CN220409928U - A base plate laying device for copper base plate production - Google Patents
A base plate laying device for copper base plate production Download PDFInfo
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- CN220409928U CN220409928U CN202322055280.3U CN202322055280U CN220409928U CN 220409928 U CN220409928 U CN 220409928U CN 202322055280 U CN202322055280 U CN 202322055280U CN 220409928 U CN220409928 U CN 220409928U
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- laying
- plate
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- copper substrate
- clamping
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 56
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 54
- 239000010949 copper Substances 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 101
- 238000009434 installation Methods 0.000 claims abstract description 23
- 238000003825 pressing Methods 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 abstract description 30
- 239000002184 metal Substances 0.000 abstract description 30
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 10
- 230000000694 effects Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model discloses a substrate laying device for copper substrate production, which relates to the technical field of copper substrate production and comprises a copper substrate production and laying device main body, wherein the copper substrate production and laying device main body comprises a laying table, an alignment moving mechanism is arranged above the laying table, and a copper substrate clamping and laying mechanism is arranged below the alignment moving mechanism; the alignment moving mechanism comprises an installation limiting unit and a driving movement alignment unit, wherein the installation limiting unit is arranged on the upper surface of the laying table, and the driving movement alignment unit is arranged on the inner side of the installation limiting unit. According to the utility model, the motor drives the threaded rod to rotate, so that the hanging laying plate borne by the groined mounting bracket moves in parallel to be aligned with the fixed laying plate under the limit fit of the limit rod, the upper and lower metal plates of the copper substrate are conveniently laid and aligned, the time is not required to be further spent for adjustment, and the laying efficiency is improved.
Description
Technical Field
The utility model relates to the technical field of copper substrate production, in particular to a substrate laying device for copper substrate production.
Background
The copper substrate is the most expensive one of the metal substrates, has a heat conduction effect which is many times better than that of an aluminum substrate and an iron substrate, is suitable for heat dissipation and architectural decoration industries of high-frequency circuits, regions with large high-low temperature variation and precision communication equipment, and generally comprises a gold-plated copper substrate, a silver-plated copper substrate, a tin-plated copper substrate, an oxidation-resistant copper substrate and the like. The copper substrate circuit layer is required to have great current carrying capacity, the heat conducting insulating layer is the core technology of the copper substrate, the core heat conducting component is composed of aluminum oxide and silicon powder and polymer filled with epoxy resin, the heat resistance is small (0.15), the viscoelastic performance is excellent, and the heat aging resistant capacity is realized, so that the heat conducting insulating layer can bear mechanical and thermal stress. The copper substrate metal base layer is a supporting member of the copper substrate, and is required to have high heat conductivity, the metal base layer needs to be laid first and then refilled and laid last in the production process of the copper substrate, and the upper and lower metal base layers need to be aligned in the laying process, so that the utility model provides a substrate laying device for copper substrate production.
In the prior art, a Chinese patent document with publication number of CN218343019U and publication date of 2023, 01 and 20 is proposed to solve the above technical problems, and the technical scheme disclosed in the patent document is as follows: the utility model provides a base plate laying device for aluminium base plate production, is provided with the supporting bench including holding the seat, holds the surface of putting the seat, and the top of supporting bench is provided with placer, holds the back of putting the seat and is provided with auxiliary device, and auxiliary device includes backup pad, hydraulic telescoping rod, connecting plate, link, splint and wear-resisting rubber pad. According to the utility model, the auxiliary device is arranged, so that the hydraulic telescopic rod can be started when the aluminum substrate laying device is used, the hydraulic telescopic rod drives the clamping plate to move forwards, the clamping plate is continuously pushed until the clamping plate contacts with the back surfaces of the aluminum substrate, the prepreg and the copper foil and is pushed forwards, and the front surfaces of the aluminum substrate, the prepreg and the copper foil are attached to the inner front surface of the supporting frame, so that the aluminum substrate laying device can be pushed to be flush, the limiting and fixing effects of the aluminum substrate are good when the aluminum substrate laying device is used, the aluminum substrate can be guaranteed to be aligned when the aluminum substrate is laid, further time is not required to be spent for adjustment, and the effect is good when the aluminum substrate laying device is used.
