped connecting plates 7 are arranged between two ends of the top pressing die 5 and the pneumatic sliding rail 6, the top pressing die 5 is connected with the pneumatic sliding rail 6 through the L-shaped connecting plates 7, and a plurality of L-shaped connecting rods 8 are arranged between the top pressing die 5 and the bending mechanism 3.
As shown in fig. 4, 5 and 6, a sliding rod 9 is arranged on one side of the top pressing die 5, the sliding rod 9 is in sliding connection with an L-shaped connecting rod 8, a transverse pressing plate 10 is arranged on one section of the other side of the top pressing die 5, a vertical guide groove 11 is arranged on the other section of the other side of the top pressing die 5, a transverse guide groove 12 is arranged below the transverse pressing plate 10, a plurality of sliding holes 13 are formed above the top pressing die 5, the adjusting mechanism 2 comprises a sliding way 14 and a sliding plate 15, a first guide rod 16 is arranged on the sliding plate 15, a spring 17 is arranged between the sliding plate 15 and the top pressing die 5 on the first guide rod 16, a plurality of inner positioning holes 18 are formed on one side of the sliding plate 15, a base plate 36 is arranged below the sliding plate 15, an outer positioning hole 19 is formed on one side of the sliding way 14, and a positioning bolt 20 is arranged in the outer positioning hole 19.
As shown in fig. 1, fig. 5, fig. 6, fig. 7, fig. 8, the bending mechanism 3 comprises an element rack 21 and a lower lifting die 22, the element rack 21 comprises a plurality of placement groove plates 23, the placement groove plates 23 are fixedly connected with the L-shaped connecting rods 8, the lower lifting die 22 comprises a plurality of vertical pressing plates 24 and a rotation lifting plate 25, the vertical pressing plates 24 are arranged below the placement groove plates 23, the rotation lifting plate 25 is arranged below the vertical pressing plates 24, arc-shaped limit protrusions 26 are arranged on the rotation lifting plates 25, two sides of the arc-shaped limit protrusions 26 are respectively provided with a rotation supporting rod 27, the rotation supporting rods 27 are connected with the supporting mechanism 4, a certain damping is arranged between the rotation supporting rods 27 and the supporting mechanism 4, or a spring hinge is utilized to connect the rotation supporting rods 27 and the supporting mechanism 4, one side of the rotation lifting plate 25, which is positioned on the arc-shaped limit protrusions 26, the short pressing plates 28 are arranged below the vertical pressing plates 24, the base plates 36 can enable the placement groove plates 23 to move downwards more, the placement groove plates 23 are arranged on the sides, the two sides of the arc-shaped limit protrusions are respectively, the two different types of the two MOS tubes can move independently, and the two MOS tubes can be folded at different top portions, and the two different top portions can be folded by different shapes, and the different top portions can be realized.
As shown in fig. 1, fig. 5, fig. 6, fig. 9 and fig. 10, the vertical pressing plate 24 is tangent to the arc limiting protrusions 26, the number of the vertical pressing plates 24 is the same as that of the placing groove plates 23, limiting arc plates 29 are arranged below the component frames 21 on the vertical pressing plates 24, the limiting arc plates 29 are fixedly connected with the L-shaped connecting rods 8, the upper surfaces of the limiting arc plates 29 are planes, the lower surfaces of the limiting arc plates 29 are cambered surfaces, the limiting arc plates 29 can enable the placing groove plates 23 to move downwards, a plurality of total guide grooves 30 are formed in the rotating lifting plates 25, the supporting mechanism 4 comprises a bottom supporting plate 31 and rotating plate supports 32, the rotating plate supports 32 are arranged on the bottom supporting plate 31, the rotating supporting rods 27 are connected with the rotating plate supports 32 in a rotating mode, and the vertical pressing plates 24 can enable the rotating lifting plates 25 to rotate from a horizontal state to a vertical state when moving downwards along the arc limiting protrusions 26.
As shown in fig. 1, fig. 2, fig. 3 and fig. 4, the pneumatic slide rail 6 is disposed on the bottom support plate 31, the pneumatic slide rail 6 includes a sliding table 33 and a sliding block 34, the sliding block 34 is fixedly connected with the top pressing mold 5 through an L-shaped connecting plate 7, a plurality of MOS tubes 35 are disposed on the element rack 21, the MOS tubes 35 below the transverse pressing plate 10 should be mounted MOS tubes, the MOS tubes 35 below the vertical guide groove 11 should be mounted MOS tubes, and the pneumatic slide rail 6 mainly has two functions, namely, providing a pressing force, and supporting the L-shaped connecting rod 8 and the element rack 21 from moving left and right in an initial stage.
