CN212848315U - Sealing device for intelligent chip - Google Patents
Sealing device for intelligent chip Download PDFInfo
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- CN212848315U CN212848315U CN202021285824.5U CN202021285824U CN212848315U CN 212848315 U CN212848315 U CN 212848315U CN 202021285824 U CN202021285824 U CN 202021285824U CN 212848315 U CN212848315 U CN 212848315U
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- heating plate
- power button
- plate
- sealing device
- workbench
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Abstract
The utility model discloses a sealing device for an intelligent chip, which belongs to the technical field of chips and comprises a workbench, wherein two fixed plates and a lower heating plate are arranged above the workbench, the lower heating plate is positioned between the two fixed plates, a connecting plate is fixedly connected between the two fixed plates, an electric push rod is fixedly connected below the connecting plate through a bolt, an installation block is fixedly welded below the electric push rod, two telescopic rods are arranged inside the installation block, an upper heating plate is clamped between the two telescopic rods, connecting blocks are fixedly welded on both sides of the installation block, springs are arranged below the two connecting blocks, a first power button and a second power button are arranged on the front surface wall of the workbench, and the telescopic rods are arranged to facilitate clamping and fixing the upper heating plate, the fastness of hot plate in the increase, drops when preventing to go up the hot plate use, influences work efficiency.
Description
Technical Field
The utility model belongs to the technical field of the chip, concretely relates to involution device for intelligent chip.
Background
Chips, also known as microcircuits, microchips, integrated circuits. It refers to a silicon chip containing integrated circuit, which is very small in volume and is often a part of a computer or other electronic equipment, and the preparation of biochips mainly depends on microfabrication, automation and chemical synthesis techniques. According to different use requirements, various fine structures can be processed on a substrate material of the chip by adopting a micro-processing technology, and then necessary biochemical substances are applied and surface treatment is carried out. The simpler chip preparation, such as the preparation of DNA chips, is to directly apply or synthesize the necessary biochemical substances on the substrate by an automated or chemical synthesis method without any microfabrication of the substrate material.
The involution device of current intelligent chip goes up the hot plate and drops easily when carrying out the heat-seal to the chip, and fixed effect is not good, and goes up the hot plate and when pushing down on the hot plate, and buffering effect is not good, causes the damage of chip easily.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a involution device for intelligent chip to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a sealing device for an intelligent chip comprises a workbench, wherein two fixed plates and a lower heating plate are arranged above the workbench, the lower heating plate is positioned between the two fixed plates, a connecting plate is fixedly connected between the two fixed plates, an electric push rod is fixedly connected below the connecting plate through a bolt, an installation block is fixedly welded below the electric push rod, two telescopic rods are arranged inside the installation block, an upper heating plate is clamped between the two telescopic rods, connecting blocks are fixedly welded on both sides of the installation block, springs are arranged below the two connecting blocks, a first power button and a second power button are arranged on the front surface wall of the workbench, the second power button is positioned below the first power button, a supporting column is arranged below the workbench, and the electric push rod is electrically connected with the first power button, the lower heating plate and the upper heating plate are both electrically connected with the second power button.
By adopting the scheme, the telescopic rod is convenient for clamp-fixing the upper heating plate, the firmness of the upper heating plate is increased, the upper heating plate is prevented from dropping when in use, the working efficiency is influenced, the connecting block plays a role in installing the spring, the spring can reduce the impact force of the upper heating plate pressing down on the lower heating plate, the impact force is prevented from being large, and the damage to the chip is easily caused.
In a preferred embodiment, a skid-proof plate is welded and fixed on one side of the telescopic rod.
Adopt above-mentioned scheme, the hot plate is gone up in the more firm centre gripping of being convenient for, prevents to go up the hot plate and drops.
In a preferred embodiment, the bottom of the supporting column is provided with anti-skid lines.
Adopt above-mentioned scheme, be convenient for increase the friction between support column and the ground, prevent that the workstation from taking place to slide easily.
In a preferred embodiment, the lower heating plate and the upper heating plate are arranged perpendicular to each other.
By adopting the scheme, the upper heating plate is convenient to press down on the lower heating plate, and the chip is heat-sealed.
In a preferred embodiment, the spring and the connecting block are fixedly connected by a bolt.
By adopting the scheme, the spring can be conveniently detached and installed.
Compared with the prior art, the beneficial effects of the utility model are that:
this a sealing device for intelligent chip is through setting up the telescopic link, and the telescopic link is convenient for carry out the clamping to last hot plate fixed, increases the fastness of hot plate, drops when preventing to go up the hot plate and use, influences work efficiency.
This a involution device for intelligent chip is through setting up spring and connecting block, and the connecting block plays the effect of installation spring, and the spring can alleviate the hot plate and push down the impact force on hot plate down, prevents that the impact force is great, causes the damage of chip easily.
Drawings
Fig. 1 is a schematic view of the internal structure of the present invention;
FIG. 2 is an external view of the present invention;
fig. 3 is a bottom view of the present invention.
In the figure: 1. an electric push rod; 2. a connecting plate; 3. a fixing plate; 4. a telescopic rod; 5. a work table; 6. a support pillar; 7. a lower heating plate; 8. an upper heating plate; 9. a spring; 10. connecting blocks; 11. mounting blocks; 12. a first power button; 13. a second power button; 14. and (4) anti-skid lines.