In order to solve the problem that the prior substrate laying device has poor limiting and fixing effects on a substrate when in use, the prior art adopts a hydraulic telescopic rod to drive the clamping plate to move forwards, and the clamping plate is continuously pushed until the clamping plate is flush with the substrate to be processed, but the clamping of the clamping plate to the metal plate is stacked up and down, so that the problem that the lower-layer metal plate is inconvenient to fill a polymer heat-conducting insulating layer is caused.
Disclosure of Invention
The utility model aims to provide a substrate placement device for copper substrate production, which is used for solving the problems in the background technology.
In order to solve the technical problems, the utility model adopts the following technical scheme:
the substrate laying device for copper substrate production comprises a copper substrate production laying device main body, wherein the copper substrate production laying device main body comprises a laying table, an alignment moving mechanism is arranged above the laying table, and a copper substrate clamping and laying mechanism is arranged below the alignment moving mechanism; the alignment moving mechanism comprises an installation limiting unit and a driving movement alignment unit, wherein the installation limiting unit is arranged on the upper surface of the laying table, and the driving movement alignment unit is arranged on the inner side of the installation limiting unit; the copper substrate clamping and laying mechanism comprises an upper and lower laying plate unit and a clamping and fixing unit, wherein the upper and lower laying plate unit is arranged above the installation limiting unit, and the clamping and fixing unit is arranged on the inner side of the upper and lower laying plate unit.
The technical scheme of the utility model is further improved as follows: the installation limiting unit comprises a fixed installation frame fixedly installed on the upper surface of the laying table, and a limiting rod is fixedly installed between the inner surfaces of one sides of the fixed installation frame.
By adopting the technical scheme, the stop block is arranged at the middle part of the limiting rod, so that the suspended laying plate and the fixed laying plate are aligned more accurately.
The technical scheme of the utility model is further improved as follows: the driving movement alignment unit comprises a threaded rod rotatably arranged between the inner side walls of the fixed mounting frames, a motor is fixedly arranged on the outer side surface of one end of the fixed mounting frames, and an output shaft of the motor is fixedly connected with one end of the threaded rod.
By adopting the technical scheme, the motor drives the threaded rod to rotate, so that the hanging laying plate borne by the groined mounting bracket moves in parallel under the limit fit of the limit rod and is aligned with the fixed laying plate.
The technical scheme of the utility model is further improved as follows: the driving movement alignment unit further comprises a groined mounting bracket which is slidably mounted between the limiting rods, and the inner wall of the middle of the groined mounting bracket is in threaded connection with the outer surface of the threaded rod.
By adopting the technical scheme, the cross-shaped mounting bracket and the suspended laying plate are fixed through bolts and nuts, so that the cross-shaped mounting bracket is convenient to detach and mount.
The technical scheme of the utility model is further improved as follows: the upper and lower laying plate units comprise fixed laying plates fixedly arranged at one side of the bottom end of the inner surface of the fixed mounting frame, and the upper and lower laying plate units further comprise suspended laying plates fixedly arranged on the lower surface of the groined mounting frame through bolts and nuts.
By adopting the technical scheme, the suspended laying plate is arranged above the fixed laying plate and can be staggered in parallel under the cooperation of the groined-shaped mounting bracket, so that a polymer heat-conducting insulating layer is filled on a metal substrate laid on the fixed laying plate.
The technical scheme of the utility model is further improved as follows: the clamping and fixing unit comprises electric hydraulic telescopic rods I which are symmetrically and fixedly arranged on two sides of the fixed laying plate and the suspended laying plate respectively, a clamping plate is fixedly arranged at the output end of each electric hydraulic telescopic rod I, and an air cushion strip is fixedly arranged on the inner side surface of each clamping plate.
By adopting the technical scheme, the air cushion strips elastically squeeze to protect the metal substrate when the clamping plates are attached to the metal substrate.
