KR102127748B1 - 구조화된 라미네이션 전사 필름 및 방법 - Google Patents

구조화된 라미네이션 전사 필름 및 방법 Download PDF

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Publication number
KR102127748B1
KR102127748B1 KR1020157003981A KR20157003981A KR102127748B1 KR 102127748 B1 KR102127748 B1 KR 102127748B1 KR 1020157003981 A KR1020157003981 A KR 1020157003981A KR 20157003981 A KR20157003981 A KR 20157003981A KR 102127748 B1 KR102127748 B1 KR 102127748B1
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South Korea
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layer
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sacrificial
structured
backfill
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Expired - Fee Related
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Korean (ko)
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KR20150034267A (ko
Inventor
마틴 비 월크
미치슬라프 에이치 마주렉
세르게이 라만스키
마가렛 엠 보겔-마틴
비비안 더블유 존스
올레스터 주니어 벤슨
마이클 벤튼 프리
에반 엘 슈와르츠
랜디 에스 베이
그라함 엠 클라크
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쓰리엠 이노베이티브 프로퍼티즈 컴파니
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025Transfer laminating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/025Duplicating or marking methods; Sheet materials for use therein by transferring ink from the master sheet
    • H01L27/3258
    • H01L51/5275
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/85Arrangements for extracting light from the devices
    • H10K50/858Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/124Insulating layers formed between TFT elements and OLED elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/875Arrangements for extracting light from the devices
    • H10K59/879Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/268Release layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02Temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12Pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/14Velocity, e.g. feed speeds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/12Photovoltaic modules
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206Organic displays, e.g. OLED
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612Composite web or sheet

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
KR1020157003981A 2012-07-20 2013-06-17 구조화된 라미네이션 전사 필름 및 방법 Expired - Fee Related KR102127748B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/553,987 2012-07-20
US13/553,987 US9780335B2 (en) 2012-07-20 2012-07-20 Structured lamination transfer films and methods
PCT/US2013/046075 WO2014014595A1 (en) 2012-07-20 2013-06-17 Structured lamination transfer films and methods

Publications (2)

Publication Number Publication Date
KR20150034267A KR20150034267A (ko) 2015-04-02
KR102127748B1 true KR102127748B1 (ko) 2020-06-29

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Country Status (6)