Detailed Description
The present invention will be further described with reference to the following examples.
The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention. The condition in the embodiment can be further adjusted according to concrete condition the utility model discloses a it is right under the design prerequisite the utility model discloses a simple improvement of method all belongs to the utility model discloses the scope of claiming.
The utility model provides a sealing device for intelligent chip, please refer to fig. 1-3, which comprises a workbench 5, two fixed plates 3 and a lower heating plate 7 are arranged above the workbench 5, the lower heating plate 7 is positioned between the two fixed plates 3, a connecting plate 2 is fixedly connected between the two fixed plates 3, an electric push rod 1 is fixedly connected below the connecting plate 2 through bolts, a mounting block 11 is fixedly welded below the electric push rod 1, two telescopic rods 4 are arranged inside the mounting block 11, an upper heating plate 8 is clamped between the two telescopic rods 4, connecting blocks 10 are fixedly welded on both sides of the mounting block 11, springs 9 are arranged below the two connecting blocks 10, a first power button 12 and a second power button 13 are arranged on the front surface wall of the workbench 5, the second power button 13 is positioned below the first power button 12, a support column 6 is arranged below the workbench 5, the electric push rod 1 is electrically connected with the first power button 12, and the lower heating plate 7 and the upper heating plate 8 are electrically connected with the second power button 13.
An anti-skid plate (see figure 1) is welded and fixed on one side of the telescopic rod 4; heating plate 8 is gone up in more firm centre gripping of being convenient for, prevents to go up heating plate 8 and drops.
The bottom of the supporting column 6 is provided with anti-skid grains 14 (see fig. 3); the friction between the supporting column 6 and the ground is increased, and the workbench 5 is prevented from sliding easily.
The lower heating plate 7 and the upper heating plate 8 are arranged perpendicular to each other (see fig. 1 and 2); so that the upper heating plate 8 is pressed down on the lower heating plate 7 to heat seal the chip.
The spring 9 and the connecting block 10 are fixedly connected by a bolt (not shown); the disassembly and the assembly of the spring 9 are convenient.
When using, operating personnel can place the chip that needs the involution on hot plate 7 down, then start electric putter 1 through first power button 12, electric putter 1 drives hot plate 8 and pushes down under on hot plate 7, carry out the heat-seal to the chip, telescopic link 4 is convenient for carry out the clamping to last hot plate 8 and fixes, hot plate 8's fastness is gone up in the increase, drop when preventing to go up hot plate 8 and use, influence work efficiency, connecting block 10 plays the effect of installation spring 9, spring 9 can alleviate hot plate 8 and push down the impact force on hot plate 7 down, it is great to prevent the impact force, cause the damage of chip easily.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A sealing device for intelligent chip, includes workstation (5), its characterized in that: the upper portion of the workbench (5) is provided with two fixing plates (3) and a lower heating plate (7), the lower heating plate (7) is located between the two fixing plates (3), two connecting plates (2) are fixedly connected between the fixing plates (3), an electric push rod (1) is fixedly connected below the connecting plates (2) through bolts, an installation block (11) is fixedly welded below the electric push rod (1), two telescopic rods (4) are arranged inside the installation block (11), an upper heating plate (8) is clamped between the two telescopic rods (4), connecting blocks (10) are fixedly welded on two sides of the installation block (11), springs (9) are arranged below the two connecting blocks (10), a first power button (12) and a second power button (13) are arranged on the front surface wall of the workbench (5), second power button (13) are located the below of first power button (12), the below of workstation (5) is provided with support column (6), electric putter (1) and first power button (12) electric connection, hot plate (7) and last hot plate (8) all with second power button (13) electric connection down.
2. The sealing device for the smart chip as claimed in claim 1, wherein: and an anti-skid plate is welded and fixed on one side of the telescopic rod (4).
3. The sealing device for the smart chip as claimed in claim 1, wherein: the bottom of the support column (6) is provided with anti-skid grains (14).
4. The sealing device for the smart chip as claimed in claim 1, wherein: the lower heating plate (7) and the upper heating plate (8) are arranged vertically to each other.
5. The sealing device for the smart chip as claimed in claim 1, wherein: the spring (9) is fixedly connected with the connecting block (10) through a bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021285824.5U CN212848315U (en) | 2020-07-04 | 2020-07-04 | Sealing device for intelligent chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021285824.5U CN212848315U (en) | 2020-07-04 | 2020-07-04 | Sealing device for intelligent chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212848315U true CN212848315U (en) | 2021-03-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021285824.5U Active CN212848315U (en) | 2020-07-04 | 2020-07-04 | Sealing device for intelligent chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212848315U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114678296A (en) * | 2022-03-11 | 2022-06-28 | 智程半导体设备科技(昆山)有限公司 | Wafer heating device |
-
2020
- 2020-07-04 CN CN202021285824.5U patent/CN212848315U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114678296A (en) * | 2022-03-11 | 2022-06-28 | 智程半导体设备科技(昆山)有限公司 | Wafer heating device |
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