The technical scheme of the utility model is further improved as follows: the clamping and fixing unit further comprises a second electric hydraulic telescopic rod fixedly installed in the middle of the suspended laying plate, a lower pressing plate is fixedly installed at the output end of the second electric hydraulic telescopic rod, and the side surface of the lower pressing plate is clamped with the side wall of the middle of the suspended laying plate.
By adopting the technical scheme, the electric hydraulic telescopic rod II stretches when the suspended laying plate is aligned with the fixed laying plate, so that the lower pressing plate compacts the upper metal substrate, the polymer heat-conducting insulating layer and the lower metal substrate, and the production quality is improved.
By adopting the technical scheme, compared with the prior art, the utility model has the following technical progress:
1. the utility model provides a substrate laying device for copper substrate production, which is characterized in that a fixed mounting frame plays a role in mounting a limiting rod, a threaded rod and a motor, the limiting rod plays a limiting role, the motor drives the threaded rod to rotate so that a hanging laying plate borne by a groined mounting bracket moves in parallel to be aligned with the fixed laying plate under the limiting fit of the limiting rod, the upper and lower metal plates of a copper substrate can be conveniently laid and aligned, the time is not required to be further spent for adjustment, and the laying efficiency is improved.
2. The utility model provides a substrate laying device for copper substrate production, which is characterized in that a cross-shaped mounting bracket and a suspended laying plate are fixed through bolts and nuts, so that the disassembly and the installation are convenient, the suspended laying plate is arranged above the fixed laying plate and can be staggered in parallel directions under the cooperation of the cross-shaped mounting bracket, so that a polymer heat conduction insulating layer is filled on a metal substrate laid on the fixed laying plate, and the substrate laying device is more convenient and has good effect in use.
3. The utility model provides a substrate laying device for copper substrate production, which is characterized in that a clamping plate is attached to a fixed laying plate by a first electric hydraulic telescopic rod, the surface of a suspended laying plate is clamped and fixed by the first electric hydraulic telescopic rod, the metal substrate is protected by elastic extrusion of an air cushion strip when the clamping plate is attached to the metal substrate, the upper metal substrate, a polymer heat-conducting insulating layer and the lower metal substrate are compacted by a lower pressing plate by the second electric hydraulic telescopic rod when the suspended laying plate is aligned with the fixed laying plate, and the production quality is improved.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic top view of the structure of the present utility model;
FIG. 3 is a schematic side view of the structure of the present utility model;
FIG. 4 is a schematic illustration of the alignment of a structurally fixed deposit plate with a suspended deposit plate of the present utility model;
FIG. 5 is a schematic view of a copper substrate clamping and laying mechanism of the present utility model.
In the figure: 1. a copper substrate production laying device main body; 11. a laying table; 2. an alignment movement mechanism; 21. a fixed mounting rack; 22. a limit rod; 23. a threaded rod; 24. a motor; 25. the groined mounting bracket; 3. the copper substrate clamping and laying mechanism; 31. fixing a laying plate; 32. suspending the laying plate; 33. an electro-hydraulic telescopic rod I; 331. a clamping plate; 332. an air cushion strip; 34. a lower pressing plate; 35. and an electric hydraulic telescopic rod II.
Detailed Description
The utility model is further illustrated by the following examples:
example 1
As shown in fig. 1-5, the utility model provides a substrate laying device for copper substrate production, which comprises a copper substrate production laying device main body 1, wherein the copper substrate production laying device main body 1 comprises a laying table 11, an alignment moving mechanism 2 is arranged above the laying table 11, and a copper substrate clamping laying mechanism 3 is arranged below the alignment moving mechanism 2; the alignment moving mechanism 2 comprises an installation limiting unit and a driving movement alignment unit, wherein the installation limiting unit is arranged on the upper surface of the laying table 11, and the driving movement alignment unit is arranged on the inner side of the installation limiting unit; the copper substrate clamping and laying mechanism 3 comprises an upper laying plate unit, a lower laying plate unit and a clamping and fixing unit, wherein the upper laying plate unit and the lower laying plate unit are arranged above an installation limiting unit, the clamping and fixing unit is arranged on the inner sides of the upper and lower laying plate units, the installation limiting unit comprises a fixed mounting frame 21 fixedly mounted on the upper surface of a laying table 11, a limiting rod 22 is fixedly mounted between one inner surface of the fixed mounting frame 21, a driving movement alignment unit comprises a threaded rod 23 rotatably mounted between the inner side walls of the fixed mounting frame 21, a motor 24 is fixedly mounted on one outer side surface of one end of the fixed mounting frame 21, an output shaft of the motor 24 is fixedly connected with one end of the threaded rod 23, the fixed mounting frame 21 plays a role of installing a limiting rod 22, the threaded rod 23 and the motor 24, the motor 24 drives the threaded rod 25 to rotate so that a hanging threaded rod mounting bracket 25 bears the laying plate 32 to be aligned with the fixed laying plate 31 under limiting fit of the limiting rod 22, and the upper and lower metal plates of the copper substrate are conveniently laid and aligned.