Country Link
US (2) US9780335B2 (https=)
JP (1) JP6272855B2 (https=)
KR (1) KR102127748B1 (https=)
CN (2) CN104471739B (https=)
TW (1) TWI590504B (https=)
WO (1) WO2014014595A1 (https=)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9595684B2 (en) * 2012-11-30 2017-03-14 Lg Chem, Ltd. Substrate for organic electronic device having high refractive layer on light scattering, optical functional layer
US20140175707A1 (en) 2012-12-21 2014-06-26 3M Innovative Properties Company Methods of using nanostructured transfer tape and articles made therefrom
US9711744B2 (en) 2012-12-21 2017-07-18 3M Innovative Properties Company Patterned structured transfer tape
US20140242343A1 (en) * 2013-02-27 2014-08-28 3M Innovative Properties Company Lamination transfer films for forming embedded nanostructures
US9878954B2 (en) 2013-09-13 2018-01-30 3M Innovative Properties Company Vacuum glazing pillars for insulated glass units
US20150202834A1 (en) 2014-01-20 2015-07-23 3M Innovative Properties Company Lamination transfer films for forming antireflective structures
WO2015108773A1 (en) * 2014-01-20 2015-07-23 3M Innovative Properties Company Lamination transfer films for forming reentrant structures
US9246134B2 (en) 2014-01-20 2016-01-26 3M Innovative Properties Company Lamination transfer films for forming articles with engineered voids
JP2017511755A (ja) 2014-01-22 2017-04-27 スリーエム イノベイティブ プロパティズ カンパニー ガラス用微小光学要素
TW201539736A (zh) 2014-03-19 2015-10-16 3M新設資產公司 用於藉白光成色之 oled 裝置的奈米結構
DE102014106634B4 (de) * 2014-05-12 2019-08-14 Osram Oled Gmbh Beleuchtungsvorrichtung, Verfahren zum Herstellen einer Beleuchtungsvorrichtung
KR102387234B1 (ko) 2014-06-13 2022-04-18 쓰리엠 이노베이티브 프로퍼티즈 컴파니 스파클 감소를 위한 광학 적층물
KR102200036B1 (ko) 2014-06-13 2021-01-07 쓰리엠 이노베이티브 프로퍼티즈 컴파니 스파클 감소용 광학 스택
US9577129B1 (en) * 2014-06-16 2017-02-21 Solaero Technologies Corp. Flexible glass support for a solar cell assembly
US9586385B2 (en) 2014-08-27 2017-03-07 3M Innovative Properties Company Inorganic multilayer lamination transfer films
CN106660355B (zh) 2014-08-27 2019-10-11 3M创新有限公司 电多层层合转印膜
US9472788B2 (en) * 2014-08-27 2016-10-18 3M Innovative Properties Company Thermally-assisted self-assembly method of nanoparticles and nanowires within engineered periodic structures
US11247501B2 (en) 2014-08-27 2022-02-15 3M Innovative Properties Company Layer-by-layer assembled multilayer lamination transfer films
JP7009992B2 (ja) 2014-10-20 2022-01-26 スリーエム イノベイティブ プロパティズ カンパニー 断熱グレージングユニット及び微細構造化拡散部を含む微小光学層並びに方法
US9800561B2 (en) * 2014-11-06 2017-10-24 Intel Corporation Secure sharing of user annotated subscription media with trusted devices
US10518512B2 (en) * 2015-03-31 2019-12-31 3M Innovative Properties Company Method of forming dual-cure nanostructure transfer film
US10106643B2 (en) 2015-03-31 2018-10-23 3M Innovative Properties Company Dual-cure nanostructure transfer film
