CN102522340A - Method for installing cooling fin of high-power module - Google Patents
Method for installing cooling fin of high-power module Download PDFInfo
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- CN102522340A CN102522340A CN2011104319987A CN201110431998A CN102522340A CN 102522340 A CN102522340 A CN 102522340A CN 2011104319987 A CN2011104319987 A CN 2011104319987A CN 201110431998 A CN201110431998 A CN 201110431998A CN 102522340 A CN102522340 A CN 102522340A
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- fin
- lead frame
- localization tool
- dao
- glue
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Abstract
The invention provides a method for installing a cooling fin of a high-power module. An island of a lead frame is adhered to a cooling fin according to the following steps: enabling a positioning jig to be connected with vacuum; placing the cooling fin in a groove of the positioning jig, and utilizing vacuum to adsorb the cooling fin; arranging high heat-conduction insulating cement on the cooling fin; placing the lead frame where a chip is installed above the positioning jig, and using a positioning hole arranged on the lead frame and a positioning pin arranged on the positioning jig to perform positioning; enabling the back surface of the frame island to coincide with a mucilage glue surface of the cooling fin; and jointly baking the lead frame and the positioning jig, and fully solidifying the high heat-conduction insulating cement which enables the cooling fin to be adhered to the frame island. The method has the advantages of being high in reliability, low in cost, good in heat dissipation effect, little in pollution and the like.
Description
Technical field
The present invention relates to the encapsulation technology of high power module, relate in particular to the module package technology that adopts fin.
Background technology
Often there is the inadequate problem of thermal diffusivity in the power semiconductor of full encapsulation, in semi-conductive use, requires to have good heat dissipation characteristics, and takes into account insulation property simultaneously.
The trend of semiconductor packages is miniaturization, modularization.Particularly high-power package module requires control integrated circuit and power IGBT (Insulated Gate Bipolar Transistor, insulated gate bipolar transistor) device package are had higher requirement to heat dissipation characteristics, insulation characterisitic together.
Though integrated circuit and other electronic equipments have experienced the demand of high speed, high power capacity, high integration already, are applicable to that now the power device of automobile, industrial equipment, household electrical appliances also is faced with similar requirement, as: minification, reduction weight, reduce cost.The mode that solves these demands just is to use module package.This module package comprises one or more power circuit chips and control circuit chip, but the heat that the power circuit chip produces will be considerably beyond the heat of control circuit chip generation.Therefore, guarantee just necessary its radiating effect that effectively guarantees of high reliability of this module package.
Summary of the invention
The present invention aims to provide the installation method of fin in a kind of high power module encapsulation process, can realize the automated production of low cost, high reliability.Wherein, fin can be that ceramic heat-dissipating sheet, DBC cover copper ceramic wafer, aluminium nitride etc.
The easy fin installation method of a kind of technology that the present invention proposes is the part in the module package technology, comprises the steps:
Step 100, at first, the heat block of preparing lead frame that Ji Dao is welded with chip and localization tool and matching with localization tool, said lead frame is the lead frame of routine, comprises location hole, Ji Dao; Said localization tool comprises the pilot pin that cooperates with the lead frame location hole, the groove that is used to place fin; The groove lower plane is provided with and is used for the pipeline or the cavity that are connected with vacuum, and the degree of depth of groove is that the thickness of fin and the Ji Dao of lead frame beat recessed degree of depth sum.Then, carry out according to following steps:
Step 200, Ji Dao and the fin with lead frame bonds as follows:
201, localization tool is connected with vacuum;
202, fin is placed in the groove of localization tool, uses vacuum that it is adsorbed;
203, high heat conductive insulating glue is put on fin;
204, will be positioned on the localization tool according to the lead frame that chip is housed that step 100 obtains, location hole on the use lead frame and the pilot pin on the localization tool position;
205, the framework Ji Dao back side is overlapped with the mucilage glue surface of fin;
206, lead frame and localization tool together are positioned over to fill in nitrogen baking oven or the infrared track toast, make the high heat conductive insulating glue of fin and framework Ji Dao bonding fully solidify.
Above-mentioned steps 205 with the framework Ji Dao back side with also comprise following two steps after the mucilage glue surface of fin overlaps:
Step 2051, localization tool are positioned on the heat block it are heated;
Step 2052, apply certain pressure and leave standstill precuring in front, framework base island.
It is further, said that applied pressure is 0.5-1.0kg/cm in front, framework base island
2, leave standstill and carried out precuring in 3-5 minute.
In above-mentioned steps 203 high heat conductive insulating glue is put after on the fin and also to be comprised:
Step 2031, the fin of having put glue is taken, carried out image analysing computer simultaneously and handle, the position and the quantity of inspection glue point, the quality of guarantee point glue.