Example 2
As shown in fig. 1-5, on the basis of embodiment 1, the present utility model provides a technical solution: preferably, the driving movement alignment unit further comprises a groined mounting bracket 25 slidably mounted between the limiting rods 22, the inner wall of the middle of the groined mounting bracket 25 is in threaded connection with the outer surface of the threaded rod 23, the upper and lower laying plate units comprise fixed laying plates 31 fixedly mounted on one side of the bottom end of the inner surface of the fixed mounting frame 21, the upper and lower laying plate units further comprise suspended laying plates 32 fixedly mounted on the lower surface of the groined mounting bracket 25 through bolts and nuts, the groined mounting bracket 25 and the suspended laying plates 32 are fixed through bolts and nuts so as to be convenient to detach and mount, the suspended laying plates 32 are arranged above the fixed laying plates 31 and can be staggered in parallel directions under the cooperation of the groined mounting bracket 25, and a metal substrate laid on the fixed laying plates 31 is convenient to be filled with a polymer heat conducting insulating layer.
Example 3
As shown in fig. 1-5, on the basis of embodiment 1, the present utility model provides a technical solution: preferably, the clamping and fixing unit comprises an electric hydraulic telescopic rod I33 which is symmetrically and fixedly arranged on two sides of the fixed laying plate 31 and the suspended laying plate 32 respectively, a clamping plate 331 is fixedly arranged at the output end of the electric hydraulic telescopic rod I33, an air cushion strip 332 is fixedly arranged on the inner side surface of the clamping plate 331, a lower pressing plate 34 is fixedly arranged at the output end of the electric hydraulic telescopic rod II 35, the side surface of the lower pressing plate 34 is clamped with the side wall of the middle part of the suspended laying plate 32, the electric hydraulic telescopic rod I33 stretches to enable the clamping plate 331 to be attached to the fixed laying plate 31 and the surface of the suspended laying plate 32 to clamp and fix a metal substrate, the air cushion strip 332 is elastically extruded to protect the metal substrate when the clamping plate 331 is attached to the metal substrate, and the electric hydraulic telescopic rod II 35 stretches to enable the lower pressing plate 34 to compact the upper metal substrate, the polymer heat conducting insulating layer and the lower metal substrate when the suspended laying plate 32 is aligned with the fixed laying plate 31.
The working principle of the substrate placement device for copper substrate production is described below.
As shown in fig. 1-5, firstly, upper and lower metal substrates of a copper substrate are respectively laid below a suspended laying plate 32 and above a fixed laying plate 31, a polymer heat conduction insulating layer is filled above the lower metal substrate, an electro-hydraulic telescopic rod 33 is started to shrink to enable a clamping plate 331 to be attached to the fixed laying plate 31 and the surface of the suspended laying plate 32 to clamp and fix the metal substrates, then a motor 24 is started to drive a threaded rod 23 to rotate to enable a groined mounting bracket 25 to bear the suspended laying plate 32 to move in parallel and align with the fixed laying plate 31 under the limit fit of a limit rod 22, and finally, the electro-hydraulic telescopic rod 33 and the electro-hydraulic telescopic rod 35 are started to stretch and push a lower pressing plate 34 to compact the upper metal substrate, the polymer heat conduction insulating layer and the lower metal substrate, and the laying is completed.