In specific use, the MOS tube 35 is placed on the element frame 21, the top pressing die 5 and the L-shaped connecting plate 7 are loosened, the positions of the sliding plate 15 and the top pressing die 5 are adjusted, the positions of the limiting arc plate 29 are adjusted by the same adjustment amount, the L-shaped connecting plate 7 and the top pressing die 5 are fixed, the air source is opened, the sliding block 34 moves downwards to drive the pressing mechanism 1 and the adjusting mechanism 2 to move downwards, the damping or spring hinge is arranged between the rotating lifting plate 25 and the supporting mechanism 4, the rotating lifting plate 25 provides support for the vertical pressing plate 24, the element frame 21 and the L-shaped connecting rod 8, after the bottom surface of the slideway 14 is contacted with the element frame 21, the vertical pressing plate 24 starts to move downwards, the rotating lifting plate 25 starts to rotate simultaneously, the bending mechanism 3 stops moving when the limiting arc plate 29 is contacted with the arc-shaped limiting protrusion 26, the placing groove plate 23 below the transverse pressing plate 10 is positioned at a higher position, the placing groove plate 23 below the vertical guide groove 11 is positioned at a lower position, the downward pressing mechanism 1 continues to move, the spring 17 is compressed, meanwhile, the rotating lifting plate 25 starts to turn upwards, pins of the MOS tube 35 are upwards bent in the process of turning upwards the rotating lifting plate 25, after the pins of the MOS tube 35 are bent to a certain extent, the pins of the MOS tube 35 below the transverse pressing plate 10 are blocked by the transverse pressing plate 10 of the top pressing mold 5 to form an inclined state, the pins of the MOS tube 35 below the vertical guide groove 11 continue to be bent under the combined action of the top pressing mold 5 and the rotating lifting plate 25, the length of the limiting arc plate 29 and the length of the element frame 21 occupied by the transverse pressing plate 10 are the same, the length of the backing plate 36 and the element frame 21 occupied by the vertical guide groove 11 are the same, after the limiting arc plate 29 contacts with the arc limiting protrusion 26, the placing groove plate 23 below the transverse pressing plate 10 cannot continue to move downwards due to the blocking of the limiting arc plate 29, the placing groove plate 23 below the vertical guide groove 11 is not limited by the limiting arc plate 29, and the backing plate 36 increases the downward displacement, so that the placing groove plate 23 below the vertical guide groove 11 can descend more, and meanwhile, the pins are bent by the rotating lifting plate 25 with more length, when the top pressing mold 5 contacts with the rotating lifting plate 25 in the vertical state after rotation, the top pressing mold 5 stops moving, at the moment, the pins of the MOS tube 35 below the transverse pressing plate 10 are bent into a Z shape, and the pins of the MOS tube 35 below the vertical guide groove 11 are bent into an L shape.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
The invention and its embodiments have been described above with no limitation, and the actual construction is not limited to the embodiments of the invention as shown in the drawings. In summary, if one of ordinary skill in the art is informed by this disclosure, a structural manner and an embodiment similar to the technical solution should not be creatively devised without departing from the gist of the present invention.
Claims (6)
1. The utility model provides an electronic component pin former, includes pushing down mechanism (1), adjustment mechanism (2), bending mechanism (3) and supporting mechanism (4), its characterized in that: the adjusting mechanism (2) is arranged inside the pressing mechanism (1), the bending mechanism (3) is arranged below the pressing mechanism (1), the supporting mechanism (4) is arranged on two sides below the bending mechanism (3), the pressing mechanism (1) comprises a top pressing die (5) and a pneumatic sliding rail (6), L-shaped connecting plates (7) are arranged between two ends of the top pressing die (5) and the pneumatic sliding rail (6), the top pressing die (5) is connected with the pneumatic sliding rail (6) through the L-shaped connecting plates (7), and a plurality of L-shaped connecting rods (8) are arranged between the top pressing die (5) and the bending mechanism (3);
a sliding rod (9) is arranged on one side of the top pressing die (5), the sliding rod (9) is in sliding connection with an L-shaped connecting rod (8), a transverse pressing plate (10) is arranged on one section of the other side of the top pressing die (5), a vertical guide groove (11) is arranged on the other section of the other side of the top pressing die (5), a transverse guide groove (12) is arranged below the transverse pressing plate (10), and a plurality of sliding holes (13) are formed above the top pressing die (5);
the adjusting mechanism (2) comprises a slide way (14) and a slide plate (15), a first guide rod (16) is arranged on the slide plate (15), a spring (17) is arranged between the slide plate (15) and the top pressing die (5) on the first guide rod (16), a plurality of inner positioning holes (18) are formed in one side of the slide plate (15), a base plate (36) is arranged below the slide plate (15), an outer positioning hole (19) is formed in one side of the slide way (14), and a positioning bolt (20) is arranged in the outer positioning hole (19);
the bending mechanism (3) comprises an element frame (21) and a lower lifting die (22), the element frame (21) comprises a plurality of placing groove plates (23), and the placing groove plates (23) are fixedly connected with the L-shaped connecting rod (8);
the lower part lift mould (22) includes a plurality of perpendicular clamp plate (24) and a rotation lift board (25), perpendicular clamp plate (24) set up in the below of placing grooved plate (23), rotate lift board (25) and set up in the below of perpendicular clamp plate (24), be equipped with arc spacing protruding (26) on rotating lift board (25), the both sides of arc spacing protruding (26) all are equipped with rotation branch (27), be connected between rotation branch (27) and supporting mechanism (4), be equipped with short clamp plate (28) on rotating lift board (25) and lie in one side of arc spacing protruding (26), short clamp plate (28) set up in the below of perpendicular clamp plate (24).
