KR102137550B1 - 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치 - Google Patents

반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치 Download PDF

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Publication number
KR102137550B1
KR102137550B1 KR1020170170794A KR20170170794A KR102137550B1 KR 102137550 B1 KR102137550 B1 KR 102137550B1 KR 1020170170794 A KR1020170170794 A KR 1020170170794A KR 20170170794 A KR20170170794 A KR 20170170794A KR 102137550 B1 KR102137550 B1 KR 102137550B1
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KR
South Korea
Prior art keywords
epoxy resin
resin composition
semiconductor device
particle diameter
average particle
Prior art date
Application number
KR1020170170794A
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English (en)
Korean (ko)
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KR20190070200A (ko
Inventor
배경철
박용엽
김정화
윤지아
김상균
이동환
Original Assignee
삼성에스디아이 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성에스디아이 주식회사 filed Critical 삼성에스디아이 주식회사
Priority to KR1020170170794A priority Critical patent/KR102137550B1/ko
Priority to CN201880080648.0A priority patent/CN111492009A/zh
Priority to PCT/KR2018/012723 priority patent/WO2019117452A1/ko
Priority to TW107144606A priority patent/TWI782155B/zh
Publication of KR20190070200A publication Critical patent/KR20190070200A/ko
Application granted granted Critical
Publication of KR102137550B1 publication Critical patent/KR102137550B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
KR1020170170794A 2017-12-12 2017-12-12 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치 KR102137550B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020170170794A KR102137550B1 (ko) 2017-12-12 2017-12-12 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치
CN201880080648.0A CN111492009A (zh) 2017-12-12 2018-10-25 用于包封半导体装置的环氧树脂组成物及使用其包封的半导体装置
PCT/KR2018/012723 WO2019117452A1 (ko) 2017-12-12 2018-10-25 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치
TW107144606A TWI782155B (zh) 2017-12-12 2018-12-11 用於包封半導體裝置的環氧樹脂組成物及使用其包封的半導體裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170170794A KR102137550B1 (ko) 2017-12-12 2017-12-12 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치

Publications (2)

Publication Number Publication Date
KR20190070200A KR20190070200A (ko) 2019-06-20
KR102137550B1 true KR102137550B1 (ko) 2020-07-24

Family

ID=66819378

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170170794A KR102137550B1 (ko) 2017-12-12 2017-12-12 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치

Country Status (4)

Country Link
KR (1) KR102137550B1 (zh)
CN (1) CN111492009A (zh)
TW (1) TWI782155B (zh)
WO (1) WO2019117452A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102544119B1 (ko) * 2023-01-12 2023-06-14 동우 화인켐 주식회사 전자 디바이스 밀봉용 수지 조성물 및 이를 사용하여 제조된 전자 디바이스

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2867056B2 (ja) * 1990-02-22 1999-03-08 株式会社巴川製紙所 半導体パッケージ用接着テープ
JP2012077098A (ja) * 2010-09-10 2012-04-19 Shin-Etsu Chemical Co Ltd オーバーコート材及びそれを用いた半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005223222A (ja) * 2004-02-06 2005-08-18 Toyoda Gosei Co Ltd 固体素子パッケージ
TWI442595B (zh) * 2007-07-25 2014-06-21 Everlight Electronics Co Ltd 發光二極體裝置
FI124314B (en) * 2012-09-28 2014-06-30 Carbodeon Ltd Oy Thermoplastic thermal composites containing nano-diamonds
TWI673319B (zh) * 2014-07-02 2019-10-01 迪愛生股份有限公司 電子材料用環氧樹脂組成物、其硬化物及電子構件
KR101854501B1 (ko) * 2015-04-29 2018-05-04 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2867056B2 (ja) * 1990-02-22 1999-03-08 株式会社巴川製紙所 半導体パッケージ用接着テープ
JP2012077098A (ja) * 2010-09-10 2012-04-19 Shin-Etsu Chemical Co Ltd オーバーコート材及びそれを用いた半導体装置

Also Published As

Publication number Publication date
CN111492009A (zh) 2020-08-04
TWI782155B (zh) 2022-11-01
WO2019117452A1 (ko) 2019-06-20
TW201927898A (zh) 2019-07-16
KR20190070200A (ko) 2019-06-20

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