Beneficial effect of the present invention is:
(1) method for packing of the present invention's proposition need not adopt Reflow Soldering; Still can carry out good management and control to the position of chip load and the cavity of chip below simultaneously; Simplified production technology; General sealed in unit can satisfy the production demand, can not use cleaning fluid that it is cleaned in the production process simultaneously, and is free from environmental pollution.
(2) the fin installation method of the module package of the present invention's proposition has fully guaranteed the status requirement of fin in the product encapsulation, is suitable for the batch process of product; Installation method also helps quality, the reliability that improves product simultaneously.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is further specified.
Fig. 1 is the installation method flow chart in the one embodiment of the invention;
Fig. 2 a-2f is a fin installation process sketch map, wherein:
Fig. 2 a is the localization tool sketch map;
Fig. 2 b is that fin is put into localization tool and put the sketch map of glue;
Fig. 2 c is the sketch map that lead frame is put into the localization tool process;
Fig. 2 d is the sketch map after lead frame is put into localization tool;
Fig. 2 e is that localization tool is put into the sketch map on the heat block;
Fig. 2 f is the sketch map that localization tool is positioned over afterburning precuring on the heat block;
Fig. 3 is the final structure sketch map of the embodiment of the invention;
Description of reference numerals: 1-localization tool; The 2-pilot pin; The 3-cavity; The 4-fin; 5-high heat conductive insulating glue, 6-lead frame, 7-location hole; The 8-heat block; The 9-chip; The 10-scolder; 11-Ji Dao.
Embodiment
Below in conjunction with specific embodiment and accompanying drawing the present invention is described further, but should limit protection scope of the present invention with this.
Present embodiment is installed the structure behind the fin; As shown in Figure 3; Comprise: lead frame 6, fin 4, the high heat conductive insulating glue 5 of chip are housed, and the one side of said fin 4 is bonded in the another side on the lead frame 6 basic islands 11 that chip 9 is housed through high heat conductive insulating glue 5.Chip 9 is bonded on the basic island 11 through scolder 10.
Described Ji Dao is the part that the lead frame 6 of chip is housed, and Ji Dao is shaped by die stamping and forms.
The flange-cooled module package fin of present embodiment installation method at first, needs to prepare a lead frame 6 and the localization tool 1 that chip is housed.On the frame of the said lead frame 6 that chip is housed location hole 7 is arranged, said localization tool 1 comprises pilot pin 2, is used to place the groove of fin, has pipeline or cavity 3 to can be used for connecting vacuum below the groove.Localization tool is at the regular through hole of arranging of other position cloth that removes the location fin.Then, carry out according to following steps:
Step 100, obtain being equipped with the lead frame 6 of chip according to known load technology;
Step 200, shown in Fig. 1 and Fig. 2 a-2f, the Ji Dao and the fin 4 of lead frame 6 bondd, comprise following eight sub-steps:
201, the cavity 3 with localization tool 1 is connected with vacuum (representing vacuum with VAC among the figure);
202, fin 4 is positioned in the groove of localization tool 1, uses vacuum that it is adsorbed;
203, with 5 in high heat conductive insulating glue on fin 4;
204, with ccd video camera the fin of having put glue is taken, carried out image analysing computer simultaneously and handle, the position and the quantity of inspection glue point, the quality of guarantee point glue;
The lead frame 6 that 205, chip will be housed is positioned on the localization tool 1, uses the location hole 7 on the lead frame 6 to position with pilot pin 2 on the localization tool 1;
The Ji Dao back side of 206, the lead frame 6 of chip being housed overlaps with the mucilage glue surface of fin 4, and the framework 6 that guarantees to be equipped with chip meets the requirements with the bonding position of fin 4; Simultaneously localization tool 1 is positioned on the heat block it is heated (shown in Fig. 2 c-2e), be heated to the needed technological temperature of high heat conductive insulating glue;
207, apply 0.5-1.0kg/cm in the front, basic island of the lead frame that chip is housed 6
2Pressure F, leave standstill and carried out precuring in 3-5 minute, but be not limited only to these specific scopes;
The lead frame 6 that 208, chip will be housed together is positioned over to fill in the nitrogen baking oven or in the infrared track with localization tool 1 and toasts, and makes the fin 4 and the high heat conductive insulating glue 5 of the Ji Dao bonding of the lead frame 6 that chip is housed fully solidify.
Though the present invention with preferred embodiment openly as above; But it is not to be used for limiting the present invention; Any those skilled in the art are not breaking away from the spirit and scope of the present invention; Can make possible change and modification, so protection scope of the present invention should be as the criterion with the scope that claim of the present invention was defined.
