KR102132846B1 - 표면을 레이저 가공하기 위한 가공 장치 및 방법 - Google Patents

표면을 레이저 가공하기 위한 가공 장치 및 방법 Download PDF

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KR102132846B1
KR102132846B1 KR1020167021946A KR20167021946A KR102132846B1 KR 102132846 B1 KR102132846 B1 KR 102132846B1 KR 1020167021946 A KR1020167021946 A KR 1020167021946A KR 20167021946 A KR20167021946 A KR 20167021946A KR 102132846 B1 KR102132846 B1 KR 102132846B1
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South Korea
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unit
optical axis
partial beams
laser
module
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KR20160107298A (ko
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슈테판 아이펠
라쎄 뷔싱
알렉산더 가테
마틴 트라웁
아놀드 길네르
옌스 홀트캄프
요아힘 라일
파트리크 그레츠키
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프라운호퍼 게젤샤프트 쭈르 푀르데룽 데어 안겐반텐 포르슝 에. 베.
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/1086—Beam splitting or combining systems operating by diffraction only
    • G02B27/1093—Beam splitting or combining systems operating by diffraction only for use with monochromatic radiation only, e.g. devices for splitting a single laser source
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
KR1020167021946A 2014-01-15 2015-01-13 표면을 레이저 가공하기 위한 가공 장치 및 방법 Active KR102132846B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014200633.3 2014-01-15
DE201410200633 DE102014200633B3 (de) 2014-01-15 2014-01-15 Bearbeitungsvorrichtung und -verfahren zur Laserbearbeitung einer Oberfläche
PCT/EP2015/050489 WO2015107044A1 (de) 2014-01-15 2015-01-13 Bearbeitungsvorrichtung und -verfahren zur laserbearbeitung einer oberfläche

Publications (2)

Publication Number Publication Date
KR20160107298A KR20160107298A (ko) 2016-09-13
KR102132846B1 true KR102132846B1 (ko) 2020-07-13

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KR1020167021946A Active KR102132846B1 (ko) 2014-01-15 2015-01-13 표면을 레이저 가공하기 위한 가공 장치 및 방법

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EP (1) EP3094444B1 (enExample)
JP (1) JP6430523B2 (enExample)
KR (1) KR102132846B1 (enExample)
CN (1) CN106102982B (enExample)
DE (1) DE102014200633B3 (enExample)
DK (1) DK3094444T3 (enExample)
ES (1) ES2751474T3 (enExample)
WO (1) WO2015107044A1 (enExample)

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CN109865939A (zh) * 2019-01-22 2019-06-11 华东师范大学 一种双飞秒激光束柱透镜汇聚干涉制备大面积周期微纳结构的装置
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CN110543090B (zh) * 2019-08-16 2022-01-28 北京钛极科技有限公司 一种光学加工系统及光学加工方法
TWI716126B (zh) * 2019-09-27 2021-01-11 財團法人工業技術研究院 雷射半切加工方法及其裝置
JP7443041B2 (ja) * 2019-12-12 2024-03-05 東レエンジニアリング株式会社 光スポット像照射装置および転写装置
JP7443042B2 (ja) * 2019-12-12 2024-03-05 東レエンジニアリング株式会社 光スポット像照射装置および転写装置
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CN112045303B (zh) * 2020-08-25 2021-12-17 之江实验室 基于光纤的高通量超分辨焦斑生成装置
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Also Published As

Publication number Publication date
CN106102982A (zh) 2016-11-09
WO2015107044A1 (de) 2015-07-23
EP3094444A1 (de) 2016-11-23
JP2017504483A (ja) 2017-02-09
DE102014200633B3 (de) 2015-05-07
DK3094444T3 (da) 2019-11-04
ES2751474T3 (es) 2020-03-31
KR20160107298A (ko) 2016-09-13
CN106102982B (zh) 2018-09-25
JP6430523B2 (ja) 2018-11-28
EP3094444B1 (de) 2019-07-31

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