The foregoing utility model has been generally described in great detail, but it will be apparent to those skilled in the art that modifications and improvements can be made thereto. Accordingly, it is intended to cover modifications or improvements within the spirit of the inventive concepts.
Claims (7)
1. The utility model provides a base plate laying device for copper base plate production, is applicable to the laying of upper and lower base plate in the copper base plate production process, includes copper base plate production laying device main part (1), copper base plate production laying device main part (1) is including laying platform (11), its characterized in that: an alignment moving mechanism (2) is arranged above the laying table (11), and a copper substrate clamping and laying mechanism (3) is arranged below the alignment moving mechanism (2);
the alignment moving mechanism (2) comprises an installation limiting unit and a driving movement alignment unit, wherein the installation limiting unit is arranged on the upper surface of the laying table (11), and the driving movement alignment unit is arranged on the inner side of the installation limiting unit;
the copper substrate clamping and laying mechanism (3) comprises an upper laying plate unit, a lower laying plate unit and a clamping and fixing unit, wherein the upper laying plate unit and the lower laying plate unit are arranged above the installation limiting unit, and the clamping and fixing unit is arranged on the inner sides of the upper laying plate unit and the lower laying plate unit.
2. A substrate placement apparatus for copper substrate production according to claim 1, wherein: the installation limiting unit comprises a fixed installation frame (21) fixedly installed on the upper surface of the laying table (11), and a limiting rod (22) is fixedly installed between the inner surfaces of one sides of the fixed installation frame (21).
3. A substrate placement apparatus for copper substrate production according to claim 1, wherein: the driving movement alignment unit comprises a threaded rod (23) rotatably arranged between the inner side walls of the fixed mounting frame (21), a motor (24) is fixedly arranged on the outer side surface of one end of the fixed mounting frame (21), and an output shaft of the motor (24) is fixedly connected with one end of the threaded rod (23).
4. A substrate placement apparatus for copper substrate production according to claim 1, wherein: the driving movement alignment unit further comprises a groined mounting bracket (25) which is slidably mounted between the limiting rods (22), and the inner wall of the middle of the groined mounting bracket (25) is in threaded connection with the outer surface of the threaded rod (23).
5. A substrate placement apparatus for copper substrate production according to claim 1, wherein: the upper and lower laying plate units comprise fixed laying plates (31) fixedly arranged at one side of the bottom end of the inner surface of the fixed mounting frame (21), and the upper and lower laying plate units further comprise suspended laying plates (32) fixedly arranged on the lower surface of the groined mounting bracket (25) through bolts and nuts.
6. A substrate placement apparatus for copper substrate production according to claim 1, wherein: the clamping and fixing unit comprises first electric hydraulic telescopic rods (33) which are symmetrically and fixedly arranged on two sides of a fixed laying plate (31) and a suspended laying plate (32), a clamping plate (331) is fixedly arranged at the output end of the first electric hydraulic telescopic rods (33), and an air cushion strip (332) is fixedly arranged on the inner side surface of the clamping plate (331).
7. A substrate placement apparatus for copper substrate production according to claim 1, wherein: the clamping and fixing unit further comprises a second electric hydraulic telescopic rod (35) fixedly installed in the middle of the suspended laying plate (32), a lower pressing plate (34) is fixedly installed at the output end of the second electric hydraulic telescopic rod (35), and the side surface of the lower pressing plate (34) is clamped with the side wall of the middle of the suspended laying plate (32).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322055280.3U CN220409928U (en) | 2023-08-02 | 2023-08-02 | A base plate laying device for copper base plate production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322055280.3U CN220409928U (en) | 2023-08-02 | 2023-08-02 | A base plate laying device for copper base plate production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220409928U true CN220409928U (en) | 2024-01-30 |
Family
ID=89648910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322055280.3U Active CN220409928U (en) | 2023-08-02 | 2023-08-02 | A base plate laying device for copper base plate production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220409928U (en) |
-
2023
- 2023-08-02 CN CN202322055280.3U patent/CN220409928U/en active Active
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