Claims (4)
1. the fin installation method of a high power module is characterized in that comprising the steps:
Step 100, at first, the heat block of preparing lead frame and localization tool and matching with localization tool, said lead frame comprises location hole, Ji Dao; The last chip that is welded with of Ji Dao; Said localization tool comprises the pilot pin that cooperates with the lead frame location hole, the groove that is used to place fin, and the groove lower plane is provided with and is used for the cavity or the pipeline that are connected with vacuum, and the degree of depth of groove is that the thickness of fin and the Ji Dao of lead frame beat recessed degree of depth sum; Then, execution in step 200;
Step 200, Ji Dao and the fin with lead frame bonds as follows:
201, localization tool is connected with vacuum;
202, fin is placed in the groove of localization tool, uses vacuum that it is adsorbed;
203, high heat conductive insulating glue is put on fin;
The lead frame that 204, chip will be housed is positioned on the localization tool, uses location hole and the pilot pin on the localization tool on the lead frame to position;
205, the framework Ji Dao back side is overlapped with the mucilage glue surface of fin;
206, lead frame and localization tool are together toasted, make the high heat conductive insulating glue of fin and framework Ji Dao bonding fully solidify.
2. fin installation method as claimed in claim 1, it is characterized in that step 205 with the framework Ji Dao back side with also comprise following two steps after the mucilage glue surface of fin overlaps:
Step 2051, localization tool are positioned on the heat block it are heated;
Step 2052, apply certain pressure and leave standstill precuring in front, framework base island.
3. fin installation method as claimed in claim 2 is characterized in that: said applied pressure is 0.5-1.0kg/cm in front, framework base island
2, leave standstill and carried out precuring in 3-5 minute.
4. like claim 1 or 2 or 3 described fin installation methods, it is characterized in that high heat conductive insulating glue point also being comprised after on the fin in step 203:
Step 2031, the fin of having put glue is taken, carried out image analysing computer simultaneously and handle, the position and the quantity of inspection glue point, the quality of guarantee point glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104319987A CN102522340A (en) | 2011-12-21 | 2011-12-21 | Method for installing cooling fin of high-power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104319987A CN102522340A (en) | 2011-12-21 | 2011-12-21 | Method for installing cooling fin of high-power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102522340A true CN102522340A (en) | 2012-06-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104319987A Pending CN102522340A (en) | 2011-12-21 | 2011-12-21 | Method for installing cooling fin of high-power module |
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| Country | Link |
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| CN (1) | CN102522340A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103915403A (en) * | 2014-03-27 | 2014-07-09 | 珠海格力电器股份有限公司 | Dual in-line package frame |
| CN104879357A (en) * | 2014-10-17 | 2015-09-02 | 苏州富强科技有限公司 | Assembly method |
| CN108695177A (en) * | 2017-03-29 | 2018-10-23 | 丰田自动车株式会社 | Semiconductor device and its manufacturing method |
| CN112090687A (en) * | 2020-09-10 | 2020-12-18 | 北京智创芯源科技有限公司 | Flip interconnection chip filling device and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH10125826A (en) * | 1996-10-24 | 1998-05-15 | Hitachi Ltd | Semiconductor device and manufacture thereof |
| JP2000216172A (en) * | 1999-01-26 | 2000-08-04 | Matsushita Electronics Industry Corp | Manufacturing apparatus of semiconductor device |
| JP2002270736A (en) * | 2001-03-14 | 2002-09-20 | Mitsubishi Electric Corp | Semiconductor device |
| CN1606804A (en) * | 2001-10-22 | 2005-04-13 | 费查尔德半导体有限公司 | Thin thermally enhanced flip chip in a leaded molded package |
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2011
- 2011-12-21 CN CN2011104319987A patent/CN102522340A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10125826A (en) * | 1996-10-24 | 1998-05-15 | Hitachi Ltd | Semiconductor device and manufacture thereof |
| JP2000216172A (en) * | 1999-01-26 | 2000-08-04 | Matsushita Electronics Industry Corp | Manufacturing apparatus of semiconductor device |
| JP2002270736A (en) * | 2001-03-14 | 2002-09-20 | Mitsubishi Electric Corp | Semiconductor device |
| CN1606804A (en) * | 2001-10-22 | 2005-04-13 | 费查尔德半导体有限公司 | Thin thermally enhanced flip chip in a leaded molded package |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103915403A (en) * | 2014-03-27 | 2014-07-09 | 珠海格力电器股份有限公司 | Dual in-line package frame |
| CN104879357A (en) * | 2014-10-17 | 2015-09-02 | 苏州富强科技有限公司 | Assembly method |
| CN108695177A (en) * | 2017-03-29 | 2018-10-23 | 丰田自动车株式会社 | Semiconductor device and its manufacturing method |
| CN108695177B (en) * | 2017-03-29 | 2021-11-02 | 株式会社电装 | Semiconductor device and method for manufacturing the same |
| CN112090687A (en) * | 2020-09-10 | 2020-12-18 | 北京智创芯源科技有限公司 | Flip interconnection chip filling device and method |
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Application publication date: 20120627 |