CN104777483B (zh) * 2015-04-17 2017-09-29 业成光电(深圳)有限公司 高解析触觉感测装置
KR20170137851A (ko) * 2015-04-17 2017-12-13 쓰리엠 이노베이티브 프로퍼티즈 컴파니 이산된 탄성중합체 특징부들을 포함하는 물품
CN107820461B (zh) 2015-06-19 2019-12-17 3M创新有限公司 分段式转印带及其制备和使用方法
WO2016205115A2 (en) 2015-06-19 2016-12-22 3M Innovative Properties Company Segmented and non-segmented transfer tapes, articles therefrom and method of making and use thereof
US11086056B2 (en) 2015-06-19 2021-08-10 3M Innovative Properties Company Micro-optical assemblies including transparent substrates having graphic layer and method of making thereof
US10656312B2 (en) 2015-06-30 2020-05-19 3M Innovative Properties Company Insulated glazing units and microoptical layer including microstructured anisotropic diffuser and methods
TWI578517B (zh) * 2015-08-14 2017-04-11 群創光電股份有限公司 有機發光二極體顯示面板
CN106469742A (zh) * 2015-08-14 2017-03-01 群创光电股份有限公司 有机发光二极管显示面板
TWI538581B (zh) 2015-11-20 2016-06-11 財團法人工業技術研究院 金屬導體結構及線路結構
DE102015015452A1 (de) * 2015-12-02 2017-06-08 Forschungszentrum Jülich GmbH Verfahren zum Planarisieren von Nanostrukturen
JP6960407B2 (ja) 2015-12-28 2021-11-05 スリーエム イノベイティブ プロパティズ カンパニー 微細構造化層を有する物品
US11312100B2 (en) 2015-12-28 2022-04-26 3M Innovative Properties Company Article with microstructured layer
KR102330028B1 (ko) * 2016-05-27 2021-11-24 쓰리엠 이노베이티브 프로퍼티즈 컴파니 개선된 색 균일도를 갖는 oled 디스플레이
EP3487948A1 (en) 2016-07-22 2019-05-29 3M Innovative Properties Company Polymeric adhesive layers as ceramic precursors
EP3487949A1 (en) 2016-07-22 2019-05-29 3M Innovative Properties Company Siloxane-based adhesive layers as ceramic precursors
CN106098940B (zh) * 2016-08-26 2019-09-06 武汉华星光电技术有限公司 无损剥离柔性基板的方法
US10707081B2 (en) 2017-11-15 2020-07-07 Taiwan Semiconductor Manufacturing Co., Ltd. Fine line patterning methods
CN111480262B (zh) * 2017-11-21 2022-10-25 应用材料公司 制造波导组合器的方法
CN116520644A (zh) 2017-11-29 2023-08-01 应用材料公司 波导组合器的直接蚀刻制造的方法
US11635622B1 (en) * 2018-12-07 2023-04-25 Meta Platforms Technologies, Llc Nanovided spacer materials and corresponding systems and methods
CN111384286B (zh) * 2018-12-29 2021-07-06 Tcl科技集团股份有限公司 量子点发光二极管及其制备方法
US11217770B2 (en) * 2019-08-12 2022-01-04 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display panel and manufacturing method thereof
CN110950299A (zh) * 2019-10-31 2020-04-03 歌尔股份有限公司 微纳米结构组件制造方法、以及以该法制造的微纳米结构组件
JP2024502733A (ja) 2020-12-18 2024-01-23 スリーエム イノベイティブ プロパティズ カンパニー 構造化フィルム及び構造化フィルムを含む光学物品
WO2022200867A1 (en) 2021-03-22 2022-09-29 3M Innovative Properties Company Edge-sealed porous substrate diagnostic devices and methods of making same
EP4336229B1 (en) * 2022-08-03 2026-03-18 Himax Technologies Limited Method for manufacturing optical element
US11926113B2 (en) 2022-08-03 2024-03-12 Himax Technologies Limited Optical element and method for manufacturing optical element
EP4634722A1 (en) * 2022-12-15 2025-10-22 Massachusetts Institute of Technology Non-planar metasurfaces and related fabrication methods