2. An electronic component pin forming apparatus according to claim 1, wherein: the vertical pressing plate (24) is tangent to the arc-shaped limiting protrusions (26), the number of the vertical pressing plates (24) is the same as that of the groove plates (23), limiting arc plates (29) are arranged below the element frames (21) on the vertical pressing plates (24), the limiting arc plates (29) are fixedly connected with the L-shaped connecting rods (8), the upper surfaces of the limiting arc plates (29) are planes, and the lower surfaces of the limiting arc plates (29) are cambered surfaces.
3. An electronic component pin forming apparatus according to claim 2, wherein: the rotating lifting plate (25) is provided with a plurality of total guide grooves (30).
4. An electronic component pin forming apparatus according to claim 3, wherein: the supporting mechanism (4) comprises a bottom supporting plate (31) and a rotating plate support (32), wherein the rotating plate support (32) is arranged on the bottom supporting plate (31), and the rotating support rod (27) is rotationally connected with the rotating plate support (32).
5. The electronic component pin forming apparatus according to claim 4, wherein: the pneumatic sliding rail (6) is arranged on the bottom supporting plate (31), the pneumatic sliding rail (6) comprises a sliding table (33) and a sliding block (34), and the sliding block (34) is fixedly connected with the top pressing die (5) through an L-shaped connecting plate (7).
6. An electronic component pin forming apparatus according to claim 5, wherein: and a plurality of MOS (metal oxide semiconductor) tubes (35) are arranged on the element frame (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310235880.XA CN116493510B (en) | 2023-03-13 | 2023-03-13 | Electronic component pin former |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310235880.XA CN116493510B (en) | 2023-03-13 | 2023-03-13 | Electronic component pin former |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116493510A CN116493510A (en) | 2023-07-28 |
| CN116493510B true CN116493510B (en) | 2023-09-29 |
Family
ID=87322050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310235880.XA Active CN116493510B (en) | 2023-03-13 | 2023-03-13 | Electronic component pin former |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116493510B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03296251A (en) * | 1990-04-13 | 1991-12-26 | Toowa Kk | Method and device for processing lead of electronic part |
| WO2016041265A1 (en) * | 2014-09-15 | 2016-03-24 | 苏松得 | Inverted type pin forming apparatus for electronic device |
| CN209697900U (en) * | 2019-03-22 | 2019-11-29 | 泉州柒望电子科技有限公司 | Device for bending pins is used in a kind of production of electronic product |
| CN211386676U (en) * | 2019-12-17 | 2020-09-01 | 上海金芒智能科技有限公司 | MOS pipe pin bending device |
| CN212857510U (en) * | 2020-07-03 | 2021-04-02 | 深圳市国王科技有限公司 | Device for bending mos tube pin |
| CN112935133A (en) * | 2019-12-11 | 2021-06-11 | 麻城市佳辉达电子科技有限公司 | Electronic component pin forming device with high production efficiency |
-
2023
- 2023-03-13 CN CN202310235880.XA patent/CN116493510B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03296251A (en) * | 1990-04-13 | 1991-12-26 | Toowa Kk | Method and device for processing lead of electronic part |
| WO2016041265A1 (en) * | 2014-09-15 | 2016-03-24 | 苏松得 | Inverted type pin forming apparatus for electronic device |
| CN209697900U (en) * | 2019-03-22 | 2019-11-29 | 泉州柒望电子科技有限公司 | Device for bending pins is used in a kind of production of electronic product |
| CN112935133A (en) * | 2019-12-11 | 2021-06-11 | 麻城市佳辉达电子科技有限公司 | Electronic component pin forming device with high production efficiency |
| CN211386676U (en) * | 2019-12-17 | 2020-09-01 | 上海金芒智能科技有限公司 | MOS pipe pin bending device |
| CN212857510U (en) * | 2020-07-03 | 2021-04-02 | 深圳市国王科技有限公司 | Device for bending mos tube pin |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116493510A (en) | 2023-07-28 |
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