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100104807A1 (en) * 2008-10-23 2010-04-29 Compal Electronics, Inc. Transfer film, method of manufacturing the same, transfer method and object surface structure

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3444053B2 (ja) 1995-10-13 2003-09-08 ソニー株式会社 薄膜半導体装置
CN1252810C (zh) 1997-01-21 2006-04-19 B·F·谷德里奇公司 用于超低电容互连的有空气隙的半导体装置的制造
EP0945254B1 (en) 1998-03-17 2004-12-22 Chi Mei Optoelectronics Corporation Material comprising an anti-reflective coating on a flexible glass substrate
US6027595A (en) 1998-07-02 2000-02-22 Samsung Electronics Co., Ltd. Method of making optical replicas by stamping in photoresist and replicas formed thereby
US6329058B1 (en) 1998-07-30 2001-12-11 3M Innovative Properties Company Nanosize metal oxide particles for producing transparent metal oxide colloids and ceramers
EP1003078A3 (en) 1998-11-17 2001-11-07 Corning Incorporated Replicating a nanoscale pattern
US6521324B1 (en) 1999-11-30 2003-02-18 3M Innovative Properties Company Thermal transfer of microstructured layers
JP2002093315A (ja) 2000-09-14 2002-03-29 Matsushita Electric Ind Co Ltd プラズマディスプレイパネルのリブ形成方法と装置
US6664786B2 (en) 2001-07-30 2003-12-16 Rockwell Automation Technologies, Inc. Magnetic field sensor using microelectromechanical system
US6849558B2 (en) * 2002-05-22 2005-02-01 The Board Of Trustees Of The Leland Stanford Junior University Replication and transfer of microstructures and nanostructures
US8011299B2 (en) 2002-07-01 2011-09-06 Inca Digital Printers Limited Printing with ink
US7419912B2 (en) 2004-04-01 2008-09-02 Cree, Inc. Laser patterning of light emitting devices
DE102005017170B4 (de) * 2005-04-13 2010-07-01 Ovd Kinegram Ag Transferfolie, Verfahren zu deren Herstellung sowie Mehrschichtkörper und dessen Verwendung
US20060270806A1 (en) 2005-05-26 2006-11-30 Hale Wesley R Miscible high Tg polyester/polymer blend compositions and films formed therefrom
MX2007016039A (es) * 2005-06-17 2008-10-27 Univ North Carolina Metodos, sistemas y materiales de fabricacion de nanoparticulas.
US7569254B2 (en) * 2005-08-22 2009-08-04 Eastman Kodak Company Nanocomposite materials comprising high loadings of filler materials and an in-situ method of making such materials
US7643203B2 (en) 2006-04-10 2010-01-05 Qualcomm Mems Technologies, Inc. Interferometric optical display system with broadband characteristics
US20070298176A1 (en) * 2006-06-26 2007-12-27 Dipietro Richard Anthony Aromatic vinyl ether based reverse-tone step and flash imprint lithography
US7419757B2 (en) * 2006-10-20 2008-09-02 3M Innovative Properties Company Structured thermal transfer donors
US7604916B2 (en) 2006-11-06 2009-10-20 3M Innovative Properties Company Donor films with pattern-directing layers
JP5349041B2 (ja) * 2006-12-08 2013-11-20 三菱レイヨン株式会社 レンズシート、面光源装置及び液晶表示装置
US20080233404A1 (en) 2007-03-22 2008-09-25 3M Innovative Properties Company Microreplication tools and patterns using laser induced thermal embossing
US7604381B2 (en) 2007-04-16 2009-10-20 3M Innovative Properties Company Optical article and method of making
US8179034B2 (en) 2007-07-13 2012-05-15 3M Innovative Properties Company Light extraction film for organic light emitting diode display and lighting devices
US20090015142A1 (en) * 2007-07-13 2009-01-15 3M Innovative Properties Company Light extraction film for organic light emitting diode display devices
US8293354B2 (en) 2008-04-09 2012-10-23 The Regents Of The University Of Michigan UV curable silsesquioxane resins for nanoprint lithography
GB2464111B (en) * 2008-10-02 2011-06-15 Cambridge Display Tech Ltd Organic electroluminescent device
US8222352B2 (en) 2008-12-24 2012-07-17 Nitto Denko Corporation Silicone resin composition
JP5052534B2 (ja) 2009-01-08 2012-10-17 株式会社ブリヂストン 光硬化性転写シート、及びこれを用いた凹凸パターンの形成方法
JP5597356B2 (ja) * 2009-03-02 2014-10-01 リンテック株式会社 シート製造装置および製造方法
US8499810B2 (en) 2009-08-27 2013-08-06 Transfer Devices Inc. Molecular transfer lithography apparatus and method for transferring patterned materials to a substrate
US9305571B2 (en) * 2009-12-23 2016-04-05 HGST Netherlands B.V. Magnetic devices and magnetic media with graphene overcoat
KR20120123741A (ko) 2010-01-13 2012-11-09 쓰리엠 이노베이티브 프로퍼티즈 컴파니 미세 구조화 저 굴절률 나노공극형 층을 갖는 광학 필름 및 이의 제조 방법
US20110305787A1 (en) 2010-06-11 2011-12-15 Satoshi Ishii Stamper for transfer of microscopic structure and transfer apparatus of microscopic structure
EP2585875B1 (en) * 2010-06-28 2016-06-29 Toray, Plastics (America), Inc. Releasable metalized embossed transfer film
US8469551B2 (en) 2010-10-20 2013-06-25 3M Innovative Properties Company Light extraction films for increasing pixelated OLED output with reduced blur
WO2012077738A1 (ja) 2010-12-09 2012-06-14 旭化成株式会社 微細構造積層体、微細構造積層体の作製方法及び微細構造体の製造方法
US20120153527A1 (en) 2010-12-21 2012-06-21 Toyota Motor Engineering & Manufacturing North America, Inc. Process for manufacturing a stand-alone thin film
US8900988B2 (en) * 2011-04-15 2014-12-02 International Business Machines Corporation Method for forming self-aligned airgap interconnect structures
KR101999253B1 (ko) * 2011-10-13 2019-10-01 캄브리오스 필름 솔루션스 코포레이션 금속 나노와이어들을 통합한 전극을 갖는 광전기 디바이스들
US9246134B2 (en) 2014-01-20 2016-01-26 3M Innovative Properties Company Lamination transfer films for forming articles with engineered voids

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100104807A1 (en) * 2008-10-23 2010-04-29 Compal Electronics, Inc. Transfer film, method of manufacturing the same, transfer method and object surface structure

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US10957878B2 (en) 2021-03-23
US20140021492A1 (en) 2014-01-23
US9780335B2 (en) 2017-10-03
WO2014014595A1 (en) 2014-01-23
CN104471739B (zh) 2017-03-22
JP2015530284A (ja) 2015-10-15
TWI590504B (zh) 2017-07-01
CN107020854A (zh) 2017-08-08
CN107020854B (zh) 2019-09-13
TW201411908A (zh) 2014-03-16
JP6272855B2 (ja) 2018-01-31
KR20150034267A (ko) 2015-04-02
US20170365818A1 (en) 2017-12-21

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